CN102166690A - Tin-zinc base composite soldering flux - Google Patents
Tin-zinc base composite soldering flux Download PDFInfo
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- CN102166690A CN102166690A CN 201110139615 CN201110139615A CN102166690A CN 102166690 A CN102166690 A CN 102166690A CN 201110139615 CN201110139615 CN 201110139615 CN 201110139615 A CN201110139615 A CN 201110139615A CN 102166690 A CN102166690 A CN 102166690A
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Abstract
The provides tin-zinc base composite soldering flux which reduces the surface tension of the soldering flux and improves the wettability of the soldering flux. The tin-zinc base composite soldering flux is characterized in that the tin-zinc base composite soldering flux comprises a tin-zinc base soldering flux base body and magnetic particles with 1-15% of the weight percentage of the composite soldering flux, the tin-zinc base soldering flux base body comprises Sn and Zn, wherein the Zn is 2-10% of the weight percentage of the tin-zinc base soldering flux base body; and the magnetic particles are any one of or the combination of Fe, Co, Ni, Fe2O3 and Fe3O4. In the tin-zinc base composite soldering flux, the magnetic particles are evenly distributed in the soldering flux base body, and the solid-phase magnetic particles move to the surface of a soldering flux melting body to be enriched due to the function of magnetic force in an external magnetic field after melting in a heating way, so that the stress state on the surface of the soldering flux melting body is changed; and the tin-zinc base composite soldering flux has the effect of reducing the surface tension of the soldering flux when the direction of the external magnetic field force is inverse to the direction of the surface tension, therefore, the wettability of the soldering flux is improved.
Description
Technical field
The invention belongs to electronic device welding and surface encapsulation material field, particularly a kind of low-melting compound lead-free solder alloy.
Background technology
Owing to used the scolder that contains Pb in a large number to encapsulate, and Pb is a kind of noxious material, therefore human health has been caused serious threat in the electronic product.Along with RoHS instruction (using some harmful substance instruction about restriction in electronic electric equipment) and WEEE instruction (about the instruction of waste and old electric electrical equipment) get the Green Light in parliament of European Union, electronic product will forbid containing Pb after 1 day July in 2006.Therefore, countries in the world are being actively developed the research in lead-free solder field at present.
Research about lead-free solder mainly concentrates on alloy systems such as Sn-Ag, Sn-Zn and Sn-Cu.Wherein Sn-Zn is that scolder is because fusing point the most near conventional solder, is expected to become the lead-free solder of a new generation.Yet the Sn-Zn bianry alloy is poor and non-oxidizability is bad in the copper wettability of the surface, can not be directly used in electronic product.In recent years, adopting alloyage process to improve Sn-Zn was that the research of solder wettability has obtained certain progress, and existing a spot of Sn-Zn is that alloy drops into practical application.But, because being wetability, the non-oxidizability problem of alloy, Sn-Zn do not solved at all, and it is good wetting to help scolder to obtain often to require to increase flux activity or atmosphere protection in actual production, and therefore this scolder is difficult to be promoted application.
Chinese patent CN 200810019336.7 discloses a kind of Sn-Zn base lead-free solder, adds Al and Nd on the basis of scolder, has improved the wetability and the non-oxidizability of alloy.
Chinese patent CN200510038181.8 discloses the Sn-Zn base lead-free solder of a kind of Bi of adding, and wetability is provided when reducing alloy melting point.
Chinese patent CN02142912 discloses a kind of content that adds and has not been higher than 0.5% Fe, Co, the Sn-Cu base lead-free solder of Ni element, and the effect of three kinds of elements is to have improved the mechanical property of scolder and reliability.
Chinese patent CN200510013430 discloses a kind of Zirconium oxide nano grain reinforced composite Sn-Ag welding material and preparation method thereof, has improved the hardness and the reliability of tin-silver solder as wild phase with zirconia.
In sum, in the lead-free solder field, the method that improves wetability adopts alloyage process more, and the element that adds in the Sn-Zn scolder comprises Al, Bi and rare earth element; High-melting-point elements such as Ni, Co, Fe are commonly used to improve the mechanical property of scolder, and mainly the mode with alloying adds; The lead-free solder that adds wild phase in the particle mode also has report, but particle often is used for improving the mechanical property of scolder mutually.
Summary of the invention
Technical problem:The invention provides a kind of tin-zinc base composite solder that improves the tin-zinc base lead-free solder wetability.
Technical scheme:A kind of tin-zinc base composite solder, comprising tin-zinc base scolder matrix and accounting for the composite solder percentage by weight is 1～15% magnetic-particle, described tin-zinc base scolder matrix comprises Sn and Zn, and wherein to account for tin-zinc base scolder matrix percentage by weight be 2～10% Zn to Zn, and surplus is Sn; Described magnetic-particle is Fe, Co, Ni, Fe
2O
3, Fe
3O
4Any or combination.
Among the present invention, the particle diameter of magnetic-particle is 0.05～50 μ m.
Among the present invention, can also comprise the Bi that accounts for tin-zinc base scolder matrix percentage by weight 0.1～10% in the tin-zinc scolder matrix or account for the Al of tin-zinc base scolder matrix percentage by weight 0.001～0.2%.
The preparation method's of above-mentioned tin-zinc base composite solder step is as follows:
1) according to being mixed and heated to 400 ℃ ± 20 ℃ fusings in the component adding smelting furnace of proportioning with tin-zinc base scolder matrix, insulation 30min ± 10min uses ultrasonic atomizatio equipment to make the tin-zinc base welding powder;
2) tin-zinc base welding powder and the magnetic-particle that makes mixed in scaling powder by proportioning, be heated to 260 ± 20 ℃ of fusings, stir, cooling obtains described composite solder.
Step 2) used scaling powder is a rosin in.
Beneficial effect:The effect of magnetic-particle is the wetability that improves scolder among the present invention, its principle is that magnetic-particle is uniformly distributed in the scolder matrix, after heat fused, the magnetic-particle of solid phase is subjected to magneticaction in diplomatic magnetic field, move to scolder bath surface surface and form enrichment state, thereby changed the force-bearing situation of scolder bath surface, when the direction of externally-applied magnetic field power is opposite with the surface tension direction, its effect has been equivalent to reduce the surface tension of scolder, thereby has improved the wetability of scolder.The magnetic that is evenly distributed in the Sn-Zn parent metal matrix is simple substance Fe particle mutually, or Co, Ni particle, or with the oxide (Fe of Fe
2O
3, Fe
3O
4) form exist, as shown in Figure 1, element of Fe, Co, Ni or few dissolving enter the scolder matrix.These tiny particles still keep solid state shape after the fusing of scolder matrix, and have magnetic, can promote solder under the effect in magnetic field, as Fig. 2, Fig. 3, shown in Figure 4, Sn-9Zn solder surface tension force is big, and the spreading area on copper sheet is little, and wetability is relatively poor; After mode by alloying adds the Bi element, reduced solder surface tension force, spreading area increases, and wetability improves; And behind the adding magnetic-particle, scolder can better reduce surface tension under the effect of externally-applied magnetic field, and spreading ratio has had more obvious raising, and effect is better than the adding of Bi element.Consider after scolder merges to have magnetic, can also pull the scolder motion, as shown in Figure 3, can realize that scolder reclaims by magnetic field.
Can further add elements such as Al, Bi in the composite solder matrix, add the non-oxidizability that Al can improve the scolder matrix, add surface tension and fusing point that Bi can reduce the scolder matrix.Two kinds of alloying elements all can further improve the composite solder wetability.
The composite solder preparation method who the present invention relates to has positive effect; be characterized under the protection of scaling powder; magnetic-particle powder and matrix powder are heated to the fusing of scolder matrix jointly, and particle keeps solid state shape, and particle is wetting good in the scolder matrix simultaneously.Scolder solidifies back scolder-granular boundary in conjunction with tight, even particle distribution.
Description of drawings
The metallographic microstructure figure of the composite solder of Fig. 1 embodiment of the invention 3 (polishing attitude);
Fig. 2 is not for adding tin-zinc base composite solder the sprawling on copper sheet of magnetic-particle, and wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and surplus is Sn;
Fig. 3 is not for adding tin-zinc base composite solder the sprawling on copper sheet of magnetic-particle, and wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Bi content is 3%, and surplus is Sn;
Fig. 4 is for adding tin-zinc base composite solder the sprawling on copper sheet of magnetic-particle, and wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and surplus is Sn;
Fig. 5 is composite solder sprawling on copper sheet when not adding attraction;
Fig. 6 is side composite solder sprawling on copper sheet when adding attraction;
Among the figure, 1 is Ni magnetic-particle (dark particle), and 2 is scolder matrix (at the bottom of the hypsochrome), and 3 are the composite solder of fusion, and 4 is scaling powder, and 5 is copper sheet, and 6 is magnet.
The specific embodiment
Embodiment 1: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 99%, Fe magnetic-particle 1%, the average grain diameter of Fe magnetic-particle is 10 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 2% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 2: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 85%, Co magnetic-particle 15%, the average grain diameter of Co magnetic-particle is 50 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 3: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Ni magnetic-particle 2%, the average grain diameter of Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and surplus is Sn.Fig. 1 is its metallographic microstructure photo.
Embodiment 4: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 90%, Fe
2O
3Magnetic-particle 10%, Fe
2O
3The average grain diameter of magnetic-particle is 5 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 5: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 95%, Fe
3O
4Magnetic-particle 5%, Fe
3O
4The average grain diameter of magnetic-particle is 0.05 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 6: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Fe magnetic-particle 1%, Ni magnetic-particle 1%, the average grain diameter of Fe, Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 7: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 90%, Fe magnetic-particle 5%, Ni magnetic-particle 5%, the average grain diameter of Fe, Ni magnetic-particle is 0.5 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 8: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 96%, Fe magnetic-particle 2%, Co magnetic-particle 2%, the average grain diameter of Fe, Co magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 9: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Fe magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 10: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Fe magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 11: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 96%, Co magnetic-particle 2%, Ni magnetic-particle 2%, the average grain diameter of Co, Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 12: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Co magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Co, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 13: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Co magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Co, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 14: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Ni, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 15: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Ni magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Ni, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 16: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 96%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 6% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 17: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Ni magnetic-particle 2%, the average grain diameter of Fe, Co, Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 18: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe, Co, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 19: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Co, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 20: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe, Ni, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 21: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Ni magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Ni, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 22: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Fe magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 23: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Co magnetic-particle 2%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Co, Ni, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 24: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Co magnetic-particle 2%, Ni magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Co, Ni, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 25: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Co magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Co, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 26: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 94%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Ni, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 27: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 92%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe, Co, Ni, Fe
2O
3The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 28: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 92%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Ni magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Co, Ni, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 29: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 92%, Fe magnetic-particle 2%, Co magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Co, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 30: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 92%, Fe magnetic-particle 2%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Fe, Ni, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 31: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 92%, Co magnetic-particle 2%, Ni magnetic-particle 2%, Fe
2O
3Magnetic-particle 2%, Fe
3O
4Magnetic-particle 2%, Co, Ni, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 32: tin-zinc base composite solder of the present invention, the percentage by weight of each component is: tin-zinc scolder matrix 95%, Fe magnetic-particle 1%, Co magnetic-particle 1%, Ni magnetic-particle 1%, Fe
2O
3Magnetic-particle 1%, Fe
3O
4Magnetic-particle 1%, Fe, Co, Ni, Fe
2O
3, Fe
3O
4The average grain diameter of magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 10% in the tin-zinc scolder matrix, and surplus is Sn.
Embodiment 33: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Fe magnetic-particle 2%, the average grain diameter of Fe magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Bi accounts for percentage by weight 0.1%, and surplus is Sn.
Embodiment 34: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Ni magnetic-particle 2%, the average grain diameter of Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Bi accounts for percentage by weight 4%, and surplus is Sn.
Embodiment 35: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 95%, Co magnetic-particle 5%, the average grain diameter of Co magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Bi accounts for percentage by weight 10%, and surplus is Sn.
Embodiment 36: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Fe magnetic-particle 2%, the average grain diameter of Fe magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Al accounts for percentage by weight 0.001%, and surplus is Sn.
Embodiment 37: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 98%, Ni magnetic-particle 2%, the average grain diameter of Ni magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Al accounts for percentage by weight 0.01%, and surplus is Sn.
Embodiment 38: tin-zinc base composite solder of the present invention, and the percentage by weight of each component is: tin-zinc scolder matrix 95%, Co magnetic-particle 5%, the average grain diameter of Co magnetic-particle is 30 μ m.Wherein Zn content is for accounting for tin-zinc base scolder matrix percentage by weight 9% in the tin-zinc scolder matrix, and Al accounts for percentage by weight 0.2%, and surplus is Sn.
The prepared composite solder of above embodiment all has common characteristic, magnetic-particle can produce magnetic force under the externally-applied magnetic field effect, magnetic-particle is in the solder surface enrichment during welding, when magnetic force direction is opposite with the surface tension direction, its effect has been equivalent to reduce the surface tension of scolder, thereby has improved the wetability of scolder.After contrasting as can be seen from Fig. 2 and Fig. 4, adding magnetic-particle, scolder spreading area under the externally-applied magnetic field effect obviously improves, and wetability is significantly improved.Prepared composite solder has magnetic, can pull the scolder motion by certain magnetic field effect, as Fig. 5, shown in Figure 6, can realize that scolder reclaims, and improves the utilization rate of scolder.
Claims (4)
1. tin-zinc base composite solder, it is characterized in that, this composite solder comprises tin-zinc base scolder matrix and accounts for the composite solder percentage by weight is 1～15% magnetic-particle, and described tin-zinc base scolder matrix comprises Sn and Zn, and wherein to account for tin-zinc base scolder matrix percentage by weight be 2～10% to Zn; Described magnetic-particle is Fe, Co, Ni, Fe
2O
3, Fe
3O
4Any or combination.
2. tin-zinc base composite solder according to claim 1 is characterized in that, the particle diameter of described magnetic-particle is 0.05～50 μ m.
3. tin-zinc base composite solder according to claim 1 is characterized in that, in the described tin-zinc scolder matrix, also comprises the Bi that accounts for tin-zinc base scolder matrix percentage by weight 0.1～10%.
4. tin-zinc base composite solder according to claim 1 is characterized in that, in the described tin-zinc scolder matrix, also comprises the Al that accounts for tin-zinc base scolder matrix percentage by weight 0.001～0.2%.
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| CN 201110139615 CN102166690A (en) | 2011-05-27 | 2011-05-27 | Tin-zinc base composite soldering flux |
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|---|---|---|---|
| CN 201110139615 CN102166690A (en) | 2011-05-27 | 2011-05-27 | Tin-zinc base composite soldering flux |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513719A (en) * | 2011-11-17 | 2012-06-27 | 东南大学 | Magnetic particle tin-zinc matrix composite solder and preparation method thereof |
| CN103071942A (en) * | 2013-01-05 | 2013-05-01 | 张家港市东大工业技术研究院 | Low-temperature solder matrix composite solder for synthesizing magnetic-phase particles in situ and preparation method thereof |
| CN104201121A (en) * | 2014-09-17 | 2014-12-10 | 北京理工大学 | Method for forming copper pillar and bump package structure |
| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| WO2020118613A1 (en) * | 2018-12-13 | 2020-06-18 | 北京联金高新科技有限公司 | Sn-zn lead-free solder material and preparation method therefor |
| EP4228850A4 (en) * | 2020-10-18 | 2024-09-04 | Mesoglue Inc | Amalgamation preform |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0612577A1 (en) * | 1993-02-22 | 1994-08-31 | AT&T Corp. | Article comprising solder with improved mechical properties, and method of making the solder |
| CN1421296A (en) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | Lead-free welding material and its prepn |
| CN101898282A (en) * | 2009-05-07 | 2010-12-01 | 通用汽车环球科技运作公司 | Be used for the material that contains magnetic-particle that parts or substrate are tightened together |
-
2011
- 2011-05-27 CN CN 201110139615 patent/CN102166690A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0612577A1 (en) * | 1993-02-22 | 1994-08-31 | AT&T Corp. | Article comprising solder with improved mechical properties, and method of making the solder |
| CN1421296A (en) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | Lead-free welding material and its prepn |
| CN101898282A (en) * | 2009-05-07 | 2010-12-01 | 通用汽车环球科技运作公司 | Be used for the material that contains magnetic-particle that parts or substrate are tightened together |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513719A (en) * | 2011-11-17 | 2012-06-27 | 东南大学 | Magnetic particle tin-zinc matrix composite solder and preparation method thereof |
| CN103071942A (en) * | 2013-01-05 | 2013-05-01 | 张家港市东大工业技术研究院 | Low-temperature solder matrix composite solder for synthesizing magnetic-phase particles in situ and preparation method thereof |
| CN104201121A (en) * | 2014-09-17 | 2014-12-10 | 北京理工大学 | Method for forming copper pillar and bump package structure |
| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| WO2020118613A1 (en) * | 2018-12-13 | 2020-06-18 | 北京联金高新科技有限公司 | Sn-zn lead-free solder material and preparation method therefor |
| EP4228850A4 (en) * | 2020-10-18 | 2024-09-04 | Mesoglue Inc | Amalgamation preform |
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