CN102116427B - Preparation method for integrally sealed LED (light-emitting diode) light with diffuser - Google Patents
Preparation method for integrally sealed LED (light-emitting diode) light with diffuser Download PDFInfo
- Publication number
- CN102116427B CN102116427B CN2010105914538A CN201010591453A CN102116427B CN 102116427 B CN102116427 B CN 102116427B CN 2010105914538 A CN2010105914538 A CN 2010105914538A CN 201010591453 A CN201010591453 A CN 201010591453A CN 102116427 B CN102116427 B CN 102116427B
- Authority
- CN
- China
- Prior art keywords
- reflection shield
- light
- led lamp
- preparation
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses a preparation method for integrally sealed LED (light-emitting diode) light with a diffuser, which is characterized by comprising the following steps: an optical source is manufactured; a first conductive bracket and a second conductive bracket are electrically connected with two opposite ends of an LED (light-emitting diode) wafer through an alloy wire; the optical source is arranged in a light-transmitting die; the light-transmitting die is provided with a first cavity; the top part of the first cavity is opened; UV (ultraviolet) photocuring glue is injected in the light-transmitting die; then photocuring is implemented on the light-transmitting die to form a sealed LED body provided with the diffuser; the sealed glue of the formed LED light is demoulded; then a metal film is coated on the inside surface of the diffuser in a vacuum coating way; and the metal film on the position of the diffuser corresponding to with the optical source is carved by an laser engraving machine; therefore, the integrally sealed LED (light-emitting diode) light with the diffuser is obtained. The preparation method for integrally sealed LED (light-emitting diode) light with the diffuser not only is simple to be manufactured, but also has strong practicality.
Description
Technical field
The present invention relates to a kind of preparation method of LED lamp, especially relate to the preparation method of the LED lamp of a kind of tool reflection shield and integral packaging formula.
Background technology
Illuminating lamp is the electrical equipment that the most often uses in people's daily life.Although the illuminating lamp of the light sources such as tradition employing fluorescent tube can satisfy lighting demand, its energy consumption is relatively high.And because fluorescent tube comprises heavy metal Hg, discarded after easily to environment.
The LED(light emitting diode) because it has high, the radiationless and lower powered characteristics of light efficiency, its application is more and more extensive since it comes out.Along with the progress of technology, the illuminating lamp take LED as light source has also constantly obtained innovation and development.Existing LED lamp generally comprises the members such as light source and packing colloid.Described LED lamp encapsulation all is to adopt thermosetting epoxy resin to be poured in the simple mould, through a few hours over drying curing molding.Yet because optically focused and the astigmatic poor performance of described LED lamp, thereby affected the overall performance of LED lamp, be unfavorable for the marketing of LED lamp; And the manufacturing process of above-mentioned LED lamp wastes time and energy, thereby expended unnecessary manpower and materials, increased production cost.
Summary of the invention
The defective that the present invention be directed to the existence of above-mentioned background technology provides the preparation method of the LED lamp of a kind of tool reflection shield and integral packaging formula.
For achieving the above object, the invention discloses the preparation method of the LED lamp of a kind of tool reflection shield and integral packaging formula, it is characterized in that comprising the steps: step 1., make light source; One first conducting bracket and one second conducting bracket are electrically connected at the opposite end of a LED wafer to form described light source by spun gold, the end of described the first conducting bracket forms one first conductive feet, and the end of described the second conducting bracket forms one second conductive feet; Step 2., described light source is placed a printing opacity mould, wherein said the first conductive feet and described the second conductive feet are stretched out described printing opacity mould, described printing opacity mould has one first cavity, the open top of described the first cavity and have a bottom surface that protrudes out in the first cavity, inject UV photocuring glue in the described printing opacity mould, then described printing opacity mould is carried out photocuring and form a packaged LED body that has with the reflection shield of the corresponding shape in bottom surface of described the first cavity; Step 3. will be after the LED lamp packing colloid demoulding after the above-mentioned steps moulding, plates metal film in the mode of vacuum coating at the medial surface of described reflection shield; 4. step with carving except so that the light that described light source sends exposes with the laser engraving machine with the metal film of described light source opposite position on the reflection shield, namely gets the LED lamp of tool reflection shield and integral packaging formula.
Further, the metal film of described step in 3. is aluminium film or the contour reflecting metallic film of chromium film.
Further, described printing opacity mould is made by silica gel.
Further, the printing opacity mould of described step in 2. also has second cavity that is connected with described the first cavity, and the center of described the first cavity bottom surface outwards is arranged with pillared the second cavity of shape; The reflection shield bottom centre place of described LED body is formed with a center salient point.
Further, 3. described step be, after the demoulding of described LED lamp, the medial surface of described reflection shield and described in
Metal film on the Vacuum Deposition on the outer surface of cardiac prominence point.
Further, 4. described step is specially, and the metal film at salient point place, described center is carved with the laser engraving machine removed so that the light that described light source sends exposes.
Further, 5. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula also comprises step, applies UV photocuring clear dope to protect described metal film on the medial surface of described reflection shield in the mode of dip-coating or spraying.
In sum, the preparation method of the LED lamp of tool reflection shield of the present invention and integral packaging formula is by being shaped in light source in the LED body that is formed in the printing opacity mould, and on the end face of described LED body, form described reflection shield, thereby optically focused or the astigmatic performance of LED lamp have effectively been improved, strengthened the practicality of LED lamp, thereby the present invention not only makes simply, and practical.
Description of drawings
Fig. 1 is the generalized section of the employed printing opacity mould of an embodiment of the present invention.
Fig. 2 is the structural representation of the LED lamp of the tool reflection shield that uses the present invention's preparation and integral packaging formula.
Fig. 3 is the structural representation of light source of the LED lamp of tool reflection shield shown in Fig. 2 and integral packaging formula.
The specific embodiment
For further understanding feature of the present invention, technological means and the specific purposes that reach, function, below in conjunction with
Accompanying drawing and the specific embodiment are described in further detail the present invention.
See also Fig. 1 to Fig. 3, the preparation method of the LED lamp 1 of tool reflection shield of the present invention and integral packaging formula, it comprises
Following steps:
Step 1., make light source 10; One first conducting bracket 11 and one second conducting bracket 12 are electrically connected at the opposite end of a LED wafer 13 to form described light source 10 by spun gold.The end of described the first conducting bracket 11 forms one first conductive feet 111, and the end of described the second conducting bracket 12 forms one second conductive feet 121.In the present embodiment, described LED wafer 13 is the solid semiconductor wafer.
Step 2., place a printing opacity mould 30 with described light source 10, wherein said the first conductive feet 111 and described the second conductive feet 121 are stretched out described printing opacity mould 30, in described printing opacity mould 30, inject UV photocuring glue, then described printing opacity mould 30 is carried out the packaged LED body 20 that photocuring formation one has reflection shield 21.In the present embodiment, described printing opacity mould 30 is made by silica gel.Described printing opacity mould 30 has one first cavity 31 and second cavity 32 that is connected with described the first cavity 31.The open top of described the first cavity 31 and have a bottom surface that protrudes out in the first cavity 31.The center of described the first cavity 31 bottom surfaces outwards is arranged with pillared the second cavity 32 of shape.One end face of the LED body 20 that forms be concaved with one with the corresponding shape in bottom surface of described the first cavity 31 reflection shield 21 and be located at the center salient point 22 that described reflection shield 21 bottom centre locate.The bottom surface of described the first cavity 31 can be other shapes such as hemispherical or polygon polygonal, and is corresponding, and described reflection shield 21 also can be other shapes such as hemispherical or polygon polygonal.
Step 3., will be after the LED lamp packing colloid demoulding after the above-mentioned steps moulding, metal film on Vacuum Deposition on the outer surface of the medial surface of described reflection shield 21 and described center salient point 22.At the present embodiment, described metal film is aluminium film or the contour reflecting metallic film of chromium film.
Step 4., with the metal film at described center salient point 22 places with laser engraving machine carving except so that the light that described light source 10 sends expose;
5. step applies UV photocuring clear dope to protect described vacuum metal film in the mode of dip-coating or spraying on the medial surface of described reflection shield 21, namely get the LED lamp 1 of tool reflection shield and integral packaging formula.If make simultaneously a plurality of LED lamps 1, then need and after the some continuous LED lamp 1 usefulness machine of step after 5. carries out punching separation with it, namely to get the LED lamp 1 of several tool reflection shields and integral packaging formula.
See also Fig. 1 to Fig. 3, when using described LED lamp 1, described the first conductive feet 111 and described the second conductive feet 121 are electrically connected with the both positive and negative polarity of external power source respectively, and the LED wafer 13 of described light source 10 is lighted.Because described LED body 20 is to be made by UV photocuring glue, so can seeing through described LED body 20, the light of described LED wafer 13 penetrates from described center salient point 22; Because plating is provided with metal film on the medial surface of described reflection shield 21, thereby described light is able to optically focused or astigmatism through described reflection shield 21, thereby has improved light efficiency and the efficiency of light energy utilization of LED lamp 1, and then has improved the practicality of described LED lamp 1.
In sum, the preparation method of the LED lamp 1 of tool reflection shield of the present invention and integral packaging formula is by being shaped in light source 10 in the LED body 20 that is formed in the printing opacity mould 30, and on the end face of described LED body 20, form described reflection shield 21, thereby optically focused or the astigmatic performance of LED lamp 1 have effectively been improved, strengthened the practicality of LED lamp 1, thereby the present invention not only makes simply, and practical.
The above embodiment has only expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as limitation of the scope of the invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with claims.
Claims (7)
1. the preparation method of the LED lamp of a tool reflection shield and integral packaging formula is characterized in that comprising the steps:
Step 1., make light source (10); One first conducting bracket (11) and one second conducting bracket (12) are electrically connected at the opposite end of a LED wafer (13) to form described light source (10) by spun gold, the end of described the first conducting bracket (11) forms one first conductive feet (111), and the end of described the second conducting bracket (12) forms one second conductive feet (121);
Step 2., described light source (10) is placed a printing opacity mould (30), wherein said the first conductive feet (111) and described the second conductive feet (121) are stretched out described printing opacity mould (30), described printing opacity mould (30) has one first cavity (31), the open top of described the first cavity (31) and have a bottom surface that protrudes out in the first cavity (31), inject UV photocuring glue in the described printing opacity mould (30), then described printing opacity mould (30) is carried out photocuring and form a packaged LED body (20) that has with the reflection shield (21) of the corresponding shape in bottom surface of described the first cavity (31);
Step 3., will be after the LED lamp packing colloid demoulding after the above-mentioned steps moulding, plate metal film in the mode of vacuum coating at the medial surface of described reflection shield (21);
Step 4., metal film with described light source (10) opposite position that reflection shield (21) is upper removes so that the light that described light source (10) sends exposes with laser engraving machine carving, namely gets the LED lamp (1) of tool reflection shield and integral packaging formula.
2. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 1 is characterized in that: the metal film of described step in 3. is aluminium film or the contour reflecting metallic film of chromium film.
3. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 1, it is characterized in that: described printing opacity mould is made by silica gel.
4. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 2, it is characterized in that: the printing opacity mould (30) of described step in 2. also has second cavity (32) that is connected with described the first cavity (31), and the center of described the first cavity (31) bottom surface outwards is arranged with pillared the second cavity of shape (32); Reflection shield (21) the bottom centre place of described LED body (20) is formed with a center salient point (22).
5. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 4, it is characterized in that: 3. described step is, after described LED lamp (1) demoulding, metal film on Vacuum Deposition on the outer surface of the medial surface of described reflection shield (21) and described center salient point (22).
6. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 5, it is characterized in that: 4. described step is specially, and the metal film that described center salient point (22) is located removes so that the light that described light source (10) sends exposes with laser engraving machine carving.
7. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula according to claim 6; it is characterized in that: 5. the preparation method of the LED lamp of described tool reflection shield and integral packaging formula also comprises step, applies UV photocuring clear dope to protect described metal film on the medial surface of described reflection shield (21) in the mode of dip-coating or spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105914538A CN102116427B (en) | 2010-12-16 | 2010-12-16 | Preparation method for integrally sealed LED (light-emitting diode) light with diffuser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105914538A CN102116427B (en) | 2010-12-16 | 2010-12-16 | Preparation method for integrally sealed LED (light-emitting diode) light with diffuser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102116427A CN102116427A (en) | 2011-07-06 |
| CN102116427B true CN102116427B (en) | 2013-04-17 |
Family
ID=44215313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105914538A Active CN102116427B (en) | 2010-12-16 | 2010-12-16 | Preparation method for integrally sealed LED (light-emitting diode) light with diffuser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102116427B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8791484B2 (en) * | 2011-09-13 | 2014-07-29 | Uniled Lighting Taiwan Inc. | LED lamp |
| CN103996780A (en) * | 2013-02-16 | 2014-08-20 | 奇麟光电股份有限公司 | LED lamp, manufacturing method of LED lamp and LED subtitle panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357929A (en) * | 2000-12-09 | 2002-07-10 | 光电子株式会社 | Optical semiconductor device and its making process |
| CN1996624A (en) * | 2006-01-04 | 2007-07-11 | 徐建国 | Light-emitting diode-LED and its encapsulation method and application |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58204575A (en) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | Semiconductor light emitting element |
-
2010
- 2010-12-16 CN CN2010105914538A patent/CN102116427B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357929A (en) * | 2000-12-09 | 2002-07-10 | 光电子株式会社 | Optical semiconductor device and its making process |
| CN1996624A (en) * | 2006-01-04 | 2007-07-11 | 徐建国 | Light-emitting diode-LED and its encapsulation method and application |
Non-Patent Citations (1)
| Title |
|---|
| JP昭58-204575A 1983.11.29 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102116427A (en) | 2011-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107342353A (en) | One kind focuses on ultraviolet LED encapsulating structure and preparation method thereof | |
| CN103474425A (en) | High-luminescence-uniformity miniaturized flexible LED area array device and preparation method thereof | |
| CN102116427B (en) | Preparation method for integrally sealed LED (light-emitting diode) light with diffuser | |
| CN101114684A (en) | SMD light-emitting diode packaging structure | |
| CN203398110U (en) | LED light source combination of fixed-type and fixed-specification packaging | |
| CN202695531U (en) | Small direct-inserting LED lamp bead | |
| CN201112408Y (en) | Luminescent diode packaging structure | |
| CN102769089B (en) | Semiconductor packaging structure | |
| CN109509827A (en) | A kind of deep ultraviolet semiconductor light emitting diode device and preparation method thereof | |
| CN202209633U (en) | Led lamp lens structure | |
| CN201673936U (en) | Sealing compound body with surface stuck with LED | |
| CN1228863C (en) | Method of package formation for LED and finished product structure thereof | |
| CN204732450U (en) | A kind of high luminous efficiency diode | |
| CN202902028U (en) | Light emitting diode (LED) searchlight with lamp cups | |
| CN107768504A (en) | A kind of paster LED bracket | |
| CN204249365U (en) | LED lamp bead pastes gluing particular manufacturing craft | |
| CN201902887U (en) | Integral encapsulated LED (light-emitting diode) lamp with reflecting shade | |
| CN210378208U (en) | Digital display module of glue spraying packaging | |
| CN203250781U (en) | LED encapsulation structure | |
| CN203787425U (en) | LED filament and illuminator | |
| CN207353288U (en) | A kind of paster LED bracket | |
| CN102269361A (en) | Modular light-emitting diode (LED) lamp | |
| CN206864466U (en) | A kind of light emitting diode based on wafer-level package | |
| CN213845309U (en) | Light emitting diode packaging structure | |
| CN2742583Y (en) | Wafer coated structure of light emitting diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221213 Address after: 602, Floor 6, Aojiahua Business Building, West of Ningchuan North Road, north of Dengfeng Road, Guangyi Street, Chenghai District, Shantou City, Guangdong Province 515800 Patentee after: Shantou Goodisi New Materials Co.,Ltd. Address before: 523000 No. 3, Shishi 4th Lane, Shenghe Zanhualing Village, Nancheng District, Dongguan City, Guangdong Province Patentee before: Ye Yiren |