CN102169878A - 拼接式发光二极管模块 - Google Patents
拼接式发光二极管模块 Download PDFInfo
- Publication number
- CN102169878A CN102169878A CN2010101235063A CN201010123506A CN102169878A CN 102169878 A CN102169878 A CN 102169878A CN 2010101235063 A CN2010101235063 A CN 2010101235063A CN 201010123506 A CN201010123506 A CN 201010123506A CN 102169878 A CN102169878 A CN 102169878A
- Authority
- CN
- China
- Prior art keywords
- splice
- holding section
- conductive part
- led
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 102
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 32
- 230000000295 complement effect Effects 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 16
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
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- 230000002950 deficient Effects 0.000 description 3
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- 238000004020 luminiscence type Methods 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 241000278713 Theora Species 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101235063A CN102169878B (zh) | 2010-02-26 | 2010-02-26 | 拼接式发光二极管模块 |
US13/032,755 US8835942B2 (en) | 2010-02-26 | 2011-02-23 | LED module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101235063A CN102169878B (zh) | 2010-02-26 | 2010-02-26 | 拼接式发光二极管模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102169878A true CN102169878A (zh) | 2011-08-31 |
CN102169878B CN102169878B (zh) | 2013-02-20 |
Family
ID=44490968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101235063A Expired - Fee Related CN102169878B (zh) | 2010-02-26 | 2010-02-26 | 拼接式发光二极管模块 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8835942B2 (zh) |
CN (1) | CN102169878B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106051652A (zh) * | 2016-06-24 | 2016-10-26 | 无锡宏纳科技有限公司 | 光器件用弧形卡位状热沉 |
CN106051653A (zh) * | 2016-06-28 | 2016-10-26 | 无锡宏纳科技有限公司 | 光器件用锯齿接口状热沉 |
WO2017020732A3 (zh) * | 2015-07-31 | 2017-03-23 | 潘志伟 | Pcb与电镀框的电连接结构及模块化灯具 |
CN106575690A (zh) * | 2014-07-30 | 2017-04-19 | Lg 伊诺特有限公司 | 光源模块 |
CN110911349A (zh) * | 2019-11-06 | 2020-03-24 | 芯盟科技有限公司 | 一种芯片、半导体器件及其制备方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101287901B1 (ko) * | 2011-02-25 | 2013-07-18 | 주식회사 우리조명지주 | 피엔접합 발광소자 조명 장치 |
WO2015066240A1 (en) * | 2013-10-29 | 2015-05-07 | Acrooptics, Llc | Led lighting system for promoting biological growth |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
CN101180777A (zh) * | 2005-05-25 | 2008-05-14 | 松下电工株式会社 | 电子元件插座 |
CN101614376A (zh) * | 2008-06-24 | 2009-12-30 | 鸿富锦精密工业(深圳)有限公司 | 发光模组及发光模组阵列 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7380961B2 (en) * | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
TW200921584A (en) | 2007-11-02 | 2009-05-16 | Foxsemicon Integrated Tech Inc | Light source module and corresponding light source device |
-
2010
- 2010-02-26 CN CN2010101235063A patent/CN102169878B/zh not_active Expired - Fee Related
-
2011
- 2011-02-23 US US13/032,755 patent/US8835942B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
CN101180777A (zh) * | 2005-05-25 | 2008-05-14 | 松下电工株式会社 | 电子元件插座 |
CN101614376A (zh) * | 2008-06-24 | 2009-12-30 | 鸿富锦精密工业(深圳)有限公司 | 发光模组及发光模组阵列 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106575690A (zh) * | 2014-07-30 | 2017-04-19 | Lg 伊诺特有限公司 | 光源模块 |
WO2017020732A3 (zh) * | 2015-07-31 | 2017-03-23 | 潘志伟 | Pcb与电镀框的电连接结构及模块化灯具 |
CN106051652A (zh) * | 2016-06-24 | 2016-10-26 | 无锡宏纳科技有限公司 | 光器件用弧形卡位状热沉 |
CN106051653A (zh) * | 2016-06-28 | 2016-10-26 | 无锡宏纳科技有限公司 | 光器件用锯齿接口状热沉 |
CN110911349A (zh) * | 2019-11-06 | 2020-03-24 | 芯盟科技有限公司 | 一种芯片、半导体器件及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110210346A1 (en) | 2011-09-01 |
US8835942B2 (en) | 2014-09-16 |
CN102169878B (zh) | 2013-02-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Free format text: FORMER NAME: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee after: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Patentee after: Lite-On Technology Co.,Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee before: Lite-On Electronics (Guangzhou) Limited Patentee before: Lite-On Technology Co.,Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Effective date: 20131111 Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131111 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510663 GUANGZHOU, GUANGDONG PROVINCE TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131111 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) Co.,Ltd. Patentee after: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Patentee after: Lite-On Technology Co.,Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee before: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Patentee before: Lite-On Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 |
|
CF01 | Termination of patent right due to non-payment of annual fee |