CN102185047A - Method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through needle valve cold runner - Google Patents
Method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through needle valve cold runner Download PDFInfo
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- CN102185047A CN102185047A CN 201110089446 CN201110089446A CN102185047A CN 102185047 A CN102185047 A CN 102185047A CN 201110089446 CN201110089446 CN 201110089446 CN 201110089446 A CN201110089446 A CN 201110089446A CN 102185047 A CN102185047 A CN 102185047A
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- silica gel
- needle valve
- liquid silica
- needle
- cold runner
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Abstract
The invention discloses a method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through a needle valve cold runner. In the method, the LED products are encapsulated by using a needle valve cold runner mold which is provided with needle valve heat insulating jacket ejection heads molded by ejecting liquid silica gel. The method comprises the following steps of: placing the products below the needle valve heat insulating jacket ejection heads molded by ejecting liquid silica gel to make the needle valve heat insulating jacket ejection heads molded by ejecting liquid silica gel correspond to each product one by one; and ejecting liquid silica gel through the needle valve heat insulating jacket ejection heads molded by ejecting liquid silica gel for encapsulating the LED products. Silica gel feeding through the needle valve cold runner is adopted, and a needle valve is sealed after gel feeding. Compared with the prior art, the method has the advantages of no flue channel, raw material saving, short molding time, high efficiency, good peripheral exhaust of the products, high yield, small scrap rubber and easiness for cleaning.
Description
Technical field
The present invention relates to a kind of LED product method for packing that advances glue with liquid silica gel needle valve cold runner.
Background technology
The method of existing LED product encapsulation is generally the form of a glue, yet the product of this mode moulding is easy to generate bubble, and external form is unstable and irregular, built on the sand bonding, influences index of refraction and attenuation rate; And the time of carrying out post-cure is of a specified duration excessively, causes waste many, can produce pollution.At above-mentioned situation, what a kind of open liquid silica gel ejection formation had appearred in industry advances the glue packaged type, yet, this mode still can produce and give shortcoming: overlap is many, is difficult to cleaning, and molding time is long, produced simultaneously bubble is many, production cost height, size instability, index of refraction and decay rate variance.
Summary of the invention
It is good that the technical problem to be solved in the present invention provides a kind of exhaust, dimensionally stable, and molding time is short, and what efficient was high advances the LED product method for packing of glue with liquid silica gel needle valve cold runner.The present invention is achieved through the following technical solutions:
A kind of needle valve cold runner mould of the present invention encapsulates for the LED product by needle valve cold runner mould, the needle-valve insulation jacket that described needle valve cold runner mould is provided with the liquid silica gel ejection formation head that shoots material; May further comprise the steps: the shoot material below of head of the needle-valve insulation jacket that product is placed into the liquid silica gel ejection formation, head is corresponding one by one with each product so that the needle-valve insulation jacket of liquid silica gel ejection formation shoots material, and the liquid jet silica gel that shoots material of the needle-valve insulation jacket by the liquid silica gel ejection formation encapsulates the LED product again.
As preferably, the described needle-valve insulation jacket head that shoots material comprises that pin is chewed overcoat, cold runner overcoat, cold runner fortune water jacket, hollow shoots material and needle-valve; Described pin is chewed the below of overcoat and is chewed for material.
As preferably, described needle-valve can be up and down or front and back control stroke shoot material and sealing.
Of the present inventionly advance the LED product method for packing of glue with liquid silica gel needle valve cold runner, owing to adopt the needle valve cold runner to advance glue, after injecting glue was intact, the needle-valve sealing did not have runner relative to existing technologies, can economize in raw materials, and molding time was short the efficient height.Simultaneously, the exhaust of product periphery, the yield height, overlap is little, and very easily cleaning.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the end view of needle valve cold runner mould of the present invention and LED product;
Fig. 2 is the vertical view of LED product among the present invention.
Embodiment
As depicted in figs. 1 and 2, a kind of LED product method for packing that advances glue with liquid silica gel needle valve cold runner of the present invention, by needle valve cold runner mould is that LED product 1 encapsulates, and the needle-valve insulation jacket that described needle valve cold runner mould is provided with the liquid silica gel ejection formation shoots material 4; May further comprise the steps: a shoot material below of 4 of the needle-valve insulation jacket that LED product 1 is placed into the liquid silica gel ejection formation, so that the needle-valve insulation jacket of liquid silica gel ejection formation shoots material is 4 corresponding one by one with each LED product 1, the 4 liquid jet silica gel that shoot material of the needle-valve insulation jacket by the liquid silica gel ejection formation encapsulate LED product 1 again.The applicant is in first to file, the needle valve insulation jacket that application documents the disclose a kind of liquid silica gel ejection formation head that shoots material.Owing to adopt the needle valve cold runner to advance glue, after injecting glue was intact, the needle-valve sealing did not have runner relative to existing technologies, can economize in raw materials, and molding time was short the efficient height.Simultaneously, the exhaust of product periphery, the yield height, overlap is little, and very easily cleaning.
