CN102110622A - Quota calculation method for packaging metal wire - Google Patents
Quota calculation method for packaging metal wire Download PDFInfo
- Publication number
- CN102110622A CN102110622A CN 200910200938 CN200910200938A CN102110622A CN 102110622 A CN102110622 A CN 102110622A CN 200910200938 CN200910200938 CN 200910200938 CN 200910200938 A CN200910200938 A CN 200910200938A CN 102110622 A CN102110622 A CN 102110622A
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- spun gold
- encapsulation
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- calculation method
- quota
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention provides a quota calculation method for a packaging metal wire, and belongs to the technical field of package. The quota calculation method for the packaging metal wire comprises the following steps of: predetermining relations among diameter, arc height, plane length and arc length ratio of the metal wire through an arc length ratio lookup table and the like; looking up the arc length ratio lookup table according to parameters such as the diameter, the arc height, the plane length and the like of the metal wire to acquire the arc length ratio; and finally, accurately acquiring the equivalent three-dimensional length of the metal wire. The quota calculation method for the packaging metal wire can be finished according to a package wiring diagram, has the characteristics of high efficiency, is accurate, is easy to operate and is suitable for multi-line calculation; and quotation to a client before package is easy to realize.
Description
Technical field
The invention belongs to the encapsulation technology field, be specifically related to a kind of encapsulation spun gold quota calculation method.
Background technology
In the process of integrated circuit (IC) Chip Packaging, all pass through " gold thread distribution " process usually to connect IC chip and lead frame pin.Figure 1 shows that the encapsulation distribution floor map of prior art, as shown in Figure 1, this encapsulation wiring diagram can be finished by the AutoCAD software design, carries out the spun gold distribution from the IC chip of centre to a plurality of predetermined pins.According to different packing forms, different factors such as IC chip circuit functional requirement, the gold thread that is consumed in the distribution process of every kind of Chip Packaging is inequality.
Simultaneously, because the price of gold costliness, the cost of the spun gold that is consumed in the encapsulation can account for 30% of entire I C Chip Packaging cost.For encapsulation factory, because the sensitiveness of price factor, the spun gold that encapsulation factory generally need be before the encapsulation beginning be consumed each client's IC Chip Packaging has an estimation accurately by norm.Therefore, encapsulation factory seeks a kind ofly can take into full account spun gold distribution encapsulation spun gold process characteristics, precise and high efficiency quota calculation method always.
In the prior art, mainly contain following several encapsulation spun gold quota calculation method.
First kind is, adopts the mode of estimation, and for example, every spun gold lead-in wire estimation length is 2mm, according to the spun gold lead-in wire radical of each Chip Packaging needs, multiply by 2mm to draw the spun gold quota with the spun gold radical then.This method is the most original method, and spun gold quota accuracy is low.
Second kind is, on the encapsulation wiring diagram of design in advance (as shown in Figure 1) directly measure the plane length of every spun gold lead-in wire (illustrating with thick lines among Fig. 1), sum up then to wait and calculate spun gold by norm.This method needs manual the realization to measure by root, and therefore length consuming time, efficient are low, the serious importing of postponing the encapsulation new chip; Simultaneously, also do not consider encapsulation radian factors such as (the spun gold distribution are not strict form of straight lines, and there is certain radian in it), it is also not necessarily accurate to measure, thereby causes its quota accuracy also not high.
The third is after the IC chip that needs are encapsulated tries encapsulation earlier, to carry out actual count according to the spun gold consumption of examination encapsulation.Though this method spun gold quota accurately, it need carry out pre-packaged, takes time and effort; Be not suitable for encapsulating the preceding accurate estimation of beginning simultaneously, feasibility is not high.
Therefore, press for a kind of spun gold quota calculation method that encapsulates efficiently, accurately.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of spun gold quota calculation method that encapsulates efficiently, accurately.
