CN102115907A - Method and device for electroplating printed circuit board - Google Patents
Method and device for electroplating printed circuit board Download PDFInfo
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- CN102115907A CN102115907A CN2010105996400A CN201010599640A CN102115907A CN 102115907 A CN102115907 A CN 102115907A CN 2010105996400 A CN2010105996400 A CN 2010105996400A CN 201010599640 A CN201010599640 A CN 201010599640A CN 102115907 A CN102115907 A CN 102115907A
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Abstract
The invention provides a method for electroplating a printed circuit board. The method comprises the following steps: the current of an electroplating fixture is detected in the electroplating process of the printed circuit board; and when the current exceeds the threshold range, alarm signals are emitted in a wired or wireless mode. The invention also provides a device for electroplating a printed circuit board. The device comprises a current detection module and a signal module, wherein the current detection module is used to detect the current of the electroplating fixture in the electroplating process of the printed circuit board; and the signal module is used to emit the alarm signals in a wired or wireless mode when the current is judged to exceed the threshold range. By adopting the method and device in the invention, the reliability of the printed circuit board can be increased.
Description
Technical field
The present invention relates to printed circuit field, in particular to being used for PCB (Printed Circuit Board, printed circuit board (PCB)) electric plating method and device.
Background technology
Hole copper on the PCB, table copper are realized by electroplating usually, can adopt vertical continuous electroplating technology, dull and stereotyped electroplating technology etc.For example, in the conventional vertical continuous electroplate technology, upper plate adopts the manual material loading of electroplating clamp monolithic, after degreasing, washing, microetch, pickling etc. are handled, enter the copper facing of copper cylinder, speed is carried continuously with 0.6M/min, anode baffle can be according to producing board size, automatically adjust adjustable height, produce plate after the copper facing and finish discharging through cleaning, anchor clamps enter feeding area after being cleaned by the nitric acid strip again.
At the anchor clamps band and to occur in the continuous operational process of production plate that electric current descends or when interrupting, cupric ion can't be diffused in plate face or the hole in the soup, has a strong impact on the electroplating ventilating hole quality, causes the hole inwall to constitute the copper coating of dog bone shape.When electric current recovers just often, cupric ion can be diffused on plate face and the hole wall again equably, thereby causes trickle microetch line.
The contriver finds, produces many microetch lines when existing P CB is electroplate with on the hole of PCB copper, table copper, and this has influenced the unfailing performance of PCB.
Summary of the invention
The present invention aims to provide a kind of PCB of being used for electric plating method and device, electroplates the problem that produces many microetch lines with the PCB that solves prior art.
In an embodiment of the present invention, provide a kind of method that is used for electroplating printed circuit board, having comprised: the electric current that in the electroplating process of printed circuit board (PCB), detects electroplating clamp; When judging that electric current exceeds threshold range, send guard signal by wired mode or wireless mode.
In an embodiment of the present invention, provide a kind of device that is used for electroplating printed circuit board, having comprised: current detection module is used for the electric current at the electroplating process detection electroplating clamp of printed circuit board (PCB); Signaling module is used for sending guard signal by wired mode or wireless mode when judging that electric current exceeds threshold range.
The method and apparatus of the embodiment of the invention detects because of the electric current to electroplating clamp, electroplates the problem that produces many microetch lines so overcome the PCB of prior art, has improved the reliability of PCB.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present invention, constitutes the application's a part, and illustrative examples of the present invention and explanation thereof are used to explain the present invention, do not constitute improper qualification of the present invention.In the accompanying drawings:
Fig. 1 shows the schema that is used for the PCB electric plating method according to an embodiment of the invention;
Fig. 2 shows the synoptic diagram that is used for the PCB electro plating device according to an embodiment of the invention;
Fig. 3 shows the synoptic diagram that is used for the PCB electro plating device in accordance with a preferred embodiment of the present invention;
Fig. 4 shows the synoptic diagram that is used for the PCB electro plating device of another preferred embodiment according to the present invention.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
Fig. 1 shows the schema that is used for the PCB electric plating method according to an embodiment of the invention, comprising:
Step S10, the electric current of detection electroplating clamp in the electroplating process of printed circuit board (PCB);
Step S20 when judging that electric current exceeds threshold range, sends guard signal by wired mode or wireless mode.
