CN102147242A - Welding ball center positioning method and device - Google Patents
Welding ball center positioning method and device Download PDFInfo
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- CN102147242A CN102147242A CN 201110004542 CN201110004542A CN102147242A CN 102147242 A CN102147242 A CN 102147242A CN 201110004542 CN201110004542 CN 201110004542 CN 201110004542 A CN201110004542 A CN 201110004542A CN 102147242 A CN102147242 A CN 102147242A
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Abstract
The invention relates to a welding ball center positioning method and device. The method comprises the following steps of: (1) setting three-dimensional coordinates (x, y, z) of a welding ball center; (2) projecting plane coordinates (x, y) of the welding ball center to a datum point on a datum plane along a vertical direction; (3) measuring three-dimensional coordinates (x, y, z') of the datum point by using a total station instrument to obtain the plane coordinates (x, y) of the welding ball center; and (4) working out a difference value between a vertical coordinate z' of the datum point and a vertical coordinate z of the welding ball center, and subtracting the difference value from the vertical coordinate z' of the datum point to obtain the vertical coordinate z of the welding ball center. The device comprises a cylinder and a bubble gradienter, wherein the cylinder is arranged on the surface of the welding ball and has an open end uniformly covered on the surface of a welding ball, and the bubble gradienter is horizontally and fixedly arranged on a geometric center of a closed end of the cylinder. In the invention, by means of the total station instrument, a positioning device is matched with the bubble gradienter so as to accurately and rapidly position the three-dimensional position of the welding ball center.
Description
Technical field
The present invention a kind ofly is used for locating as the method for the solder sphere centre of sphere of grid structure welding node and used device thereof.
Background technology
At present, the large-size net rack steel construction generally is to adopt node solder sphere and each rod member to be welded, and has advantages such as in light weight, that rigidity is big, anti-seismic performance is good, can be used as the roof system of buildings such as gymnasium, cinema, show room, Waiting Lounge, hangar.And with the node of solder sphere as grid structure, be one of joint form of the most normal application at present, have simple structure, advantage such as power transmission is clear and definite, and is easy to connect.
In the assembling of solder sphere rack, the installation process, support system need position solder sphere, existing way is the super large solder sphere to be carried out tentatively in place by bottle gouard moved by hands, rely on naked eyes that the centre of sphere of solder sphere is estimated with instruments such as rulers, but this way can't know accurately whether the sphere center position of solder sphere is accurate, can't satisfy the requirement of engineering degree of accuracy.
The instrument of existing sphere center locating method and use is all comparatively simple, and degree of accuracy is lower, and speed of application is extremely slow, even causes the position inaccurate and influence the butt joint success ratio of other rod members, influences speed of application greatly.Therefore, the solder sphere localization method of existing solder sphere rack has certain defective: (1) only relies on artificial and naked eyes are estimated the centre of sphere of solder sphere; (2) positioning time longer, need repeated multiple times that solder sphere is adjusted, thereby influence the duration.
Summary of the invention
Fundamental purpose of the present invention is: the method and the device that provide a kind of accurate tacking fast to receive the centre of sphere.
For achieving the above object, the invention provides a kind of solder sphere sphere center locating method, it includes following steps:
1) three-dimensional coordinate with the described solder sphere centre of sphere be set at (x, y, z);
2) (x y) vertically is projected to reference point on the reference plane, and the coordinate of described reference point is (x, y, z ') with the planimetric coordinates of the described solder sphere centre of sphere;
3) measure the three-dimensional coordinate (x, y, z ') of this reference point by total powerstation, thus draw the solder sphere centre of sphere planimetric coordinates (x, y);
4) calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z by formula, z ' deducts described difference with the reference point ordinate, thereby draws solder sphere centre of sphere ordinate z;
By the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: described solder sphere surface is provided with a cylinder, described cylinder opening end evenly is overlying on the solder sphere surface, level sets firmly a spirit level on the geometric center of described cylinder enclosed end, move described cylinder along the solder sphere surface, when treating spirit level reveal competence state, described cylinder enclosed end is a reference plane, and the geometric center of cylinder enclosed end is a reference point;
Calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z by following formula: known solder sphere radius r, cylinder heights h, drum diameter d, the cylinder radius is less than the solder sphere radius, 2 A farthest and B that the cylinder opening end contact with the solder sphere surface, and string AB is apart from equaling drum diameter d, string AB mid point to the ultimate range action of solder sphere round edge is m, according to Pythagorean theorem, (r-m) 2+ (d/2) 2=r2 solves
Thereby calculating the difference that vertically goes up reference point ordinate z ' and solder sphere centre of sphere ordinate z is h-m+r;
By the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: described solder sphere surface is provided with a location device, described locating device comprises a panel, this panel is the center symmetric shape, described panel bottom surface is provided with the feet of a plurality of equal length, and described feet is symmetrical arranged according to described face plate center, described feet evenly is overlying on the solder sphere surface with the end that the solder sphere surface contacts, level sets firmly a spirit level on the described panel geometric center, move described device along the solder sphere surface, when treating spirit level reveal competence state, described panel is a reference plane, and the geometric center of panel is a reference point.
