CN102116427B - Preparation method for integrally sealed LED (light-emitting diode) light with diffuser - Google Patents

Preparation method for integrally sealed LED (light-emitting diode) light with diffuser Download PDF

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CN102116427B
CN102116427B CN2010105914538A CN201010591453A CN102116427B CN 102116427 B CN102116427 B CN 102116427B CN 2010105914538 A CN2010105914538 A CN 2010105914538A CN 201010591453 A CN201010591453 A CN 201010591453A CN 102116427 B CN102116427 B CN 102116427B
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reflector
light
step
led lamp
cavity
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CN102116427A (en
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叶逸仁
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叶逸仁
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Abstract

本发明公开了一种具反光罩且一体封装式的LED灯的制备方法,其特征在于包括如下步骤:步骤①,制作光源;将一第一导电支架及一第二导电支架通过金丝电性连接于一LED晶片的相对两端;步骤②,将所述光源置于一透光模具中,所述透光模具具有一第一腔体,所述第一腔体的顶部开口,往所述透光模具中注入UV光固化胶水,再对所述透光模具进行光固化形成一具有反光罩的封装LED本体;步骤③,将经上述步骤成型后的LED灯封装胶体脱模后,以真空镀膜的方式在所述反光罩的内侧面上镀上金属膜;步骤④,将反光罩上与所述光源相对应位置的金属膜用镭射雕刻机雕除,即得具反光罩且一体封装式的LED灯。 The present invention discloses a method for producing a reflector and having integrally packaged LED lamp, comprising the following steps: Step ①, making a light source; and a first conductive frame and a second electrically conductive frame by gold connected to opposite ends of a LED chip; step ②, the light source is placed in a light-transmissive mold, the mold having a light-transmitting first cavity, the top opening of the first cavity, towards the injection mold the light-transmitting UV light curing adhesive, and then the light transmissive mold cured to form a package having a reflector of LED body; step ③, the LED lamp after the encapsulant release after molding step, vacuum coating the inner surface of the reflector in a manner plated on the metal film; step ④, the metal film and the light source corresponding to the position of the reflector with a laser engraving machine carving other, and one that was packaged with a reflector LED lamp. 从而本发明不仅制作简单,而且实用性强。 The present invention is not so easy to build and practical.