Produce many microetch lines when existing P CB is electroplate with on the hole of PCB copper, table copper, plate electric wire and figure electric wire etc., the contriver has carried out a large amount of analysis of experimentss for this reason, has found that finally PCB electroplates the reason that produces many microetch lines.In the electroplating process (for example vertical continuous plating) of PCB, electroplating clamp is accompanied by travelling belt and constantly moves with respect to a plurality of copper cylinders.This movement continuously causes electroplating clamp when moving to certain position, may descend or interrupt by electric current owing to loose contact.And the electric current instability on the electroplating clamp finally causes producing many microetch lines on the hole of PCB copper, table copper, plate electric wire and figure electric wire etc.
The contriver is according to own above-mentioned achievement in research, thereby developed the technical scheme of Fig. 1 embodiment.In this scheme, electric current on the electroplating clamp is detected, in case find the undesired just warning of electric current, eliminate the contact fault of electroplating clamp thereby in follow-up flow process, can adopt an effective measure, make electroplating clamp work recover normal, avoid on the hole of PCB copper, table copper, plate electric wire and figure electric wire etc., producing many microetch lines, and then improved the reliability of PCB.
In addition,, select wired mode or wireless mode neatly for use, can reduce equipment cost, guarantee communication quality according to the practical situation of production scene.
Preferably, guard signal comprises that warning reason and/or electric current exceed the sign of the electroplating clamp of threshold range.According to warning reason, can promptly determine to take place unusual reason, code value that for example can pre-defined warning reason when warning reason is 1, then is defined as electric current and is lower than threshold range, and warning reason is 2, then is defined as electric current and is higher than threshold range etc.In addition, because a plurality of electroplating clamps are arranged on the production line usually, so the sign of this preferred embodiment prompting electroplating clamp when reporting to the police makes and can promptly determine the electroplating clamp that breaks down in the follow-up flow process.It should be noted that warning reason and sign can be arranged in the same guard signal, perhaps generate a guard signal respectively, the present invention does not limit this.
Preferably, when judging that electric current exceeds threshold range, carry out following at least one step: the electric current of electroplating clamp is adjusted in the threshold range; Adjust the movement velocity of electroplating clamp and corresponding printed circuit board (PCB) thereof; Adjust the electroplating time of electroplating clamp and corresponding printed circuit board (PCB) thereof; Stop the work of all electroplating clamps on this electroplating clamp or this electroplating clamp place production line.This preferred embodiment can be under unattended situation, by automatization control, automatically the electric current of electroplating clamp is adjusted in the threshold range, adjusts the movement velocity of electroplating clamp or stops the work of electroplating clamp, and this can eliminate fault in time.
Preferably, sending guard signal by wireless mode comprises: trigger wireless transmitter module and launch guard signal by wireless mode; Wireless receiving module receives the guard signal from wireless transmitter module; The guard signal that decoding module receives wireless receiving module converts the form that the controller that is used to handle guard signal can be handled to, and offers controller.This preferred embodiment provides a kind of scheme of radio communication, and this mode can be deployed to this device in some industry spot that are unfavorable for connecting up at an easy rate, has reduced cost.
Preferably, present method also comprises according to guard signal at least a in reporting to the police of warning, light warning and screen of sounding.Report to the police by the warning of sounding, light warning or screen, the staff just can in time obtain the prompting of current anomaly, thereby production line hand-manipulated is in time eliminated fault.
