CN102131139B - Microphone package of micro-electro-mechanical system and manufacturing method thereof - Google Patents
Microphone package of micro-electro-mechanical system and manufacturing method thereof Download PDFInfo
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- CN102131139B CN102131139B CN201010605278.3A CN201010605278A CN102131139B CN 102131139 B CN102131139 B CN 102131139B CN 201010605278 A CN201010605278 A CN 201010605278A CN 102131139 B CN102131139 B CN 102131139B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
Abstract
The present invention provides a microphone package of a micro-electro-mechanical system and a manufacturing method thereof. The microphone package comprises an outer cover with a conductive component, wherein the outer cover is provided on a substrate for constructing a hollow chamber. A sensing component of the micro-electro-mechanical system and an IC chip are provided in the hollow chamber. A sound hole comprises a sound transmission channel which is connected with the hollow chamber and an outer space. A first grounding pad is provided on a back surface of the substrate, and is connected with a conductive component of the outer cover through a through hole in the substrate. A second grounding pad is provided on a back surface of the substrate, and is connected with the sensing component of the micro-electro-mechanical system or the IC chip through an inner connecting line in the substrate, wherein the first grounding pad and the second grounding pad are insulated from each other.
Description
Technical field
The present invention relates to a kind of micromachined acoustic element packaging body, particularly a kind of micromachined MEMS (micro electro mechanical system) (MEMS) microphone package and manufacture method thereof.
Background technology
Micromachined silicon microphone has been disclosed in many patents.For example, US Patent No. 5,619,476, US 5,870,351, US 5,894,452 and US 6,493,288 disclose the manufacture method of a kind of capacitor type ultrasonic sensors (transducer).Moreover, US Patent No. 5,146,435, US 5,452,268, US6,535,460 and US 6,870,937 disclose a kind of micromachined capacitance type transducers, it is mainly used in the acquisition of sound.Yet in above-mentioned patent, main invention technical characterictic is all absorbed in design and the manufacture of micromachined microphone chip.In brief, foregoing invention technical characterictic is all absorbed in the wafer level process of microphone.
For being applied to the microphone of any pattern electronic installation, suitable outer cover component need to be provided, this microphone chip can be stored in applicable packaging part, to avoid it to be subject to the interference of environment.Preferably, this outer cover element structure also can cover the sensing member of silicon microphone, the electromagnetic interference of isolating exterior.Moreover the microphone of this encapsulation need to contact lead foot, make this contact lead foot energy soldering in using on the electron plate of this microphone.Finally, the method for encapsulation being applied to microphone must meet low-cost important document and allow mass-produced important document.
Compared to traditional electret microphone (electret microphone), the advantage of the MEMS microphone of micromachined is for can bear high reflow (re-flow) temperature.Therefore,, in order to reduce the packaging cost of electronic product, the encapsulation pattern of the MEMS microphone of this micromachined is to allow microphone surface encapsulation on printed circuit board (PCB) (PCB).
Many method for packing for MEMS microphone have been disclosed in known technology.US Patent No. 6,781,231, is incorporated herein by a part herein by its all content, discloses a kind of MEMS (micro electro mechanical system) (MEMS) packaging body, and it comprises MEMS microphone, substrate and capping.This substrate has surface, supports this MEMS microphone.This capping comprises conductive layer, and it has middle body and partly bonds by periphery edge.The periphery edge part that the formation of outer cover component is passed through to connect this capping is to this substrate.Insulating space between the middle body of this capping and the surface of this substrate, to hold this MEMS microphone.This outer cover component comprises acoustics port (acoustic port), allows acoustic signal to arrive at this MEMS microphone.U.S. Patent application discloses US 2005/0018864 in early days, and its all content is incorporated herein by a part herein, discloses a kind of silicon capacitance microphone packaging body, and it comprises sensor unit, substrate and capping.This substrate comprises upper surface, has recessed portion in the inner.This sensor unit is attached on the upper surface of this substrate, and overlapping with this recessed at least a portion, and wherein this sensor unit has back volume and is formed between this sensor unit and this substrate.This capping is arranged at this sensor unit top and comprises perforate.
US Patent No. 7,434,305, is incorporated herein by a part herein by its all content, discloses a kind of silicon capacitance microphone packaging body, and it comprises sensor unit, substrate and capping.This substrate comprises upper surface, has recessed portion in the inner.This sensor unit is attached on the upper surface of this substrate, and overlapping with this recessed at least a portion, and wherein this sensor unit has back volume and is formed between this sensor unit and this substrate.This capping is arranged at this sensor unit top and comprises perforate.
United States Patent (USP) 7,439,616, is incorporated herein by a part herein by its all content, discloses a kind of silicon capacitance microphone packaging body, and it comprises sensor unit, substrate and capping.This substrate comprises upper surface.This sensor unit is attached on the upper surface of this substrate, and overlapping with this recessed at least a portion, and wherein this sensor unit has back volume and is formed between this sensor unit and this substrate.This capping is arranged at this sensor unit top, and one of them of this substrate or this capping comprises perforate.
Above-mentioned method for packing provides silicon capacitance microphone packaging body, and it allows acoustic energy contact to be arranged at this sensor unit in outer cover.This outer cover provides essential pressure reference value, and at the same time, can protect again this transducer to avoid optical, electrical magnetic disturbance and physical injury.Yet described method for packing fails to solve this microphone package in the key viewpoint of using in upper or assembling.The viewpoint of part comprises, but be not limited to, see through the sidewall of this microphone package and/or the leakage of the acoustics of capping, safely microphone is attached to the PCB motherboard that is positioned at lower floor, the validity of shield electromagnetic interference, the electronic signal transmission distortion of the PCB motherboard from this microphone package to lower floor, the microphone of encapsulation is in the flexibility of surface encapsulation, and mass-produced ease of manufacture etc.
Summary of the invention
According to embodiments of the invention, a kind of MEMS (micro electro mechanical system) (MEMS) microphone package comprises: have the outer cover of conductive component, be arranged on substrate, to be built into hole; It is inner that MEMS sensing element and IC chip are arranged at this hole; Sound hole comprises that transaudient passage connects this hole and space outerpace; The first ground mat, is arranged at the back side of this substrate, connects this conductive component of this outer cover by the perforation in this substrate; And second ground mat, be arranged at the back side of this substrate, by the intraconnections in this substrate, connect this MEMS sensing element or this IC chip; Wherein this first ground mat and this second ground mat are isolated each other.
According to another embodiment of the present invention, the manufacture method of a kind of MEMS (micro electro mechanical system) (MEMS) microphone package, comprising: substrate is provided; Form MEMS sensing element and IC chip on this substrate; Joint has the outer of conductive component and covers on this substrate, around forming hole to hold this MEMS sensing element and this IC chip; Formation sound hole comprises that transaudient passage connects this hole and space outerpace; By the perforation in this substrate, connect this conductive component of this outer cover to the first ground mat that is arranged at this substrate back; And by the intraconnections in this substrate, connect this MEMS sensing element or this IC chip to the second ground mat that is arranged at this substrate back; Wherein this first ground mat and this second ground mat are isolated each other.
For the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing, be described in detail below.
Accompanying drawing explanation
Figure 1A-1C shows according to the microphone package of the embodiment of the present invention, with surface encapsulation in the generalized section of the PCB substrate supporting.
Fig. 2 A-2B shows microphone package according to an embodiment of the invention, there is no the generalized section of additional outer cover.
Fig. 3 shows the schematic top plan view of the conductive outer shield of MEMS microphone package according to an embodiment of the invention.
Fig. 4 shows conductive outer shield schematic top plan view according to another embodiment of the present invention.
Fig. 5 shows the generalized section along A-A ' line of cut direction by the microphone package of Fig. 3.
Fig. 6 shows according to the embodiment of the present invention schematic diagram that sound wave transmits in sandwich construction.
Fig. 7 shows according to the embodiment of the present invention schematic diagram that sound wave transmits in three ply board structure.
Fig. 8 is presented at transmission loss schematic diagram estimated in the three ply board structure of Fig. 7.
Fig. 9 shows the generalized section of the partition wall part of microphone package according to an embodiment of the invention.
Figure 10 A-10C shows the microphone package of other embodiment according to the present invention, with surface encapsulation in the generalized section of the PCB substrate supporting.
Figure 11 A-11C shows the microphone package of the other embodiment according to the present invention, with surface encapsulation in the generalized section of the PCB substrate supporting.
Description of reference numerals
1A, 1B～sound hole;
2～weld pad;
3～MEMS acoustics sensing apparatus;
4～IC chip;
5～passive component;
6～hole;
8～guard;
10～substrate;
11～interval;
15～extra sound hole;
17～transaudient passage;
20～partition wall part;
30～glueing material;
40～head components;
50～conductive outer shield;
51～edge rail;
52～welded gasket;
The top surface of 53～conductive outer shield;
60～acoustic absorption layer;
70～PCB motherboard;
80～acoustics envelope is layer only;
100a-100i～MEMS microphone package;
120～perforation;
130～the first ground mats;
135～contact pad;
140～the second ground mats;
150a, 150b～outer cover;
152 and 156～non-conductive layer;
153～partition wall part;
154～conductive layer;
155～head components;
160～intraconnections;
170～common ground pad;
175～contact pad.
Embodiment
With each embodiment, describe and be accompanied by below the example of accompanying drawing explanation in detail, as reference frame of the present invention.In accompanying drawing or specification description, similar or identical part is all used identical figure number.And in the accompanying drawings, the shape of embodiment or thickness can expand, and to simplify or convenient sign.Moreover, in accompanying drawing, the part of each element will be to describe respectively explanation, it should be noted that, the element that does not illustrate in figure or describe, for form known to a person of ordinary skill in the art in affiliated technical field, in addition, the ad hoc fashion that specific embodiment is only used for disclosing the present invention, it is not in order to limit the present invention.
The technical characteristics of the embodiment of the present invention and crucial example provide MEMS microphone package to have conductive outer shield, it is electrically connected to the common analogue ground lead foot of supporting printing circuit (PCB) motherboard, with shielding sensing element, isolation environment and electromagnetic interference.In embodiment, MEMS microphone package has very strong combination between the PCB of microphone package and support substrate, the connection between the PCB substrate based on conductive outer shield and this support.Embodiments of the invention also provide MEMS microphone package, for the enough ability to bears of thermal agitation tool that occur in encapsulation and packaging technology.Other embodiment of MEMS microphone package of the present invention more strengthen the sensor component that transfers to of acoustic signal, and this sensor component is arranged in this packaging body.
Of the present invention at present and other objects can reach by following examples, the MEMS microphone package of surface encapsulation comprises that sensor component, IC chip and other passive components are by base plate supports, and stores in the hole consisting of this substrate.Partition wall part and head components are arranged on this substrate.This head components has sound hole to allow acoustic signal to penetrate and arrive at the barrier film of MEMS sensing member.This substrate, partition wall part and head components are stacking and be combined into one, and to form hole in wherein, this hole changes the acoustic response of this MEMS sensing member with minimizing.Partition wall part and the head components of conductive outer shield around this microphone package is provided.Then, provide acoustic absorbing layer, and be folded between the partition wall part and head components of this conductive outer shield and this microphone package.This conductive outer shield can soldering in supporting on this PCB substrate of this microphone package, and be electrically connected to the common analogue ground lead foot being positioned on PCB motherboard, to form screen-wall, this wheat can be isolated with environmental interference and electromagnetic interference by wind.
Meanwhile, compared to known technology, the method for packing of the disclosed a kind of different MEMS microphone of the embodiment of the present invention.The packaging body of the MEMS microphone of the embodiment of the present invention has acoustics ground sounding and mass productivity concurrently.MEMS microphone of the present invention can be considered independently device and integrated member.After completing encapsulation, according to the present invention, the method for packing of part embodiment can change the acoustic response of this microphone with minimizing.Meanwhile, according to the present invention, the method for packing of part embodiment can provide and transmits electrical signals distortion from the microphone of this encapsulation to the PCB motherboard attaching with minimizing.According to the microphone package of other embodiments of the invention, provide mechanical shielding, with isolation environment and electromagnetic interference.
Refer to Figure 1A, MEMS microphone package 100a comprises substrate 10 according to an embodiment of the invention, and MEMS acoustics sensing apparatus 3, IC chip 4 and passive component 5 are packaged on substrate 10.Acoustics hole 6 is consisted of substrate 10, partition wall part 20 and head components 40.Described partition wall part 20 and head components 40 arrange and are attached on substrate 10, by glueing material 30, coat between substrate 10 and partition wall part 20, and between partition wall part 20 and head components 40.The height of described partition wall part 20 is enough high, causes between the top surface of MEMS acoustics sensing apparatus 3 and head components 40 and has enough intervals 11.Then, weld pad 2 is formed to the bottom of substrate 10, makes described MEMS microphone package be able to adhesive surface on PCB motherboard 70.Described substrate 10 can be made by FR-4 material, and substrate 10 is mated with the thermal property of PCB motherboard 70.Described head components 40 has sound hole 1A, can allow acoustic signal transmission to penetrate, to arrive at the surface of MEMS acoustics sensing apparatus 3.In embodiment, sound hole 1A is formed at and extends and penetrates this head components 40.This sound hole 1A comprises that transaudient passage 17 connects described hole and space outerpace.The position that can select sound hole 1A makes it away from sensing apparatus 3, to avoid it to be subject to that dust falls into and moisture is invaded, for example, from mankind's mouth, sends, and arrives at the surface of sensing apparatus 3.
Refer to Figure 1A, conductive outer shield 50 is surrounded and around described microphone package again.In embodiment, extra sound hole 15 is formed in described conductive outer shield 50 and with sound hole 1A and aims at, and acoustic signal is able to by this sound hole.Acoustic absorption layer 60 is folded in the position between partition wall part 20 and/or head components 40 and conductive outer shield 50.Described conductive outer shield 50 is not connected directly to the analog or digital ground connection lead foot of microphone package.Described conductive outer shield 50 but be electrically connected to the common analogue ground lead foot on PCB motherboard by welded gasket 52.
Described conductive outer shield 50 is consisted of metal or other electric conducting materials, and partition wall part 20 and head components 40 are generally to consist of plastic material or FR-4 material, to reach the object being electrically insulated.Described acoustic absorption layer 60 can comprise foam, cork, sponge, rubber or spraying silica-gel coating.
The manufacture method of MEMS microphone package is provided according to another embodiment of the present invention.Described manufacture method comprises the following steps: to provide substrate, forms hole, and described hole is surrounded by head components, partition wall part and substrate, wherein said partition wall part around and support top cover and described base plate supports head components and partition wall part.MEMS sensing element and IC chip are formed to the inside in hole.Then, formation sound hole comprises that transaudient passage connects described hole and space outerpace, and forms conductive outer shield encirclement head components and partition wall part.By described conductive outer shield soldering on printed circuit board (PCB) and be electrically connected to common analogue ground lead foot and be positioned on printed circuit board (PCB).
Figure 1B shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Figure 1B, MEMS microphone package 100b comprises the outer cover 150a with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150a is whole metal housing, by conducting resinl 30, is attached on described substrate 10.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.Sound hole 1A comprises that transaudient passage connects described hole 11 and space outerpace.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150a by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.Because the interference of digital signal and environment is isolated by different ground mats respectively, therefore can effectively reduce crosstalk effect and electromagnetic interference (EMI) noise.What in view of this, finally by MEMS microphone package 100b, received is voice signal totally and clearly.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
Fig. 1 C shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Fig. 1 C, MEMS microphone package 100c comprises the outer cover 150b with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150b is multilayer outer cover, by conducting resinl 30, is attached on described substrate 10.Described multilayer outer cover 150b can comprise head components 155 and partition wall part 153 around and support this head components.In another embodiment, described multilayer outer cover comprises conductive layer 154, is folded between two-layer non-conductive layer 152 and 156.It should be noted, described multilayer outer cover can also comprise that acoustic absorption layer liner is in the nexine of this multilayer outer cover.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.Sound hole 1A comprises that transaudient passage connects described hole 11 and space outerpace.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150b by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
Microphone package there is no the enforcement example of additional outer cover 50, as shown in Figure 2 A.This partition wall part 20 is for being typically integral with adhesive glue with this substrate 10 and head components 40.Separately alternatively, for example, when using plastic material as partition wall part 20 and head components 40, described partition wall part 20 can form with head components 40 and become the single capping 40 of integration, as shown in Figure 2 B.This single capping 40 is being attached at by adhesive glue on this substrate 10.When manufacturing, this head components 40, partition wall part 20 and substrate 10 can be stacked on one.In this embodiment, the medium that adhesive glue 30 is lamination, can be bonded to partition wall part 20 by described head components 40, continues and is bonded to substrate 10 again.
Described head components 40 and partition wall part 20 can be the material of individual layer, the material of for example plastic cement, or multilayer, for example FR-4 material.In any situation, do not need sandwiched conductive material layer between multilayer material.Head components 40 and the needed condition of partition wall part 20 are that the space in the hole that formed by it is enough large, make it be enough to include in MEMS sensing apparatus 3, passive component 5 and IC chip 4.Yet preferably, this head components 40 has high acoustic impedance (acousticimpedance) with this partition wall part 20.
Fig. 3 shows conductive outer shield 50 schematic top plan view according to an embodiment of the invention.Perforation 1A penetrate this conductive outer shield 50, make acoustic pressure wave (acoustic pressure wave) transmitted through.This conductive outer shield 50 has top surface 53 and edge rail 51, typically by metallic plate technique, and for example aluminium sheet or other electric conducting materials.This conductive outer shield 50 also can be made by multilayer material.Yet no matter which kind of situation, must have conductivity by one of them layer.Fig. 4 shows conductive outer shield 50 schematic top plan view according to another embodiment of the present invention.In this, described edge rail 51 is noncontinuity, yet it remains by the identical material of top surface 53 with this conductive outer shield 50, makes.
Fig. 5 shows the generalized section along A-A ' line of cut direction by the microphone package of Fig. 3.This acoustic absorption layer 60 can be coated the surface, inside of this conductive outer shield 50.In the bottom of this edge rail 51, scolding tin pad 52 is set so that whole conductive outer shield 50 is attached on this PCB motherboard 70, as shown in Figure 1 hermetically.This scolding tin pad 52 is electrical conductor, therefore makes this conductive outer shield 50 be electrically connected to common analogue ground lead foot 70 and is positioned on printed circuit board (PCB).As previous, emphasize, this acoustic absorption layer 60 can comprise foam, cork, sponge, rubber or spraying silica-gel coating.For the convenience on assembling, this acoustic absorption layer 60 can first be attached in this conductive outer shield 50, as shown in Figure 5.
The large subject under discussion that above-mentioned microphone package faces shields the ability of unwanted acoustic noise for it.These noises are spilt by partition wall part and the head components of this microphone package sometimes, and arrive at this sensing apparatus.Can consider that the multi-layer sheet of another embodiment is with head it off, as shown in Figure 6.When the incident of forward plane wave, penetrating coefficient (transmission coefficient) can be expressed as:
Wherein,
Z
n=ρ
nc
nfor impedance, k
n=ω c
nbe n
ththe wave number of layer, and d
nfor the position at interface, as shown in Figure 6.With regard to viscoelastic body material, described C can be expressed as follows:
Wherein, G
b(ω) and G
s(ω) represent respectively plural phantom number and cut-off-die number.
, transmission loss can have following formula and try to achieve:
TL＝20log|T(ω)|
The dependence of frequency and penetrating coefficient just can conclusively show thus.
With regard to three ply board (glass-macromolecule-glass), as shown in Figure 7, the function that this transmission loss is frequency, and be depicted in Fig. 8.At this, h represents the thickness of each layer.For material and the geometric parameter calculating, show below:
h
1＝h
3＝1.5mm，h
2＝2.2mm
ρ
0＝ρ
4＝1.2kg/m
3，ρ
1＝ρ
3＝2461kg/m
3，ρ
2＝1115kg/m
3
c
0＝c
4＝340m/sec，c
1＝c
3＝5770m/sec，
G
S(ω)＝μ
∞+(μ
0-μ
∞)[1+(iωτ
0)
1-α]
β
μ
∞＝2.35×10
8Pa
μ
0＝4.79×10
5Pa
α＝0.46
β＝-0.1946
τ
0＝0.3979sec
The result of Fig. 8 shows, by three ply board structure as shown in Figure 7, and can be so that the MEMS microphone package of micromachined during in 1kHz, can reach reducing noise to 20dB in frequency position standard.
Refer to Fig. 9, it shows partition wall part and the head components generalized section of this microphone package.This acoustic absorption layer 60 is folded between this outer cover 50 and partition wall part 20.Compared to Fig. 8, can point out easily that this sandwich structure is less than the illustrated three ply board structure at Fig. 8.Yet in typical microphone package, the thickness range of this outer cover 50 is conventionally between 0.05mm to 0.2mm.And the thickness of this partition wall part 20 is between changing between 0.1mm to 0.5mm.By the drawing of this numerical value and Fig. 8 the default comparison of arriving, the thickness of this partition wall part 20 is obviously less than the thickness of this outer cover 50.It should be noted, by selecting applicable acoustic absorption layer 60 just may reach transmission loss is reduced to acceptable degree.
As previously pointed, for the material of this acoustic absorption layer 60, can comprise foam, cork, sponge, rubber or spraying silica-gel coating.According to embodiments of the invention, this acoustic absorption layer 60 is viscoelastic layer, has concrete dynamic modulus, and can be by wave propagation velocity in a low voice by its characteristic.In brief, acoustic absorption layer 60 has the characteristic of acoustic impedance (acoustic impedance), and its acoustic impedance characteristic compared to outer cover 50 and partition wall part 20 or head components 40 is manyly little.
According to another embodiment of the present invention, refer to Figure 10 A, described MEMS microphone package 100d has substrate 10.MEMS acoustics sensing apparatus 3, IC chip 4 and passive component 5 are packaged on substrate 10.Acoustics hole 6 is consisted of substrate 10, partition wall part 20 and head components 40.This partition wall part 20 and head components 40 arrange and are attached on this substrate 10, by glueing material 30, coat between this substrate 10 and partition wall part 20, and between this partition wall part 20 and head components 40.The height of this partition wall part 20 is enough high, causes between the top surface of this MEMS acoustics sensing apparatus 3 and this head components 40 and has enough intervals 11.Then, weld pad 2 is formed to the bottom of this substrate 10, makes this MEMS microphone package be able to adhesive surface on this PCB motherboard 70.This substrate 10 can be made by FR-4 material, and substrate 10 is mated with the thermal property of this PCB motherboard 70.1B extension in sound hole penetrates this substrate 10 and this PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.In embodiment, sound hole 1B is formed at and extends and penetrates this substrate 10.This sound hole 1B comprises that transaudient passage connects this hole 6 and space outerpace.The position that can select this sound hole 1B makes it away from this sensing apparatus 3, to avoid it to be subject to that dust falls into and moisture is invaded, for example, from mankind's mouth, sends, and arrives at the surface of this sensing apparatus 3.Acoustics envelope is stopped to the outer rim that layer 80 was coated with and was surrounded on this sound hole 1B, to seal the gap of stopping between this substrate 10 and PCB motherboard 70.According to another embodiment of the present invention, this acoustics envelope only layer 80 can comprise metal welding tin projection, epoxy resin filling thing or rubber.
Refer to Figure 10 A, conductive outer shield 50 is surrounded and around this microphone package again.Acoustic absorption layer 60 is folded in the position between this partition wall part 20 and/or this head components 40 and this conductive outer shield 50.This conductive outer shield 50 is not connected directly to the analog or digital ground connection lead foot of this microphone package.This conductive outer shield 50 but be electrically connected to the common analogue ground lead foot on PCB motherboard by welded gasket 52.
Figure 10 B shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Figure 10 B, MEMS microphone package 100e comprises the outer cover 150a with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150a is whole metal housing, by conducting resinl 30, is attached on described substrate 10.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.1B extension in sound hole penetrates substrate 10 and PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150a by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.Because the interference of digital signal and environment is isolated by different ground mats respectively, therefore can effectively reduce crosstalk effect and electromagnetic interference (EMI) noise.What in view of this, finally by MEMS microphone package 100e, received is voice signal totally and clearly.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
Figure 10 C shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Figure 10 C, MEMS microphone package 100f comprises the outer cover 150b with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150b is multilayer outer cover, by conducting resinl 30, is attached on described substrate 10.Described multilayer outer cover 150b can comprise head components 155 and partition wall part 153 around and support this head components.In another embodiment, described multilayer outer cover comprises conductive layer 154, is folded between two-layer non-conductive layer 152 and 156.It should be noted, described multilayer outer cover can also comprise that acoustic absorption layer liner is in the nexine of this multilayer outer cover.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.1B extension in sound hole penetrates substrate 10 and PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150b by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
According to another embodiment of the present invention, refer to Figure 11 A, MEMS microphone package 100g has substrate 10.MEMS acoustics sensing apparatus 3, IC chip 4 and passive component 5 are packaged on substrate 10.Acoustics hole 6 is consisted of substrate 10, partition wall part 20 and head components 40.This partition wall part 20 and head components 40 arrange and are attached on this substrate 10, by glueing material 30, coat between this substrate 10 and partition wall part 20, and between this partition wall part 20 and head components 40.The height of this partition wall part 20 is enough high, causes between the top surface of this MEMS acoustics sensing apparatus 3 and this head components 40 and has enough intervals 11.Then, weld pad 2 is formed to the bottom of this substrate 10, makes this MEMS microphone package be able to adhesive surface on this PCB motherboard 70.This substrate 10 can be made by FR-4 material, and substrate 10 is mated with the thermal property of this PCB motherboard 70.1B extension in sound hole penetrates this substrate 10 and this PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.The position of this sound hole 1B is optional be positioned this sensing apparatus 3 under.Guard 8 is arranged between this MEMS acoustics sensing apparatus 3 and this sound hole 1B.This guard 8 is porous plate, and its size range with a plurality of sound hole (acoustic holes) is on the whole between 10 microns to 50 microns.According to another embodiment of the present invention, the thickness range of this guard 8 is on the whole between 10 microns to 100 microns.
According to further embodiment of this invention, acoustics envelope is stopped to the outer rim that layer 80 was coated with and was surrounded on this sound hole 1B, to seal the gap of stopping between this substrate 10 and PCB motherboard 70.This acoustics envelope only layer 80 can comprise metal welding tin projection, epoxy resin filling thing or rubber.
Refer to Figure 11 A, conductive outer shield 50 is surrounded and around this microphone package again.Acoustic absorption layer 60 is folded in the position between this partition wall part 20 and/or this head components 40 and this conductive outer shield 50.This conductive outer shield 50 is not connected directly to the analog or digital ground connection lead foot of this microphone package.This conductive outer shield 50 but be electrically connected to the common analogue ground lead foot on PCB motherboard by welded gasket 52.
The advantage of the embodiment of the MEMS microphone package of above-mentioned micromachined is effectively to reduce the acoustics leakage loss of the partition wall part or the head components that penetrate this MEMS microphone package.By this conductive outer shield and this PCB motherboard are electrically connected, can strengthen the adhesion strength of this MEMS microphone package.Moreover this MEMS microphone package is to the enough ability to bears of thermal agitation tool that occur in the technique in encapsulation and assembling.Moreover, because this conductive outer shield is electrically connected to the common analogue ground lead foot that supports PCB motherboard, therefore can shield sensing element, with isolation environment and electromagnetic interference.
Figure 11 B shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Figure 11 B, MEMS microphone package 100h comprises the outer cover 150a with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150a is whole metal housing, by conducting resinl 30, is attached on described substrate 10.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.1B extension in sound hole penetrates this substrate 10 and this PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.This MEMS sensing element is arranged at the one end in this sound hole, and optional be positioned this sensing apparatus 3 under.Guard 8 is arranged between this MEMS acoustics sensing apparatus 3 and this sound hole 1B.This guard 8 is porous plate, and its size range with a plurality of sound hole (acoustic holes) is on the whole between 10 microns to 50 microns.In embodiment, can select acoustics envelope stop member surround sound hole 1B and be folded in substrate 10 and PCB motherboard 70 between.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150a by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.Because the interference of digital signal and environment is isolated by different ground mats respectively, therefore can effectively reduce crosstalk effect and electromagnetic interference (EMI) noise.What in view of this, finally by MEMS microphone package 100h, received is voice signal totally and clearly.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
Figure 11 C shows the generalized section of MEMS microphone package according to another embodiment of the present invention.In Figure 11 C, MEMS microphone package 100i comprises the outer cover 150b with conductive component, is arranged at substrate 10 (being also commonly referred to as MIC substrate) upper, to be built into hole 11.Described outer cover 150b is multilayer outer cover, by conducting resinl 30, is attached on described substrate 10.Described multilayer outer cover 150b can comprise head components 155 and partition wall part 153 around and support this head components.In another embodiment, described multilayer outer cover comprises conductive layer 154, is folded between two-layer non-conductive layer 152 and 156.It should be noted, described multilayer outer cover can also comprise that acoustic absorption layer liner is in the nexine of this multilayer outer cover.MEMS sensing element 3, IC chip 4 and at least one passive component 5 are arranged at the inside in described hole 11.1B extension in sound hole penetrates this substrate 10 and this PCB motherboard 70, and can allow acoustic signal transmission to penetrate, to arrive at the surface of this MEMS acoustics sensing apparatus 3.This MEMS sensing element is arranged at the one end in this sound hole, and optional be positioned this sensing apparatus 3 under.Guard 8 is arranged between this MEMS acoustics sensing apparatus 3 and this sound hole 1B.This guard 8 is porous plate, and its size range with a plurality of sound hole (acoustic holes) is on the whole between 10 microns to 50 microns.In embodiment, can select acoustics envelope stop member surround sound hole 1B and be folded in substrate 10 and PCB motherboard 70 between.The first ground mat 130 (being also commonly referred to as analogue ground pad) is arranged at the back side of substrate 10, connects the conductive component of described outer cover 150b by the perforation 120 (be also commonly referred to as and wear silicon guide hole TSV) of substrate 10 inside.The second ground mat 140 (being also commonly referred to as digital grounding pad) is arranged at the back side of described substrate 10, intraconnections 160 or redistribution line (RDL) by substrate 10 inside connect described MEMS sensing element 3 or IC chip 4, and wherein said the first ground mat 130 and the second ground mat 140 are isolated each other.
In embodiment, can further described substrate 10 be welded in to PCB motherboard 70 (being also commonly referred to as PCB system board) upper, wherein said the first ground mat 130 and the second ground mat 140 are soldered to the common ground pad 170 on PCB motherboard 70.In another embodiment, described substrate 10 is welded on PCB motherboard 70, and wherein said the first ground mat 130 and the second ground mat 140 are respectively welded to different ground mat on described PCB motherboard 70.Other contact pads 135 at substrate 10 back sides are welded on the corresponding contact pad 175 on described PCB motherboard 70 respectively.
Though the present invention discloses as above with various embodiment, so it is not in order to limit scope of the present invention, those of ordinary skill in any affiliated technical field, without departing from the spirit and scope of the present invention, when doing a little change and retouching.Protection scope of the present invention is when defining and be as the criterion depending on claim.
Claims (26)
1. a Miniature MEMS condenser microphone packages, comprising:
The outer cover with conductive component, is arranged on substrate, to be built into hole;
MEMS (micro electro mechanical system) sensing element and IC chip, be arranged at this hole inner;
Sound hole, comprises that transaudient passage is to connect this hole and space outerpace;
The first ground mat, is arranged at the back side of this substrate, connects this conductive component of this outer cover by the perforation in this substrate; And
The second ground mat, is arranged at the back side of this substrate, by the intraconnections in this substrate, connects this MEMS (micro electro mechanical system) sensing element or this IC chip;
Wherein this first ground mat and this second ground mat are isolated each other.
2. Miniature MEMS condenser microphone packages as claimed in claim 1, wherein this substrate is welded on printed circuit mother board, wherein this first and this second ground mat be soldered to ground mat common on this printed circuit mother board.
3. Miniature MEMS condenser microphone packages as claimed in claim 1, wherein this substrate is welded on printed circuit mother board, wherein this first and this second ground mat be respectively welded to ground mats different on this printed circuit mother board.
4. Miniature MEMS condenser microphone packages as claimed in claim 1, wherein this outer cover is whole metal housing.
5. Miniature MEMS condenser microphone packages as claimed in claim 1, wherein this outer cover is multilayer outer cover and comprises head components and partition wall part, this partition wall part around and support this head components.
6. Miniature MEMS condenser microphone packages as claimed in claim 5, wherein this multilayer outer cover comprises conductive layer, is folded between two-layer non-conductive layer.
7. Miniature MEMS condenser microphone packages as claimed in claim 5, also comprises that acoustic absorption layer liner is in the nexine of this multilayer outer cover.
8. Miniature MEMS condenser microphone packages as claimed in claim 1, wherein this sound hole is formed in this outer cover and extends and penetrates this outer cover, and acoustic signal is able to by this sound hole.
9. Miniature MEMS condenser microphone packages as claimed in claim 2, wherein this sound hole is formed in this substrate and extends and penetrates this substrate, and wherein extra sound hole is formed in this printed circuit mother board and with this sound hole and aims at, and acoustic signal is able to by this sound hole.
10. Miniature MEMS condenser microphone packages as claimed in claim 9, wherein this MEMS (micro electro mechanical system) sensing element is arranged at the one end in this sound hole.
11. Miniature MEMS condenser microphone packages as claimed in claim 10, also comprise that porous plate is folded between the one end and this MEMS (micro electro mechanical system) sensing element in this sound hole.
12. Miniature MEMS condenser microphone packages as claimed in claim 9, also comprise acoustics envelope stop member around this sound hole and be folded in this substrate and this printed circuit mother board between.
13. Miniature MEMS condenser microphone packages as claimed in claim 1, also comprise that at least one passive component is arranged at this hole inner.
The manufacture method of 14. 1 kinds of Miniature MEMS condenser microphone packages, comprising:
Substrate is provided;
Form MEMS (micro electro mechanical system) sensing element and IC chip on this substrate;
Joint has the outer of conductive component and covers on this substrate, around forming hole to hold this MEMS (micro electro mechanical system) sensing element and this IC chip;
Formation sound hole comprises that transaudient passage connects this hole and space outerpace;
By the perforation in this substrate, connect this conductive component of this outer cover to the first ground mat that is arranged at this substrate back; And
By the intraconnections in this substrate, connect this MEMS (micro electro mechanical system) sensing element or this IC chip to the second ground mat that is arranged at this substrate back;
Wherein this first ground mat and this second ground mat are isolated each other.
The manufacture method of 15. Miniature MEMS condenser microphone packages as claimed in claim 14, wherein this substrate is welded on printed circuit mother board, wherein this first and this second ground mat be soldered to ground mat common on this printed circuit mother board.
The manufacture method of 16. Miniature MEMS condenser microphone packages as claimed in claim 14, wherein this substrate is welded on printed circuit mother board, wherein this first and this second ground mat be respectively welded to ground mats different on this printed circuit mother board.
The manufacture method of 17. Miniature MEMS condenser microphone packages as claimed in claim 14, wherein this outer cover is whole metal housing.
The manufacture method of 18. Miniature MEMS condenser microphone packages as claimed in claim 14, wherein this outer cover is multilayer outer cover and comprises head components and partition wall part, this partition wall part around and support this head components.
The manufacture method of 19. Miniature MEMS condenser microphone packages as claimed in claim 18, wherein this multilayer outer cover comprises conductive layer, is folded between two-layer non-conductive layer.
The manufacture method of 20. Miniature MEMS condenser microphone packages as claimed in claim 18, also comprises and forms acoustic absorption layer liner in the nexine of this multilayer outer cover.
The manufacture method of 21. Miniature MEMS condenser microphone packages as claimed in claim 14, wherein this sound hole is formed in this outer cover and extends and penetrates this outer cover, and acoustic signal is able to by this sound hole.
The manufacture method of 22. Miniature MEMS condenser microphone packages as claimed in claim 15, wherein this sound hole is formed in this substrate and extends and penetrates this substrate, and wherein extra sound hole is formed in this printed circuit mother board and with this sound hole and aims at, and acoustic signal is able to by this sound hole.
The manufacture method of 23. Miniature MEMS condenser microphone packages as claimed in claim 22, wherein this MEMS (micro electro mechanical system) sensing element is arranged at the one end in this sound hole.
The manufacture method of 24. Miniature MEMS condenser microphone packages as claimed in claim 23, also comprises that forming porous plate is folded between the one end and this MEMS (micro electro mechanical system) sensing element in this sound hole.
The manufacture method of 25. Miniature MEMS condenser microphone packages as claimed in claim 22, also comprise form acoustics envelope stop member around this sound hole and be folded in this substrate and this printed circuit mother board between.
The manufacture method of 26. Miniature MEMS condenser microphone packages as claimed in claim 14, also comprises that forming at least one passive component is arranged at this inside, hole.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/689,283 US8325951B2 (en) | 2009-01-20 | 2010-01-19 | Miniature MEMS condenser microphone packages and fabrication method thereof |
| US12/689,283 | 2010-01-19 | ||
| US12/813,730 | 2010-06-11 | ||
| US12/813,730 US8472648B2 (en) | 2009-01-20 | 2010-06-11 | Miniature MEMS condenser microphone package and fabrication method thereof |
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| CN102131139A CN102131139A (en) | 2011-07-20 |
| CN102131139B true CN102131139B (en) | 2014-03-12 |
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| CN201010605278.3A Active CN102131139B (en) | 2010-01-19 | 2010-12-24 | Microphone package of micro-electro-mechanical system and manufacturing method thereof |
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| TW (1) | TWI451538B (en) |
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| US9695040B2 (en) * | 2012-10-16 | 2017-07-04 | Invensense, Inc. | Microphone system with integrated passive device die |
| TWI533710B (en) * | 2013-03-27 | 2016-05-11 | 緯創資通股份有限公司 | Sound receiving module |
| CN104517944A (en) | 2013-09-30 | 2015-04-15 | 日月光半导体制造股份有限公司 | Packaging structure and production method thereof |
| US9630834B2 (en) * | 2014-06-16 | 2017-04-25 | InSense, Inc. | Wafer scale monolithic CMOS-integration of free- and non-free-standing Metal- and Metal alloy-based MEMS structures in a sealed cavity |
| JP6430201B2 (en) | 2014-09-30 | 2018-11-28 | 株式会社東芝 | Sensor |
| DE102014118214B4 (en) | 2014-12-09 | 2024-02-22 | Snaptrack, Inc. | Easily manufactured electrical component and method for producing an electrical component |
| GB2593401B (en) * | 2014-12-23 | 2021-12-15 | Cirrus Logic Int Semiconductor Ltd | MEMS transducer package |
| TWI610406B (en) * | 2015-02-09 | 2018-01-01 | 精材科技股份有限公司 | Chip package and manufacturing method thereof |
| CN104766831B (en) * | 2015-04-16 | 2018-03-23 | 歌尔股份有限公司 | A kind of encapsulating structure of integrated sensor |
| US20180366424A1 (en) | 2017-06-20 | 2018-12-20 | Infineon Technologies Ag | Device Package with Reduced Radio Frequency Losses |
| CN109068250B (en) * | 2018-10-15 | 2021-01-08 | 维沃移动通信有限公司 | Microphone and electronic equipment |
| CN109327784B (en) * | 2018-12-03 | 2024-03-29 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone of borderless equipment |
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| CN102131139A (en) | 2011-07-20 |
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