Description

具反光罩且一体封装式的LED灯的制备方法技术领域[0001] 本发明涉及一种LED灯的制备方法,尤其是涉及一种具反光罩且一体封装式的LED灯的制备方法。 TECHNICAL FIELD The packaged integrated with the reflector and an LED lamp [0001] The present invention relates to a method of LED lamp, particularly to a reflector and having integrally packaged LED lamp production method. 背景技术[0002] 照明灯是人们日常生活中最经常使用的电器。 [0002] Electric lamp daily life is most frequently used. 传统采用荧光管等光源的照明灯虽然能够满足照明需求,但其能耗相对较高。 Using traditional lighting sources such as fluorescent tubes, although able to meet the lighting requirements, but its energy consumption is relatively high. 并且由于荧光管包含重金属汞,废弃后容易对环境造成污染。 And since fluorescent tubes contain heavy metals mercury, likely to cause pollution to the environment after discarded. [0003] LED (发光二极管)由于其具有光效高、无辐射和低功率的特点,自其问世以来其应用越来越广泛。 [0003] LED (light emitting diode) because of its characteristics of high luminous efficiency, no radiation and low power, since its advent which is widely applied. 随着技术的进步,以LED为光源的照明灯也不断得到了创新和发展。 As technology advances, LED light source for lighting the lamp also continuously innovation and development. 现有的LED灯一般包括光源及封装胶体等构件。 A conventional LED lamp generally comprises a light source and other components encapsulant. 所述LED灯封装都是采用热固型环氧树脂灌注在简单的模具中,经数小时加温热烘固化成型。 The LED lamp packages are based on thermoset epoxy resin infusion in a simple mold, after hours of heat and bake curing. 然而由于所述LED灯的聚光及散光性能差,从而影响了LED灯的总体性能,不利于LED灯的市场推广;而且上述LED灯的制作过程费时费力,从而耗费了不必要的人力物力,增加了生产成本。 However, due to the difference between the condensing performance of the LED lamp and astigmatism, thus affecting the overall performance of the LED lamp, the LED lamp is not conducive to the marketing; production process of the LED lamps and laborious, and thus unnecessary cost of manpower and resources, increased production costs. 发明内容[0004] 本发明是针对上述背景技术存在的缺陷提供一种具反光罩且一体封装式的LED 灯的制备方法。 [0004] The present invention provides a method for preparing an encapsulated integrated reflector and an LED lamp having the defects present in the above-described background art. [0005] 为实现上述目的,本发明公开了一种具反光罩且一体封装式的LED灯的制备方法,其特征在于包括如下步骤:步骤①,制作光源;将一第一导电支架及一第二导电支架通过金丝电性连接于一LED晶片的相对两端以形成所述光源,所述第一导电支架的末端形成一第一导电脚,所述第二导电支架的末端形成一第二导电脚;步骤②,将所述光源置于一透光模具中,其中所述第一导电脚及所述第二导电脚伸出所述透光模具,所述透光模具具有一第一腔体,所述第一腔体的顶部开口且具有一向第一腔体内凸伸的底面,往所述透光模具中注入UV光固化胶水,然后对所述透光模具进行光固化形成一具有与所述第一腔体的底面相对应形状的反光罩的封装LED本体;步骤③,将经上述步骤成型后的LED灯封装胶体脱模后,以真空镀膜的方式在所述反光罩的内侧面上镀上金 [0005] To achieve the above object, the present invention discloses a method for producing a reflector and having integrally packaged LED lamp, comprising the following steps: Step ①, making a light source; and a first and a second conductive frame two conductive frame electrically connected by a gold wire to the opposite ends of a wafer to form the LED light source end of the first conductive frame forming a first conductive pin, said second end forming a second conductive frame a conductive pin; step ②, the light source is placed in a transparent mold, wherein the first conductive pin and the second contact pins projecting said light transmissive mold, the mold having a first light transmitting chamber a top member, the opening of the first cavity and a first cavity having a bottom surface always extending projections, to injection mold the light-transmitting UV light-cured glue, the light-transmitting mold and cured to form a light having a bottom surface of the first cavity corresponding to the shape of the reflector LED body package; step ③, the LED lamp after the encapsulant release step after forming, vacuum plating manner in the inner side surface of the reflector gold plated 膜;步骤④,将反光罩上与所述光源相对应位置的金属膜用镭射雕刻机雕除以使所述光源发出的光线露出来,即得具反光罩且一体封装式的LED灯。 Film; step ④, the metal film and the light source corresponding to the position of the reflector carved using laser engraving machine dividing light emitted from the light source is exposed, and one that was packaged with the reflector LED lamp. [0006] 进一步地,所述步骤③中的金属膜为铝膜或铬膜等高反射金属膜。 [0006] Further, a metal film in the step ③ an aluminum film or chromium film is highly reflective metal film. [0007] 进一步地,所述透光模具由硅胶制成。 [0007] Further, the mold is made of a light-transmissive silicone. [0008] 进一步地,所述步骤②中的透光模具还具有一与所述第一腔体相连通的第二腔体,所述第一腔体底面的中心向外凹设形成柱状的第二腔体;所述LED本体的反光罩底部中心处形成有一中心凸点。 [0008] Further, in the step ② of the light-transmitting mold further having a second cavity and the first cavity in communication, the center of the bottom surface of the first cavity recessed outwardly of a columnar two cavities; bottom center of the reflector of the LED body is formed with a central bump. [0009] 进一步地,所述步骤③为,将所述LED灯脱模后,在所述反光罩的内侧面及所述中[0010] 心凸点的外表面上真空镀上金属膜。 [0009] Further, the step ③ is, the LED lamp after release, the inner surface of the reflector and the [0010] outer surface of the heart vacuum plating bump on the metal film. [0011] 进ー步地,所述步骤④具体为,将所述中心凸点处的金属膜用镭射雕刻机雕除以使所述光源发出的光线露出来。 [0011] Step ー feed, the step ④ specifically, the center bump metal film by laser engraving machine at the engraving is divided by that light emitted from the light source is exposed.

[0012] 进ー步地,所述具反光罩且一体封装式的LED灯的制备方法还包括步骤⑤,以浸涂或喷涂的方式于所述反光罩的内侧面上涂覆UV光固化透明涂料以保护所述金属膜。 [0012] Step ー feed, the preparation having a reflector and integrally packaged LED lamp further comprises the step ⑤, dipping or spraying manner to the reflector coating on the inner surface of the transparent UV-curable coating to protect the metal film.