Fig. 2 shows the synoptic diagram that is used for the PCB electro plating device according to an embodiment of the invention, comprising:
This device detects the electric current on the electroplating clamp, thereby has avoided producing many microetch lines on the hole of PCB copper and table copper, and then has improved the reliability of PCB.
Preferably, guard signal comprises that warning reason and/or electric current exceed the sign of the electroplating clamp of threshold range.In the follow-up flow process, utilize warning reason can promptly determine to take place unusual reason, utilize sign can promptly determine the electroplating clamp that breaks down.
Fig. 3 shows the synoptic diagram that is used for the PCB electro plating device in accordance with a preferred embodiment of the present invention, also comprises controller 30, is used for sending actuate signal according to guard signal; Device also comprises following at least one module:
Speed adjusting module 60 is used under the actuate signal of controller adjusting the movement velocity of electroplating clamp and corresponding printed circuit board (PCB) thereof;
Stopping modular 70 is used in the work that stops all electroplating clamps on this electroplating clamp or this electroplating clamp place production line under the actuate signal of controller.
This preferred embodiment can be under unattended situation, by above-mentioned automatic equipment, automatically the electric current of electroplating clamp is adjusted in the threshold range, adjusted the movement velocity of electroplating clamp or stop the work of electroplating clamp, this can eliminate fault in time.
Preferably, signaling module comprises: wire module is arranged, be used for by wired mode guard signal being sent to controller from signaling module; Wireless module is used for by wireless mode guard signal being sent to controller from signaling module.According to the practical situation of production scene, select wired mode or wireless mode neatly for use, can reduce equipment cost, guarantee communication quality.
Preferably, as shown in Figure 3, this device also comprises alarm module 40, alarm module 40 comprise following one of at least: indicating meter is used for sending screen and reports to the police under the actuate signal of controller; Loud speaker is used for the warning of sounding under the actuate signal of controller; And lamp, be used under the actuate signal of controller, sending light warning.Report to the police by the warning of sounding, light warning or screen, the staff just can in time obtain the prompting of current anomaly, thereby production line hand-manipulated is in time eliminated fault.
Fig. 4 shows the synoptic diagram that is used for the PCB electro plating device of another preferred embodiment according to the present invention.
As shown in Figure 4, controller is PLC (Programmable Logic Controller, programmable logic controller) 25.PLC uses wider in industry spot, stable performance, and this device adopts PLC can satisfy every performance requriements as controller.
As shown in Figure 4, alarm module comprise following one of at least: indicating meter 32, combined aural and visual alarm 34 (for example loud speaker, lamp).These all are common output equipments, can carry out acousto-optic hint or text prompt etc.
As shown in Figure 4, signaling module comprises: wireless transmitter module 42 is used for by the guard signal of wireless mode emission from current detection module; Wireless receiving module 44 is used to receive the guard signal from wireless transmitter module; Decoding module 46 is used for converting the guard signal that wireless receiving module receives to form that controller can be handled, and offers controller.
This preferred embodiment provides a kind of scheme of radio communication, and this mode can be deployed to this device in the industry spot at an easy rate, has reduced cost.
Preferably, wireless mode adopts the wireless signal of 900MHZ.This frequency belongs to citizens' radio band commonly used.
Preferably, threshold range is 110～130A.In the electroplating technology of PCB, the outward current of rectifier is 1-300A usually, and the normal working current of electroplating clamp is 110-130A.Threshold range is set to 110-130A, and when the electric current on the electroplating clamp exceeded this threshold range, current detection module can send warning, thereby notes abnormalities like this.
The current detection module 10 of Fig. 4 can be installed on the electroplating clamp, when electroplating clamp runs to the electro-coppering cylinder, current detection module 10 is started working, by the current value on the current mutual inductor coil detection electroplating clamp, the alarm current value can be regulated according to need of work, and alarm current value scope is 110-300A (being threshold range).When the current value on certain electroplating clamp exceeds 110-300A, current detection module 10 triggers wireless transmitter module 42 and sends the signal of 900MHZ in wireless receiving module 44, signal by 46 pairs of receptions of decoding module is deciphered, translate the sign (for example number) of corresponding electroplating clamp, be input to again among the PLC 25.PLC 25 receives the anchor clamps number that decoding module 46 is provided, and driving display 32 (computer monitor or touch-screen) shows the sign of electroplating clamp, drives combined aural and visual alarm 34 simultaneously and sends sound and light alarm.After electroplating clamp was finished plating, current detection module 10 quit work.In addition, can also carry out automatic record to alarm condition, being convenient in the future, the staff checks historic records.After obtaining alarm, the staff just can adopt an effective measure and correct the fault of electroplating clamp.It should be noted that on the electroplating assembly line has a plurality of electroplating clamps usually, for each electroplating clamp a current detection module 10 is installed all in the preferred embodiment, but in the whole device controller can only be set.The sign of corresponding electroplating clamp because current detection module 10 can be reported to the police is which electroplating clamp takes place unusually so this controller can be discerned.
This shows that the above embodiments of the present invention have solved the poor plating problem of electroplating clamp effectively, reduced the quality hidden danger of PCB.
Obviously, those skilled in the art should be understood that, above-mentioned each module of the present invention or each step can realize with the general calculation device, they can concentrate on the one calculating device, perhaps be distributed on the network that a plurality of calculating device forms, alternatively, they can be realized with the executable program code of calculating device, carry out by calculating device thereby they can be stored in the storing device, perhaps they are made into each integrated circuit modules respectively, perhaps a plurality of modules in them or step are made into the single integrated circuit module and realize.Like this, the present invention is not restricted to any specific hardware and software combination.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. a method that is used for electroplating printed circuit board is characterized in that, comprising:
In the electroplating process of printed circuit board (PCB), detect the electric current of electroplating clamp;
When judging that described electric current exceeds threshold range, send guard signal by wired mode or wireless mode.
2. method according to claim 1 is characterized in that, described guard signal comprises that warning reason and/or described electric current exceed the sign of the electroplating clamp of threshold range.
3. method according to claim 1 and 2 is characterized in that, when judging that described electric current exceeds threshold range, carries out following at least one step:
The electric current of described electroplating clamp is adjusted in the described threshold range;
Adjust the movement velocity of described electroplating clamp and corresponding printed circuit board (PCB) thereof;
Adjust the electroplating time of described electroplating clamp and corresponding printed circuit board (PCB) thereof;
Stop the work of all electroplating clamps on described electroplating clamp or the described electroplating clamp place production line.
4. according to each described method among the claim 1-3, it is characterized in that, send described guard signal by wireless mode, comprising:
Trigger wireless transmitter module and launch described guard signal by wireless mode;
Wireless receiving module receives the guard signal from described wireless transmitter module;
The described guard signal that decoding module receives described wireless receiving module converts the form that the controller that is used to handle described guard signal can be handled to, and offers described controller.
5. according to each described method among the claim 1-4, it is characterized in that, also comprise:
According to described guard signal at least a in reporting to the police of warning, light warning and screen of sounding.
6. a device that is used for electroplating printed circuit board is characterized in that, comprising:
Current detection module is used for the electric current at the electroplating process detection electroplating clamp of printed circuit board (PCB);
Signaling module is used for sending guard signal by wired mode or wireless mode when judging that described electric current exceeds threshold range.
7. device according to claim 6 is characterized in that, described guard signal comprises that warning reason and/or described electric current exceed the sign of the electroplating clamp of threshold range.