Wherein, described needle-valve insulation jacket shoots material and 4 comprises that pin chews overcoat 40, cold runner overcoat 41, cold runner fortune water jacket 42, hollow and shoot material 43 and needle-valve 44; Described pin is chewed the below of overcoat 40 and is chewed for material.Described needle-valve 44 can be up and down or front and back control stroke shoot material and sealing.
Of the present inventionly advance the LED product method for packing of glue with liquid silica gel needle valve cold runner, owing to adopt the needle valve cold runner to advance glue, after injecting glue was intact, the needle-valve sealing did not have runner relative to existing technologies, can economize in raw materials, and molding time was short the efficient height.Simultaneously, the exhaust of product periphery, the yield height, overlap is little, and very easily cleaning.
The foregoing description, just an example of the present invention is not to be used for limiting enforcement of the present invention and interest field, the identical or technical scheme that is equal to of the described content of claim all and of the present invention all should be included in the protection range of the present invention.
Claims (3)
1. one kind is advanced the LED product method for packing of glue with liquid silica gel needle valve cold runner, encapsulates the needle-valve insulation jacket that described needle valve cold runner mould is provided with the liquid silica gel ejection formation head that shoots material for the LED product by needle valve cold runner mould; It is characterized in that: may further comprise the steps: the shoot material below of head of the needle-valve insulation jacket that product is placed into the liquid silica gel ejection formation, head is corresponding one by one with each product so that the needle-valve insulation jacket of liquid silica gel ejection formation shoots material, and the liquid jet silica gel that shoots material of the needle-valve insulation jacket by the liquid silica gel ejection formation encapsulates the LED product again.
2. according to claim 1ly advance the LED product method for packing of glue with liquid silica gel needle valve cold runner, it is characterized in that: the described needle-valve insulation jacket head that shoots material comprises that pin is chewed overcoat, cold runner overcoat, cold runner fortune water jacket, hollow shoots material and needle-valve; Described pin is chewed the below of overcoat and is chewed for material.
3. according to claim 2ly advance the LED product method for packing of glue, it is characterized in that with liquid silica gel needle valve cold runner: described needle-valve can be up and down or front and back control stroke shoot material and sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110089446 CN102185047A (en) | 2011-03-29 | 2011-03-29 | Method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through needle valve cold runner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110089446 CN102185047A (en) | 2011-03-29 | 2011-03-29 | Method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through needle valve cold runner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102185047A true CN102185047A (en) | 2011-09-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110089446 Pending CN102185047A (en) | 2011-03-29 | 2011-03-29 | Method for encapsulating LED (Light Emitting Diode) products by feeding liquid silica gel through needle valve cold runner |
Country Status (1)
| Country | Link |
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| CN (1) | CN102185047A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163921A (en) * | 2013-03-26 | 2015-12-16 | Nok株式会社 | Molding apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1997496A (en) * | 2004-07-22 | 2007-07-11 | 兰茨胡特工具制造阿尔弗雷德·施泰因勒有限及两合公司 | Injection molding machine and injection molding method |
| CN101264655A (en) * | 2007-03-13 | 2008-09-17 | 好塑热流道科技发展（北京）有限公司 | Injection molding forming method and device for plastic base material |
| CN201240036Y (en) * | 2008-06-18 | 2009-05-20 | 李建新 | Needle valve type heat insulating jacket filling head for liquid silica gel injection molding |
| US20100183763A1 (en) * | 2009-01-22 | 2010-07-22 | Mold-Masters (2007) Limited | Injection Molding Apparatus |
| CN201913752U (en) * | 2010-10-15 | 2011-08-03 | 董富有 | Complete equipment for injection molding of two liquid silica gel components |
-
2011
- 2011-03-29 CN CN 201110089446 patent/CN102185047A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1997496A (en) * | 2004-07-22 | 2007-07-11 | 兰茨胡特工具制造阿尔弗雷德·施泰因勒有限及两合公司 | Injection molding machine and injection molding method |
| CN101264655A (en) * | 2007-03-13 | 2008-09-17 | 好塑热流道科技发展（北京）有限公司 | Injection molding forming method and device for plastic base material |
| CN201240036Y (en) * | 2008-06-18 | 2009-05-20 | 李建新 | Needle valve type heat insulating jacket filling head for liquid silica gel injection molding |
| US20100183763A1 (en) * | 2009-01-22 | 2010-07-22 | Mold-Masters (2007) Limited | Injection Molding Apparatus |
| CN201913752U (en) * | 2010-10-15 | 2011-08-03 | 董富有 | Complete equipment for injection molding of two liquid silica gel components |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163921A (en) * | 2013-03-26 | 2015-12-16 | Nok株式会社 | Molding apparatus |
| US9895835B2 (en) | 2013-03-26 | 2018-02-20 | Nok Corporation | Molding apparatus |
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Application publication date: 20110914 |