CN102170274A - Electronic component and mounting structure and mounting method thereof - Google Patents
Electronic component and mounting structure and mounting method thereof Download PDFInfo
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- CN102170274A CN102170274A CN2011100358056A CN201110035805A CN102170274A CN 102170274 A CN102170274 A CN 102170274A CN 2011100358056 A CN2011100358056 A CN 2011100358056A CN 201110035805 A CN201110035805 A CN 201110035805A CN 102170274 A CN102170274 A CN 102170274A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Microelectronics & Electronic Packaging (AREA)
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
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Abstract
The invention provides an electronic component capable of improving the connection reliability with a connecting electrode, a mounting structure and a mounting method. The electronic component comprises a quartz plate (11) with regulated function, a projection electrode (14) formed on the quartz plate (11), and a sticking layer (15) which maintains the contacting state between the projection electrode (14) and connecting electrodes (33, 34). The projection electrode (14) has a resin core (24) with elasticity and conductive films (25, 26) disposed on the surface of the resin core (24). Through the elastic deformation of the resin core (24), the conductive films (25, 26) are in a conductive contact with the connecting electrodes (33, 34).
Description
The present invention's application number that to be applicant Seiko Epson Corp propose on October 17th, 2008 be 200810166689.X, denomination of invention divides an application for " electronic unit and mounting structure thereof and installation method " patent application.
Technical field
The present invention relates to electronic unit and mounting structure and installation methods such as a kind of for example crystal oscillator.
Background technology
For example in the encapsulation of the electrostriction element (electronic unit) that comprises crystal oscillator etc., exciting electrode that is provided with in the crystal oscillator and the connection electrode that is used to be connected to the drive circuit that crystal oscillator is driven, by the electrocondution slurry of scolder etc., under the conduction state of contact fixing (for example, with reference to patent documentation 1).
Patent documentation 1: Japanese kokai publication hei 11-261360 communique
Yet, the problem below in above-mentioned existing crystal oscillator, also existing.Also promptly, when having concaveconvex shape on the surface of connection electrode, the problem that exists the contact area between exciting electrode and the connection electrode to diminish.And, the crystal oscillator when expectation has applied the impact of drop impact etc. to encapsulation and the raising of the connection reliability between the connection electrode.
Summary of the invention
The present invention is in view of above-mentioned existing and make, and its purpose is to provide a kind of electronic unit and the mounting structure and installation method that can improve with the connection reliability of connection electrode.
The present invention has adopted following structure in order to solve above-mentioned problem.Also promptly, the electronic unit electronic unit that the present invention is correlated with is the electronic unit that is connected to the connection electrode of drive circuit conducting, it is characterized in that described electronic unit possesses: the functional sheet with function of regulation; Be formed on the salient pole of this functional sheet; And maintaining part, it keeps the conduction contact condition of this salient pole and described connection electrode; Described salient pole possesses the rubber-like core and is arranged on the conducting film on the surface of this core, and by the strain of described core, described conducting film contacts with described connection electrode conduction.
In the present invention, because core generation strain, even therefore have convex form on the connection electrode, conducting film also conducts electricity well with enough contacts area with connection electrode and contacts.In addition, by maintaining part, keep conducting film to contact with conduction between the connection electrode.Thereby, between conducting film and connection electrode, can obtain high connection reliability.
Also promptly, when the installation of electronic unit, when being pressed in connection electrode, core is imitated the surface configuration of connection electrode and strain is taken place with salient pole.Accompany therewith, the conducting film that is formed on the surface of core is also imitated the surface configuration of connection electrode and is deformed.Therefore, the contact area between conducting film and the connection electrode increases.And, keep contact condition between conducting film and the connection electrode by maintaining part.Therefore, the connection reliability between conducting film and the connection electrode improves.Here, even on the contact position between salient pole and the connection electrode, apply impact,, thereby can absorb this impact because of salient pole generation strain.Thus, can obtain high resistance to impact on the contact position between salient pole and the connection electrode.
In addition, form maintaining part and salient pole, can select best material to each member thus with different members.Thus, between salient pole and connection electrode, can obtain high connection reliability.
In addition, can preferably adopt described functional sheet by the structure of cantilever support in the present invention.
Thus, in the present invention, affined position is one-sided, so the mechanical degree of freedom of functional sheet is improved, and can Min. ground reduces loss of power (the escaping of vibration, omission etc.).
Have again,, can preferably adopt near the electrically conducting contact of described conducting film and described connection electrode by the structure of cantilever support as described functional sheet.
Thus, in the present invention, owing to adopted only one-sided connection, therefore be connected with face, the two ends syndeton compares, even when having the difference of thermal coefficient of expansion between substrate with connection electrode etc. and functional sheet, because thermal stress can not be delivered to connecting portion, functional sheet, it is elongated therefore can to prolong connection lifetime, and improve stability as electronic unit, can be to unnecessary thermal stress of generation such as substrates yet.Have again, can also suppress to be delivered to the mechanical deformation, thermal deformation of functional sheet and the stress influence that produces via connecting portion.
In addition, in above-mentioned structure, preferably can adopt described functional sheet on the position of the node of the vibration of this functional sheet by the structure of cantilever support.
Thus, in the present invention, the vibration of attenuation function sheet in the support portion can also improve the Q value (conversion efficiency) of electromechanical vibration.
In addition, as electronic unit of the present invention, described functional sheet also can constitute utilization to the energising of described conducting film and produce the electrostriction element of displacement.
In addition, in the electronic unit of the present invention, described functional sheet also can be a quartz plate.
In the present invention, adopted quartz plate, constituted crystal oscillator thus as functional sheet.
In addition, in the electronic unit of the present invention, described maintaining part also can be an adhesive linkage.
In the present invention, come bonding conducting film and connection electrode, keep thus conducting electricity between conducting film and the connection electrode and contact by adhesive linkage.
In addition, in the electronic unit of the present invention, described adhesive linkage also can cover described conducting film.
In the present invention, when the installation of electronic unit, when being pressed in connection electrode, because of adhesive linkage is extruded, and conducting film contacts with the connection electrode conduction with salient pole.
In addition, in the electronic unit of the present invention, the part of described conducting film also can be exposed from described adhesive linkage.
In the present invention, when the installation of electronic unit, salient pole when being pressed in connection electrode, because conducting film exposes from adhesive linkage, therefore, need not be pushed adhesive linkage, conducting film is easily conducted electricity with connection electrode contact.Thereby the connection reliability between conducting film and the connection electrode further improves.
In addition, in the electronic unit of the present invention, preferably described adhesive linkage and described conducting film are spaced apart.
In the present invention, when the installation of electronic unit, with salient pole when being pressed in connection electrode because adhesive linkage is spaced apart with conducting film, therefore with above-mentioned equally, conducting film is easily conducted electricity with connection electrode contact.Thereby, further improve the connection reliability between conducting film and the connection electrode.
In addition, the mounting structure of electronic unit of the present invention is characterized in that, aforesaid electronic unit is installed in the substrate with described connection electrode.
In addition, the installation method of electronic unit of the present invention is characterized in that, has the operation that aforesaid electronic unit is installed in the substrate with described connection electrode.
Thus, in the present invention, on the contact position between salient pole and the connection electrode, can obtain high resistance to impact, and, form maintaining part and salient pole with different members, can select best material to each member thus, between salient pole and connection electrode, can obtain high connection reliability.Have again, in the present invention, by the cantilever support functional sheet, the mechanical degree of freedom of functional sheet is improved, can Min. ground suppress loss of power (the escaping of vibration, omission etc.), in addition, can prolong connection lifetime, can improve stability, and also can not produce unnecessary thermal stress, can also suppress to be delivered to the mechanical deformation, thermal deformation of functional sheet and the stress influence that produces via connecting portion to substrate etc. as electronic unit.
In addition, electronic unit among the present invention, be meant the parts of finding the function stipulated by electromagnetic action, it comprise by the electric power effect produce vibration etc. displacement electrostriction element and pass through the magnetostriction element that magneticaction produces the displacement of vibration etc.
Description of drawings
Fig. 1 is the sectional view of the crystal oscillator encapsulation in expression first execution mode.
Fig. 2 is the plane graph of Fig. 1.
Fig. 3 is the stereogram of expression crystal oscillator.
Fig. 4 is the process chart of the installation method of expression crystal oscillator.
Fig. 5 is the stereogram that expression possesses the mobile phone of crystal oscillator.
Fig. 6 is the stereogram of the crystal oscillator in expression second execution mode.
Fig. 7 is the process chart of the installation method of expression crystal oscillator.
Fig. 8 is the stereogram of the crystal oscillator in expression the 3rd execution mode.
Fig. 9 is the process chart of the installation method of expression crystal oscillator.
1,110,120-crystal oscillator (electrostriction element, electronic unit) among the figure:; 11-quartz plate (functional sheet); The 14-salient pole; 15,111,121-adhesive linkage (maintaining part); 24-resin core (core); 25,26-conducting film; 33,34-connection electrode
Embodiment
(first execution mode)
Below, with reference to the accompanying drawings, first execution mode of the electronic unit among the present invention is described.In addition, in each drawing of Shi Yonging, become discernible size in the following description, changed engineer's scale aptly in order to make each member.Here, Fig. 1 is that the expression sectional view that possesses the crystal oscillator encapsulation of crystal oscillator, plane graph, Fig. 3 that Fig. 2 is Fig. 1 are the stereograms of expression crystal oscillator.
At first, the crystal oscillator encapsulation 2 that has as the crystal oscillator (electrostriction element) 1 of the electronic unit among the present invention is described.Crystal oscillator encapsulation 2 possesses the container 3 of crystal oscillator 1 and sealing crystal oscillator 1 as Fig. 1 and shown in Figure 2.
Crystal oscillator 1 has pair of exciting 12,13, salient pole 14 and the adhesive linkage (maintaining part) 15 of quartz plate (functional sheet) 11, excitation quartz plate 11 as Fig. 1～shown in Figure 3.
Pair of exciting 12,13 is formed by for example Al electric conducting materials such as (aluminium) respectively, and is formed at the one side of quartz plate 11.And exciting electrode 12 is formed up to arm 22 from base portion 21 in the one side of quartz plate 11 (among Fig. 1, below).In addition, exciting electrode 13 is formed up to arm 23 from base portion 21 in the one side of quartz plate 11.
Resin core 24 is formed by photosensitive insulating resin, thermosetting insulating resins such as polyimide resin, acrylic resin, phenol (phenol) resin, silicones, silicon sex change polyimide resin, epoxy resin.
In addition, resin core 24 before crystal oscillator 1 is installed in container body 31, forms roughly semicolumn (Pu Pike as shown in Figure 3) shape, in the one side of base portion 21 along with a pair of arm 22,23 bearing of trend separately roughly quadrature direction and extend.Here, roughly semi-cylindrical is meant that the inner face (bottom surface) that joins with quartz plate 11 is that plane and non-contacting exterior side are the columnar shape of flexure plane.Particularly, cross section be can list as semi-cylindrical roughly and semicircle shape roughly, roughly semiellipse shape, trapezoidal shape roughly are.
And, resin core 24 as shown in Figure 1, after crystal oscillator 1 is installed to container body 31, by with crystal oscillator 1 relatively by being pressed in container body 31, the connection electrode 33,34 that resin core 24 is imitated narrate later separately surface configuration and strain takes place.
In addition, resin core 24 utilizes photoetching technique, etching technique to form.In addition, material of resin core 24 (hardness) and shape are that shape etc. according to each connection electrode 33,34 is selected aptly, designed.
Pair of conductive film 25,26 respectively as shown in Figure 3, in the surperficial devices spaced apart of resin core 24 and form, pair of conductive film 25,26 is formed by for example Au (gold), TiW (titanium/tungsten), Cu (copper), Cr (chromium), Ni (nickel), Ti, W, NiV (nickel/vanadium), Al, Pd (palladium), kupper solder metal, alloys such as (Pb free solder) respectively, both can be the individual layer member of these materials, the Mnltilayered structures of multiple material that can be stacked also.
Conducting film 25 forms continuously with exciting electrode 12, and with exciting electrode 12 conductings.In addition, as shown in Figure 1, after crystal oscillator 1 is installed to container body 31, make conducting film 25 imitate the surface configuration of connection electrode 33 to deform, and then conducting film 25 is contacted with connection electrode 33 conductions because of strain takes place resin core 24.
And conducting film 26 forms continuously with exciting electrode 13, and with exciting electrode 13 conductings.In addition, after crystal oscillator 1 is installed to container body 31, make conducting film 26 imitate the surface configuration of connection electrode 34 to deform, and then conducting film 26 is contacted with connection electrode 34 conductions because of strain takes place resin core 24.
Here, each conducting film the 25, the 26th is undertaken by adopting sputtering method etc. for example that the laggard capable composition of film forming (patterning) forms.In addition, each conducting film 25,26 utilize the stacked upper layer film of electrolysis plating to form after also can utilize sputtering method, electroless plating to apply to form basilar memebrane.In addition, each conducting film 25,26, same with resin core 24, according to shape of each connection electrode 33,34 etc., select aptly, design.Wherein, as back narration because resin core 24 imitates the shape of connection electrode 33,34 that strain takes place, therefore for each conducting film 25,26 preferably the good especially Au of employing ductility form.Here, when conducting film 25,26 has stepped construction, preferably form its outermost layer by Au.
And, the crystal oscillator 1 of this structure (quartz plate 11) is as Fig. 1 and shown in Figure 2, near the electrically conducting contact between conducting film 25,26 and connection electrode 33,34 (among Fig. 1 and Fig. 2, left end), become the cantilevered support structure of having only base portion 21 to be supported by container 3.
More specifically, adopted the vibration characteristics of crystal oscillator 1 based crystal sheet 11, on the position of the node of the vibration of the amplitude minimum when these quartz plate 11 vibrations, with the structure of above-mentioned electrically conducting contact as the setting of cantilever support portion.
Each connection electrode 33,34 is formed by the electric conducting material of metal etc., and such as be the stacked structure of Au film on the Ni plating layer that forms on W film for example, the wiring through being formed on container body 31 (omitting diagram) is connected respectively with each terminal electrode 35,36.
Then, with reference to Fig. 4, the installation method of crystal oscillator 1 is described.Here, Fig. 4 is the sectional view of the salient pole of expression when crystal oscillator is installed to container body.
At first, the salient pole 14 that is arranged on crystal oscillator 1 is contacted, is pressed into the connection electrode 33,34 (Fig. 4 (a), Fig. 4 (b)) that forms on the container body 31.
At this moment, strains take place and imitate the shape of each connection electrode 33,34 in resin core 24.
And conducting film 25 is followed the strain of resin core 24 and is imitated the surface configuration of connection electrode 33, and conducting film 26 is imitated the surface configuration of connection electrode 34.In addition, the adhesive linkage 15 that covers conducting film 25,26 is extruded gradually along the outer peripheral face of resin core 24.Therefore, at least a portion of each conducting film 25,26 that is covered by adhesive linkage 15 is exposed and is contacted with each connection electrode 33,34 from adhesive linkage 15.Thus, conducting film 25 and connection electrode 33 and conducting film 26 and connection electrode 34 are conducted electricity with enough contacts area respectively and are contacted.
And, adhesive linkage 15 adhesive bumps electrodes 14 and connection electrode 33,34, conducting film 25 and connection electrode 33 and conducting film 26 and connection electrode 34 keep in touch state respectively.
By the way, crystal oscillator 1 is installed in the container body 31.Afterwards, engage container body 31 and seal crystal oscillator 1 with lid 32.By like this, form crystal oscillator encapsulation 2.
Here, the coupling part between crystal oscillator 1 and container body 31 has for example applied drop impact etc. when impacting, and resin core 24 strains takes place absorbs this impact.
In addition, in the above-mentioned crystal oscillator 1, near the place of quartz plate 11 electrically conducting contact between conducting film 25,26 and the connection electrode 33,34 is by cantilever support, therefore the mechanical degree of freedom of the front of quartz plate 11 is improved, and can Min. ground suppresses loss of power (the escaping of vibration, omission etc.).In addition, crystal oscillator 1 is only with the one-sided container body 31 that is connected in, therefore, be connected with face, the two ends syndeton compares, even when between member with connection electrode 33,34 etc. and crystal oscillator 1 (quartz plate 11), having the difference of thermal coefficient of expansion, because thermal stress can not be delivered to connecting portion, quartz plate 11, therefore can prolong connection lifetime, can improve stability, and can not produce unnecessary thermal stress the member of substrate etc. as electronic unit.Have again, can also suppress to be delivered to the mechanical deformation, thermal deformation of quartz plate 11 and the stress influence that produces via connecting portion.
Have again, in the above-mentioned crystal oscillator 1 since on the position of the node of the vibration of quartz plate 11 by cantilever support, so suppress the decay of the vibration of quartz plate 11 in the support portion, can also improve the Q value (conversion efficiency) of electromechanical vibration.
(electronic equipment)
And, as above-mentioned crystal oscillator 1, adopt mobile phone 100 for example shown in Figure 5.Here, Fig. 5 is the stereogram of expression mobile phone.
The main part that this mobile phone 100 possesses display part 101, a plurality of operation push-button 102, tin nozzle 103, microphone mouth 104 and has above-mentioned display part 101.
As mentioned above, according to the crystal oscillator in the present embodiment 1, resin core 24 sends strains, and each conducting film 25,26 and connection electrode 33,34 are conducted electricity well with enough contacts area and contacted.And, by adhesive linkage 15, keep conducting film 25,26 to contact with conduction between the connection electrode 33,34.Thereby, between conducting film 25,26 and connection electrode 33,34, can obtain high connection reliability.
In addition, according to the crystal oscillator in the present embodiment 1, the mechanical degree of freedom of the front of quartz plate 11 is improved, can Min. ground suppress loss of power (the escaping of vibration, omission etc.), even and when between member with connection electrode 33,34 etc. and crystal oscillator 1 (quartz plate 11), having the difference of thermal coefficient of expansion, therefore thermal stress can not be delivered to connecting portion, quartz plate 11, can prolong connection lifetime and can improve stability as electronic unit.Have again, in the present embodiment, also can not produce unnecessary thermal stress, can also suppress to be delivered to the mechanical deformation, thermal deformation of quartz plate 11 and the stress influence that produces via connecting portion to the member of substrate etc.
(second execution mode)
Then, with reference to accompanying drawing, second execution mode of the crystal oscillator among the present invention is described.Here, Fig. 6 is that stereogram, Fig. 7 that expression is installed to the crystal oscillator before the container body are the sectional views of the salient pole of expression when crystal oscillator is installed to container body.In addition, in the present embodiment, owing to compare with the first above-mentioned execution mode, therefore the shape difference of adhesive linkage is that the center describes with this point, gives same-sign to the structural element that illustrates in the above-mentioned execution mode, and it is omitted explanation.
In the crystal oscillator 110 in the present embodiment, as shown in Figure 6, before crystal oscillator 110 was installed to container body 31, exposed from adhesive linkage 111 at the top of each conducting film 25,26.
In the crystal oscillator 110 of this structure, the salient pole 14 that is arranged on crystal oscillator 110 is contacted, is pressed into the connection electrode 33,34 (Fig. 7 (a), Fig. 7 (b)) that is provided with in the container body 31.
At this moment, strains take place and imitate the shape of each connection electrode 33,34 in resin core 24.And conducting film 25 is accompanied by the strain of resin core 24 and imitates the shape of connection electrode 33, and conducting film 26 is imitated the shape of connection electrode 34.Here, the part of each conducting film 25,26 is exposed from adhesive linkage 111, therefore salient pole 14 is touched connection electrode at 33,34 o'clock, and each conducting film 25,26 contacts with each connection electrode 33,34.
And adhesive linkage 111 adhesive bumps electrodes 14 and connection electrode 33,34 keep conducting film 25 and connection electrode 33 and conducting film 26 and connection electrode 34 contact condition separately.
By the way, crystal oscillator 110 is installed in the container body 31.
As mentioned above, crystal oscillator 110 in the present embodiment, also produce and above-mentioned same effect, the effect of first execution mode, but, owing in advance the part of each conducting film 25,26 is exposed from adhesive linkage 111, can further improve conducting film 25 and connection electrode 33 and conducting film 26 and connection electrode 34 connection reliability in separately when therefore installing.
(the 3rd execution mode)
Then, with reference to accompanying drawing, the 3rd execution mode of the crystal oscillator among the present invention is described.Here, Fig. 8 is that stereogram, Fig. 9 that expression is installed to the crystal oscillator before the container body are the sectional views of the salient pole of expression when crystal oscillator is installed to container body.In addition, in the present embodiment, compare with the first above-mentioned execution mode, therefore the shape difference of adhesive linkage is that the center describes with this point, and gives identical symbol to the structural element that illustrates in the above-mentioned execution mode, and it is omitted explanation.
In the crystal oscillator 120 in the present embodiment, as shown in Figure 8, before crystal oscillator 120 is installed to container body 31, separates with each conducting film 25,26 and adhesive linkage 121 is set.
With the direction of the bearing of trend quadrature of resin core 24 on, with form a pair of adhesive linkage 121 via resin core 24 near the side that a side of arms 22,23 separates.And adhesive linkage 121 forms the quadrangular shape, with the periphery position spaced of each conducting film 25,26 on extend along resin core 24.
In the crystal oscillator 120 of this structure, the salient pole 14 that also will be arranged on crystal oscillator 120 contacts, is pressed into the connection electrode 33,34 (Fig. 9 (a), Fig. 9 (b)) that is provided with in the container body 31.
At this moment, strains take place and imitate the shape of each connection electrode 33,34 in resin core 24.And conducting film 25 is accompanied by the strain of resin core 24 and imitates the shape of connection electrode 33, and conducting film 26 is imitated the shape of connection electrode 34.Here, adhesive linkage 121 separates with each conducting film 25,26 and forms, and therefore, when salient pole 14 was contacted with connection electrode 33,34, each conducting film 25,26 contacted with connection electrode 33,34.
And adhesive linkage 121 adhesive bumps electrodes 14 and connection electrode 33,34 keep conducting film 25 and connection electrode 33 and conducting film 26 and connection electrode 34 contact condition separately.
By the way, crystal oscillator 120 is installed in the container body 31.
As mentioned above, in the crystal oscillator 120 in the present embodiment, also produce and above-mentioned same effect, the effect of second execution mode.
In addition, in the present embodiment,, also can be other shapes such as ring-type for example as long as each adhesive linkage 121 is arranged on and conducting film 25,26 position spaced.
In addition, the present invention is not limited to above-mentioned execution mode, only otherwise break away from the scope of purport of the present invention, can implement various changes.
For example, the shape of resin core is not limited to semi-cylindrical, also can be trapezoidal shape.In addition, be formed with two conducting films, but also can form two resin cores respectively accordingly with two conducting films at a resin core.At this moment, the resin core also can be hemispherical grade, other shapes.
In addition, as long as core has elasticity, also can adopt resin material other materials in addition to form.
And, in the present embodiment, adopt the tuning-fork-type member to describe as crystal oscillator, but be not limited to this, also can adopt crystal oscillators such as AT cutting oscillator, SAW oscillator.In addition, by quartz plate is used as functional sheet, constitute crystal oscillator, but also can adopt other piezoelectrics, constitute crystal oscillator other electrostriction elements in addition.
In addition, in the above-described embodiment, illustration on functional sheet, produce the electrostriction element of displacement during as the electronic unit supply capability, but be not limited to this, also can use because of for example magnetic force and on functional sheet, produce the magnetostriction element of displacement.
Have, the structure of the cantilever style that crystal oscillator, electrostriction element are not limited to illustrate in the present embodiment also can be that face connecting-type, double fastener are held his structure such as structure again.
In addition, in the present embodiment, for example understand the situation that crystal oscillator is installed in container.Also can be installed to the substrate that is formed with wiring pattern, rather than container.In addition, the installation method of crystal oscillator is provided with at crystal oscillator under the state of adhesive linkage crystal oscillator is installed to container body, but also can in crystal oscillator, form the salient pole that illustrates in the present embodiment and adhesive linkage is not set, under the state that adhesive linkage is arranged on container body, substrate, crystal oscillator is installed to container body.
In addition, the electronic unit of explanation and mounting structure thereof and installation method can be widely used in element parts, transducer, actuator, the integrated equipment MEMS (Micro Electro Mechanical Systems) such as (shower nozzle of ink-jet printer, pressure sensor, acceleration transducer, gyroscopes) on a silicon substrate of electronic circuit in the above-described embodiment.
Claims (12)
1. electronic unit, it is connected to the connection electrode with the drive circuit conducting,
Described electronic unit possesses:
Functional sheet with function of regulation;
Be formed on the salient pole of this functional sheet; With
Maintaining part, it keeps the conduction contact condition of this salient pole and described connection electrode;
Described salient pole possesses the core that is formed by resin and is arranged on the conducting film on the surface of this core, and described conducting film contacts with described connection electrode conduction.
2. electronic unit according to claim 1 is characterized in that,
Described functional sheet is by cantilever support.
3. electronic unit according to claim 2 is characterized in that,
Described functional sheet, near the electrically conducting contact of described conducting film and described connection electrode by cantilever support.
4. electronic unit according to claim 2 is characterized in that,
Described functional sheet, on the position of the node of the vibration of this functional sheet by cantilever support.
5. electronic unit according to claim 1 is characterized in that,
Described functional sheet formation is utilized the energising of described conducting film is produced the electrostriction element of displacement.
6. electronic unit according to claim 5 is characterized in that,
Described functional sheet is a quartz plate.
7. electronic unit according to claim 1 is characterized in that,
Described maintaining part is an adhesive linkage.
8. electronic unit according to claim 7 is characterized in that,
Described adhesive linkage covers described conducting film.
9. electronic unit according to claim 8 is characterized in that,
The part of described conducting film is exposed from described adhesive linkage.
10. electronic unit according to claim 7 is characterized in that,
Described adhesive linkage and described conducting film are spaced apart.
11. the mounting structure of an electronic unit, each described electronic unit is installed in the substrate with described connection electrode in the claim 1～10.
12. the installation method of an electronic unit, this electronic unit is connected to the connection electrode with the drive circuit conducting,
Described installation method comprises the operation that each described electronic unit in the claim 1～10 is installed to the substrate with described connection electrode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007272532 | 2007-10-19 | ||
| JP2007-272532 | 2007-10-19 | ||
| JP2008036715A JP4453763B2 (en) | 2007-10-19 | 2008-02-18 | Electronic component and its mounting structure and mounting method |
| JP2008-036715 | 2008-02-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810166689XA Division CN101414809B (en) | 2007-10-19 | 2008-10-17 | Electronic component, mounting structure thereof, and method for mounting electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102170274A true CN102170274A (en) | 2011-08-31 |
| CN102170274B CN102170274B (en) | 2014-11-12 |
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| CN201110035805.6A Expired - Fee Related CN102170274B (en) | 2007-10-19 | 2008-10-17 | Electronic component and mounting structure and mounting method thereof |
| CN200810166689XA Expired - Fee Related CN101414809B (en) | 2007-10-19 | 2008-10-17 | Electronic component, mounting structure thereof, and method for mounting electronic component |
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| CN200810166689XA Expired - Fee Related CN101414809B (en) | 2007-10-19 | 2008-10-17 | Electronic component, mounting structure thereof, and method for mounting electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5167870B2 (en) * | 2008-03-05 | 2013-03-21 | セイコーエプソン株式会社 | Electronic component mounting substrate, electronic component mounting structure, and crystal resonator package |
| JP5223383B2 (en) * | 2008-03-05 | 2013-06-26 | セイコーエプソン株式会社 | Quartz crystal unit, crystal unit package, electronic component, electronic device, mounting method for electronic component |
| JP2011182155A (en) * | 2010-03-01 | 2011-09-15 | Seiko Epson Corp | Piezoelectric device and method of manufacturing the same |
| JP6561447B2 (en) * | 2014-10-02 | 2019-08-21 | セイコーエプソン株式会社 | Vibrator, oscillator, electronic device, and moving object |
| JP6432737B2 (en) * | 2015-03-04 | 2018-12-05 | セイコーエプソン株式会社 | MEMS device, head, and liquid ejecting apparatus |
| JP6551010B2 (en) * | 2015-07-28 | 2019-07-31 | セイコーエプソン株式会社 | Piezoelectric device, liquid jet head, and method of manufacturing piezoelectric device |
| US10242940B2 (en) * | 2016-10-17 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Fan-out ball grid array package structure and process for manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925930A (en) * | 1996-05-21 | 1999-07-20 | Micron Technology, Inc. | IC contacts with palladium layer and flexible conductive epoxy bumps |
| CN1343043A (en) * | 2000-08-31 | 2002-04-03 | 精工爱普生株式会社 | Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
| CN1584672A (en) * | 2003-08-21 | 2005-02-23 | 精工爱普生株式会社 | Installation structure and method of electronic device, photoelectric device and electronic apparatus |
| CN1711680A (en) * | 2002-12-17 | 2005-12-21 | 精工爱普生株式会社 | Piezoelectric vibration piece, piezoelectric device using piezoelectric vibration piece, portable phone unit using piezoelectric device, and electronic equipment using piezoelectric device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10173006A (en) * | 1996-12-09 | 1998-06-26 | Hitachi Ltd | Semiconductor device and its manufacturing method |
| JP2003133886A (en) * | 2001-10-24 | 2003-05-09 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator |
| JP2003158440A (en) * | 2001-11-19 | 2003-05-30 | Daishinku Corp | Joining member, piezoelectric vibration device using the joining member, and manufacturing method for the piezoelectric vibration device |
| JP2007103737A (en) * | 2005-10-05 | 2007-04-19 | Sharp Corp | Semiconductor device |
| JP4784304B2 (en) * | 2005-12-27 | 2011-10-05 | セイコーエプソン株式会社 | Electronic component, method for manufacturing electronic component, circuit board, and electronic device |
-
2008
- 2008-02-18 JP JP2008036715A patent/JP4453763B2/en not_active Expired - Fee Related
- 2008-10-17 CN CN201110035805.6A patent/CN102170274B/en not_active Expired - Fee Related
- 2008-10-17 CN CN200810166689XA patent/CN101414809B/en not_active Expired - Fee Related
-
2009
- 2009-12-04 JP JP2009276226A patent/JP4798283B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925930A (en) * | 1996-05-21 | 1999-07-20 | Micron Technology, Inc. | IC contacts with palladium layer and flexible conductive epoxy bumps |
| CN1343043A (en) * | 2000-08-31 | 2002-04-03 | 精工爱普生株式会社 | Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
| CN1711680A (en) * | 2002-12-17 | 2005-12-21 | 精工爱普生株式会社 | Piezoelectric vibration piece, piezoelectric device using piezoelectric vibration piece, portable phone unit using piezoelectric device, and electronic equipment using piezoelectric device |
| CN1584672A (en) * | 2003-08-21 | 2005-02-23 | 精工爱普生株式会社 | Installation structure and method of electronic device, photoelectric device and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4453763B2 (en) | 2010-04-21 |
| CN101414809B (en) | 2011-04-06 |
| JP2009118450A (en) | 2009-05-28 |
| JP4798283B2 (en) | 2011-10-19 |
| CN102170274B (en) | 2014-11-12 |
| JP2010063154A (en) | 2010-03-18 |
| CN101414809A (en) | 2009-04-22 |
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