8. according to claim 6 or 7 described devices, it is characterized in that, also comprise controller, be used for sending actuate signal to control the operation of following at least one module according to described guard signal:
Current adjusting module is used under the actuate signal of described controller the electric current of described electroplating clamp being adjusted in the described threshold range;
The speed adjusting module is used under the actuate signal of described controller adjusting the movement velocity of described electroplating clamp and corresponding printed circuit board (PCB) thereof;
Time regulating module is used under the actuate signal of described controller adjusting the electroplating time of described electroplating clamp and corresponding printed circuit board (PCB) thereof;
Stopping modular is used in the work that stops all electroplating clamps on described electroplating clamp or the described electroplating clamp place production line under the actuate signal of described controller.
9. according to each described device of claim 6-8, it is characterized in that described controller is a programmable logic controller.
10. according to each described device of claim 6-9, it is characterized in that, also comprise alarm module, described alarm module comprise following one of at least: indicating meter is used for sending screen and reports to the police under the actuate signal of described controller; Loud speaker is used for the warning of sounding under the actuate signal of described controller; And lamp, be used under the actuate signal of described controller, sending light warning.
11., it is characterized in that described signaling module comprises according to each described device of claim 6-10:
Wireless transmitter module is used for by the guard signal of wireless mode emission from described signaling module;
Wireless receiving module is used to receive the guard signal from described wireless transmitter module;
Decoding module is used for converting the described guard signal that described wireless receiving module receives to form that described controller can be handled, and offers described controller.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010599640.0A CN102115907B (en) | 2010-12-10 | 2010-12-10 | Method and device for electroplating printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010599640.0A CN102115907B (en) | 2010-12-10 | 2010-12-10 | Method and device for electroplating printed circuit board |
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| CN102115907A true CN102115907A (en) | 2011-07-06 |
| CN102115907B CN102115907B (en) | 2014-04-09 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102965717A (en) * | 2012-12-13 | 2013-03-13 | 深圳市博敏电子有限公司 | Device and method for monitoring current density of electroplating equipment in real time |
| CN103789818A (en) * | 2012-10-31 | 2014-05-14 | 三星电机株式会社 | System and method for controlling electroplating |
| CN104532334A (en) * | 2015-01-01 | 2015-04-22 | 深圳市兴达线路板有限公司 | Plating line current abnormality detection and current regulation method and device |
| CN107268067A (en) * | 2016-04-08 | 2017-10-20 | 贵州黎阳航空动力有限公司 | A kind of method that total current is correctly entered in guarantee electroplating work procedure |
| CN107604425A (en) * | 2017-07-19 | 2018-01-19 | 东莞市开美电路板设备有限公司 | The vertical continuous pulse plating line of computer-readable recording medium and the application medium |
| CN111074327A (en) * | 2020-01-02 | 2020-04-28 | 长江存储科技有限责任公司 | Electroplating process and apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58113399A (en) * | 1981-12-28 | 1983-07-06 | Kawasaki Steel Corp | Automatic adjusting method for spacing between electrodes in continuous electroplating device for steel plate |