For solving above technical problem, the invention provides a kind of encapsulation spun gold quota calculation method, may further comprise the steps:
Pre-determine the diameter, camber, plane length of spun gold and arc length than between relation;
Determine the equivalent three-dimensional length of one group of spun gold; And
The equivalent three-dimensional length of described one group of spun gold is determined encapsulation spun gold quota mutually,
Wherein, calculate the equivalent three-dimensional length of each root in described one group of spun gold according to following manner:
Utilize described relation, determine the arc length ratio according to diameter, the camber peace face length degree of this root spun gold; And
Obtain the equivalent three-dimensional length of this root spun gold than peaceful face length degree according to described arc length.
According to encapsulation spun gold quota calculation method provided by the present invention, wherein, described relation can be determined by analog computation, also can determine according to experimental data.
As an embodiment, described encapsulation spun gold quota calculation method comprises the steps:
(1) sets up arc length and compare look-up table;
(2) input spun gold diameter;
(3) the input packing forms is to determine camber;
(4) select N root spun gold;
(5) read N root spun gold plane length;
(6) search arc length than look-up table according to spun gold diameter, camber, plane length parameter, to obtain the arc length ratio;
(7) calculate the three-dimensional length of this root spun gold equivalence, N is from adding 1;
(8) whether judge N greater than M,, then enter step (4),, then enter step (9) if be judged as "Yes" if be judged as "No";
(9) (M-N) the equivalent three-dimensional length of root spun gold add and;
Wherein M, N are positive integer, and M is greater than N.
In this embodiment, the relation between the diameter of spun gold, camber, plane length and the arc length ratio is represented with the form of look-up table.Described camber determined by packing forms, and described packing forms comprises a kind of in DIP encapsulation, SOP encapsulation and the encapsulation of ultrathin plastic-sealed body.Described arc length be multiply by the equivalent three-dimensional length that draws this root spun gold mutually than peaceful face length degree.When determining described the relation, be the spun gold of certain-length with the pad equivalence at spun gold two ends.The precision of described spun gold plane length is 0.1 micron.
As another embodiment, this encapsulation spun gold quota calculation method may further comprise the steps:
(1) sets up arc length and compare look-up table;
(1a) import the encapsulation wiring diagram in the AutoCAD software;
(1b) spun gold that will desire distribution is arranged on the same figure layer;
(1c) input encapsulation wiring diagram scaling;
(2) input spun gold diameter;
(3) the input packing forms is to determine camber;
(4) select N root spun gold;
(4a) close figure layer outside the figure layer of N root spun gold place;
(5) read N root spun gold plane length;
(6) search arc length than look-up table according to spun gold diameter, camber, plane length parameter, to obtain the arc length ratio;
(7) calculate the three-dimensional length of this root spun gold equivalence, N is from adding 1;
(8) whether judge N greater than M,, then enter step (4) if be judged as "No",
If be judged as "Yes", then enter step (9);
(9) (M-N) the equivalent three-dimensional length of root spun gold add and;
(9a) execution graph layer reposition routine, the variable of untouched assembling line chart also restores;
Wherein M, N are positive integer, and M is greater than N.
In this embodiment, described method realizes in the AutoCAD software environment, and wherein programming language adopts at least a among AutoLisp, VBA, the DCL.
Technique effect of the present invention is, this spun gold quota calculation method is finished according to the encapsulation wiring diagram, avoids by the pre-packaged spun gold quota that carries out, and the client offered before being implemented in encapsulation easily.Simultaneously, take into full account the factors such as camber that spun gold diameter, packing forms are influenced, can in computer, finish automatically, had efficient, accurate, simple to operate, as to be suitable for multi-line section calculating characteristics.
Description of drawings
Fig. 1 is the encapsulation distribution floor map of prior art;
Fig. 2 is a kind of flow chart that encapsulates spun gold quota calculation method according to one embodiment of the present of invention;
Fig. 3 is the flow chart according to the spun gold quota calculation method of further embodiment of this invention.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, the present invention is described in further detail below in conjunction with accompanying drawing.
In spun gold distribution process, according to different IC chip requirements, can select different packing forms, different spun gold diameters, different spun gold radicals, factors such as packing forms, spun gold diameter, the spun gold radical of encapsulation is many have been taken into full account in the spun gold quota calculation process of this embodiment, be implemented in the client with the engineering drawing (for example design drawing of autocad file form) of spun gold distribution and relevant parameter pay come after, can realize the calculating of spun gold quota by this method.Its basic computational process as shown in Figure 2.
Figure 2 shows that a kind of encapsulation spun gold quota calculation method flow diagram provided by the invention.Followingly the spun gold quota calculation method of this embodiment is described in detail explanation to each step according to Fig. 2.
Step S110 sets up arc length and compares look-up table.
The engineering drawing of general spun gold distribution is X-Y scheme as shown in Figure 1, and the spun gold length on its figure can only reflect its plane length, i.e. the straight line plan range of the end to end pin of IC chip.And in the actual package process, exist certain altitude poor between gold thread two welding endss, the spun gold of the end to end pin of IC chip also is to have certain crooked radian, the spun gold diameter not simultaneously, can there be different relatively crooked radians in spun gold.Simultaneously, the pad at spun gold two ends also is to consume certain spun gold length, and each solder joint can equivalence be certain spun gold length, adds up in wherein.Therefore, this embodiment is according to different packing forms, different spun gold diameter, after the factors such as equivalent spun gold length of the pad at the determined crooked radian of consideration spun gold diameter, the determined camber of packing forms, spun gold two ends, by every gold thread distribution being carried out computer simulation to draw the arc length ratio, perhaps experimental data (perhaps empirical data) accumulation by repeatedly encapsulation draws the arc length ratio, thus can draw different spun gold diameters, different packing forms for look-up table.In look-up table, different packing forms, different spun gold diameters, different spun golds plane length can corresponding draw different arc length ratios, and this arc length has reflected the influence to actual spun gold distribution length of packing forms, spun gold diameter, spun gold plane length than look-up table.In sum, this step S110 also promptly pre-determine the diameter, camber, plane length of spun gold and arc length than between relation, this relation is with the form performance of arc length than look-up table.
Step S120, input spun gold diameter.
Current, the spun gold distribution of general same IC chip adopts the spun gold with a kind of diameter parameters, according to the current parameters of chip, can select the spun gold of different-diameter.General electric current is big more, and the spun gold diameter of selection is big more.Simultaneously, in some cases, the spun gold distribution of same IC chip also may adopt two kinds or two or more spun gold diameters, can X root spun gold be first kind of diameter for example, Y root spun gold is second kind of diameter, adopt different spun gold diameter spun gold distributions, though technology is wanted complexity,, under the requirement of satisfying electric current, also can save cost relatively.In this embodiment, encapsulate the spun gold that factory generally provides the different size model usually, when input, also can directly import the specifications and models of spun gold, search spun gold diameter table, can draw the spun gold diameter indirectly by correspondence.If the specifications and models of being imported are not to be included in the spun gold diameter table, spun gold diameter assignment is 0.
Step S130, the input packing forms is to determine camber.
In this step, because the IC Chip Packaging generally comprises the encapsulation of different-thickness, for example, the plastic packaging resinite encapsulation that DIP etc. are thicker, the SOP encapsulation of intermediate gauge, ultrathin plastic-sealed body encapsulation etc.By existing packing forms table, can corresponding search the camber (camber is the vertical range that chip surface is left on the highest top of spun gold) of determining this packing forms.In this embodiment, input packing forms d then represents thicker plastic packaging resinite encapsulation such as DIP, and the spun gold camber is defined as 250 microns; Input packing forms s then represents the encapsulation of SOP thickness, and the spun gold camber is defined as 220 microns; Input packing forms t then represents ultrathin plastic-sealed body encapsulation, and the spun gold camber is defined as 190 microns.
Step S140 selects N root spun gold.
In this embodiment, the spun gold that needs distribution (M-N) root diameter identical (M, N are integer, and M is greater than N) of IC chip is then at first selected a spun gold, begins to calculate its equivalent three-dimensional length computation.In this step, be by in the engineering drawing (for example spun gold wiring diagram of AutoCAD form) of spun gold distribution, selecting.
Step S150 reads N root spun gold plane length.
