CN102117689A - Array isobaric insulating water-cooling resistor - Google Patents
Array isobaric insulating water-cooling resistor Download PDFInfo
- Publication number
- CN102117689A CN102117689A CN 201010168566 CN201010168566A CN102117689A CN 102117689 A CN102117689 A CN 102117689A CN 201010168566 CN201010168566 CN 201010168566 CN 201010168566 A CN201010168566 A CN 201010168566A CN 102117689 A CN102117689 A CN 102117689A
- Authority
- CN
- China
- Prior art keywords
- water
- water cavity
- plane
- ceramics
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses an insulating water-cooling resistor and a making method thereof, and provides an array isobaric insulating water-cooling resistor with low heat resistance, high heat radiating efficiency and small size. The array isobaric insulating water-cooling resistor is provided with a flow splitting tank at the bottom, an isobaric multi-cavity cooling resistor at the middle part and a water collecting tank at the upper part, sealing rings are sealed among all the parts, water flows into a water inlet of the flow splitting tank and is divided into N paths to flow through N cavities of the multi-cavity cooling resistor, and N paths of water is collected to the water collecting tank and finally flows out of a water outlet. The array isobaric insulating water-cooling resistor is in a multi-line and multi-row multi-water cavity structure, each water cavity comprises a water cavity frame, a sealing ring and a multilayer resistance chip, all the water cavities share the flow splitting tank and the water collecting tank, the multilayer resistance chip is in a three-layer structure, wherein the middle layer is provided with an insulating base slice, and the outer layer is a resistance chip. As both surfaces of the multilayer resistance chip have no water pressure difference, the insulating water-cooling resistor can be thinner so that the heat resistance is greatly reduced, the heat radiating efficiency is increased, and the volume is diminished; an insulating tile isolates a resistance film from the water so that electric insulation is ensured; an array assembly is adopted, and no unused space exists in the multi-cavity cooling resistor so that the volume is greatly diminished.
Description
Affiliated technical field
The invention belongs to insulation water-cooled resistor field.
Background technology
Existing insulation water-cooled resistor, the one, adopting internal layer is that the insulating oil cooling adds outer water-cooled dual-cooling type resistor; The 2nd, at the porcelain tube inner-cooled resistor of porcelain tube outer wall system resistive film, endoporus water flowing cooling; The 3rd, resistance wire is penetrated metal tube, between silk and pipe, fill insulant, metal tube is immersed in the water cool off.
The internal layer cooling fluid of dual-cooling type resistor is an oil, and the cooling effect of oil is than water difference, and complex structure, the volume of double-deck cooling are big;
The tube wall of porcelain tube inner-cooled resistor will bear the pressure of water, and tube wall will have enough thickness, and the thick more thermal resistance of tube wall is big more, heat transfer efficiency will descend greatly, the power that reaches expectation must increase volume, will have spacing to install between porcelain tube and the porcelain tube simultaneously, and this further causes volume to increase.
Metal tube cooling resistor need add cooling water channel, and the complex structure volume is big, and this structure is mainly when heater usefulness.
Summary of the invention
For solving problem and the defective that exists in the such scheme, the invention provides a kind of matrix equal pressure insulation water-cooled resistor and preparation method thereof.
The present invention is achieved by the following technical solutions:
Involved in the present invention is a kind of matrix equal pressure insulation water-cooled resistor, mainly comprises a multilayer resistance chip, sealing ring, interior water cavity frame, outer water cavity frame, external electrode, current divider box, header tank.Adopt the isobaric multi-cavity structure of matrix, the cavity number (line number) of each row equates, between adjacent two chambeies of same column, separate by multilayer resistance chip, because shared current divider box and header tank, each cavity pressure that is listed as each row equates, two working faces of the multilayer resistance chip between adjacent two chambeies do not have pressure differential, and multilayer resistance chip can be done very thinly.The structure of multilayer resistance chip is: a slice insulation ceramics, and thickness is 0.3mm～3mm; Two sheet resistor ceramics, the alumina content of resistance ceramics substrate for use are greater than 80%, and thickness is 0.3mm～3mm (it is fixed to come according to maximum operating voltage, and voltage is high more, and ceramics is thick more); Be coated with one deck elastic resin on the resistive film of 2 sheet resistor ceramics, the resistive film of 2 sheet resistor ceramics is relative, and a slice insulation ceramics is put in the centre, and three ceramics are bonded together, and forms multilayer resistance chip; Multilayer resistance chip has 3 big advantages: 1) multilayer resistance chip is very thin, and institute takes up space very little; 2) the used substrate of resistance chip is the alumina ceramic chip that heat transfer efficiency is very high, thickness is very little (alumina content＞80%).When two outer surface water flowings of multilayer resistance chip, because resistance substrate is very thin, alumina content is very high, and surface area is also big, and the heat that resistive film produces can be very fast by substrate conduction feedwater, and current are taken away heat; 3) one side of the resistance substrate of multilayer resistance chip is a resistive film, another side is the ceramic whiteware face, assembling back water cavity frame and multilayer resistance chip are formed complete water cavity, and the water in the water cavity can only contact with the ceramic whiteware face in the sealing ring, thereby have guaranteed the insulation between the power and water resistance film.By the isobaric assembling of matrix, can conveniently obtain matrix equal pressure insulation water-cooled resistor, there is not useless space in the resistive element, under the prerequisite that guarantees insulation, obtain very big power with very little volume.