The end that described feet and solder sphere surface contacts and solder sphere surface can be for contacting; Same, described feet also can be provided with pulley with the end that the solder sphere surface contacts, and is arranged on the described solder sphere surface by described pulley rolling.
A kind of solder sphere sphere centre positioning device, it includes a cylinder and a spirit level; Described cylinder comprises an openend and a blind end, is located at the solder sphere surface, and its openend evenly is overlying on the solder sphere surface, and described spirit level is horizontally located on the geometric center of described cylinder enclosed end;
A kind of solder sphere sphere centre positioning device includes a panel, four feet and spirit levels that length is identical; This panel is the center symmetric shape, and described feet is symmetrical arranged according to described face plate center, and described feet evenly is overlying on the solder sphere surface with the end that the solder sphere surface contacts, and described spirit level is horizontally located on the geometric center of described panel.
The end that described feet contacts with the solder sphere surface contacts for point with the solder sphere surface.
Described feet is provided with pulley with the end that the solder sphere surface contacts.
A kind of solder sphere sphere center locating method of the present invention and device, by total powerstation, locating device cooperates with spirit level, accurately the receive three-dimensional position of the centre of sphere of tacking apace; Described apparatus structure is simple, and cost is low, operation easily in the work progress, and described method step is simple, positioning time is short, has accelerated the engineering construction progress.
Description of drawings
Fig. 1 is the schematic perspective view of solder sphere sphere centre positioning device of the present invention;
Fig. 2 is the side view of solder sphere sphere centre positioning device of the present invention;
Fig. 3 is the schematic perspective view of another embodiment of solder sphere sphere centre positioning device of the present invention; And
Fig. 4 is the schematic perspective view of an embodiment again of solder sphere sphere centre positioning device of the present invention.
Embodiment
A kind of solder sphere sphere center locating method provided by the present invention, it includes following steps:
1) three-dimensional coordinate with the described solder sphere centre of sphere be set at (x, y, z);
2) (x y) vertically is projected to reference point on the reference plane, and the coordinate of described reference point is (x, y, z ') with the planimetric coordinates of the described solder sphere centre of sphere;
3) measure the three-dimensional coordinate (x, y, z ') of this reference point by total powerstation, thus draw the solder sphere centre of sphere planimetric coordinates (x, y);
4) calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z by formula, z ' deducts described difference with the reference point ordinate, thereby draws solder sphere centre of sphere ordinate z;
Wherein, by the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: as shown in Figures 1 and 2, described solder sphere 10 surfaces are provided with a cylinder 20, described cylinder 20 openends evenly are overlying on solder sphere 10 surfaces, level sets firmly a spirit level 30 on described cylinder 20 blind ends 21 geometric centers, move described cylinder 20 along solder sphere 10 surfaces, when treating the bubble reveal competence state of spirit level 30, described cylinder 20 blind ends 21 are reference plane, and the geometric center of cylinder 20 blind ends 21 is a reference point O point; Measure the three-dimensional coordinate (x, y, z ') that this reference point O is ordered by total powerstation, thus draw the solder sphere centre of sphere planimetric coordinates (x, y);
Calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z again by following formula: as shown in Figure 2, the radius r of known solder sphere 10, the height h of cylinder 20, the diameter d of cylinder 20, the cylinder radius is less than the solder sphere radius, 2 A farthest and B that cylinder 20 openends and solder sphere 10 surfaces contact, string AB distance equals drum diameter d, and string AB mid point to the ultimate range action of solder sphere round edge is m, according to Pythagorean theorem, (r-m) 2+ (d/2) 2=r2 solves
Thereby calculating the difference that vertically goes up ordinate z ' that reference point O orders and solder sphere centre of sphere ordinate z is h-m+r, and the ordinate z ' of ordering with reference point O deducts described difference, thereby draw solder sphere centre of sphere ordinate z, thereby draw the solder sphere centre of sphere three-dimensional coordinate (x, y, z);
The inventive method also can be by the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: as shown in Figure 3, described solder sphere 10 surfaces are provided with a device 40, described device 40 comprises a panel 41, this panel 41 is the center symmetric shape, in this specific embodiment, this panel 41 is a rectangular panel, described panel 41 is got four end points symmetrically on four summits, perpendicular to panel 41 ground four highly identical feets 42 are set on each end points, described feet 42 evenly is overlying on solder sphere 10 surfaces with the end that the solder sphere surface contacts, as a better embodiment of the present invention, feet 42 contacts for point with solder sphere 10 surfaces, level sets firmly a spirit level 30 on described panel 41 geometric centers, moves described device 40 along solder sphere 10 surfaces, when treating spirit level 30 reveal competence states, described panel 41 is a reference plane, and the geometric center of panel 41 is a reference point; Measure the three-dimensional coordinate (x, y, z ') of this reference point by total powerstation, thus draw the solder sphere centre of sphere planimetric coordinates (x, y); In like manner calculate the difference of the ordinate z ' that vertically goes up reference point and solder sphere centre of sphere ordinate z by above-mentioned formula, thus draw the solder sphere centre of sphere three-dimensional coordinate (x, y, z);
Same, as shown in Figure 4, as another better embodiment of the present invention, can add identical pulley 43 with an end of solder sphere 10 surface contacts at the feet 42 of described device 40, described pulley 43 evenly is overlying on described solder sphere 10 surfaces, and slides on described solder sphere 10 surfaces; In like manner can calculate the solder sphere centre of sphere three-dimensional coordinate (x, y, z).
The present invention provides a kind of solder sphere sphere centre positioning device simultaneously, and as shown in Figures 1 and 2, it includes a cylinder 20 and a spirit level 30; Described cylinder 20 is located at solder sphere 10 surfaces, and its openend evenly is overlying on solder sphere 10 surfaces, and described spirit level 30 is horizontally located on the geometric center of described cylinder 20 blind ends 21;
Another specific embodiment of solder sphere sphere centre positioning device of the present invention as shown in Figure 3, includes a panel 41, four identical feets 42 and spirit levels 30; This panel 41 is a symmetric shape, in this specific embodiment, this panel 41 is a rectangular panel, described panel 41 is got four end points symmetrically on four summits, perpendicular to panel 41 ground four identical feets 42 are set on each end points, described feet 42 evenly is overlying on solder sphere 10 surfaces, and feet 42 is surperficial for point contacts with solder sphere 10, and described spirit level 30 is horizontally located on the geometric center of described panel 41;
In the specific embodiment again of apparatus of the present invention, as shown in Figure 4, feet 42 at described device 40 adds identical pulley 43 with an end of solder sphere 10 surface contacts, and described pulley 43 evenly is overlying on described solder sphere 10 surfaces, and slides on described solder sphere 10 surfaces.
Claims (10)
1. a solder sphere sphere center locating method is characterized in that, includes following steps:
1) three-dimensional coordinate with the described solder sphere centre of sphere be set at (x, y, z);
2) (x y) vertically is projected to reference point on the reference plane, and the coordinate of described reference point is (x, y, z ') with the planimetric coordinates of the described solder sphere centre of sphere;
3) measure the three-dimensional coordinate (x, y, z ') of this reference point by total powerstation, thus draw the solder sphere centre of sphere planimetric coordinates (x, y);
4) calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z by formula, z ' deducts described difference with the reference point ordinate, thereby draws solder sphere centre of sphere ordinate z.
2. solder sphere sphere center locating method as claimed in claim 1, it is characterized in that, by the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: described solder sphere surface is provided with a cylinder, described cylinder opening end evenly is overlying on the solder sphere surface, level sets firmly a spirit level on the geometric center of described cylinder enclosed end, move described cylinder along the solder sphere surface, when treating spirit level reveal competence state, described cylinder enclosed end is a reference plane, and the geometric center of cylinder enclosed end is a reference point.
3. solder sphere sphere center locating method as claimed in claim 2, it is characterized in that, calculate the difference of described reference point ordinate z ' and described solder sphere centre of sphere ordinate z by following formula: known solder sphere radius r, cylinder heights h, drum diameter d, the cylinder radius is less than the solder sphere radius, 2 A farthest and B that cylinder opening end and solder sphere surface contacts, string AB distance equals drum diameter d, string AB mid point to the ultimate range action of solder sphere round edge is m, according to Pythagorean theorem, (r-m) 2+ (d/2) 2=r2 solves
Thereby calculating the difference that vertically goes up reference point ordinate z ' and solder sphere centre of sphere ordinate z is h-m+r.
4. solder sphere sphere center locating method as claimed in claim 1, it is characterized in that, by the following method with the planimetric coordinates (x of the described solder sphere centre of sphere, y) vertically be projected to reference point on the reference plane: described solder sphere surface is provided with a location device, described locating device comprises a panel, this panel is the center symmetric shape, described panel bottom surface is provided with the feet of a plurality of equal length, and described feet is symmetrical arranged according to described face plate center, described feet evenly is overlying on the solder sphere surface with the end that the solder sphere surface contacts, level sets firmly a spirit level on the described panel geometric center, move described device along the solder sphere surface, when treating spirit level reveal competence state, described panel is a reference plane, and the geometric center of panel is a reference point.
5. solder sphere sphere center locating method according to claim 4 is characterized in that, the end that described feet contacts with the solder sphere surface contacts for point with the solder sphere surface.
6. solder sphere sphere center locating method according to claim 4 is characterized in that, described feet is provided with pulley with the end that the solder sphere surface contacts, and is arranged on the described solder sphere surface by described pulley rolling.
7. a solder sphere sphere centre positioning device is characterized in that including a cylinder and a spirit level; Described cylinder comprises an openend and a blind end, is located at the solder sphere surface, and its openend evenly is overlying on the solder sphere surface, and described spirit level is horizontally located on the geometric center of described cylinder enclosed end.
8. a solder sphere sphere centre positioning device is characterized in that including a panel, four feet and spirit levels that length is identical; This panel is the center symmetric shape, and described feet is symmetrical arranged according to described face plate center, and described feet evenly is overlying on the solder sphere surface with the end that the solder sphere surface contacts, and described spirit level is horizontally located on the geometric center of described panel.
9. solder sphere sphere center locating method according to claim 8 is characterized in that, the end that described feet contacts with the solder sphere surface contacts for point with the solder sphere surface.
10. solder sphere sphere centre positioning device according to claim 8 is characterized in that, described feet is provided with pulley with the end that the solder sphere surface contacts.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110004542.2A CN102147242B (en) | 2011-01-11 | 2011-01-11 | Welding ball center positioning method and device |
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| CN201110004542.2A CN102147242B (en) | 2011-01-11 | 2011-01-11 | Welding ball center positioning method and device |
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Cited By (6)
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| CN103481264A (en) * | 2013-09-12 | 2014-01-01 | 广州市恒盛建设工程有限公司 | Positioning device used in mounting process of spherical-surface latticed shell of welded ball |
| CN106197390A (en) * | 2016-09-18 | 2016-12-07 | 南通市测绘院有限公司 | A kind of spheroid centre of sphere coordinate location device |
| CN106323169A (en) * | 2016-09-18 | 2017-01-11 | 南通市测绘院有限公司 | Sphere center coordinate positioning method |
| CN108592735A (en) * | 2018-05-17 | 2018-09-28 | 中冶建工集团有限公司 | Solder sphere sphere centre positioning device and method |
| CN110966934A (en) * | 2019-12-13 | 2020-04-07 | 西安飞机工业（集团）有限责任公司 | Calibration method for ball socket central point of posture adjusting device |
| CN114775785A (en) * | 2022-03-23 | 2022-07-22 | 中国建筑第八工程局有限公司 | Rapid assembling device for steel structure net rack ball joint connecting rod pieces and construction method thereof |
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| CN101240565A (en) * | 2007-12-28 | 2008-08-13 | 浙江东南网架股份有限公司 | Method for positioning spatial structure sphere node and localizer |
| CN201463795U (en) * | 2009-08-07 | 2010-05-12 | 北京首钢建设集团有限公司 | Special tool for measuring axis coordinate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2006122421A1 (en) * | 2005-05-20 | 2006-11-23 | Orthosoft Inc. | Method and apparatus for calibrating spherical objects using a computer system |
| CN101240565A (en) * | 2007-12-28 | 2008-08-13 | 浙江东南网架股份有限公司 | Method for positioning spatial structure sphere node and localizer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103481264A (en) * | 2013-09-12 | 2014-01-01 | 广州市恒盛建设工程有限公司 | Positioning device used in mounting process of spherical-surface latticed shell of welded ball |
| CN106197390A (en) * | 2016-09-18 | 2016-12-07 | 南通市测绘院有限公司 | A kind of spheroid centre of sphere coordinate location device |
| CN106323169A (en) * | 2016-09-18 | 2017-01-11 | 南通市测绘院有限公司 | Sphere center coordinate positioning method |
| CN108592735A (en) * | 2018-05-17 | 2018-09-28 | 中冶建工集团有限公司 | Solder sphere sphere centre positioning device and method |
| CN110966934A (en) * | 2019-12-13 | 2020-04-07 | 西安飞机工业（集团）有限责任公司 | Calibration method for ball socket central point of posture adjusting device |
| CN114775785A (en) * | 2022-03-23 | 2022-07-22 | 中国建筑第八工程局有限公司 | Rapid assembling device for steel structure net rack ball joint connecting rod pieces and construction method thereof |
| CN114775785B (en) * | 2022-03-23 | 2024-01-23 | 中国建筑第八工程局有限公司 | Rapid assembling device for steel structure net rack ball node connecting rod pieces and construction method thereof |
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| CN102147242B (en) | 2014-01-08 |
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