CN102184880B - Unit for supporting substrate and equipment equipped with the unit for processing substrate - Google Patents
Unit for supporting substrate and equipment equipped with the unit for processing substrate Download PDFInfo
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- CN102184880B CN102184880B CN201010624115.XA CN201010624115A CN102184880B CN 102184880 B CN102184880 B CN 102184880B CN 201010624115 A CN201010624115 A CN 201010624115A CN 102184880 B CN102184880 B CN 102184880B
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- unit
- electrostatic chuck
- chuck unit
- link
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a unit for supporting substrates, which comprises a static chuck unit for movably supporting substrate and a connection member. One end of the connection member is connected with the static chuck unit so as to provide electric power for the static chuck unit. The shape can be flexibly adjusted according to the movement of the static chuck unit by the connection member. The connection member comprises a flexible pipe for limiting the inner space and a conductive line inserted into the flexible pipe. One end of the conductive line is connected with the static chuck unit. Since the conductive line is inserted into the flexible pipe, the mobility of the connection member is improved. Since the shape of the connection member connected with the static chuck unit can be flexibly adjusted according to the up-down movement or the rotation of the static chuck unit, the static chuck unit can smoothly move. In addition, since the connection member is flexible in shape, the connection member can be installed without the limitation of positions and areas.
Description
Technical field
The present invention relates to the substrate-treating apparatus of substrate supporting unit (substrate supporting unit) and the described unit of use, and more particularly, the present invention relates to the substrate supporting unit easily moving electrostatic chuck unit (electrostatic chuck unit) and the substrate-treating apparatus using described unit.
Background technology
In general, flat-panel monitor (flatpanel display) is manufactured by making upper substrate and lower substrate be bonded to each other.Substrate bonding apparatus (substrate bonding apparatus) for this comprises the chamber (chamber) of supply inner space, be placed in described chamber to support the top electrostatic chuck unit of upper substrate, be connected with the first power subsystem supplying electric power to top electrostatic chuck unit (first power supply unit) with top electrostatic chuck unit, the low portion being placed in top electrostatic chuck unit sentences the lower electrostatic cartridge unit supporting lower substrate in the face of top electrostatic chuck unit, and the second source unit supplying electric power with lower portion electrostatic chuck unit is connected with lower electrostatic cartridge unit.Herein, each self-contained metal shaft of the first and second power subsystem (metal shaft) and conductor wire (conductive line), described conductor wire to be contained in described axle and to be connected to electrostatic chuck unit by its one end.The other end of the first and second power subsystems is projected into exterior thereto and is connected with generator unit (power generation unit), and generator unit applies electric power to the first and second power subsystems.There is provided seal member (sealingmember) to close the other end being projected into exterior thereto of the first and second power subsystems.
In order to use substrate bonding apparatus in conjunction with upper substrate and lower substrate, first reduce top electrostatic chuck unit, make upper substrate and lower substrate closer to each other.Then, pivot bottom electrostatic chuck unit on X, Y and θ direction of principal axis, and then upper substrate is aimed at lower substrate.Further reduction top electrostatic chuck unit is to make upper substrate and lower substrate close contact.Herein, because one end of the first and second power subsystems is connected with top electrostatic chuck unit and lower electrostatic cartridge unit respectively, therefore when top electrostatic chuck moves down, the first power subsystem moves down together.And when bottom electrostatic chuck finite element rotation, second source unit rotates together.For this reason, the first and second power subsystems need to move swimmingly according to the movement of upper and lower electrostatic chuck unit respectively.But the first and second power subsystems being projected into exterior thereto are fixed by seal member, and be therefore not easy mobile.For head it off, collapsible and extendible metal bellows (metal bellow) is used as the seal member closing the first and second power subsystems.
But because the axle of the first and second power subsystems and bellows are made of metal, therefore the mobile range of axle and bellows is limited.Therefore, electrostatic chuck unit in upper and lower is not moved swimmingly by the first and second power subsystems and bellows.And, be difficult to process metal (material of bellows) according to the installation site of bellows and region.That is, the installation site of bellows and region limited.
Summary of the invention
The invention provides a kind of substrate supporting unit that easily can move electrostatic chuck unit and the substrate-treating apparatus using described unit.
The present invention also provides a kind of substrate supporting unit, and it improves the mobility of the link of the electrostatic chuck unit supply electric power to support substrates, and uses the substrate-treating apparatus of described unit.