In this step, directly in the software of opening spun gold distribution engineering drawing, directly read selected N root spun gold plane length by software.The precision of the spun gold length that is read can be selected to determine that for example, it can be 0.1 micron according to the user.
Step S160 searches arc length than look-up table according to parameters such as spun gold diameter, camber, plane length, to obtain the arc length ratio.
In this step, according to parameters such as the determined spun gold diameter of above step, camber, plane length, the arc length that integrating step S110 got is determined the arc length ratio than look-up table from look-up table.This arc length has also reflected the spun gold length that solder joint consumed at spun gold two ends than the crooked radian that has reflected spun gold, camber.
Step S170 calculates the three-dimensional length of this root spun gold equivalence, and N is from adding 1.
In this step, than peaceful face length degree, multiply by arc length than the equivalent three-dimensional length that draws this root spun gold according to arc length with plane length, can calculate the equivalent three-dimensional length of this root spun gold, also be the spun gold length that this root spun gold time institute actual needs of distribution consumes.Simultaneously, N is from adding 1, to prepare the calculating of next root spun gold.
Step S180 judges that whether N is greater than M.
Among this embodiment, represent total radical of spun gold distribution, (M-N) be total radical of the identical spun gold distribution of spun gold diameter with M.If N, then represents the calculating of all distribution spun golds of this spun gold diameter greater than M and finishes, then enters step S190; If N is less than M, the calculating of all distribution spun golds of this spun gold diameter is not finished in expression, then enters step S140, repeats the calculating to next root spun gold.If the diameter of the distribution spun gold of an IC chip is all identical, then represent this IC Chip Packaging to need the identical spun gold of M bar spun gold diameter, N is since 1; N represents that then the calculating of all spun golds of this IC Chip Packaging is finished during greater than M.
Step S190, (M-N) the equivalent three-dimensional length of root spun gold add and.
N is during greater than M, and the equivalent three-dimensional length computation of expression (M-N) root spun gold is finished respectively, the equivalent three-dimensional length value of (M-N) root spun gold is summed up, thereby can draw the quota calculation of all distribution spun golds of this spun gold diameter.
If also comprise the spun gold distribution of other diameter in IC Chip Packaging, then repeat above step S120 to S190, thereby can finish the spun gold quota calculation of every kind of diameter, preferably finished the spun gold quota calculation of an IC Chip Packaging mutually.Need to prove that above computational process can select micron or Mill (mil) to be unit.According to general customer requirement, can be according to above quota calculation result, convert the quota of how much rice/ten thousand to.
Figure 3 shows that another embodiment spun gold quota calculation method flow diagram provided by the invention.In this embodiment, spun gold quota calculation method combination shown in Figure 2 is applied to Application and Development in the AutoCAD software environment.The calculation process method of this embodiment can be passed through Programming with Pascal Language such as AutoLisp, VBA, DCL and form software, and the environment that this software depends on is AutoCADR14 version or the running environment after more highest version starts.Followingly the spun gold quota calculation method of this embodiment is described in detail explanation to each step according to Fig. 2.
Step S110 sets up arc length and compares look-up table.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S111 imports the encapsulation wiring diagram in the AutoCAD software.
Step S112 is arranged on the spun gold of desiring distribution on the same figure layer.
In this step because the encapsulation wiring diagram is after (plane graph) design in AutoCAD software, spun gold sometimes be not design on a figure layer, therefore spun gold need be arranged on the same figure layer, to be suitable for the requirement of quota calculation.Certainly, divide when multiple, can be arranged on the spun gold of every kind of diameter specifications on the same figure layer in the spun gold diameter specifications of same IC chip.
Step S113, input encapsulation wiring diagram scaling.
In this step, generally, the encapsulation wiring diagram is set for 1: 1 scaling, can directly carry out spun gold plane length computation.For in the encapsulation wiring diagram of having finished, check drawing scale, thereby directly import proportional sizes, guarantee that line segment proportionally calculates when calculating, guarantee the accurate of quota.
Step S120, input spun gold diameter.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S130, the input packing forms is to determine camber.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S140 selects N root spun gold.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S141 closes the figure layer outside the figure layer of N root spun gold place.This step is to get ready for next read step.
Step S150 reads N root spun gold plane length.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S160 searches arc length than look-up table according to parameters such as spun gold diameter, camber, plane length, to obtain the arc length ratio.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S170 calculates the three-dimensional length of this root spun gold equivalence, and N is from adding 1.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S180 judges that whether N is greater than M.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S190, (M-N) the equivalent three-dimensional length of root spun gold add and.The detailed process of this step and corresponding steps shown in Figure 2 is basic identical.
Step S191, execution graph layer reposition routine, the variable of untouched assembling line chart also restores.
If also comprise the spun gold distribution of other diameter in IC Chip Packaging, then repeat above step S111 to S191, thereby can finish the spun gold quota calculation of an IC Chip Packaging.
The spun gold quota calculation method of above embodiment is finished according to the encapsulation wiring diagram, avoids by the pre-packaged spun gold quota of carrying out, and the client is offered before being implemented in encapsulation easily.Simultaneously, take into full account factors such as spun gold diameter, packing forms, can in computer, finish automatically, had efficient, accurate, simple to operate, as to be suitable for multi-line section calculating characteristics.Through practical proof, the accuracy of this spun gold quota calculation method can reach more than 3%.
Under situation without departing from the spirit and scope of the present invention, can also constitute many very embodiment of big difference that have.Should be appreciated that except as defined by the appended claims, the invention is not restricted at the specific embodiment described in the specification.
Claims (10)
1. an encapsulation spun gold quota calculation method is characterized in that, may further comprise the steps:
Pre-determine the diameter, camber, plane length of spun gold and arc length than between relation;
Determine the equivalent three-dimensional length of one group of spun gold; And
The equivalent three-dimensional length of described one group of spun gold is determined encapsulation spun gold quota mutually;
Wherein, calculate the equivalent three-dimensional length of each root in described one group of spun gold according to following manner:
Utilize described relation, determine arc according to diameter, the camber peace face length degree of this root spun gold
Long ratio; And
Obtain the equivalent three-dimensional length of this root spun gold than peaceful face length degree according to described arc length.
2. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, described relation is determined by analog computation.
3. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, described relation is determined according to experimental data.
4. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that described relation is represented with the form of look-up table.
5. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, described camber is determined by packing forms.
6. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, described arc length be multiply by the equivalent three-dimensional length that draws this root spun gold mutually than peaceful face length degree.
7. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, when determining described the relation, is the spun gold of certain-length with the pad equivalence at spun gold two ends.
8. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that the precision of described spun gold plane length is 0.1 micron.
9. encapsulation spun gold quota calculation method as claimed in claim 1 is characterized in that, described method realizes in the AutoCAD software environment, and wherein programming language adopts at least a among AutoLisp, VBA, the DCL.
10. encapsulation spun gold quota calculation method as claimed in claim 5 is characterized in that, described packing forms comprises a kind of in DIP encapsulation, SOP encapsulation and the encapsulation of ultrathin plastic-sealed body.
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| CN 200910200938 CN102110622B (en) | 2009-12-25 | 2009-12-25 | Quota calculation method for packaging metal wire |
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| CN117519693A (en) * | 2024-01-02 | 2024-02-06 | 深圳维盛半导体科技有限公司 | 3D conversion method, device, equipment and storage medium for bond wire quota statistics |
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| CN100530578C (en) * | 2005-12-13 | 2009-08-19 | 天水华天科技股份有限公司 | Production of long-lead, low-arc and high-density golden-wire ball welding |
| CN101419926A (en) * | 2008-11-17 | 2009-04-29 | 上海伊诺尔信息技术有限公司 | Welding method for thin type non-contact modular encapsulation |
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| CN117519693A (en) * | 2024-01-02 | 2024-02-06 | 深圳维盛半导体科技有限公司 | 3D conversion method, device, equipment and storage medium for bond wire quota statistics |
| CN117519693B (en) * | 2024-01-02 | 2024-04-02 | 深圳维盛半导体科技有限公司 | 3D conversion method, device, equipment and storage medium for bond wire quota statistics |
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