CN102143255A - Method for detecting failure mechanism of automatic dialing of mobile phone - Google Patents
Method for detecting failure mechanism of automatic dialing of mobile phone Download PDFInfo
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- CN102143255A CN102143255A CN2010105920168A CN201010592016A CN102143255A CN 102143255 A CN102143255 A CN 102143255A CN 2010105920168 A CN2010105920168 A CN 2010105920168A CN 201010592016 A CN201010592016 A CN 201010592016A CN 102143255 A CN102143255 A CN 102143255A
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Abstract
The invention discloses a method for detecting a failure mechanism of automatic dialing of a mobile phone, which comprises the following steps specified in the standard: baking, physical isolation of failure point locating, electrical analysis of failure point locating, and microsection analysis. The method can be used for quickly locating the failure point, so as to determine the party responsible for the failure and generate technical innovation references, thereby avoiding reoccurrence of similar failures.
Description
Technical field
The present invention relates to a kind of mobile phone fault detect field, particularly a kind of mobile phone is the detection method of the failure mechanism of dialing automatically.
Background technology
Mobile phone is a very important contact instrument in the daily life, its manufacturer and product recoverable amount are very huge, if in the manufacturing, there is hidden danger of quality, just may cause great economy and credibility loss to manufacturer, such as post sales, after the user uses a period of time, same fault takes place in same model or same batch mobile phone on a large scale, the manufacturer promptly can be taken place be reluctant the situation seen, and at present this type of stealthy fault is lacked unified detection method, can't promptly find this hidden danger at production link, and then its influence is reduced to bottom line, to avoid loss, in the existing stealthy fault, having a kind of is after hygrothermal environment uses a period of time, and specific several key failure of removal of dialing automatically takes place, can accurately find the source of trouble efficiently and go back the neither one standard method at present, determine the responsible party.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of mobile phone detection method of the failure mechanism of dialing automatically.
For achieving the above object, technical scheme of the present invention is: a kind of mobile phone is the detection method of the failure mechanism of dialing automatically, may further comprise the steps,
(1), toasts, with defective products mobile phone baking drying, the moist factor of eliminating initiating failure;
(2), failpoint location physical isolation, the defective products mobile phone is removed shell, peel off the mobile phone key keyboard, add the power supply start after, still exist as the phenomenon of automatic dialing, get rid of the mobile phone key keyboard and cause and lost efficacy, search the common node of automatic dialing inefficacy button;
(3), failpoint location electricity analysis, after start, with the waveform on the described common node of oscilloscope measurement, as abnormal signal is arranged on the common node, and its abnormal signal is subjected to an end and is electrically connected on the resistance of described common node and the effect of signals on the diode, the time and the frequency of the two appearance are quite similar, further measure described resistance two ends resistance, as this resistance well below normal value, can determine that failpoint is described resistance position, described resistance is taken off measurement, and normal as resistance, promptly the decidable failure cause is the circuit board inefficacy between two welding of described resistance buried via hole;
(4), microsection analysis, buried via hole that links to each other with described resistance on defective products, the non-defective unit and the buried via hole that links to each other with inefficacy button common node are carried out the microsection analysis, the section sample grinds, if between two buried via holes of defective products mobile phone microsection Fil-Lumiere is arranged in the metallograph, and length is longer than Fil-Lumiere length between the non-defective unit mobile phone buried via hole far away, can determine that fault is due to the wicking length of mobile phone pcb board exceeds standard.
Also comprise step (5), ESEM and energy spectrum analysis (SEM/EDS):
In specimen, again microsection surface filiform focused ion beam (FI B) cutting and ESEM and energy spectrum analysis have been carried out, check whether glass and interlaminar resin have the slit, if any the slit, whether there is copper to exist in the slit, and described microsection surface plane is ground the back round material around the buried via hole is carried out energy spectrum analysis, check between described two buried via holes in the glass and resin fillers matter whether the copper existence is arranged.
Preferably, also comprise step (6), wicking linear measure longimetry:
Diffusion length to described copper is that wicking length is measured, and sees the regulation that whether does not meet among IPC-6012B and the IPC-A-600G the class2 product.
Preferably, also comprise step (7), carry out the crash simulation experiment, promptly between the above buried via hole of the pcb board of non-defective unit mobile phone, connect variable resistor, and reduce resistance gradually, when resistance is reduced to a certain resistance, occur as automatic dialing fault, can obtain failure mechanism: because wicking length exceeds standard between two close through hole holes of pcb board, issue the migration of pig copper ion at the hectic fever environment, cause two resistance between the buried via hole to descend, thereby cause dialing automatically to be lost efficacy.
Preferably, baking temperature is 60 ℃-90 ℃ in the described step (2).
Preferably, stoving time is 30-60 minute in the described step (2).
Adopt the beneficial effect of the technical program to be: the following step that adopts standard criterion: baking, failpoint location physical isolation, failpoint location electricity analysis and microsection analysis, can find the fault point very soon, so that determine the fault responsible party and, avoid similar fault to take place once more as production technological transformation foundation.
Description of drawings
Fig. 1 is a kind of mobile phone of the present invention flow chart of the detection method of the failure mechanism of dialing automatically.
Embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Embodiment 1,
Client has a collection of mobile phone to use about 3 months after sale at the Southeast Asia damp-heat area, a large amount of No. 6/7/8 identical three buttons failure of removal that dial automatically that occur, fault shows as No. 6/,7/8 three buttons dialing automatically under the situation of not operation, numerical value reality all over the screen, until mobile phone shutdown, bring the tremendous economic loss for mobile phone production and sales each side, must accurately determine failure cause as early as possible, with clearly defining responsibilities, and take related technical measures, stop similar accident and take place, sampling fault mobile phone is tested, all have above-mentioned phenomenon of the failure really.
As shown in Figure 1, above-mentioned fault mobile phone is carried out the fault principle analyze, concrete steps are as follows:
(1), toasts, with defective products mobile phone baking drying, the moist factor of eliminating initiating failure; Be specially the defective products mobile phone was toasted 45 minutes in 85 degrees centigrade environment, be cooled to room temperature, after mobile phone added the power supply start, the phenomenon that dials automatically still existed, and explanation causes the factor of dialing automatically still to exist thus.
(2), failpoint location physical isolation, the defective products mobile phone is removed shell, peel off the mobile phone key keyboard, add the power supply start after, still exist as the phenomenon of automatic dialing, get rid of the mobile phone key keyboard and cause and lost efficacy, search the common node of automatic dialing inefficacy button; Be specially the defective products mobile phone removed shell, peel off the mobile phone key keyboard, add power supply start after, the phenomenon of dialing still exists automatically, has got rid of the mobile phone key keyboard and has caused and lost efficacy.Owing to dialling automatically is 6,7, No. 8, and is not one number, checks circuit theory diagrams as can be known, and button 6,7,8 has a common node KPD_R3, and the signal that therefore causes dialling automatically should be on the common node KPD_R3 of 6,7,8 buttons.
(3), failpoint location electricity analysis, after start, with the waveform on the described common node of oscilloscope measurement, as abnormal signal is arranged on the common node, and its abnormal signal is subjected to an end and is electrically connected on the resistance of described common node and the effect of signals on the diode, the time and the frequency of the two appearance are quite similar, further measure described resistance two ends resistance, as this resistance well below normal value, can determine that failpoint is described resistance position, described resistance is taken off measurement, and normal as resistance, promptly the decidable failure cause is the circuit board inefficacy between two welding of described resistance buried via hole.
Detailed process is after start, and with the waveform on the oscilloscope measurement defective products KPD_R3, finding has abnormal signal on the KPD_R3, the effect of signals on the R366/D15 that its abnormal signal is close to, and the time and the frequency of the two appearance are quite similar; And contrast non-defective unit mobile phone, last with the contiguous R366/D15 of KPD_R3 does not have this influencing each other, and this abnormal signal can not occur on the common node KPD_R3.
Illustrate that thus signal and KPD_R3 signal on the defective products mobile phone R366/D15 influence each other, promptly for the defective products mobile phone of automatic dialing class, in case start, R366/D15 will produce signal, this moment, KPD_R3 can produce signal simultaneously, make the signal on the KPD_R3 become low level, be equivalent to 6,7,8 keys and produce dialing automatically by high level (about 3V).
At above-mentioned electricity analysis, to carrying out resistance measurement (result such as table 3) between R366 and common point KPD_R3, find always that automatically resistance value is more much lower than the resistance value of non-defective unit mobile phone same position between the R366 of dial-in handset NG006 and common point KPD_R3.
(4), microsection analysis, buried via hole that links to each other with described resistance on defective products, the non-defective unit and the buried via hole that links to each other with inefficacy button common node are carried out the microsection analysis, the section sample grinds, if between two buried via holes of defective products mobile phone microsection Fil-Lumiere is arranged in the metallograph, and length is longer than Fil-Lumiere length between the non-defective unit mobile phone buried via hole far away, can determine that fault is due to the wicking length by length of mobile phone pcb board exceeds standard.
The concrete steps process is carried out the microsection analysis for the buried via hole that links to each other with R366 on the product that lost efficacy, the non-defective unit being reached the buried via hole that links to each other with 6,7, No. 8 key common point KPD_R3, and carry out sample and grind, metallograph shows between the defective products mobile phone microsection through hole Fil-Lumiere, and plane lapping finds around R366 buried via hole and the common point KPD_R3 buried via hole round ghost image material is arranged.Fil-Lumiere is shorter between the non-defective unit mobile phone through hole.
(5), ESEM and energy spectrum analysis (SEM/EDS):
In specimen, again sample microsection surface filiform focused ion beam (FIB) cutting and ESEM and energy spectrum analysis have been carried out.As can be seen, glass and interlaminar resin have the slit, have copper to exist in the slit.Sample plane is ground the back round material around the buried via hole is carried out energy spectrum analysis, and the result proves between two buried via holes has the copper existence in the glass and resin fillers matter.
(6) wicking linear measure longimetry:
20 pcb boards are carried out microsection, and the wicking length of finding 1 pcb board is greater than 100 microns (μ m), do not meet among IPC-6012B, the IPC-A-600G regulation to the class2 product.
(7), carry out the crash simulation experiment, promptly between the above buried via hole of the pcb board of non-defective unit mobile phone, connect variable resistor, and reduce resistance gradually, when resistance is reduced to a certain resistance, occur as automatic dialing fault, can obtain failure mechanism:, issue the migration of pig copper ion at the hectic fever environment because wicking length exceeds standard between two close through hole holes of pcb board, cause two resistance between the buried via hole to descend, thereby cause dialing automatically to be lost efficacy.Be specially between OK035 sample R366 buried via hole and common point KPD_R3 buried via hole, the resistance of the different resistances that directly link to each other is to simulate automatic dialing phenomenon.Test back finds that sample OK035 dials automatically when the resistance that loads between two buried via holes during smaller or equal to 27K Ω.
Obtain failure mechanism by above-mentioned analytic process:
Because wicking length exceeds standard between two close through hole holes of pcb board, issue the migration of pig copper ion at the hectic fever environment, cause the resistance between R366 and the KPDR3 to drop to below 27K ohm, thereby cause dialing automatically to be lost efficacy.Thereby determined that fault responsible party has also found foundation for the technological improvement of producing from now on.
Embodiment 2, and all the other are identical with embodiment 1, and difference is that baking temperature is 60 ℃ in the described step (2), and stoving time is 60 minutes.
Embodiment 3, and all the other are identical with embodiment 1, and difference is that baking temperature is 90 ℃ in the described step (2), and stoving time is 30 minutes.
Adopt the beneficial effect of the technical program to be: the following step that adopts standard criterion: baking, failpoint location physical isolation, failpoint location electricity analysis and microsection analysis, can find the fault point very soon, so that determine the fault responsible party and, avoid similar fault to take place once more as production technological transformation foundation.
Above-described only is preferred implementation of the present invention, should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the invention design, can also make some distortion and improvement, and these all belong to protection scope of the present invention.
Claims (6)
1. the detection method of the failure mechanism of the automatic dialing of mobile phone may further comprise the steps,
(1), toasts, with defective products mobile phone baking drying, the moist factor of eliminating initiating failure;
(2), failpoint location physical isolation, the defective products mobile phone is removed shell, peel off the mobile phone key keyboard, add the power supply start after, still exist as the phenomenon of automatic dialing, get rid of the mobile phone key keyboard and cause and lost efficacy, search the common node of automatic dialing inefficacy button;
(3), failpoint location electricity analysis, after start, with the waveform on the described common node of oscilloscope measurement, as abnormal signal is arranged on the common node, and its abnormal signal is subjected to an end and is electrically connected on the resistance of described common node and the effect of signals on the diode, the time and the frequency of the two appearance are quite similar, further measure described resistance two ends resistance, as this resistance well below normal value, can determine that failpoint is described resistance position, described resistance is taken off measurement, and normal as resistance, promptly the decidable failure cause is the circuit board inefficacy between two welding of described resistance buried via hole;
(4), microsection analysis, buried via hole that links to each other with described resistance on defective products, the non-defective unit and the buried via hole that links to each other with inefficacy button common node are carried out the microsection analysis, the section sample grinds, if between two buried via holes of defective products mobile phone microsection Fil-Lumiere is arranged in the metallograph, and length is longer than Fil-Lumiere length between the non-defective unit mobile phone buried via hole far away, can determine that fault is due to the wicking length by length of mobile phone pcb board exceeds standard.
2. mobile phone according to claim 1 is the detection method of the failure mechanism of dialing automatically, it is characterized in that, also comprises step (5), ESEM and energy spectrum analysis (SEM/EDS):
In specimen, again microsection surface filiform focused ion beam (FIB) cutting and ESEM and energy spectrum analysis have been carried out, check whether glass and interlaminar resin have the slit, if any the slit, whether there is copper to exist in the slit, and described microsection surface plane is ground the back round material around the buried via hole is carried out energy spectrum analysis, check between described two buried via holes in the glass and resin fillers matter whether the copper existence is arranged.
3. mobile phone according to claim 2 is the detection method of the failure mechanism of dialing automatically, it is characterized in that, also comprises step (6), wicking linear measure longimetry:
Diffusion length to described copper is that wicking length is measured, and sees the regulation that whether does not meet among IPC-6012B and the IPC-A-600G the class2 product.
4. mobile phone according to claim 3 is the detection method of the failure mechanism of dialing automatically, it is characterized in that, also comprise step (7), carry out the crash simulation experiment, promptly between the above buried via hole of the pcb board of non-defective unit mobile phone, connect variable resistor, and reduce resistance gradually, when resistance is reduced to a certain resistance, occur as automatic dialing fault, can obtain failure mechanism: because wicking length exceeds standard between two close through hole holes of pcb board, issue the migration of pig copper ion at the hectic fever environment, cause two resistance between the buried via hole to descend, thereby cause dialing automatically to be lost efficacy.
5. according to the detection method of the automatic failure mechanism that dials of the arbitrary described mobile phone of claim 1 to 4, it is characterized in that baking temperature is 60 ℃-90 ℃ in the described step (2).
6. mobile phone according to claim 5 is the detection method of the failure mechanism of dialing automatically, it is characterized in that, stoving time is 30-60 minute in the described step (2).
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105920168A CN102143255A (en) | 2010-12-16 | 2010-12-16 | Method for detecting failure mechanism of automatic dialing of mobile phone |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105920168A CN102143255A (en) | 2010-12-16 | 2010-12-16 | Method for detecting failure mechanism of automatic dialing of mobile phone |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102495780A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Computer mainboard failure analysis method |
| CN102495309A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Failure analysis method |
| CN106226310A (en) * | 2016-07-28 | 2016-12-14 | 广州兴森快捷电路科技有限公司 | A kind of failure analysis test method of wiring board through hole expanded by heating |
| CN106776485A (en) * | 2016-12-23 | 2017-05-31 | 苏州华碧微科检测技术有限公司 | A kind of method that expert's conclusion based on probability calculation quantifies |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1272038A (en) * | 1999-04-26 | 2000-11-01 | 国际商业机器公司 | Porous power source and stratum capable of reducing PCB stripping with higher reliability |
Non-Patent Citations (1)
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| 莫芸绮: "LCD用COF挠性印制板制作工艺研究及PCB失效分析", 《中国优秀硕士学位论文全文数据库》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102495780A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Computer mainboard failure analysis method |
| CN102495309A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Failure analysis method |
| CN106226310A (en) * | 2016-07-28 | 2016-12-14 | 广州兴森快捷电路科技有限公司 | A kind of failure analysis test method of wiring board through hole expanded by heating |
| CN106776485A (en) * | 2016-12-23 | 2017-05-31 | 苏州华碧微科检测技术有限公司 | A kind of method that expert's conclusion based on probability calculation quantifies |
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Application publication date: 20110803 |