According to one exemplary embodiment, a kind of substrate supporting unit comprises: electrostatic chuck unit, and it is configured as moveable also support substrates; And link, its one end is connected to described electrostatic chuck unit to supply electric power to described electrostatic chuck unit, described link is configured to the movement according to described electrostatic chuck unit and changes shape neatly, wherein said link comprises: flexible pipe, and it is configured to define inner space; And conductor wire, it is inserted in described flexible pipe and its one end and is connected to described electrostatic chuck unit.
Described electrostatic chuck unit by move up and down and in rotating at least one and move.
Described flexible pipe can be made up of insulating material.
Described conductor wire can be changed shape neatly electric conducting material by the movement according to described electrostatic chuck unit is made.
Described link changeable shape, makes the distance between the two ends of described link move down along with described electrostatic chuck unit and increase and move up along with described electrostatic chuck unit and reduce.
Substrate supporting unit can comprise the first fixed part and the second fixed part further, and it is in order to pass through partly to receive one end of described link and the other end to fix described link respectively.
According to another one exemplary embodiment, a kind of substrate-treating apparatus comprises: chamber unit, and it is configured to define inner space; First and second (table), its respectively component capable of movable installed in described chamber unit with facing with each other and in order to support substrates; Electrostatic chuck unit, it is installed to one or two in described First and described second movably to support described substrate by electrostatic force; And link, it is placed in described chamber unit, its one end is made to be connected to described electrostatic chuck unit to supply electric power to described electrostatic chuck unit, and its shape is changed neatly according to the movement of described electrostatic chuck unit, wherein said link comprises the flexible pipe being configured to define inner space, and conductor wire, it is inserted in described flexible pipe and its one end and is connected to described electrostatic chuck unit.
Described First and described second by move up and down and in rotating at least one and move.
Described flexible pipe can be made up of insulating material.
Described conductor wire can be changed shape neatly electric conducting material by the movement according to described electrostatic chuck unit is made.
Accompanying drawing explanation
One exemplary embodiment can be understood in more detail, in accompanying drawing from the description carried out below in conjunction with accompanying drawing:
Fig. 1 is the sectional view of the substrate-treating apparatus according to one exemplary embodiment.
Fig. 2 A and Fig. 2 B is the figure of the operation for explaining the link according to one exemplary embodiment.
Fig. 3 is the figure of the first revision of link according to one exemplary embodiment.
Fig. 4 is the figure of the second revision of link according to one exemplary embodiment.
Fig. 5 is the figure for explaining the second source unit according to one exemplary embodiment.
Fig. 6 A to Fig. 6 C is sequentially the figure of the operation of the substrate-treating apparatus according to one exemplary embodiment.
Embodiment
Hereinafter, specific embodiment is described in detail with reference to each accompanying drawing.But the present invention can embody in different forms and should not be illustrated as the embodiment being limited to and stating herein.In fact, provide these embodiments to make the present invention by for detailed and complete, and scope of the present invention will be conveyed to those skilled in the art completely.Same reference numerals represents similar elements in the drawings all the time.
Fig. 1 is the sectional view of the substrate-treating apparatus according to one exemplary embodiment.Fig. 2 A and Fig. 2 B is the figure of the operation for explaining the link according to one exemplary embodiment.Fig. 3 is the figure of the link of the first revision according to one exemplary embodiment, and Fig. 4 is the figure of the link of the second revision according to one exemplary embodiment.Fig. 5 is the figure for explaining the second source unit according to one exemplary embodiment.
According to the substrate bonding apparatus that the substrate-treating apparatus of embodiment is in order to a pair substrate 210 and 220 to be bonded to each other.As shown in Figure 1, this substrate-treating apparatus comprises: chamber unit 100, and it defines inner space; Upper substrate support unit 300, it is comprised and is placed in chamber unit 100 to be supported the upper substrate eyelid retractor (substrate supporter) 310 of upper substrate 210 and the first power supply 320 in order to supply electric power to top substrate holder 310 by electrostatic force; Lower substrate support unit 500, its comprise through settle with in the face of upper substrate eyelid retractor 310 to be supported the lower substrate eyelid retractor 510 of lower substrate 220 by electrostatic force and to supply the second source 520 of electric power in order to lower portion substrate holder 510; Upper driver 400, it is in order to move up and down upper substrate eyelid retractor 310; And lower driver 600, it is in order to pivot bottom substrate holder 510 on X, Y and θ direction of principal axis.
Chamber unit 100 comprises upper chamber 110 and lower chamber 120, and it forms space to perform the combination of upper substrate 210 and lower substrate 220.Exemplarily, upper chamber 110 and lower chamber 120 are connected to each other separably.Although not shown, pressure adjusting unit (pressure adjusting unit) (not shown) can be provided further to adjust the internal pressure of chamber unit 100 to chamber unit 100.In addition, chamber unit 100 can comprise clean unit (purge unit) (not shown) further, and it is from the inner space discharge impurities of chamber unit 100.Although chamber unit 100 has rectangular tube shape in FIG, the shape of chamber unit 100 is not limited thereto and can changes according to the shape of substrate 210 and 220.In addition, although not shown, form entrance (entrance) (not shown) entering and exiting for upper substrate 210 and lower substrate 220 at the side place of chamber unit 100.And, gate valve (gate valve) (not shown) can be provided further to open and close entrance (not shown).In addition, upper chamber 110 or the lower chamber 120 of chamber unit 100 can move up and down, and make upper substrate 210 and lower substrate 220 move into and shift out chamber unit 100.In the case, the Special-purpose lifting parts (elevation member) (not shown) moving upper chamber 110 and lower chamber 120 up and down can be provided for.
Specifically, upper substrate support unit 300 comprises upper substrate eyelid retractor 310 and multiple first power supply 320.Upper substrate eyelid retractor 310 comprises: upper stage 311, and it is adjacent to the inner surface of chamber 110 and settles; And multiple tops electrostatic chuck unit 312, its lower surface being installed to upper stage 311 is to support upper substrate 210 by electrostatic force.First power supply 320 is connected respectively to described multiple tops electrostatic chuck unit 312 to supply electric power to top electrostatic chuck unit 312.
Although the upper stage 311 of the present embodiment has rectangular plate shape, the shape of upper stage 311 is not limited thereto and can changes according to the shape of upper substrate 210.Described multiple tops electrostatic chuck unit 312 is fixedly secured to the lower surface of upper stage 311 in the matrix form.The top electrostatic chuck unit 312 of the present embodiment has rectangular plate shape.But being not limited to this, top electrostatic chuck unit 312 can have other shape various.In addition, although not shown, but each in top electrostatic chuck unit 312 comprises multiple anode electrode pattern, multiple cathode electrode pattern, to be electrically connected and to input the plus end of positive electricity with anode electrode pattern, and is electrically connected with cathode electrode pattern and inputs the negative terminal of negative electricity.Herein, alternately arrange that positive electrode pattern and negative electrode pattern are exemplary.
First power supply 320 supplies electric power to described top electrostatic chuck unit 312, makes top electrostatic chuck unit 312 support upper substrate 210 by electrostatic force.Each in first power supply 320 comprises: link 321, and its one end is connected to top electrostatic chuck unit 312 and changes shape neatly according to moving up and down of top electrostatic chuck unit 312; And first power supply unit (not shown), its other end being connected to link 321 is to apply electric power to link 321.First power supply unit (not shown) of the present embodiment is placed in the outside of upper chamber 110, but is not limited thereto.In addition, the first power supply 320 comprises: the first fixed part 322a, wherein partly inserts the low portion being adjacent to top electrostatic chuck unit 312 of link 321 to support this link 321; First fixture (clamp) 323a, it clamps a part for this link 321, and this link 321 is sentenced and then fixed to the upper part being placed in the first fixed part 322a; Second fixed part 322b, wherein the upper part being adjacent to the upper end of upper chamber 110 of this link 321 fixes this link 321; And the second fixture 323b, it clamps a part for this link 321, is placed in the low portion place of the second fixed part 322b, and and then fixes this link 321.
This link 321 comprises: pipe 321a, and it defines inner space and is made up of flexible material; And conductor wire 321b, to make its one end be connected to top electrostatic chuck unit 312 and its other end is connected to the first power supply unit (not shown) in its Inserting Tube 321a.Herein, conductor wire 321b is divided into: positive electricity polar curve (positive electrode line) 321b-1, and its one end is connected with the plus end of top electrostatic chuck unit 312; With negative electrode wire (negative electrode line) 321b-2, its one end is connected with the negative terminal of top electrostatic chuck unit 312.
Pipe 321a is made for the pipe shape defining inner space by flexible material.When top electrostatic chuck unit 312 moves up and down, corresponding power is transferred to pipe 321a, and then changes the shape of pipe 321a.To more specifically explain the alteration of form of pipe 321a after a while.Herein, the material of pipe 321a has flexibility and is exemplary maintaining its current shape before applying power separately.In addition, pipe 321a is made up of insulating material is exemplary.For this reason, be made up of flexible polymer according to the pipe 321a of the present embodiment.But, be not limited thereto, other material various can be applied.As mentioned above, in positive electricity polar curve 321b-1 and negative electrode wire 321b-2 Inserting Tube 321a.Therefore, although not shown, pipe 321a comprises independent space to receive positive electricity polar curve 321b-1 and negative electrode wire 321b-2 respectively.
Conductor wire 321b comprises positive electricity polar curve 321b-1 and negative electrode wire 321b-2.One end of positive electricity polar curve 321b-1 is connected to the plus end of top electrostatic chuck unit 312, and the other end is connected to the first power supply unit (not shown).One end of negative electrode wire 321b-2 is connected to the negative terminal of top electrostatic chuck unit 312, and the other end is connected to the first power supply unit (not shown).Herein, positive electricity polar curve 321b-1 and negative electrode wire 321b-2 is projected into the outside of upper chamber 110 and is connected to the first power supply unit (not shown).Therefore, the first shell (housing) 324 is installed with the ledge of closed positive electricity polar curve 321b-1 and negative electrode wire 321b-2 (protruding parts).Thin conductor wire can be used as positive electricity polar curve 321b-1 and negative electrode wire 321b-2, makes positive electricity polar curve 321b-1 and negative electrode wire 321b-2 can change shape neatly according to moving up and down of top electrostatic chuck unit 312.Exemplarily, one end of positive electricity polar curve 321b-1 and negative electrode wire 321b-2 is connected to top electrostatic chuck unit 312 being exposed under the state outside pipe 321a.
Because conductor wire 321b so inserts in flexible pipe 321a, therefore the mobility of this link 321 compared with prior art can increase.
Hereinafter, the operation of the link according to one exemplary embodiment is described with reference to Fig. 2 A and Fig. 2 B.
In order to the combination between upper substrate 210 and lower substrate 220, first, use upper driver 400 to move down upper substrate eyelid retractor 310 to settle close to each other to make upper substrate 210 and lower substrate 220.Before moving down upper substrate eyelid retractor 310, it is spiral-shaped that the part of this link 321 can maintain as shown in Figure 2 A.When upper substrate eyelid retractor 310 is moved down by upper driver 400, the spiral part of this link 321 is stretching gradually.In other words, when upper driver 400 moves down, the shape of this link 321 becomes straight line, the distance between its two ends is increased gradually, as shown in Figure 2 B.Therefore, because the shape of this link 321 changes according to moving up and down of top electrostatic chuck unit 312, therefore top electrostatic chuck unit 312 can easily move.In addition, due to this link 321 flexible shapes change, therefore in the unconstrained situation in position and region, this link 321 can be installed.
Be not limited to above description, the shape of this link 321 can change in every way according to moving up and down of top electrostatic chuck unit 312.For example, before moving down upper substrate eyelid retractor 310, the part of this link 321 can have meander-shaped as shown in Figure 3.And before moving down upper substrate eyelid retractor 310, the part of this link 321 can have semicircular in shape as shown in Figure 4.To understand, except the first and second revisions shown in Fig. 3 and Fig. 4, other shape various can be applied.
With reference to figure 1 and Fig. 5, lower substrate support unit 500 comprises lower substrate eyelid retractor 510 and multiple second source 520.Lower substrate eyelid retractor 510 comprises: lower stage 511, and it is adjacent to the inner surface of lower chamber 120 and settles; And multiple lower electrostatic cartridge unit 512, its upper surface being installed to lower stage 511 is to support lower substrate 220 by electrostatic force.Second source 520 lower portion electrostatic chuck unit 512 supplies electric power.Although not shown, provide the second power supply unit (not shown) to apply electric power to second source 520 further.Herein, according to one exemplary embodiment, lower stage 511 is formed as the shape identical with upper stage 311.Described multiple lower electrostatic cartridge unit 512 is fixedly secured to the upper surface of lower stage 511 in the matrix form.In addition, although not shown, but lower electrostatic cartridge unit 512 comprises multiple anode electrode pattern, multiple cathode electrode pattern, to be electrically connected and to input the plus end of positive electricity with anode electrode pattern, and is electrically connected with cathode electrode pattern and inputs the negative terminal of negative electricity.
Second source 520 has the structure identical with above-described first power supply 320, and therefore will only explain briefly.Each in second source 520 comprises: link 521, and its one end is connected to lower electrostatic cartridge unit 512 and changes shape neatly according to the rotation of lower electrostatic cartridge unit 512; And second power supply unit (not shown), its other end being connected to link 521 is to apply electric power to link 521.Herein, the second power supply unit (not shown) is placed in the outside of lower chamber 120.
Link 521 comprises: pipe 521a, and it defines inner space and is made up of flexible material; And conductor wire 521b, to make its one end be connected to lower electrostatic cartridge unit 512 and its other end is connected to the second power supply unit (not shown) in its Inserting Tube 521a.More exemplarily, pipe 521a is made up of insulating material.For this reason, be made up of flexible polymer according to the pipe 521a of the present embodiment.But be not limited to this, other material various can be applied.Conductor wire 521b comprises positive electricity polar curve 521b-1 and negative electrode wire 521b-2.One end of positive electricity polar curve 521b-1 is connected to the plus end of lower electrostatic cartridge unit 512, and the other end is connected to the second power supply unit (not shown).One end of negative electrode wire 521b-2 is connected to the negative terminal of lower electrostatic cartridge unit 512, and the other end is connected to the second power supply unit (not shown).Herein, the other end of positive electricity polar curve 521b-1 and negative electrode wire 521b-2 is projected into the low portion of lower chamber 120 and is connected to the second power supply unit (not shown).Therefore, second housing 524 is installed with the ledge of closed positive electricity polar curve 521b-1 and negative electrode wire 521b-2.
Rotate with on X, Y and θ direction of principal axis according to the lower substrate support unit 500 of the present embodiment and then upper substrate 210 to be combined is aimed at lower substrate 220.Specifically, lower stage 511 is rotated on X, Y and θ direction of principal axis by lower driver 600, and the described multiple lower electrostatic cartridge unit 512 being installed to the upper surface of lower stage 511 rotate on X, Y and θ direction of principal axis.According to the rotation of lower electrostatic cartridge unit 512, the alteration of form of the link 521 of second source 520.That is, when lower electrostatic cartridge unit 512 rotates, revolving force is transferred to link 521, and then changes the shape of link 521.Because therefore the rotation according to lower electrostatic cartridge unit 512 changes by the shape of link 521, then can easily pivot bottom electrostatic chuck unit 512.
According to embodiment, described multiple tops electrostatic chuck unit 312 is installed to upper stage 311, and described multiple lower electrostatic cartridge unit 512 is installed to lower stage 511.But be not limited to above-described embodiment, electrostatic chuck unit 312 and 512 can be installed to any one in upper stage 311 and lower stage 511.For example, only described multiple tops electrostatic chuck unit 312 can be installed to the lower surface of upper stage 311, omits lower electrostatic cartridge unit 512 from the upper surface of lower stage 511 simultaneously.In the case, lower stage 511 can comprise the Special support parts that can support lower substrate 220 further, such as, use vacuum adsorption force (vacuum absorption force) to support the vacuum corrector (vacuumadjuster) of lower substrate 220.And, Special support parts can be provided in the con-trary case.
In addition, according to the present embodiment, upper substrate eyelid retractor 310 moves up and down and lower substrate eyelid retractor 510 rotates for the combination between upper substrate 210 and lower substrate 220 on X, Y and θ direction of principal axis.But upper substrate eyelid retractor 310 can rotate on X, Y and θ direction of principal axis and lower substrate eyelid retractor 510 can move up and down.And upper substrate eyelid retractor 310 and lower substrate eyelid retractor 510 two all can move up and down and rotate on X, Y and θ direction of principal axis.
In the embodiment of above explaination, described multiple anode electrode pattern and cathode electrode pattern are formed at top electrostatic chuck unit 312 and lower electrostatic cartridge unit 512 place respectively.But the configuration of top electrostatic chuck unit 312 and lower electrostatic cartridge unit 512 is not limited thereto and can revises in every way.For example, anode electrode pattern can be formed at some places in top electrostatic chuck unit 312, and cathode electrode pattern is formed at all the other places in top electrostatic chuck unit 312.In the case, the top electrostatic chuck unit 312 with anode electrode pattern is alternately arranged with the top electrostatic chuck unit 312 with cathode electrode pattern.According to above embodiment, multiple tops electrostatic chuck unit 312 is installed to the lower surface of upper stage 311.In addition, anode electrode pattern can be formed at some places in lower electrostatic cartridge unit 512, and cathode electrode pattern is formed at all the other places in lower electrostatic cartridge unit 512.In the case, the lower electrostatic cartridge unit 512 with anode electrode pattern is alternately arranged with the lower electrostatic cartridge unit 512 with cathode electrode pattern.In addition, according to embodiment, described multiple tops electrostatic chuck unit 312 and described multiple lower electrostatic cartridge unit 512 are respectively installed to upper stage 311 and lower stage 511.But, be different from described embodiment, single top electrostatic chuck unit 312 and lower electrostatic cartridge unit 512 can be provided.
According to above embodiment, positive electricity polar curve 321b-1 and negative electrode wire 321b-2 two is received in a pipe 321a of link 321.But, two pipe 321a can be provided to receive separately positive electricity polar curve 321b-1 and negative electrode wire 321b-2.For example, assuming that as mentioned above, anode electrode pattern is formed at some places in top electrostatic chuck unit 312 and cathode electrode pattern is formed at all the other places in top electrostatic chuck unit 312, then this link 321 (wherein positive electricity polar curve 321b-1 is received in pipe 321a) is connected to the top electrostatic chuck unit 312 with anode electrode pattern.This link 321 (wherein negative electrode wire 321b-2 is received in pipe 321a) is connected to the top electrostatic chuck unit 321 with cathode electrode pattern.
Fig. 6 A to Fig. 6 C is sequentially the figure of the operation of the substrate-treating apparatus according to one exemplary embodiment.Hereinafter, the operation of substrate-treating apparatus is sequentially explained with reference to Fig. 6 A to Fig. 6 C.
First, by described multiple first power supply 320, electric power is put on described multiple tops electrostatic chuck unit 312.Upper substrate 210 is positioned on described multiple tops electrostatic chuck unit 312.Herein for example, upper substrate 210 can comprise common electrode (not shown) and colored filter (colorfilter) pattern (not shown) above.Upper substrate 210 is supported on top electrostatic chuck unit 312 by the electrostatic force of top electrostatic chuck unit 312.Herein, the part of the link 321 of the first power supply 320 can have spiral-shaped before top electrostatic chuck unit 312 moves down as shown in Figure 1.In addition, electric power is put on described multiple lower electrostatic cartridge unit 512 by described multiple second source 520.Then, lower substrate 220 is positioned in described multiple lower electrostatic cartridge unit 512.Herein for example, lower substrate 220 can comprise thin-film transistor (thin film transistor) (not shown) and pixel electrode (pixel electrode) (not shown).Lower substrate 220 is supported in lower electrostatic cartridge unit 512 by the electrostatic force of lower electrostatic cartridge unit 512.Then, the seal members such as such as sealant (sealant) are put on the periphery edge of lower substrate 220, and liquid crystal (liquid crystal) is dropped onto in lower substrate 220.
With reference to figure 6A, the upper substrate eyelid retractor 310 supporting upper substrate 210 is moved down by upper driver 400, and upper substrate 210 and lower substrate 220 are bonded to each other.Herein, exemplarily, upper substrate eyelid retractor 310 moves down, make upper substrate 210 and lower substrate 220 closer to each other.When upper substrate eyelid retractor 310 so moves down, the alteration of form of the link 321 of the first power supply 320 be connected with top electrostatic chuck unit 312.In other words, when upper substrate eyelid retractor 310 moves down, the shape of link 321 changes in the mode of the increase compared with initial condition of the distance between the two ends of link 321.
As shown in Figure 6B, lower substrate eyelid retractor 510 is rotated by lower driver 600 on X, Y and θ direction of principal axis, and then by upper substrate 210 in alignment with lower substrate 220.When bottom substrate holder 510 rotates on X, Y and θ direction of principal axis, the shape of the second link 521 of second source 520 is changed by the revolving force of the lower electrostatic cartridge unit 512 of lower substrate eyelid retractor 510.That is, the alteration of form of the link 521 of second source 520 be rotate from lower substrate eyelid retractor 510 before the different shape of the original shape of link 521.
Then, as shown in Figure 6 C, upper substrate eyelid retractor 310 is moved down further by upper driver 400, make upper substrate 210 and lower substrate 220 intimate contact with one another.When upper substrate eyelid retractor 310 so moves down, the alteration of form of the link 321 of the first power supply 320.That is, when upper substrate eyelid retractor 310 moves down further, the distance between the two ends of link 321 increases gradually.According to the present embodiment, the shape of link 321 finally becomes straight line.
In addition, upper substrate 210 and lower substrate 220 are solidified by the seal member that the periphery edge made along lower substrate 220 applies and are bonded to each other.
Therefore, because the shape of the link 321 of the first power supply 320 be connected with top electrostatic chuck unit 312 changes neatly according to moving down of top electrostatic chuck unit 312, therefore top electrostatic chuck unit 312 can easily move down.In addition, because the shape of the link 521 of second source 520 changes neatly according to moving down of lower electrostatic cartridge unit 512, therefore lower electrostatic cartridge unit 512 can easily move down.
Although, explain embodiment about the substrate bonding apparatus being used as example, the present invention is not limited thereto, but can be applicable to other power supplys various of the electrostatic chuck unit supply electric power to motion.
As mentioned above, according to one exemplary embodiment, by inserting conductor wire to improve the mobility of link in flexible pipe.Therefore, because the shape of link changes neatly when electrostatic chuck unit moves up and down or rotates, therefore electrostatic chuck unit can easily movement.In addition, in the unconstrained situation in installation site and region, this link can be installed.
In addition, owing to managing not outwardly, the special bellows therefore in order to this pipe closed is unnecessary.Therefore, extend the space outside chamber, and then facilitate the maintenance and repair of equipment.
Although describe substrate supporting unit with reference to specific embodiment and use the substrate-treating apparatus of described unit, it is not limited thereto.Therefore, it will be apparent to those skilled in the art that and can make various amendment and change to it when not departing from the spirit and scope of the present invention defined by appended claims.
Claims (9)
1. a substrate supporting unit, is characterized in that comprising:
Electrostatic chuck unit, it is configured as moveable also support substrates;
Link, its one end is connected to described electrostatic chuck unit to supply electric power to described electrostatic chuck unit, described link is configured to the movement according to described electrostatic chuck unit and in the inner space of chamber unit, changes shape neatly, the distance between the two ends of described link is made to move down along with described electrostatic chuck unit and increase and move up along with described electrostatic chuck unit and reduce
Described link comprises:
Flexible pipe, it is configured to define inner space;
Conductor wire, comprise the positive electricity polar curve and negative electrode wire that are inserted into described flexible pipe, and one end of described positive electricity polar curve and described negative electrode wire is connected respectively to described electrostatic chuck unit, and the other end of described positive electricity polar curve and described negative electrode wire protrudes from described chamber unit to be respectively positioned at part above described electrostatic chuck unit outer and be connected to power supply unit, wherein
The described inner space that described flexible pipe defines comprises independent space to receive described positive electricity polar curve and described negative electrode wire respectively;
First fixture, is arranged on platform, clamps the part being adjacent to electrostatic chuck unit of described link; And
Second fixture, to be arranged in described chamber unit and to be arranged in the inner space of described chamber unit, clamping the part being adjacent to chamber unit of described link.
2. substrate supporting unit according to claim 1, it is characterized in that described electrostatic chuck unit by move up and down and in rotating at least one and move.
3. substrate supporting unit according to claim 1, is characterized in that described flexible pipe is made up of insulating material.
4. substrate supporting unit according to claim 1, is characterized in that described conductor wire is changed shape neatly electric conducting material by the movement according to described electrostatic chuck unit is made.
5. substrate supporting unit according to claim 1, it comprises the first fixed part and the second fixed part further, in order to pass through partly to receive one end of described link and the other end to fix described link respectively.
6. a substrate-treating apparatus, is characterized in that comprising:
Chamber unit, it is configured to define inner space;
First and second, its respectively component capable of movable installed in described chamber unit with facing with each other and in order to support substrates;
Electrostatic chuck unit, it is installed to one or two in described First and described second movably to support described substrate by electrostatic force; And
Link, it is placed in described chamber unit, its one end is made to be connected to described electrostatic chuck unit to supply electric power to described electrostatic chuck unit, and its shape is changed in the described inner space of described chamber unit neatly according to the movement of described electrostatic chuck unit, the distance between the two ends of described link is made to move down along with described electrostatic chuck unit and increase and move up along with described electrostatic chuck unit and reduce
Described link comprises the flexible pipe being configured to define inner space, and conductor wire, described conductor wire comprises the positive electricity polar curve and negative electrode wire that are inserted into described flexible pipe, one end of described positive electricity polar curve and described negative electrode wire is connected respectively to described electrostatic chuck unit, and the other end of described positive electricity polar curve and described negative electrode wire protrudes from described chamber unit to be respectively positioned at part above described electrostatic chuck unit outer and be connected to power supply unit, wherein
The described inner space that described flexible pipe defines comprises independent space to receive described positive electricity polar curve and described negative electrode wire respectively;
First fixture, is arranged on described First or described second platform, clamps the part being adjacent to electrostatic chuck unit of described link; And
Second fixture, to be arranged in described chamber unit and to be arranged in the inner space of described chamber unit, clamping the part being adjacent to chamber unit of described link.
7. substrate-treating apparatus according to claim 6, it is characterized in that described First and described second by move up and down and in rotating at least one and move.
8. substrate-treating apparatus according to claim 6, is characterized in that described flexible pipe is made up of insulating material.
9. substrate-treating apparatus according to claim 6, is characterized in that described conductor wire is changed shape neatly electric conducting material by the movement according to described electrostatic chuck unit is made.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0134089 | 2009-12-30 | ||
| KR1020090134089A KR101152235B1 (en) | 2009-12-30 | 2009-12-30 | Unit for supporting a substrate and Apparatus for treating a substrate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102184880A CN102184880A (en) | 2011-09-14 |
| CN102184880B true CN102184880B (en) | 2015-05-13 |
Family
ID=44571034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010624115.XA Expired - Fee Related CN102184880B (en) | 2009-12-30 | 2010-12-29 | Unit for supporting substrate and equipment equipped with the unit for processing substrate |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101152235B1 (en) |
| CN (1) | CN102184880B (en) |
| TW (1) | TWI421977B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023516061A (en) | 2020-03-02 | 2023-04-17 | ラム リサーチ コーポレーション | Chiller open/close connector for substrate processing system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118865A (en) * | 2006-08-01 | 2008-02-06 | 应用材料股份有限公司 | Substrate support with a protective layer for plasma resistance |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5481494U (en) * | 1977-11-21 | 1979-06-09 | ||
| JPH0774234A (en) * | 1993-06-28 | 1995-03-17 | Tokyo Electron Ltd | Electrode structure of electrostatic chuck, its assembly method, its assembly jig and treatment apparatus |
| TW298660B (en) | 1995-06-13 | 1997-02-21 | Nisshin Denki Kk | |
| JP3484991B2 (en) * | 1998-09-09 | 2004-01-06 | トヨタ車体株式会社 | Cable wiring structure between fixed and movable members |
| JP4458113B2 (en) * | 2007-05-02 | 2010-04-28 | ソニー株式会社 | Data transfer circuit, solid-state imaging device, and camera system |
| KR100963439B1 (en) * | 2008-04-02 | 2010-06-17 | 에이피시스템 주식회사 | Substrate assembling apparatus |
-
2009
- 2009-12-30 KR KR1020090134089A patent/KR101152235B1/en active IP Right Grant
-
2010
- 2010-12-23 TW TW099145545A patent/TWI421977B/en not_active IP Right Cessation
- 2010-12-29 CN CN201010624115.XA patent/CN102184880B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118865A (en) * | 2006-08-01 | 2008-02-06 | 应用材料股份有限公司 | Substrate support with a protective layer for plasma resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI421977B (en) | 2014-01-01 |
| CN102184880A (en) | 2011-09-14 |
| KR101152235B1 (en) | 2012-06-08 |
| KR20110077490A (en) | 2011-07-07 |
| TW201123343A (en) | 2011-07-01 |
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