[0013] 综上所述,本发明具反光罩且一体封装式的LED灯的制备方法通过将光源一体成型于形成于透光模具中的LED本体中,且于所述LED本体的端面上形成所述反光罩,因而有效地提高了LED灯的聚光或散光性能,增强了LED灯的实用性,从而本发明不仅制作简単,而且实用性強。 [0013] In summary, with the present invention, the reflector and integrally packaged preparation by the LED light source is formed integrally formed to the LED in the light-transmitting body in a mold, and is formed on the end surface of the LED body the reflector, thus effectively improving the performance of the condenser or astigmatism LED lamp, LED lamp enhance usability, the invention is not so simple production radiolabeling, and practical.

附图说明 BRIEF DESCRIPTION

[0014] 图1为本发明一种实施例所使用的透光模具的剖面示意图。 [0014] FIG 1. A schematic sectional view of a light-transmitting mold used in Example embodiments of the present invention.

[0015] 图2为使用本发明制备的具反光罩且一体封装式的LED灯的结构示意图。 [0015] FIG. 2 is a schematic view of one packaged LED lamp prepared with the use of the present invention and the reflector.

[0016] 图3为图2所示具反光罩且一体封装式的LED灯的光源的结构示意图。 [0016] FIG. 3 is a schematic structural diagram of FIG. 2 with the reflector and integrally packaged LED lamp light source.

具体实施方式 detailed description

[0017] 为能进一歩了解本发明的特征、技术手段以及所达到的具体目的、功能,下面结合 [0017] ho understood as to enter a feature of the invention, and the technical means to achieve the specific purpose, function, in conjunction with the following

[0018] 附图与具体实施方式对本发明作进ー步详细描述。 [0018] accompanying drawings and specific embodiments of the present invention will be described in further detail ー feed.

[0019] 请參阅图1至图3,本发明具反光罩且一体封装式的LED灯I的制备方法,其包括 [0019] Please refer to FIG. 1 to FIG. 3, the reflector of the present invention and having integrally packaged LED lamp production method I, which comprises

[0020] 如下步骤: [0020] the steps of:

[0021] 步骤①、制作光源10 ;将一第一导电支架11及一第二导电支架12通过金丝电性连接于一LED晶片13的相对两端以形成所述光源10。 [0021] Step ①, making a light source 10; and a first conductive frame 11 and a second conductive holder 12 is connected to opposite ends of the LED chip 13 through a gold wire electrically to the light source 10 is formed. 所述第一导电支架11的末端形成一第一导电脚111,所述第二导电支架12的末端形成一第二导电脚121。 The first conductive end holder 11 is formed of a first conductive pin 111, the second conductive end holder 12 is formed a second conductive pin 121. 在本实施例中,所述LED晶片13为固体半导体晶片。 In the present embodiment, the LED chip 13 as a semiconductor wafer solid.

[0022] 步骤②、将所述光源10置于一透光模具30中,其中所述第一导电脚111及所述第二导电脚121伸出所述透光模具30,往所述透光模具30中注入UV光固化胶水,然后对所述透光模具30进行光固化形成一具有反光罩21的封装LED本体20。 [0022] Step ②, the light source 10 in a light-transmitting mold 30, wherein the first conductive pin 111 and the second conductive pin 121 extends out of the light-transmitting mold 30, toward the light-transmissive injection mold 30 UV light-cured glue, the light-transmitting mold 30 is then light cured body having a reflector 21 LED packages 20 are formed. 在本实施例中,所述透光模具30由硅胶制成。 In the present embodiment, the light-transmitting mold 30 is made of silicone. 所述透光模具30具有一第一腔体31及一与所述第一腔体31相连通的第二腔体32。 The light-transmitting mold 30 having a first 31 and a cavity with the first cavity 31 communicating the second cavity 32. 所述第一腔体31的顶部开ロ且具有一向第一腔体31内凸伸的底面。 The first cavity 31 is open at the top and having a bottom surface ro always a first cavity 31 which protrudes. 所述第一腔体31底面的中心向外凹设形成柱状的第二腔体32。 The center of the first cavity 31 of the bottom surface of a columnar recessed outwardly second cavity 32. 形成的LED本体20的一端面凹设有一与所述第一腔体31的底面相对应形状的的反光罩21及ー设于所述反光罩21底部中心处的中心凸点22。 A recess end surface of the LED body is formed with a reflector 20 provided with the first cavity 31 corresponding to the bottom surface 21 and the shape of the reflector ー disposed at the center of the bottom center bump 2122. 所述第一腔体31的底面可以为半球形或多边多角形等其它形状,相对应的,所述反光罩21也可以为半球形或多边多角形等其它形状。 The first cavity 31 of the bottom surface may be hemispherical or other multilateral polygonal shapes, corresponding to the reflector 21 may be hemispherical or other shape multilateral polygonal.

[0023] 步骤③、将经上述步骤成型后的LED灯封装胶体脱模后,在所述反光罩21的内侧面及所述中心凸点22的外表面上真空镀上金属膜。 [0023] Step ③, the LED lights through the encapsulant after the step of releasing after molding, the outer surface of the reflector 21 and the inner surface 22 of the central vacuum plating bump on the metal film. 在本实施例,所述金属膜为铝膜或铬膜等高反射金属膜。 In this embodiment, the metal film is an aluminum film or chromium film is highly reflective metal film.

[0024] 步骤④、将所述中心凸点22处的金属膜用镭射雕刻机雕除以使所述光源10发出的光线露出来; [0024] Step ④, the metal film at the center of the bump 22 is divided by carving laser engraving machine so that the light emitted from the light source 10 is exposed;

[0025] 步骤⑤,以浸涂或喷涂的方式于所述反光罩21的内侧面上涂覆UV光固化透明涂料以保护所述真空金属膜,即得具反光罩且一体封装式的LED灯I。 [0025] Step ⑤, dipping or spraying manner to the reflector coating on the inner surface of UV-curable clear coating 21 to protect the metal film is vacuum, to give the packaged integrated with the reflector and an LED lamp I. 若是同时制作多个LED灯1,则需将经步骤⑤后的若干相连的LED灯I用机器将其进行冲切分离后,即得若干个具反光罩且一体封装式的LED灯I。 If after making a plurality of the LED lamp 1 at the same time, need to be connected by a plurality of LED lamp after step ⑤ I punching machines which separation, i.e. to obtain a plurality of packaged integrated with the reflector and an LED light I.

[0026] 请參阅图1至图3,在使用所述LED灯I时,所述第一导电脚111与所述第二导电脚121分别与外部电源的正负极相电连接,所述光源10的LED晶片13点亮。 [0026] Please refer to FIGS. 1 to 3, when using the LED lamp I, the first conductive pin 111 and the second conductive pin 121 and the positive and negative electrodes electrically respectively connected to an external power source, the LED light source 10 of the wafer 13 is lit. 由于所述LED本体20是由UV光固化胶水制成,所以所述LED晶片13的光线可以透过所述LED本体20从所述中心凸点22射出;由于所述反光罩21的内侧面上镀设有金属膜,从而所述光线经所述反光罩21得以聚光或散光,从而提高了LED灯I的光效和光能利用率,进而提高了所述LED灯I的实用性。 Since the LED body 20 is made of a UV light-cured glue, so that the LED chip 20 can emit light 13 from the bump 22 through the center LED body; since the inner surface 21 of the reflector provided with a metal plating film, so that the light is condensed by the reflector 21 or astigmatism, thereby improving light efficiency and energy efficiency of the LED lamp I, thereby improving the usability of the LED lamp I.

[0027] 综上所述,本发明具反光罩且一体封装式的LED灯I的制备方法通过将光源10一体成型于形成于透光模具30中的LED本体20中,且于所述LED本体20的端面上形成所述反光罩21,因而有效地提高了LED灯I的聚光或散光性能,增强了LED灯I的实用性,从而本发明不仅制作简单,而且实用性強。 [0027] In summary, with the present invention, the reflector and integrally packaged LED lamp I is prepared by the method of the light source 10 integrally formed in the light-transmitting mold 30 is formed on the LED body 20, and to the LED body forming the end face 20 of the reflector 21, thus effectively improving the performance of the LED light focusing or astigmatic I, I enhance the practicality of the LED lamp, thereby making the present invention is not only simple, but practical.

[0028] 以上所述实施例仅表达了本发明的一种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明范围的限制。 [0028] Expression of the above-described embodiments are merely one embodiment of the present invention, and detailed description thereof is more specific, but can not therefore be construed as limiting the scope of the present invention. 应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。 It should be noted that those of ordinary skill in the art, without departing from the spirit of the present invention, can make various changes and modifications, which fall within the protection scope of the present invention. 因此,本发明的保护范围应以所附权利要求为准。 Accordingly, the scope of the invention should be defined by the appended claims.

Claims (7)

1. 一种具反光罩且一体封装式的LED灯的制备方法,其特征在于包括如下步骤:步骤①、制作光源(10);将一第一导电支架(11)及一第二导电支架(12)通过金丝电性连接于一LED晶片(13)的相对两端以形成所述光源(10),所述第一导电支架(11)的末端形成一第一导电脚(111),所述第二导电支架(12)的末端形成一第二导电脚(121);步骤②、将所述光源(10)置于一透光模具(30)中,其中所述第一导电脚(111)及所述第二导电脚(121)伸出所述透光模具(30),所述透光模具(30)具有一第一腔体(31),所述第一腔体(31)的顶部开口且具有一向第一腔体(31)内凸伸的底面,往所述透光模具(30) 中注入UV光固化胶水,然后对所述透光模具(30)进行光固化形成一具有与所述第一腔体(31)的底面相对应形状的反光罩(21)的封装LED本体(20);步骤③、将经上述步骤成型后的LED An integrally packaged with a reflector and an LED lamp production method, comprising the following steps: Step ①, making a light source (10); and a first conductive frame (11) and a second conductive support ( 12) is electrically connected by gold wire to the opposite ends of a LED chip (13) to form said light source (10), an end of the first conductive frame (11) forming a first conductive pin (111), the a second end of said conductive frame (12) forming a second conductive pin (121); step ②, the light source (10) is placed a transparent mold (30), wherein said first conductive pin (111 ) and the second conductive pin (121) extending out of said light-transmitting mold (30), the light-transmitting mold (30) having a first cavity (31), said first cavity (31) having a top opening and the bottom surface has been first cavity (31) which protrudes, into the light-transmitting mold (30) in UV curing glue is injected, and the light-transmitting mold (30) having a light-cured to form reflector (21) with a bottom surface of said first cavity (31) corresponding to the shape of the LED package body (20); the step ③, after the step of forming the above-described LED 封装胶体脱模后,以真空镀膜的方式在所述反光罩(21)的内侧面上镀上金属膜;步骤④、将反光罩(21)上与所述光源(10)相对应位置的金属膜用镭射雕刻机雕除以使所述光源(10)发出的光线露出来,即得具反光罩且一体封装式的LED灯(I )。 After the encapsulant release, vacuum plating manner in the reflector (21) on the inner surface of the metal plating film; step ④, the metal reflector with the light source (10) corresponding to the position (21) film laser engraving machine carving dividing the light source (10) is exposed to light emitted, and one that was packaged with the reflector LED lamp (I).
2.根据权利要求1所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于: 所述步骤③中的金属膜为铝膜或铬膜等高反射金属膜。 2. The device according to claim 1 packaged integrated reflector and LED lamp production method, wherein: the metal film in the step ③ aluminum or chromium film is highly reflective metal film.
3.根据权利要求1所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于: 所述透光模具由硅胶制成。 3. The device according to claim 1 packaged integrated reflector and LED lamp production method, wherein: said mold is made of a translucent silicone.
4.根据权利要求2所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于: 所述步骤②中的透光模具(30)还具有一与所述第一腔体(31)相连通的第二腔体(32),所述第一腔体(31)底面的中心向外凹设形成柱状的第二腔体(32);所述LED本体(20)的反光罩(21)底部中心处形成有一中心凸点(22)。 4. The device according to claim 2 and one reflector packaged LED lamp production method, wherein: said light-transmitting mold (30) further includes the step of ② with said first cavity ( 31) communicating the second cavity (32), said first cavity (31) outwardly recessed central bottom surface of a columnar second cavity (32); reflector of the LED body (20) (21) is formed at the center of the bottom has a central bump (22).
5.根据权利要求4所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于: 所述步骤③为,将所述LED灯(I)脱模后,在所述反光罩(21)的内侧面及所述中心凸点(22)的外表面上真空镀上金属膜。 The device as claimed in claim 4, wherein the reflector and integrally packaged LED lamp production method, wherein: said step of ③ is, the LED lamp (I) after the release, the reflector (21) and the inner surface of the center bump (22) on an outer surface of a metal film vacuum deposition.
6.根据权利要求5所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于:所述步骤④具体为,将所述中心凸点(22)处的金属膜用镭射雕刻机雕除以使所述光源(10)发出的光线露出来。 6. The device of claim 5, wherein the reflector and integrally packaged LED lamp production method, wherein: said step ④ specifically, the center bump metal film (22) by laser engraving carving machine divided by the light source (10) emits light exposed.
7.根据权利要求6所述的具反光罩且一体封装式的LED灯的制备方法,其特征在于: 所述具反光罩且一体封装式的LED灯的制备方法还包括步骤⑤,以浸涂或喷涂的方式于所述反光罩(21)的内侧面上涂覆UV光固化透明涂料以保护所述金属膜。 7. The device according to claim 6 and a reflector integrally packaged LED lamp production method, wherein: said reflector and having integrally packaged LED lamp production method further comprises the step ⑤, dipping or are sprayed on to the reflector (21) of the inner surface of the UV-curable clearcoat coating to protect the metal film.
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