The isobaric multi-cavity multilayer of described insulation resistor manufacture method:
1. make electrode ceramics in the band: the slurry that prints electrode at the two ends of eggshell china sheet one side, through being sintered into interior electrode;
2. make strip resistance film ceramics: printed resistor slurry between electrode ceramics two electrodes in band, resistance slurry will overlap with interior electrode, through being sintered into resistive film;
3. make the resistance ceramics: at strip resistance film ceramics surface printing dielectric paste, through being sintered into the resistive film protective layer;
4. make band connecting line resistance ceramics: the resistance ceramics two in respectively weld a copper cash on the electrode, as the connecting line of interior electrode and external electrode;
5. make multilayer resistance chip: be coated with one deck elastic resin on the resistive film of 2 band connecting line resistance ceramics, the resistive film of 2 band connecting line resistance ceramics is relative, and a slice insulation ceramics is put in the centre, with three's oven dry that bonds together;
6. make outer water cavity frame: be processed into following frame with engineering plastics: there is the inlet opening lower end of frame, there is apopore the upper end, a side of frame is the plane, the middle part of another side is recessed, a homogenizing plate is arranged at the bottom at recessed position, be the plane all around, have seal groove in the plane, the outer vertical installing hole of peaceful face that is with of seal groove;
7. water cavity frame in making: be processed into following frame with engineering plastics: there is water inlet the lower end of frame, there is delivery port the upper end, the middle part hollow out of frame, a homogenizing plate is arranged at the bottom at hollow out position, the remaining both ends of the surface of hollow out are the plane, on each plane, respectively have a seal groove, the outer vertical installing hole of peaceful face that is with of seal groove;
8. make multi-cavity water-cooled resistance body: put a multilayer resistance chip between two water cavity frames, the sealing ring sealing is arranged between water cavity frame and the multilayer resistance chip, outer water cavity frame is put on outermost both sides, and interior water cavity frame is put in the centre.According to the size of power, the quantity of multilayer resistance chip can be from 1 to n (preferably selecting from 10～30), and water cavity frame quantity=(single-row multilayer resistance number of chips-2) ÷ 2+2 is strained water cavity frame and multilayer resistance chip with pull bar;
9. making current divider box: make water tank with stainless steel, 1 bigbore water inlet is opened in the side of water tank or bottom surface, and end face is a plane, has N small-bore delivery port on this plane;
10. making header tank: make water tank with stainless steel, the bottom surface of water tank is a plane, has the water inlet of N medium caliber on this plane, and the side of water tank or end face are opened 1 bigbore delivery port;
11. assembling matrix equal pressure insulation water-cooled resistor: current divider box is following, header tank is last, the middle multi-cavity cooling resistive element of placing between current divider box and the multi-cavity cooling resistive element, between header tank and the multi-cavity cooling resistive element sealing ring sealing is arranged all, is strained the three with pull bar; The connecting line of band connecting line resistance ceramics is received on the external electrode; Voltage is added on two external electrodes, and cooling water flows to from the water inlet of current divider box, is divided into flow through N water cavity of multi-cavity cooling resistive element of N road, and N road water is pooled to header tank, from the delivery port outflow of header tank, the heat of multilayer resistance chip is taken away.
The invention has the beneficial effects as follows: the two sides of multilayer resistance chip does not have differential water pressures, and that can do is very thin, has greatly reduced thermal resistance, has improved radiating efficiency, has dwindled volume; There is the insulation ceramics to separate between resistive film and the water, guaranteed electric insulation; The assembling of employing matrix does not have useless space in the multi-cavity cooling resistive element, has dwindled volume greatly.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is an electrode ceramics schematic diagram in the band.
Fig. 2 is a strip resistance film ceramics schematic diagram.
Fig. 3 is a band dielectric resistance ceramics schematic diagram.
Fig. 4 is a band connecting line resistance ceramics schematic diagram.
Fig. 5 is a multilayer resistance chip schematic diagram.
Fig. 6 is outer water cavity frame schematic diagram.
Fig. 7 is interior water cavity frame schematic diagram.
Fig. 8 is isobaric multi-cavity cooling resistive element schematic diagram.
Fig. 9 is the current divider box schematic diagram.
Figure 10 is the header tank schematic diagram.
Figure 11 is a matrix equal pressure insulation water-cooled resistor schematic diagram.
1 represents ceramics among the figure; Electrode in 2 representatives; 3 represent resistive film; 4 represent connecting line; 5 representative insulation ceramics; 6 representative depression planes; 7 represent primary plane; 8 represent seal groove; The 9 representatives installing hole vertical with primary plane; 10 represent apopore; 11 represent homogenizing plate; 12 represent the inlet opening; 13 represent rectangular opening; 14 represent header tank; The isobaric multi-cavity cooling of 15 representatives resistive element; 16 represent current divider box; 17 represent pull bar; 18 represent external electrode;
Embodiment
1. at the ceramics 1 surperficial roll printing electrode slurry of Fig. 1 belt electrode ceramics, electrode 2 in high temperature sintering becomes to have.
2. at Fig. 1 belt electrode ceramics surface roll printing resistance slurry, resistance slurry will overlap with the interior electrode 2 at two ends, becomes to have Fig. 2 strip resistance film ceramics of resistive film 3 through high temperature sintering;
3. at Fig. 2 strip resistance film ceramics surface roll printing dielectric paste, become to have Fig. 3 band dielectric resistance ceramics of medium protective layer 4 through high temperature sintering.
4. weld metal connecting line 4 on 2 interior electrodes 2 of Fig. 3 band dielectric resistance ceramics is formed with Fig. 4 band connecting line resistance ceramics of connecting line.
5. be coated with one deck elastic resin on the resistive film of 2 Fig. 4 band connecting line resistance ceramics, resistive film is relative, and a slice insulation ceramics 5 is put in the centre, and the three is bonded together to dry forms Fig. 5 multilayer resistance chip.
6. be injection molded into the outer water cavity frame of Fig. 6 with engineering plastics, there is inlet opening 12 lower end of frame, there is apopore 10 upper end, a side of frame is the plane, and there is depression plane 6 another side, and depression plane 6 quantity equal columns, a homogenizing plate 11 is arranged at the bottom on each depression plane, around each depression plane 6 be primary plane 7, opens one around each depression plane 6 and enclose seal groove 8 on primary plane 7, is with the installing hole 9 vertical with primary plane 7 at every circle seal groove 8 outer.
7. be injection molded into water cavity frame in Fig. 7 with engineering plastics, there is inlet opening 12 lower end of frame, there is apopore 10 upper end, the plane hollow out of frame goes out rectangular opening 13, the quantity of rectangular opening 13 equals columns, and a homogenizing plate 11 is arranged in the bottom of each rectangular opening 13, is primary plane 7 around each rectangular opening 13, on primary plane 7, open a circle seal groove 8, be with the installing hole 9 vertical with primary plane 7 at every circle seal groove 8 outer around each rectangular opening 13.
8. make isobaric multi-cavity cooling resistive element 15: between two adjacent water cavity frames of same column, place two sealing rings, place a slice Fig. 5 multilayer resistance chip between two sealing rings, the water cavity frame of outermost both sides is the outer water cavity frame of Fig. 6, water cavity frame between the outer water cavity frame of two Fig. 6 be a water cavity frame in Fig. 7, with pull bar with water cavity frame, Fig. 5 multilayer resistance chip and sealing ring 8 tensions in the outer water cavity frame of Fig. 6, Fig. 7.
9. be processed into current divider box 16 with corrosion resistant plate, the side of current divider box 16 (or bottom surface) opens 1 bigbore water inlet, and end face is opened N small-bore delivery port.
10. be processed into header tank 14 with corrosion resistant plate, the water inlet of N medium caliber is opened in the bottom surface of header tank 14, and end face (or side) is opened 1 bigbore delivery port.
11. assembling Figure 11 matrix equal pressure insulation water-cooled resistor: current divider box 16 is following, header tank 14 is last, the middle isobaric multi-cavity cooling of Fig. 8 resistive element of placing, between current divider box 16 and the isobaric multi-cavity cooling resistive element 15, between header tank 14 and the isobaric multi-cavity cooling resistive element 15 the sealing ring sealing is arranged all, the three is strained with pull bar 17; The connecting line 4 of Fig. 4 band connecting line resistance ceramics is received on the external electrode 18; Voltage is added on two external electrodes 18, and cooling water flows to from the water inlet of current divider box 16, flows into isobaric multi-cavity cooling resistive element 15, is pooled to header tank 14, from the delivery port outflow of header tank 14, the heat of Fig. 5 multilayer resistance chip is taken away.
Claims (6)
1. involved in the present invention is a kind of matrix equal pressure insulation water-cooled resistor, its bottom is a current divider box, the middle part is isobaric multi-cavity cooling resistive element, top is header tank, the sealing ring sealing is arranged between the each several part, water flows to from the current divider box water inlet, be divided into flow through N cavity of multi-cavity cooling resistive element of N road, N road water is pooled to header tank, flows out from delivery port at last, it is characterized in that: described matrix equal pressure insulation water-cooled resistor adopts many water cavities structure of multiple lines and multiple rows, each water cavity is by the water cavity frame, sealing ring, multilayer resistance chip is formed, shared current divider box and header tank, and described multilayer resistance chip is a 3-tier architecture, the intermediate layer is an insulating substrate, and skin is the resistance chip.
2. matrix equal pressure insulation water-cooled resistor according to claim 1, it is characterized in that: the water cavity number (line number) of each row equates in many water cavities structure of described multiple lines and multiple rows, water cavity is made up of water cavity frame, sealing ring, multilayer resistance chip, place two sealing rings between adjacent two the water cavity frames of same column, place a slice multilayer resistance chip between two sealing rings, the outermost both sides are outer water cavity frame, are interior water cavity frame between the two outer water cavity frames.Between two adjacent water cavity frames of same column, place 2 sealing rings, put a multilayer resistance chip between 2 sealing rings.
3. matrix equal pressure insulation water-cooled resistor according to claim 1, it is characterized in that: described water cavity frame is the insulation frame, the water cavity frame of colleague's different lines is made of one, the water cavity frame is water cavity frame and interior water cavity frame exceptionally, all water cavity frames are contour, the upper and lower end face is the plane, and this plane seals by sealing ring and current divider box, header tank.
4. matrix equal pressure insulation water-cooled resistor according to claim 3, it is characterized in that: the lower surface of described outer water cavity frame has the inlet opening, the upper surface has delivery port, a side of outer water cavity frame is the plane, there is the depression plane another side, depression plane quantity equals columns, a homogenizing plate is arranged at the bottom on each depression plane, around each depression plane is primary plane, on primary plane, open a circle seal groove, be with the installing hole vertical with primary plane at every circle seal groove outer around each depression plane.
5. matrix equal pressure insulation water-cooled resistor according to claim 3, it is characterized in that: the lower surface of water cavity frame has the inlet opening in described, the upper surface has delivery port, the plane hollow out of interior water cavity frame goes out rectangular opening, the quantity of rectangular opening equals columns, and a homogenizing plate is arranged in the bottom of each rectangular opening, is primary plane around each rectangular opening, on primary plane, open a circle seal groove, be with the installing hole vertical with primary plane at every circle seal groove outer around each rectangular opening.
