CN112394255A - Method for testing electromagnetic radiation sensitivity of PCB (printed circuit board) - Google Patents

Method for testing electromagnetic radiation sensitivity of PCB (printed circuit board) Download PDF

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Publication number
CN112394255A
CN112394255A CN202011482769.3A CN202011482769A CN112394255A CN 112394255 A CN112394255 A CN 112394255A CN 202011482769 A CN202011482769 A CN 202011482769A CN 112394255 A CN112394255 A CN 112394255A
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CN
China
Prior art keywords
pcb
tested
radiation sensitivity
electromagnetic radiation
simulation
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Pending
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CN202011482769.3A
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Chinese (zh)
Inventor
薄元窈
张宗兵
张钰
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Guangzhou GRG Metrology and Test Co Ltd
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Guangzhou GRG Metrology and Test Co Ltd
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Priority to CN202011482769.3A priority Critical patent/CN112394255A/en
Publication of CN112394255A publication Critical patent/CN112394255A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00Details relating to the type of the circuit
    • G06F2115/12Printed circuit boards [PCB] or multi-chip modules [MCM]

Abstract

The invention provides a method for testing electromagnetic radiation sensitivity of a PCB, which comprises the following steps: importing the PCB model to be tested into HFSS software; setting a simulation solving type, a load resistance and an electromagnetic wave attribute according to a preset simulation scheme, and establishing a port at a key pin to be tested; and carrying out simulation test after adding boundary conditions to the PCB model to be tested, and outputting a monitoring curve of the key pin to be tested. By implementing the invention, the electromagnetic radiation sensitivity of the PCB can be accurately simulated and tested, and the radiation sensitivity of the key pins of the PCB can be simulated and obtained, thereby avoiding the risk that the radiation sensitivity of the molded product exceeds the standard.

Description

Method for testing electromagnetic radiation sensitivity of PCB (printed circuit board)
Technical Field
The invention relates to the field of electromagnetic testing, in particular to a method for testing electromagnetic radiation sensitivity of a PCB.
Background
The modern electronics industry has an increasingly widespread need for the study of electromagnetic compatibility characteristics of electrical and electronic systems. The microwave circuit is one of essential core components in the fields of ground communication, satellite communication, navigation, guidance, radar, electronic countermeasure, microwave remote sensing, measuring instruments, aerospace technology and the like, and whether the microwave circuit works normally or not is directly related to the performance of equipment.
At present, the electromagnetic compatibility characteristic of the PCB circuit is mainly focused on the electromagnetic interference part, and relatively few researches on electromagnetic sensitivity are made, especially, simulations on radiation sensitivity of the PCB are much less and less, and only simulations on radiation coupling electromagnetic sensitivity of the circuit are also mainly focused on obtaining the resonant frequency and the strong coupling frequency point of the circuit physical model of the electronic device. The resonant frequency and the strong coupling frequency point aim at the electromagnetic property of the whole PCB circuit in a frequency domain, in actual work, electronic equipment and related devices of the PCB mainly pay attention to the bearing capacity of the electronic equipment and related devices of the PCB on current and voltage in a time domain, the electromagnetic properties paid attention to the electronic equipment and related devices of the PCB cannot be directly converted, and when the electronic equipment is interfered by external electromagnetic waves, only one device in one PCB cannot normally work, so that the whole equipment is caused to have problems. In the prior art, because the electromagnetic sensitivity of electronic equipment or devices cannot be accurately tested during product design, the risk of over-standard radiation sensitivity of the formed products is easy to occur.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a method for testing the electromagnetic radiation sensitivity of a PCB, which can accurately simulate and test the electromagnetic radiation sensitivity of the PCB, thereby avoiding the risk that the radiation sensitivity of a product after being molded exceeds the standard.
In order to solve the above technical problem, an embodiment of the present invention provides a method for testing electromagnetic radiation sensitivity of a PCB, including:
importing the PCB model to be tested into HFSS software;
setting a simulation solving type, a load resistance and an electromagnetic wave attribute according to a preset simulation scheme, and establishing a port at a key pin to be tested;
and carrying out simulation test after adding boundary conditions to the PCB model to be tested, and outputting a monitoring curve of the key pin to be tested.
Further, the PCB model to be tested is an SIwave model of a buzzer circuit, and devices in the buzzer circuit comprise a double operational amplifier, an infrared pair tube and a buzzer.
Further, the setting of the simulation solution type, the load resistance and the electromagnetic wave property according to a preset simulation scheme and the establishment of the port at the key pin to be tested specifically include:
according to a preset simulation scheme, the simulation solving type is set to be time domain solving, the load resistance is set to be 50 ohms, the electromagnetic wave property is set to be plane wave with the incident direction perpendicular to the surface of the PCB, the incident wave shape is broadband pulse, and a port is established at a key pin to be tested.
Further, the key pins to be tested comprise an input pin and an output pin of the dual operational amplifier.
Further, the method for testing electromagnetic radiation sensitivity of the PCB further comprises:
and acquiring and outputting the amplitude of the monitoring curve.
Further, the monitoring curves include a voltage monitoring curve and a current monitoring curve.
Further, the method for testing electromagnetic radiation sensitivity of the PCB further comprises:
and acquiring and outputting the rated current value and the rated voltage value of the device corresponding to the key pin to be tested.
Further, the method for testing electromagnetic radiation sensitivity of the PCB further comprises:
when the amplitude of the current monitoring curve is judged to be larger than a preset current threshold or the amplitude of the voltage monitoring curve is judged to be larger than a preset voltage threshold, the electromagnetic radiation sensitivity test of the PCB is judged to be unqualified; the preset current threshold value is smaller than or equal to the rated current value, and the preset voltage threshold value is smaller than or equal to the rated voltage value.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a method for testing electromagnetic radiation sensitivity of a PCB, which comprises the following steps: importing the PCB model to be tested into HFSS software; setting a simulation solving type, a load resistance and an electromagnetic wave attribute according to a preset simulation scheme, and establishing a port at a key pin to be tested; and carrying out simulation test after adding boundary conditions to the PCB model to be tested, and outputting a monitoring curve of the key pin to be tested. By implementing the invention, the electromagnetic radiation sensitivity of the PCB can be accurately simulated and tested, and the radiation sensitivity of the key pins of the PCB can be simulated and obtained, thereby avoiding the risk that the radiation sensitivity of the molded product exceeds the standard.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for testing electromagnetic radiation sensitivity of a PCB according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a wideband pulse waveform provided in accordance with an embodiment of the present invention;
fig. 3 is a RS103 limit parameter table in the GJB151B according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a time-domain current curve of a critical pin to be tested according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a time domain voltage curve of a critical pin to be tested according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, at present, the electromagnetic compatibility characteristic of the PCB circuit is mainly focused on the electromagnetic interference part, and relatively few researches on the electromagnetic sensitivity are made, especially, simulations on the radiation sensitivity of the PCB are few, and only simulations on the radiation coupling electromagnetic sensitivity of the circuit are also mainly focused on obtaining the resonant frequency and the strong coupling frequency point of the physical model of the electronic device circuit. The resonant frequency and the strong coupling frequency point aim at the electromagnetic property of the whole PCB circuit in the frequency domain, in the actual work, the electronic equipment and related devices of the PCB mainly pay attention to the bearing capacity of the electronic equipment and related devices of the PCB on current and voltage in the time domain, the electromagnetic properties concerned by the electronic equipment and related devices of the PCB cannot be directly converted, and when the electronic equipment is interfered by external electromagnetic waves, only one device in a certain PCB cannot normally work, so that the whole equipment is caused to have problems, and therefore, the acquisition of the voltage and current properties of a key device pin is very important. Meanwhile, if the voltage and current values possibly coupled to the electronic equipment or the device under the external electromagnetic wave interference can be obtained in a simulation mode during product design, powerful reference is provided for product design and device selection, and the risk that the radiation sensitivity of the formed product exceeds the standard is avoided.
The invention aims to research a method for acquiring the irradiation sensitivity of a PCB under the irradiation of plane waves by utilizing the simulation of HFSS (high Frequency Structure simulator) of electromagnetic simulation software, and reflects the influence of electromagnetic waves on the PCB by monitoring the waveforms of voltage and current signals of key pins on the PCB. According to the simulation method, the voltage and current waveforms of any pin on the PCB under the interference of certain electromagnetic waves can be obtained in a simulation mode, so that whether the voltage and current coupled to the pin under the interference of the electromagnetic waves exceed rated values which can be borne by the device or not can be judged visually, and the design of the PCB is guided.
The existing simulation method for the radiation coupling electromagnetic sensitivity of electronic equipment comprises the following specific steps: firstly, establishing a circuit physical model of the electronic equipment; secondly, setting constraint conditions of the simulation of the radiation coupling electromagnetic sensitivity of the electronic equipment; and thirdly, performing electromagnetic sensitivity simulation on the electronic equipment in three-dimensional electromagnetic simulation software HFSS. Obtaining the resonant frequency R of the electromagnetic sensitivity of the electronic equipment through electromagnetic sensitivity simulationFAAAnd a strong coupling frequency point QFAA
It should be noted that the prior art has the following disadvantages:
1. the simulation result obtained by the prior art aims at the whole PCB circuit model of the electronic equipment, and the electromagnetic characteristics of the key device pins on the PCB cannot be obtained.
2. The resonant frequency and the strong coupling frequency point concerned by the prior art are the electromagnetic characteristics of the whole PCB circuit of the electronic equipment in the frequency domain, and the bearing capacity of relevant devices of a product PCB to current and voltage in the time domain cannot be directly obtained in practical application, so that the problem that the radiation sensitivity of the product exceeds the standard cannot be quickly and accurately found.
The simulation method of the radiation sensitivity of the PCB researched by the invention can simulate and acquire the voltage and current waveforms of any pin on any PCB under the interference of certain electromagnetic wave, thereby judging whether the voltage and current coupled to any pin under the interference of the electromagnetic wave exceed the limit value which can be born by the device or not and further guiding the design of the PCB.
Referring to fig. 1, an embodiment of the present invention provides a method for testing electromagnetic radiation sensitivity of a PCB, including the steps of:
and S1, importing the PCB model to be tested into HFSS software. Further, the PCB model to be tested is an SIwave model of a buzzer circuit, and devices in the buzzer circuit comprise a double operational amplifier, an infrared pair tube and a buzzer.
And S2, setting the simulation solving type, the load resistance and the electromagnetic wave attribute according to a preset simulation scheme, and establishing a port at the key pin to be tested. Further, step S2 specifically includes:
according to a preset simulation scheme, the simulation solving type is set to be time domain solving, the load resistance is set to be 50 ohms, the electromagnetic wave property is set to be plane wave with the incident direction perpendicular to the surface of the PCB, the incident wave shape is broadband pulse, and a port is established at a key pin to be tested. Further, the key pins to be tested comprise an input pin and an output pin of the dual operational amplifier.
The plane wave means that both an electric field and a magnetic field of an electromagnetic wave can be analyzed in a plane. The analysis of the plane wave is an analysis method for simplifying a 3-dimensional wave into a 2-dimensional wave, which can characterize the characteristics of the electromagnetic wave, but the plane wave does not exist in practice, and only the 3-dimensional electromagnetic wave can be equivalent to the 2-dimensional plane wave analysis in some far-field problem analysis.
And S3, performing simulation test after adding boundary conditions to the PCB model to be tested, and outputting a monitoring curve of the key pin to be tested. Further, the monitoring curves include a voltage monitoring curve and a current monitoring curve.
Further, the method for testing the electromagnetic radiation sensitivity of the PCB further comprises the following steps:
and S4, acquiring and outputting the amplitude of the monitoring curve.
Further, the method for testing the electromagnetic radiation sensitivity of the PCB further comprises the following steps:
and S5, acquiring and outputting the rated current value and the rated voltage value of the device corresponding to the key pin to be tested.
Further, the method for testing the electromagnetic radiation sensitivity of the PCB further comprises the following steps:
s6, when the amplitude of the current monitoring curve is judged to be larger than a preset current threshold or the amplitude of the voltage monitoring curve is judged to be larger than a preset voltage threshold, judging that the electromagnetic radiation sensitivity test of the PCB is unqualified; the preset current threshold value is smaller than or equal to the rated current value, and the preset voltage threshold value is smaller than or equal to the rated voltage value.
It should be noted that the above method or flow embodiment is described as a series of acts or combinations for simplicity, but those skilled in the art should understand that the present invention is not limited by the described acts or sequences, as some steps may be performed in other sequences or simultaneously according to the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are exemplary embodiments and that no single embodiment is necessarily required by the inventive embodiments.
Based on the above scheme, in order to better understand the method for testing the electromagnetic radiation sensitivity of the PCB provided by the embodiment of the present invention, the following detailed description is made:
1. aiming at a self-made SIwave model of a buzzer circuit, in order to calculate the radiation sensitivity of the buzzer circuit, a PCB model is led into an electromagnetic simulation software HFSS. The buzzer PCB mainly comprises a double operational amplifier, an infrared geminate transistor, a buzzer and the like.
2. After the PCB model is led into the HFSS, setting the solving type as time domain solving, establishing a port at a key pin which an engineer wants to monitor in the PCB, and setting lumpRLC boundary conditions, namely load resistance as 50 ohms; a plane wave is arranged right above the PCB, the incident direction is vertical to the surface of the PCB, the incident waveform is a broadband pulse, and as shown in fig. 2, the limit of the incident field intensity, which is referred to as RS103 in GJB151B shown in fig. 3, on the ground surface of the army is set to be 50V/m.
3. After the simulation model is set, boundary conditions required by simulation are added, and then the simulation is carried out. Fig. 4 and 5 are time domain current and time domain voltage curves monitored at input and output pins of a device dual operational amplifier, respectively, wherein the A, C curve is a result monitored at the output pin, and the B, D curve is a result monitored at the input pin.
4. As can be seen from fig. 4 and 5, the voltage amplitude monitored at the input/output pin of the dual operational amplifier is in the uV order, and the current amplitude is in the nA order. According to the simulation method, the intensity of external electromagnetic radiation sensed on the pin of the PCB key device can be obtained, if the external electromagnetic radiation coupled to the key pin is large, the voltage or current monitored from the pin is larger than the voltage or current of the pin without external electromagnetic interference, and whether the interference of the intensity can influence the normal work of the device can be judged by combining with the rated voltage or current value which can be born by the device.
It should be noted that, the technical scheme of the invention has the following beneficial effects:
1. whether the radiation sensitivity of the device is qualified or not can be judged during the research and development of the PCB;
2. the PCB research and development cost is saved, and the production efficiency is improved.
The key points of the technology of the invention are as follows:
1. the simulation method discussed in the invention mainly uses HFSS simulation of electromagnetic simulation software to obtain the radiation sensitivity of the key pins of the PCB.
2. The method discussed by the invention can provide a reference for the selection of the device during the design of the PCB, and avoids the influence of the device with higher radiation sensitivity on the normal work of the PCB.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims (8)

1. A method for testing electromagnetic radiation sensitivity of a PCB is characterized by comprising the following steps:
importing the PCB model to be tested into HFSS software;
setting a simulation solving type, a load resistance and an electromagnetic wave attribute according to a preset simulation scheme, and establishing a port at a key pin to be tested;
and carrying out simulation test after adding boundary conditions to the PCB model to be tested, and outputting a monitoring curve of the key pin to be tested.
2. The method for testing the electromagnetic radiation sensitivity of the PCB as recited in claim 1, wherein the PCB model to be tested is an SIwave model of a buzzer circuit, and devices in the buzzer circuit comprise a dual operational amplifier, an infrared pair transistor and a buzzer.
3. The method for testing electromagnetic radiation sensitivity of a PCB according to claim 1, wherein the setting of the simulation solution type, the load resistance, and the electromagnetic wave property according to the preset simulation scheme, and the establishing of the port at the critical pin to be tested specifically comprises:
according to a preset simulation scheme, the simulation solving type is set to be time domain solving, the load resistance is set to be 50 ohms, the electromagnetic wave property is set to be plane wave with the incident direction perpendicular to the surface of the PCB, the incident wave shape is broadband pulse, and a port is established at a key pin to be tested.
4. The method for testing electromagnetic radiation sensitivity of the PCB according to claim 2, wherein the critical pins to be tested comprise an input pin and an output pin of the dual operational amplifier.
5. The method for testing electromagnetic radiation sensitivity of the PCB according to claim 1, further comprising:
and acquiring and outputting the amplitude of the monitoring curve.
6. The PCB board electromagnetic radiation sensitivity test method of claim 5, wherein the monitoring curves comprise a voltage monitoring curve and a current monitoring curve.
7. The PCB board electromagnetic radiation sensitivity test method of claim 6, further comprising:
and acquiring and outputting the rated current value and the rated voltage value of the device corresponding to the key pin to be tested.
8. The method for testing electromagnetic radiation sensitivity of the PCB of claim 7, further comprising:
when the amplitude of the current monitoring curve is judged to be larger than a preset current threshold or the amplitude of the voltage monitoring curve is judged to be larger than a preset voltage threshold, the electromagnetic radiation sensitivity test of the PCB is judged to be unqualified; the preset current threshold value is smaller than or equal to the rated current value, and the preset voltage threshold value is smaller than or equal to the rated voltage value.
CN202011482769.3A 2020-12-15 2020-12-15 Method for testing electromagnetic radiation sensitivity of PCB (printed circuit board) Pending CN112394255A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114355089A (en) * 2022-01-10 2022-04-15 北京航空航天大学 Electromagnetic environment effect boundary testing method for electronic system
TWI771232B (en) * 2021-11-23 2022-07-11 英業達股份有限公司 System and method for testing radiation susceptibility

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771232B (en) * 2021-11-23 2022-07-11 英業達股份有限公司 System and method for testing radiation susceptibility
CN114355089A (en) * 2022-01-10 2022-04-15 北京航空航天大学 Electromagnetic environment effect boundary testing method for electronic system

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Application publication date: 20210223