CN102148311B - LED (light-emitting diode) packaging method - Google Patents
LED (light-emitting diode) packaging method Download PDFInfo
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- CN102148311B CN102148311B CN 201010113713 CN201010113713A CN102148311B CN 102148311 B CN102148311 B CN 102148311B CN 201010113713 CN201010113713 CN 201010113713 CN 201010113713 A CN201010113713 A CN 201010113713A CN 102148311 B CN102148311 B CN 102148311B
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- led
- printing opacity
- packing
- mould
- light
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Abstract
The invention provides an LED (light-emitting diode) packaging method which comprises the steps of firstly preparing a circuit board, a light-transmission sealing cover and at least one LED material; then placing the light-transmission sealing cover on the LED material and aligning and overlaying the light-transmission sealing cover with the circuit board; and finally forming a light packaging layer on the light-transmission sealing cover in an in-mould injection way, wherein during the in-mould injection, a filling port on a mold faces right above the LED material. The method can prevent the deviation of the LED material, save the SMT (surface mounting technology) process and also can manufacture the light LED through one-step molding, therefore good waterproof and anti-static effect and the like can be achieved.
Description
Technical field
The present invention is relevant with the packaging technology of the naked crystalline substance of a kind of light-emitting diode (LED), espespecially a kind of method of packaged LED.
Background technology
At present, LED has been widely used in the occasions such as each illumination or luminescence display.And want on the naked crystalline substance of LED to form two secondary mirrors or wish with light type in the past, the naked crystalline substance of LED is carried out the packaging technologies such as two secondary mirrors, tended to cause because of pouring into of plastics the naked brilliant generation off normal of LED, affected the qualification rate of conductive contact etc.Therefore, usually first with surface mounting technology (SMT) technique, the naked crystalline substance of LED is welded on circuit board, then encapsulates, but can cause so technologic program too much and complicated, and easily increase man-hour and material cost etc.
Summary of the invention
Main purpose of the present invention is to provide a kind of LED method for packing, the naked brilliant generation off normal of LED or LED in the time of can either preventing material feeding, and then save SMT technique, can also reach good waterproof and antistatic effect.
In order to achieve the above object, the invention provides a kind of LED method for packing, its step comprises:
A) prepare circuit substrate, printing opacity capping and at least one LED material material;
B) this printing opacity capping is placed on described LED material material, and stacked with this circuit substrate contraposition;
C) prepare mould, with shoot mode in mould, form the encapsulated layer with light type in this printing opacity capping;
Wherein, above-mentioned steps c) when penetrating in mould, the sprue on its mould is over against the top of described LED material material.
Compared with prior art, the present invention is by the printing opacity capping, the LED that wants to be arranged at the naked crystalline substance of LED on circuit substrate or coated a secondary mirror is positioned, carry out penetrating in mould, this printing opacity capping can be guaranteed LED or the unlikely generation off normal of the naked crystalline substance of LED, simultaneously again, the sprue that penetrates in mould is over against the top of LED or the naked crystalline substance of LED, in the time of can preventing with other direction material feeding, plastics can produce the shortcomings such as LED or the naked brilliant off normal of LED because of the thrust of injecting, and then save SMT technique.On the other hand, the present invention also can be directly one-body molded two secondary mirrors with light type once, and complete coating all be located at LED or the naked crystalline substance of LED on circuit substrate, thereby reach good waterproof and antistatic effect.
Description of drawings
Fig. 1 is flow chart of steps of the present invention;
Fig. 2 is the decomposing schematic representation of circuit substrate of the present invention, printing opacity capping and LED material material;
Fig. 3 is that front cross-sectional schematic is completed in the combination of circuit substrate of the present invention, printing opacity capping and LED material material;
Fig. 4 is that cross-sectional schematic is completed in the combination of circuit substrate of the present invention, printing opacity capping and LED material material;
Fig. 5 is the decomposing schematic representation of the present invention and mould;
Fig. 6 is the cross-sectional schematic before the present invention carries out penetrating in mould;
Fig. 7 is the cross-sectional schematic after the present invention carries out penetrating in mould;
Fig. 8 is finished product three-dimensional combination figure of the present invention;
Fig. 9 is along the finished product cross-sectional schematic of the present invention of 9-9 in Fig. 8.
Description of reference numerals
LED expects material 2
Encapsulated layer 4
The two smooth type of secondary mirror 40 sections 41
Mould 5
Counterdie 50 accommodation spaces 500
Patrix 51 die cavitys 510
Sprue 511 step S1～S3
Embodiment
See also following about detailed description of the present invention and accompanying drawing, appended accompanying drawing only for reference with the explanation use, the present invention is limited.
The invention provides a kind of LED method for packing, it is can be once one-body molded and make the LED with light type, and can save SMT technique, when reducing encapsulation the contraposition of LED or the naked crystalline substance of LED bad, even reach good waterproof effect etc., and do not need additional processing and increase on foot man-hour and material cost.This method for packing step is as follows:
At first, see also the step S1 of Fig. 1, and coordinate shown in Figure 2: prepare circuit substrate 1, printing opacity capping 3 and at least one LED material material 2; Wherein, LED material material 2 refers to fully not through the naked crystalline substance of LED that encapsulates or the LED that has coated a secondary mirror.In addition, described circuit substrate 1 is provided with the conductive part 10 of doing electric connection for LED material material 2 in advance, be formed with in this printing opacity capping 3 for the accommodating shade section 30 of LED material material 2, and this printing opacity capping 3 is in order to mutually stacked with circuit substrate 1, and registration holes 11 can be set on circuit substrate 1, be provided with the outstanding contraposition post 31 of described registration holes 11 on the circuit substrate 1 in printing opacity capping 3.In addition, the also visual actual demand and set up its quantity and be two or more of LED material material 2, the quantity of the shade section 30 of this printing opacity capping 3 simultaneously expects that with LED the quantity of material 2 is consistent.
Then, see also the step S2 of Fig. 1, printing opacity capping 3 is placed on described LED material material 2, and stacked with circuit substrate 1 contraposition, and cooperation Fig. 3 and shown in Figure 4, described LED material material 2 is placed in the shade section 30 of printing opacity capping 3, and make printing opacity capping 3 and circuit substrate 1 by each contraposition post 31 respectively contraposition penetrate each registration holes 11, and make the printing opacity capping 3 can be stacked with circuit substrate 1 contraposition, and described LED material material 2 is arranged between printing opacity capping 3 and circuit substrate 1, in the shade section 30 that is fixed on printing opacity capping 3.
Then, see also the step S3 of Fig. 1, and coordinate Fig. 5 and shown in Figure 6: prepare mould 5, and with shoot mode in mould, form the encapsulated layer 4 (namely as shown in Figure 7) with light type in above-mentioned printing opacity capping 3.Wherein, this mould 5 has counterdie 50 and patrix 51, and counterdie 50 is concaved with accommodation space 500, inserts for the above-mentioned stacked circuit substrate of completing 1 assembly such as grade; Patrix 51 is the described LED of correspondence material material 2 and be concaved with to form the die cavity 510 of two secondary mirrors and light type, and is provided with the sprue 511 that is connected with die cavity 510, and the described sprue 511 on patrix 51 is over against the top of described LED material material 2.
Accordingly; as shown in Figure 7; after plastics are poured into by each sprue 511; because each sprue 511 is positioned at corresponding LED material material 2 tops respectively; and LED material material 2 is covered by printing opacity capping 3 to be put and protects; therefore when the technique that penetrates in mould was carried out, the impulsive force when plastics pour into can not cause the off normal of LED material material 2, make LED material material 2 still can keep original positioning states and carry out the encapsulation of two secondary mirrors 40.Simultaneously, also can be directly on two secondary mirrors 40 one-body molded smooth type section 41 once, and because the problem without LED material material 2 off normals produces, also can save SMT technique.
At last, as Fig. 8 and shown in Figure 9, owing to forming described encapsulated layer 4 in the mode that penetrates in above-mentioned mould, this encapsulated layer 4 also further is coated in printing opacity capping 3, therefore can expect material 2 by all LED that are located on circuit substrate 1 of complete coating, to reach good waterproof and antistatic effect.
The above is only preferred embodiment of the present invention, is not be used to limiting the scope of the claims of the present invention, thus the variations such as the equivalence techniques that all utilizations specification of the present invention and accompanying drawing content are done, means, all within the scope of the present invention.
Claims (7)
1. a LED method for packing, is characterized in that, its step comprises:
A) prepare circuit substrate, printing opacity capping and at least one LED material material;
B) this printing opacity capping is placed on described LED material material, and with this circuit substrate contraposition stacked location;
C) prepare mould, with shoot mode in mould, form the encapsulated layer with light type in this printing opacity capping;
Wherein, above-mentioned steps c) when penetrating in mould, the sprue on its mould is over against the top of described LED material material.
2. LED method for packing as claimed in claim 1, is characterized in that, step a) is provided with on described circuit substrate for described LED material material and makes the conductive part that is electrically connected.
3. LED method for packing as claimed in claim 1, is characterized in that, step a) arranges registration holes on described circuit substrate, is provided with in described printing opacity capping towards the outstanding contraposition post of described registration holes.
4. LED method for packing as claimed in claim 1, is characterized in that, step a) described LED material material refers to fully not through the naked crystalline substance of LED that encapsulates or the LED that has coated a secondary mirror.
5. LED method for packing as claimed in claim 1, is characterized in that, step a) is formed with in described printing opacity capping for the accommodating shade section of described LED material material, and the quantity of described shade section expects that with described LED the quantity of material is consistent.
6. LED method for packing as claimed in claim 5, is characterized in that step b) described LED material material is placed in the shade section of described printing opacity capping.
7. LED method for packing as claimed in claim 1, is characterized in that step c) mould have counterdie and patrix, the corresponding described LED material material of described patrix and be concaved with to form the die cavity of two secondary mirrors and light type, and described sprue is connected with described die cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010113713 CN102148311B (en) | 2010-02-09 | 2010-02-09 | LED (light-emitting diode) packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010113713 CN102148311B (en) | 2010-02-09 | 2010-02-09 | LED (light-emitting diode) packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102148311A CN102148311A (en) | 2011-08-10 |
| CN102148311B true CN102148311B (en) | 2013-06-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010113713 Expired - Fee Related CN102148311B (en) | 2010-02-09 | 2010-02-09 | LED (light-emitting diode) packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102148311B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1100347C (en) * | 1994-05-24 | 2003-01-29 | 夏普株式会社 | Method for producing semiconductor device |
| CN1124922C (en) * | 1996-12-10 | 2003-10-22 | 全美冈布尔公司 | Injection molding encapsulation for an electronic device directly onto a substrate |
-
2010
- 2010-02-09 CN CN 201010113713 patent/CN102148311B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1100347C (en) * | 1994-05-24 | 2003-01-29 | 夏普株式会社 | Method for producing semiconductor device |
| CN1124922C (en) * | 1996-12-10 | 2003-10-22 | 全美冈布尔公司 | Injection molding encapsulation for an electronic device directly onto a substrate |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平11-237850A 1999.08.31 |
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| Publication number | Publication date |
|---|---|
| CN102148311A (en) | 2011-08-10 |
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