6. matrix equal pressure insulation water-cooled resistor according to claim 1, it is characterized in that: described resistance chip is a 3-tier architecture, the intermediate layer is the insulation ceramics, thickness 0.3mm～3mm, both sides are the resistance ceramics, the used substrate of resistance ceramics is that thickness 0.3mm～3mm, thermal conductivity insulating properties are good, the ceramics of alumina content＞80%, a plane of ceramics is with resistive film, the insulation ceramics in this face and intermediate layer pastes mutually, another plane of base ceramics is the insulation plane, this face is formed water cavity by sealing ring and water cavity frame, and the insulation plane directly contacts with water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010168566 CN102117689B (en) | 2010-05-11 | 2010-05-11 | Array isobaric insulating water-cooling resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010168566 CN102117689B (en) | 2010-05-11 | 2010-05-11 | Array isobaric insulating water-cooling resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102117689A true CN102117689A (en) | 2011-07-06 |
| CN102117689B CN102117689B (en) | 2013-07-03 |
Family
ID=44216402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010168566 Active CN102117689B (en) | 2010-05-11 | 2010-05-11 | Array isobaric insulating water-cooling resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102117689B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585611A2 (en) * | 1992-08-04 | 1994-03-09 | ABBPATENT GmbH | Power resistor for liquid cooling |
| US5737186A (en) * | 1995-04-20 | 1998-04-07 | Daimler-Benz Ag | Arrangement of plural micro-cooling devices with electronic components |
| CN101308716A (en) * | 2008-07-18 | 2008-11-19 | 北京七一八友晟电子有限公司 | Matrix type dielectric water-cooling resistor locker |
| CN201336193Y (en) * | 2009-01-04 | 2009-10-28 | 中冶新融电气技术有限公司 | Water-cooled resistor |
-
2010
- 2010-05-11 CN CN 201010168566 patent/CN102117689B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585611A2 (en) * | 1992-08-04 | 1994-03-09 | ABBPATENT GmbH | Power resistor for liquid cooling |
| US5737186A (en) * | 1995-04-20 | 1998-04-07 | Daimler-Benz Ag | Arrangement of plural micro-cooling devices with electronic components |
| CN101308716A (en) * | 2008-07-18 | 2008-11-19 | 北京七一八友晟电子有限公司 | Matrix type dielectric water-cooling resistor locker |
| CN201336193Y (en) * | 2009-01-04 | 2009-10-28 | 中冶新融电气技术有限公司 | Water-cooled resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102117689B (en) | 2013-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI299220B (en) | Fuel cell device assembly and frame | |
| CN104486901B (en) | Radiating insulating liner plate, package module comprising this liner plate and preparation method thereof | |
| CN105692562B (en) | The base unit component and Ozone generator module of dielectric barrier discharge plate, panel type ozone producer | |
| CN102738378A (en) | Thermoelectric cluster, method for operating same, device for connecting an active element in said cluster to a thermoelectric drive, generator (variants) and heat pump (variants) based thereon | |
| CN106455456B (en) | Copper-aluminum composite water cooling plate, processing and manufacturing method thereof and water cooling method | |
| CN104869674B (en) | A kind of PTC electrothermal tube and electric automobile water-warming heater | |
| CN201066936Y (en) | Heater | |
| US11618956B2 (en) | Bipolar plate for use in an electrochemical device | |
| JP2020024922A5 (en) | ||
| CN103578667A (en) | Series water-cooled radiator based on damping resistors | |
| WO2016095804A1 (en) | Electrical heat-generating device | |
| CN102117689B (en) | Array isobaric insulating water-cooling resistor | |
| CN205634886U (en) | Dielectric barrier discharge board and plate -type ozone generator's base unit component | |
| CN201066182Y (en) | Modular combined type liquid quick-heating device | |
| CN104748605B (en) | A kind of electric field-enhanced nano-fluid phase-change heat transfer close-coupled multilamellar micro-channel heat exchanger | |
| CN107339794A (en) | Electric heating device | |
| CN103415191A (en) | Temperature equalizing device of heat pipe/micro channel cold plate composite structure | |
| CN109323607A (en) | A kind of ultra-compact heat-exchangers of the plate type of honeycomb type | |
| WO2017092616A1 (en) | Heat dissipation module for igbt module and igbt module having same | |
| CN204669631U (en) | A kind of PTC electrothermal tube and electric automobile water-warming heater | |
| CN203839401U (en) | An LED transverse fluid heat radiation COB light source | |
| CN202749169U (en) | Inlaid insulation water-cooling glass glaze resistor | |
| CN206061176U (en) | A kind of PTC electric heater units | |
| CN109509890A (en) | Fuel cell separator part, individual fuel cells and fuel cell pile | |
| CN210004824U (en) | heat exchanger for automobile engine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |