CN102175196B - Coupling matching device for electromagnetic ultrasonic thickness measuring probe - Google Patents
Coupling matching device for electromagnetic ultrasonic thickness measuring probe Download PDFInfo
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Abstract
The invention provides a coupling matching device for an electromagnetic ultrasonic thickness measuring probe, and the coupling matching device provided by the invention comprises an excitation signal input interface, an isolated interference prevention module, a thickness measuring probe interface, an impedance matching module, a clamping voltage limiting module and a signal conditioning module interface, wherein an excitation source is accessed to the excitation signal input interface so as to input original excitation signals; the isolated interference prevention module is used for shielding interference signals in the original excitation signals; the thickness measuring probe interface is used for connecting the electromagnetic ultrasonic thickness measuring probe and driving the electromagnetic ultrasonic thickness measuring probe through the excitation signals; the impedance matching module is used for carrying out impedance matching on the output impedance of the isolated interference prevention module and the input impedance of the thickness measuring probe interface; the clamping voltage limiting module is used for carrying out clamping voltage limiting on the echo signals of the electromagnetic ultrasonic thickness measuring probe; and the signal conditioning module interface is used for accessing a signal conditioning module and outputting the actual echo signals of the electromagnetic ultrasonic thickness measuring probe according to the echo signals subjected to clamping voltage limiting. The coupling matching device provided by the invention has the advantages of simple structure, accurate detection signal extraction and high transmission quality of the excitation signals, and can be used for the thickness measuring operation of a pulse echo technique transducer.
Description
Technical field
The present invention relates to the electromagnetic ultrasonic thickness measuring technical field of nondestructive testing, particularly a kind of coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe.
Background technology
Supersonic thickness meter carries out thickness measure according to the ultrasonic pulse principle of reflection; When probe ultrasonic waves transmitted pulse arrived material interface through testee, pulse was reflected back toward time that probe propagates in material through accurate measurement ultrasound wave and confirms the thickness of measured material.All ultrasound waves that can make all can adopt this principle to measure with the various materials of constant speed portion's propagation within it.If adopt the poly-talented transducer of pulse echo for electromagnetic ultrasonic thickness measuring instrument, the detecting instrument structure will obtain simplifying.
It is Detection of weak that the echoed signal of electromagnetic ultrasonic thickness measuring instrument detects; The exciting power signal is high-frequency, high voltage, high power signals; To the two be connected simultaneously the same port of pulse echo technology transducer; And guarantee that transducer obtains the desired voltage waveform; Will guarantee the transducer echoed signal complete signal output port that is sent to of trying one's best simultaneously, the equipment that also will avoid connecting signal output part is broken down by high-voltage and considers how to shield the electromagnetic interference (EMI) of exciting power input circuit to signal receiving circuit.
Existing electromagnetical ultrasonic thickness-measuring method can not be collected echoed signal; And coupling is not coupled between the driving source of thickness measuring instrument and the signal receiving device; Thereby can not make the echoed signal complete signal output port that is sent to of trying one's best; The equipment that is connected to signal output part simultaneously may be energized the high-voltage breakdown of voltage, and the electromagnetic interference (EMI) of being introduced by the pumping signal interface in addition also can influence the precision of measurement.
Summary of the invention
The object of the invention is intended to solve at least one of above-mentioned technological deficiency, propose especially a kind of simple in structure, signal transmission quality is high is used for the coupling coalignment of electromagnetic ultrasonic thickness measuring probe.
For achieving the above object; Embodiments of the invention propose a kind of coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe; Comprise: the pumping signal input interface; Said pumping signal input interface inserts driving source with the input original excitation signal, and wherein, said original excitation signal comprises pumping signal and undesired signal; Isolate anti-tampering module, the anti-tampering module of said isolation links to each other with said pumping signal input interface, is used for shielding the said undesired signal of said original excitation signal; The Thicknesser probe interface, said Thicknesser probe interface links to each other with the anti-tampering module of said isolation, is used to connect said electromagnetic ultrasonic thickness measuring probe, and is used to drive said electromagnetic ultrasonic thickness measuring probe from the said pumping signal of the anti-tampering module of said isolation; Impedance matching module; Said impedance matching module links to each other with said Thicknesser probe interface with the anti-tampering module of said isolation respectively; And said Thicknesser probe interface is parallelly connected with said impedance matching module, and said impedance matching module is used for impedance matching is carried out in the input impedance of the output impedance of the anti-tampering module of said isolation and said Thicknesser probe interface; Clamp pressure limiting module; Said clamp pressure limiting module links to each other with said impedance matching module; Be used for the echoed signal of said electromagnetic ultrasonic thickness measuring probe is carried out the clamp pressure limiting; Wherein, the echoed signal of said electromagnetic ultrasonic thickness measuring probe is that the echoed signal of said Thicknesser probe interface end voltage transfers to said clamp pressure limiting module through said impedance matching module; And signal condition module interface; Said signal condition module interface links to each other with said impedance matching module and said clamp pressure limiting module; Be used to insert the signal condition module, and export the actual ghosts signal of said electromagnetic ultrasonic thickness measuring probe according to the echoed signal after the said clamp pressure limiting.
The coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe according to the embodiment of the invention is applicable to electromagnetic acoustic pulse echo technology transducing type measuring thickness device, and suitable frequency range is 200kHz～2MHz.The coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention not only shields the undesired signal that the excitation input interface is introduced; And driving source and probe are carried out impedance matching so that probe obtains maximum excitation voltage; Simultaneously the clamp pressure limiting has been implemented in the output of echoed signal and can be energized the high-voltage breakdown of voltage with the signal conditioning circuit of guaranteeing to export signal and connecting, strong and weak electricity does not clash between the two.In addition, the coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention is simple in structure, can be used for the thickness measuring operation of paired pulses echo technique transducer, and detection signal extracts accurately pumping signal transmission quality height.
Aspect that the present invention adds and advantage part in the following description provide, and part will become obviously from the following description, or recognize through practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously with easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the structural representation according to the coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention;
Fig. 2 is the synoptic diagram according to the original excitation signal of the embodiment of the invention;
Fig. 3 is the synoptic diagram according to the drive signal at the electromagnetic ultrasonic thickness measuring probe two ends of the embodiment of the invention; And
Fig. 4 is the actual ghosts signal according to the electromagnetic ultrasonic thickness measuring probe two ends of the embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the present invention, and can not be interpreted as limitation of the present invention.
Referring to figs. 1 to Fig. 4 the coupling coalignment 1000 that is used for the electromagnetic ultrasonic thickness measuring probe according to the embodiment of the invention is described below.Wherein, the embodiment of the invention provides coupling coalignment 1000 to go for electromagnetic acoustic pulse echo technology transducing type measuring thickness device.
As shown in Figure 1, comprise pumping signal input interface 100, isolate anti-tampering module 200, Thicknesser probe interface 300, impedance matching module 400, clamp pressure limiting module 500 and signal condition module interface 600 according to the coupling coalignment 1000 that is used for electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention.
In one embodiment of the invention, pumping signal input interface 100, Thicknesser probe interface 300 and signal condition module interface 600 are bayonet nut connector (Bayonet Nut Connector, BNC) joint.
Pumping signal input interface 100 is used to insert driving source with the input original excitation signal, and wherein, original excitation signal comprises pumping signal and the undesired signal of being introduced by pumping signal input interface 100.In one embodiment of the invention, driving source can be power amplifier, promptly by power amplifier original excitation signal is provided.Fig. 2 shows a kind of form of original excitation signal, and horizontal ordinate is the time in Fig. 2, and unit is microsecond (μ s); Ordinate is a voltage amplitude, and unit is a volt (V).Certainly it will be appreciated by persons skilled in the art that Fig. 2 has only provided a kind of feasible form of original excitation signal, original excitation signal is not limited thereto, and can also be other forms of pumping signal.
Isolate anti-tampering module 200 and link to each other, can the undesired signal in the original excitation signal be shielded with pumping signal input interface 100.Isolate anti-tampering module 200 and comprise first group of diode assembly, wherein first group of diode assembly comprises first group of parallel diode 210 and second group of parallel diode 220.One end of first group of diode assembly links to each other with the heart yearn of pumping signal input interface 100, and the other end links to each other with the heart yearn of Thicknesser probe interface 300.
First group of parallel diode 210 comprises the first fast diode D4, the second fast diode D6, the 3rd fast diode D8, the 4th fast diode D10, and wherein the negative pole end parallel connection of the positive terminal of the negative pole end of the positive terminal of the first fast diode D4, the second fast diode D6, the 3rd fast diode D8 and the 4th fast diode D10 is as first end of first group of parallel diode 210.The positive terminal parallel connection of the negative pole end of the positive terminal of the negative pole end of the first fast diode D4, the second fast diode D6, the 3rd fast diode D8 and the 4th fast diode D10 is second end of first group of parallel diode 210.That is, the first fast diode D4, the second fast diode D6, the 3rd fast diode D8, the 4th fast diode D10 are carried out parallel connection according to positive and negative, positive and negative order.
Second group of parallel diode 220 comprises the 5th fast diode D9, the 6th fast diode D7, the 7th fast diode D5, the 8th fast diode D3, and wherein the negative pole end parallel connection of the positive terminal of the negative pole end of the positive terminal of the 5th fast diode D9, the 6th fast diode D7, the 7th fast diode D5 and the 8th fast diode D3 is as first end of second group of parallel diode 220.The positive terminal parallel connection of the negative pole end of the positive terminal of the negative pole end of the 5th fast diode D9, the 6th fast diode D7, the 7th fast diode D5 and the 8th fast diode D3 is second end of second group of parallel diode 220.That is, the 5th fast diode D9, the 6th fast diode D7, the 7th fast diode D5, the 8th fast diode D3 are carried out parallel connection according to positive and negative, positive and negative order.
First group of parallel diode 210 connected with second group of parallel diode 220, and particularly, second end of first group of parallel diode 210 links to each other with first end of second group of parallel diode 220.
In one embodiment of the invention, the D3～D10 in first group of diode assembly is the quick-speed turning on-off diode, in the interval that original excitation signal stops to import, can isolate the noise of being introduced by pumping signal input interface 100.In one embodiment of the invention, quick-speed turning on-off diode D3～D10 can be PH4148 type diode, its single tube is withstand voltage 400 volts, 2 amperes in maximum conducting electric current.
Thicknesser probe interface 300 links to each other with the anti-tampering module 200 of isolation, is used to connect the electromagnetic ultrasonic thickness measuring probe, and is used to the pumping signal driving electromagnetic ultrasonic thickness measuring probe of the anti-tampering module 200 of self-isolation.Incorporate Thicknesser probe interface 300 into isolating the pumping signal that obtains after the anti-tampering module 200 shielding undesired signals, with the drive signal of this pumping signal as electromagnetic ultrasonic thickness measuring probe two ends.Fig. 3 shows a kind of form of drive signal, and horizontal ordinate is the time in Fig. 3, and unit is microsecond (μ s); Ordinate is a voltage amplitude, and unit is a volt (V).Certainly it will be appreciated by persons skilled in the art that Fig. 3 has only provided a kind of feasible form of drive signal, drive signal is not limited thereto, and can also be other forms of drive signal.According to the difference of the original excitation signal of importing, the corresponding drive signal that obtains is also inequality.Compare with the original excitation signal among Fig. 2, the obvious filtering of drive signal among Fig. 3 noise signal, more smooth.
As shown in Figure 1, the shielding layer line of pumping signal input interface 100 links to each other with the shielding layer line of Thicknesser probe interface 300 and is connected to signal ground 700 jointly, thereby realizes public domain.
Isolate the pumping signal that obtains after the anti-tampering module 200 shielding undesired signals and incorporate impedance matching module 400 simultaneously into incorporating Thicknesser probe interface 300 into, wherein Thicknesser probe interface 300 is parallelly connected with impedance matching module 400.Impedance matching module 400 links to each other with Thicknesser probe interface 300 with the anti-tampering module 200 of isolation respectively; Be used for to isolate the output impedance of anti-tampering module 200 and impedance matching is carried out in the input impedance of Thicknesser probe interface 300; Be about to driving source and electromagnetic ultrasonic thickness measuring probe and carry out impedance matching, thereby make the electromagnetic ultrasonic thickness measuring probe obtain maximum driving voltage.
In one embodiment of the invention, impedance matching module 400 inductive impedance of input of inductive impedance and Thicknesser probe interface 300 that will isolate the output of anti-tampering module 200 carries out impedance matching.
One end of the shielding layer line 421 of noninductive coil 420 links to each other with the shielding layer line of signal condition module interface 600; The other end links to each other with the shielding layer line of the thick probe interface 300 of side; Thereby will do to be connected altogether with impedance matching module 400 by the signal condition module that signal condition module interface 600 inserts, be connected to signal ground 700 jointly.
Because noninductive coil 420 has capacity effect; The impedance matching module of forming through noninductive coil 420 and build-out resistor 410 400 can be optimized the terminal voltage of electromagnetic ultrasonic thickness measuring probe, thereby the thickness measuring ability of electromagnetic ultrasonic thickness measuring probe is adjusted at utmost.
In one embodiment of the invention, noninductive coil 420 is formed by the concentric cable coiling, and wherein, the insulating layer material of concentric cable can be tygon.
In one embodiment of the invention, the diameter of the heart yearn 422 of noninductive coil 420 is 0.33 millimeter, and the diameter of shielding layer line 421 can be 2 millimeters, and the unit length wave impedance is about 70.887 ohm, and axial length is 10 centimetres.
Can not be energized the high-voltage breakdown of voltage in order to ensure the signal condition module that inserts by signal condition module interface 600, need carry out the clamp pressure limiting the echoed signal of electromagnetic ultrasonic thickness measuring probe.Particularly, the echoed signal of Thicknesser probe interface 300 terminal voltages is transferred to clamp pressure limiting module 500 through impedance matching module 400, finally export signal condition module interface 600 to.
Clamp pressure limiting module 500 and impedance matching module 400 polyphones; Be used for the echoed signal of electromagnetic ultrasonic thickness measuring probe is carried out the clamp pressure limiting; Wherein, the echoed signal of electromagnetic ultrasonic thickness measuring probe is that the echoed signal of Thicknesser probe interface 300 terminal voltages transfers to clamp pressure limiting module 500 through impedance matching module 400.
Clamp pressure limiting module 500 comprises second group of diode assembly, and wherein second group of diode assembly comprises the 9th fast diode D1 and the tenth fast diode D2.The positive terminal of the 9th fast diode D1 is parallelly connected with the negative pole end of the tenth fast diode D2 to be first end of second group of diode assembly, and the negative pole end of the 9th fast diode D1 is parallelly connected with the positive terminal of the tenth fast diode D2 to be second end of second group of diode assembly.That is, the positive terminal with the 9th fast diode D1 is connected according to just antiparallel mode with the tenth fast diode D2.First end of second group of diode assembly links to each other with the shielding layer line of signal condition module interface 600, and second end links to each other with the heart yearn of signal condition module interface 600.
D1～D2 in second group of diode assembly is the quick-speed turning on-off diode.In one embodiment of the invention, quick-speed turning on-off diode D1～D2 can be PH4148 type diode, its single tube is withstand voltage 400 volts, 2 amperes in maximum conducting electric current.
Through just antiparallel second group of diode assembly the echoed signal of electromagnetic ultrasonic thickness measuring probe is carried out the clamp pressure limiting, thereby can guarantee that signal condition module interface 600 output voltage of signals do not have high voltage, and then protected late-class circuit.
Signal condition module interface 600 links to each other with impedance matching module 400 and clamp pressure limiting module 500, is used to insert the signal condition module, and according to the actual ghosts signal by the output of the echoed signal after the 500 clamp pressure limitings of clamp pressure limiting module electromagnetic ultrasonic thickness measuring probe.
Particularly, the echoed signal after the clamp pressure limiting is introduced signal condition module interface 600 from clamp pressure limiting module 500 two ends.When the echoed signal of electromagnetic ultrasonic thickness measuring probe was very weak, the diode of clamp pressure limiting module 500 ended, and the voltage signal of signal condition module interface 600 outputs this moment is the actual ghosts signal at electromagnetic ultrasonic thickness measuring probe two ends.As shown in Figure 4; Horizontal ordinate is the time; Unit is a millisecond (ms), and ordinate is a voltage magnitude, and unit is a volt (V); Because the electromagnetic ultrasonic thickness measuring of embodiment of the invention probe is parallelly connected with resonant capacitance, so the pop one's head in actual ghosts signal at two ends of electromagnetic ultrasonic thickness measuring is a discontinuous pulses bunch signal such as discontinuous.Certainly it will be appreciated by persons skilled in the art that Fig. 4 has only provided a kind of feasible form of the actual ghosts signal at electromagnetic ultrasonic thickness measuring probe two ends, the actual ghosts signal is not limited thereto, and can also be other forms of signal.According to the difference of electromagnetic ultrasonic thickness measuring probe annexation, the corresponding actual ghosts signal that obtains is also inequality.
The coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe according to the embodiment of the invention is applicable to electromagnetic acoustic pulse echo technology transducing type measuring thickness device, and suitable frequency range is 200kHz～2MHz.The coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention not only shields the undesired signal that the excitation input interface is introduced; And driving source and probe are carried out impedance matching so that probe obtains maximum excitation voltage; Simultaneously the clamp pressure limiting has been implemented in the output of echoed signal and can be energized the high-voltage breakdown of voltage with the signal conditioning circuit of guaranteeing to export signal and connecting, strong and weak electricity does not clash between the two.In addition, the coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe of the embodiment of the invention is simple in structure, can be used for the thickness measuring operation of paired pulses echo technique transducer, and detection signal extracts accurately pumping signal transmission quality height.
In the description of this instructions, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means the concrete characteristic, structure, material or the characteristics that combine this embodiment or example to describe and is contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete characteristic, structure, material or the characteristics of description can combine with suitable manner in any one or more embodiment or example.
Although illustrated and described embodiments of the invention; For those of ordinary skill in the art; Be appreciated that under the situation that does not break away from principle of the present invention and spirit and can carry out multiple variation, modification, replacement and modification that scope of the present invention is accompanying claims and be equal to and limit to these embodiment.
Claims (9)
1. a coupling coalignment that is used for the electromagnetic ultrasonic thickness measuring probe is characterized in that, comprising:
Pumping signal input interface, said pumping signal input interface insert driving source with the input original excitation signal, and wherein, said original excitation signal comprises pumping signal and undesired signal;
Isolate anti-tampering module, the anti-tampering module of said isolation links to each other with said pumping signal input interface, is used for shielding the said undesired signal of said original excitation signal;
The Thicknesser probe interface, said Thicknesser probe interface links to each other with the anti-tampering module of said isolation, is used to connect said electromagnetic ultrasonic thickness measuring probe, and is used to drive said electromagnetic ultrasonic thickness measuring probe from the said pumping signal of the anti-tampering module of said isolation;
Impedance matching module; Said impedance matching module links to each other with said Thicknesser probe interface with the anti-tampering module of said isolation respectively; And said Thicknesser probe interface is parallelly connected with said impedance matching module, and said impedance matching module will be used for the output impedance of the anti-tampering module of said isolation and impedance matching is carried out in the input impedance of said Thicknesser probe interface;
Clamp pressure limiting module; Said clamp pressure limiting module links to each other with said impedance matching module; Be used for the echoed signal of said electromagnetic ultrasonic thickness measuring probe is carried out the clamp pressure limiting; Wherein, the echoed signal of said electromagnetic ultrasonic thickness measuring probe is that the echoed signal of said Thicknesser probe interface end voltage transfers to said clamp pressure limiting module through said impedance matching module; And
The signal condition module interface; Said signal condition module interface links to each other with said impedance matching module and said clamp pressure limiting module; Be used to insert the signal condition module, and export the actual ghosts signal of said electromagnetic ultrasonic thickness measuring probe according to the echoed signal after the said clamp pressure limiting.
2. coupling coalignment as claimed in claim 1 is characterized in that, the anti-tampering module of said isolation comprises first group of diode assembly; Said first group of diode assembly comprises first group of parallel diode and second group of parallel diode; Said first group of parallel diode connected with said second group of parallel diode, and wherein, an end of said first group of diode assembly links to each other with said pumping signal input interface; The other end links to each other with said Thicknesser probe interface
Wherein, Said first group of parallel diode comprises first fast diode, second fast diode, the 3rd fast diode and the 4th fast diode; Wherein, The negative pole end parallel connection of the positive terminal of the negative pole end of the positive terminal of said first fast diode, said second fast diode, said the 3rd fast diode and said the 4th fast diode is as first end of said first group of parallel diode, and the parallel connection of the positive terminal of the positive terminal of the negative pole end of said first fast diode, said second fast diode, the negative pole end of said the 3rd fast diode and said the 4th fast diode is second end of said first group of parallel diode;
Said second group of parallel diode comprises the 5th fast diode; The 6th fast diode; The 7th fast diode and the 8th fast diode; Wherein, The positive terminal of said the 5th fast diode; The negative pole end of said the 6th fast diode; The negative pole end parallel connection of the positive terminal of said the 7th fast diode and said the 8th fast diode is as first end of said second group of parallel diode; The negative pole end of said the 5th fast diode; The positive terminal of said the 6th fast diode; The positive terminal parallel connection of the negative pole end of said the 7th fast diode and said the 8th fast diode is second end of said second group of parallel diode
Wherein, second end of said first group of parallel diode links to each other with first end of said second group of parallel diode.
3. coupling coalignment as claimed in claim 1; It is characterized in that; The shielding layer line of said pumping signal input interface links to each other with the shielding layer line of said Thicknesser probe interface, and the shielding layer line of the shielding layer line of said pumping signal input interface and said Thicknesser probe interface is connected to signal ground.
4. coupling coalignment as claimed in claim 1; It is characterized in that; Said impedance matching module comprises build-out resistor and noninductive coil, and wherein, first end of said build-out resistor links to each other with said Thicknesser probe interface; Second end of said build-out resistor links to each other with the heart yearn of first end of said noninductive coil; The heart yearn of second end of said noninductive coil links to each other with the heart yearn of said signal condition module interface, and an end of the shielding layer line of said noninductive coil links to each other with the shielding layer line of said signal condition module interface, and the other end links to each other with the shielding layer line of said Thicknesser probe interface.
5. coupling coalignment as claimed in claim 4 is characterized in that said noninductive coil is formed by the concentric cable coiling.
6. coupling coalignment as claimed in claim 5 is characterized in that, the material of the insulation course of said concentric cable is a tygon.
7. coupling coalignment as claimed in claim 1; It is characterized in that; Said clamp pressure limiting module comprises second group of diode assembly; Wherein, Said second group of diode assembly comprises the 9th fast diode and the tenth fast diode, and the positive terminal of wherein said the 9th fast diode is parallelly connected with the negative pole end of said the tenth fast diode to be first end of said second group of diode assembly, and the negative pole end of said the 9th fast diode is parallelly connected with the positive terminal of said the tenth fast diode to be second end of said second group of diode assembly; First end of said second group of diode assembly links to each other with the shielding layer line of said signal condition module interface, and second end of said second group of diode assembly links to each other with the heart yearn of said signal condition module interface.
8. coupling coalignment as claimed in claim 1 is characterized in that, the said actual ghosts signal of said signal condition module interface output is a discontinuous pulses bunch signal such as discontinuous.
9. coupling coalignment as claimed in claim 1 is characterized in that, said pumping signal input interface, said Thicknesser probe interface and said signal condition module interface are bayonet nut connector.
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| CN113922181B (en) * | 2021-10-12 | 2024-03-12 | 无锡贵聚智能化科技有限公司 | Electromagnetic interference prevention method for magnetic attraction socket |
| CN114777696B (en) * | 2022-05-07 | 2023-08-11 | 中国科学院声学研究所 | Ultrasonic thickness measuring method |
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| US4481824A (en) * | 1981-09-04 | 1984-11-13 | Hitachi, Ltd. | Weld detector |
| EP0607481A1 (en) * | 1993-01-19 | 1994-07-27 | Electronic Development, Inc. | Apparatus and method for electromagnetical field susceptibility testing |
| CN2779421Y (en) * | 2005-01-14 | 2006-05-10 | 廊坊市万科石油天然气技术工程有限公司 | Active transmitting-receiving probe for downfield NMR |
| CN101871977A (en) * | 2009-04-24 | 2010-10-27 | 陕西海泰电子有限责任公司 | High-voltage transient electromagnetic pulse detector |
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2011
- 2011-01-20 CN CN201110023402XA patent/CN102175196B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4481824A (en) * | 1981-09-04 | 1984-11-13 | Hitachi, Ltd. | Weld detector |
| EP0607481A1 (en) * | 1993-01-19 | 1994-07-27 | Electronic Development, Inc. | Apparatus and method for electromagnetical field susceptibility testing |
| CN2779421Y (en) * | 2005-01-14 | 2006-05-10 | 廊坊市万科石油天然气技术工程有限公司 | Active transmitting-receiving probe for downfield NMR |
| CN101871977A (en) * | 2009-04-24 | 2010-10-27 | 陕西海泰电子有限责任公司 | High-voltage transient electromagnetic pulse detector |
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