| CN87107414A (en) * | 1987-04-14 | 1988-09-14 | 华中工学院 | Electroplating technology and parameter microcomputer control system |
| JPH01177400A (en) * | 1988-01-06 | 1989-07-13 | Kosaku:Kk | Plating equipment for automatically controlling plating current |
| JPH1177400A (en) * | 1997-09-12 | 1999-03-23 | Kasai Kogyo Co Ltd | Positioning method and positioning device for sheet material |
| JP2004149858A (en) * | 2002-10-30 | 2004-05-27 | Marunaka Kogyo Kk | Electroplating treatment device capable of uniform plating treatment |
| CN101613876A (en) * | 2009-07-24 | 2009-12-30 | 深圳崇达多层线路板有限公司 | Electroplating parameter error detecting system of circuit board and method |
| CN101613875A (en) * | 2009-07-24 | 2009-12-30 | 深圳崇达多层线路板有限公司 | Electroplating correction system of circuit board and method |
| CN201908150U (en) * | 2010-12-10 | 2011-07-27 | 北大方正集团有限公司 | Automatic control equipment and production line for electroplating PCB |
-
2010
- 2010-12-10 CN CN201010599640.0A patent/CN102115907B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58113399A (en) * | 1981-12-28 | 1983-07-06 | Kawasaki Steel Corp | Automatic adjusting method for spacing between electrodes in continuous electroplating device for steel plate |
| CN87107414A (en) * | 1987-04-14 | 1988-09-14 | 华中工学院 | Electroplating technology and parameter microcomputer control system |
| JPH01177400A (en) * | 1988-01-06 | 1989-07-13 | Kosaku:Kk | Plating equipment for automatically controlling plating current |
| JPH1177400A (en) * | 1997-09-12 | 1999-03-23 | Kasai Kogyo Co Ltd | Positioning method and positioning device for sheet material |
| JP2004149858A (en) * | 2002-10-30 | 2004-05-27 | Marunaka Kogyo Kk | Electroplating treatment device capable of uniform plating treatment |
| CN101613876A (en) * | 2009-07-24 | 2009-12-30 | 深圳崇达多层线路板有限公司 | Electroplating parameter error detecting system of circuit board and method |
| CN101613875A (en) * | 2009-07-24 | 2009-12-30 | 深圳崇达多层线路板有限公司 | Electroplating correction system of circuit board and method |
| CN201908150U (en) * | 2010-12-10 | 2011-07-27 | 北大方正集团有限公司 | Automatic control equipment and production line for electroplating PCB |
Non-Patent Citations (7)
| Title |
|---|
| 《2003年全国电子电镀学术研讨会论文集》 20030701 桑田能安等 印刷线路板用垂直连续搬运式电镀装置"Ucon-jr" 第150页 1-11 , * |
| 《材料保护》 19950731 徐叔炎 "DM-200型电镀电流密度计的工作原理及应用" 第35页左栏第1段和右栏第3段 1-10 , 第07期 * |
| 侯荣阶等: "浅谈电镀挂具的设计与制作", 《电镀与环保》, vol. 22, no. 2, 30 March 2002 (2002-03-30), pages 34 - 36 * |
| 徐叔炎: ""DM-200型电镀电流密度计的工作原理及应用"", 《材料保护》, no. 07, 31 July 1995 (1995-07-31) * |
| 李亚冰等: "印制线路板微孔镀铜研究现状", 《电镀与精饰》, vol. 29, no. 1, 15 January 2007 (2007-01-15), pages 32 - 39 * |
| 李剑峰: "挂具与电镀质量的关系", 《2008年中国电镀技术研讨会》, 27 November 2008 (2008-11-27), pages 450 - 452 * |
| 桑田能安等: "印刷线路板用垂直连续搬运式电镀装置"Ucon-jr"", 《2003年全国电子电镀学术研讨会论文集》, 1 July 2003 (2003-07-01), pages 150 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789818A (en) * | 2012-10-31 | 2014-05-14 | 三星电机株式会社 | System and method for controlling electroplating |
| CN102965717A (en) * | 2012-12-13 | 2013-03-13 | 深圳市博敏电子有限公司 | Device and method for monitoring current density of electroplating equipment in real time |
| CN104532334A (en) * | 2015-01-01 | 2015-04-22 | 深圳市兴达线路板有限公司 | Plating line current abnormality detection and current regulation method and device |
| CN107268067A (en) * | 2016-04-08 | 2017-10-20 | 贵州黎阳航空动力有限公司 | A kind of method that total current is correctly entered in guarantee electroplating work procedure |
| CN107604425A (en) * | 2017-07-19 | 2018-01-19 | 东莞市开美电路板设备有限公司 | The vertical continuous pulse plating line of computer-readable recording medium and the application medium |
| CN111074327A (en) * | 2020-01-02 | 2020-04-28 | 长江存储科技有限责任公司 | Electroplating process and apparatus |
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Effective date of registration: 20220623 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |