CN102108536A - Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires - Google Patents
Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires Download PDFInfo
- Publication number
- CN102108536A CN102108536A CN 201010566325 CN201010566325A CN102108536A CN 102108536 A CN102108536 A CN 102108536A CN 201010566325 CN201010566325 CN 201010566325 CN 201010566325 A CN201010566325 A CN 201010566325A CN 102108536 A CN102108536 A CN 102108536A
- Authority
- CN
- China
- Prior art keywords
- steel wire
- controlled
- washing
- scope
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires, which is characterized by comprising the following steps: 1, aligning and feeding wires; 2, washing with acid; 3, washing with water; 4, carrying out electrodeposition pretreatment; 5, washing with water; 6, carrying out electrodeposition posttreatment; 7, washing with water; 8, passivating; and 9, winding and coiling in an inverted mode. The invention has the following advantages: 1, multiple coils of steel wires can be simultaneously fed for electrodeposition, and finally wound, coiled and packaged in an inverted mode, thereby ensuring high production efficiency and convenient transportation and storage; and the copper clad steel wires can be continuously and linearly produced, thereby meeting the requirements for large length; and 2, 6.5-20mm thick copper clad steel wires can be produced, and the size range of the product is wide, thereby ensuring that the product can meet the requirements of grounding wires.
Description
Technical field:
The present invention relates to the production technique of a kind of blister copper Baogang wire rod, especially a kind of grounding wire is with the straight line traction galvanic deposit production technique of blister copper Baogang wire rod.
Background technology:
Ground system is to guarantee the safe operation of power system, electric installation, guarantees the important measures of operations staff and other people member's personnel safety, and along with expanding economy, the safety problem of substation grounding system causes the attention of power industry day by day.Ground net corrosion is the principal element that causes substation to have an accident, the direct relation power grid security.Copper clad steel wire has had both the high-intensity mechanical property of steel and copper electric conductivity height, electrical property and corrosion resistance nature that contact resistance is little on performance, thereby is widely applied in the earth works such as electric power and petrochemical system.
The production method of producing the blister copper steel clad wire at present mainly contains: 1, sleeve pipe coats method and copper strips crimping method, and the copper clad steel wire bimetallic junction that these two kinds of methods are produced is poor with joint efforts, the easy peeling of follow-up screw thread rolling.2, molten copper casting and roll process, this method copper layer and steel core in the coating process are difficult for coaxial, and it is easily dry and cracked that follow-up axial cold-heading adds man-hour, and the equipment complexity, the production cost height.3, rack plating method is placed on the bottom as the anodic copper coin in this method, therefore the easy skewness of copper layer in electrodeposition process, easy peeling during curved twisting or during following process, and this method can only produce the copper clad steel wire of certain-length, need become bale packaging, so production efficiency is low, the transportation cost height.
Summary of the invention:
The objective of the invention is to overcome the weak point in the above-mentioned technology, it is simple to disclose a kind of production unit, the production efficiency height, quality is good, the product size scope is wide, can produce 6.5-20mm blister copper steel clad wire, and especially a kind of grounding wire draws the galvanic deposit production technique with the straight line of blister copper Baogang wire rod.
Technical scheme of the present invention, a kind of grounding wire is characterized in that comprising the following steps: with the straight line traction electrodeposition technology of blister copper Baogang
1, alignment line sending, the steel wire that will handle through descaling is by the alignment wire-sending device;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled in the 180-250g/L scope, and current density is controlled at 10-20A/dm
2In the scope, remove a small amount of residue oxide skin that stays after previous step is handled, and activation steel wire surface;
3, washing is removed the steel wire surface because of the residual acid solution of pickling process;
4, the cyanide copper plating process of preplating is adopted in pre-treatment galvanic deposit herein, and bath temperature is controlled in the 30-45 ℃ of scope, and current density is at 1.2-3.0A/dm
2In the scope, the equidistant steel wire both sides that are positioned over of anode copper coin;
5, washing, residual solution in the step in the removal;
6, thick processing galvanic deposit, the equidistant steel wire both sides that are positioned over of anode copper coin, steel wire by 14 identical plating tanks, are carried out the thick processing galvanic deposit of further vitriol and are produced copper clad steel wire continuously, bath temperature is controlled in the 30-55 ℃ of scope herein, and current density is controlled at 5-30 A/dm
2In the scope;
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled in the 40-70 ℃ of scope;
9, inverted take-up one-tenth dish.
Preferably, the diameter range of the steel wire of described process descaling processing is 6.5mm-20mm.
Advantage of the present invention is as follows:
1, polydisc steel wire line sending simultaneously galvanic deposit, last inverted take-up one-tenth dish packing, so production efficiency height, transportation, convenient storage; The continuous straight line production of copper clad steel wire is so can satisfy the length requirement.
2, as the equidistant steel wire both sides that are positioned over of anodic copper coin, the steel wire level is at the uniform velocity by 14 plating tanks, therefore, the concentration of control galvanic deposit master salt, cathode current density and Trace speed can prepare the copper clad steel wire of copper layer thickness 〉=0.25mm, and the copper layer are evenly distributed, firm binding force, the crooked and several of reeling does not have peeling and peels off; Can prepare the thick copper clad steel wire of 6.5-20mm, the product size scope is wide, can reach grounding wire with requiring.
Embodiment:
Below by embodiment, technical scheme of the present invention is described in further detail.
Embodiment 1
1, alignment line sending, the diameter that will handle through descaling for the 6.5mm steel wire by the alignment wire-sending device;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled at 180g/L, and current density is controlled at 10A/dm
2, remove a small amount of residue oxide skin that stays after previous step is handled, and activation steel wire surface;
3, washing is removed the steel wire surface because of the residual acid solution of pickling process;
4, the cyanide copper plating process of preplating is adopted in pre-treatment galvanic deposit herein, and bath temperature is controlled at 30 ℃, and current density is at 1.2A/dm
2, the equidistant steel wire both sides that are positioned over of anode copper coin;
5, washing, residual solution in the step in the removal;
6, thick processing galvanic deposit, the equidistant steel wire both sides that are positioned over of anode copper coin, steel wire by 14 identical plating tanks, are carried out the thick processing galvanic deposit of further vitriol and are produced copper clad steel wire continuously, bath temperature is controlled at 30 ℃ herein, and current density is controlled at 5 A/dm
2
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 40 ℃;
9, inverted take-up one-tenth dish.
Embodiment 2
1, alignment line sending, the diameter that will handle through descaling for the 12mm steel wire by the alignment wire-sending device;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled at 220g/L, and current density is controlled at 15A/dm
2, remove a small amount of residue oxide skin that stays after previous step is handled, and activation steel wire surface;
3, washing is removed the steel wire surface because of the residual acid solution of pickling process;
4, the cyanide copper plating process of preplating is adopted in pre-treatment galvanic deposit herein, and bath temperature is controlled at 40 ℃, and current density is at 2.0A/dm
2, the equidistant steel wire both sides that are positioned over of anode copper coin;
5, washing, residual solution in the step in the removal;
6, thick processing galvanic deposit, the equidistant steel wire both sides that are positioned over of anode copper coin, steel wire by 14 identical plating tanks, are carried out the thick processing galvanic deposit of further vitriol and are produced copper clad steel wire continuously, bath temperature is controlled at 45 ℃ herein, and current density is controlled at 20 A/dm
2
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 55 ℃;
9, inverted take-up one-tenth dish.
Embodiment 3
1, alignment line sending, the diameter that will handle through descaling for the 20mm steel wire by the alignment wire-sending device;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled at 250g/L, and current density is controlled at 20A/dm
2, remove a small amount of residue oxide skin that stays after previous step is handled, and activation steel wire surface;
3, washing is removed the steel wire surface because of the residual acid solution of pickling process;
4, the cyanide copper plating process of preplating is adopted in pre-treatment galvanic deposit herein, and bath temperature is controlled at 45 ℃, and current density is at 3.0A/dm
2, the equidistant steel wire both sides that are positioned over of anode copper coin;
5, washing, residual solution in the step in the removal;
6, thick processing galvanic deposit, the equidistant steel wire both sides that are positioned over of anode copper coin, steel wire by 14 identical plating tanks, are carried out the thick processing galvanic deposit of further vitriol and are produced copper clad steel wire continuously, bath temperature is controlled at 55 ℃ herein, and current density is controlled at 30 A/dm
2
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 70 ℃;
9, inverted take-up one-tenth dish.
Also the steel wire diameter of handling through descaling among the embodiment 1,2,3 can be replaced with the arbitrary value in the 6.5mm-20mm scope.
Specific embodiment described herein only is that the present invention is illustrated.The technician of the technical field of the invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Claims (2)
1. a grounding wire uses the straight line of blister copper Baogang to draw electrodeposition technology, it is characterized in that comprising the following steps:
One, alignment line sending, the steel wire that will handle through descaling is by the alignment wire-sending device;
Two, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled in the 180-250g/L scope, and current density is controlled in 10-20A/dm 2 scopes, removes a small amount of residue oxide skin that stays after previous step is handled, and activation steel wire surface;
Three, washing is removed the steel wire surface because of the residual acid solution of pickling process;
Four, the cyanide copper plating process of preplating is adopted in pre-treatment galvanic deposit herein, and bath temperature is controlled in the 30-45 ℃ of scope, current density in the 1.2-3.0A/dm2 scope, the equidistant steel wire both sides that are positioned over of anode copper coin;
Five, washing, residual solution in the step in the removal;
Six, thick processing galvanic deposit, the equidistant steel wire both sides that are positioned over of anode copper coin, steel wire is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce copper clad steel wire, bath temperature is controlled in the 30-55 ℃ of scope herein, and current density is controlled in the 5-30 A/dm2 scope;
Seven, washing, the electrodeposit liquid of removal remained on surface;
Eight, thermal inactivation is adopted in passivation, and temperature is controlled in the 40-70 ℃ of scope;
Nine, inverted take-up one-tenth dish.
2. a kind of grounding wire according to claim 1 is characterized in that with the straight line traction electrodeposition technology of blister copper Baogang the diameter range of the steel wire that described process descaling is handled is 6.5mm-20mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010566325 CN102108536A (en) | 2010-11-30 | 2010-11-30 | Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010566325 CN102108536A (en) | 2010-11-30 | 2010-11-30 | Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102108536A true CN102108536A (en) | 2011-06-29 |
Family
ID=44172820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201010566325 Pending CN102108536A (en) | 2010-11-30 | 2010-11-30 | Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102108536A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109402681A (en) * | 2018-10-08 | 2019-03-01 | 湖北捷地安电气有限公司 | A kind of highly conductive multilayer materials of tight type |
CN111519224A (en) * | 2020-06-01 | 2020-08-11 | 合肥浩凌机械设计制造有限公司 | Post-processing method for electroplating molding in copper-clad wire manufacturing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5871391A (en) * | 1981-10-21 | 1983-04-28 | Kobe Steel Ltd | Method for electroplating steel wire for welding in copper sulfate bath |
CN2157838Y (en) * | 1993-06-30 | 1994-03-02 | 西安拉拔设备辅机厂 | Wire-winding up machine |
US20040247865A1 (en) * | 2001-07-27 | 2004-12-09 | Federico Pavan | Electrolytic process for depositing a layer of copper on a steel wire |
CN1913046A (en) * | 2006-08-03 | 2007-02-14 | 仲庆 | Preparation method of copper covered steel woven wire special for communication cable shielding layer |
CN201082905Y (en) * | 2007-07-09 | 2008-07-09 | 唐文玺 | Wire electric plating machine |
CN101303923A (en) * | 2008-07-07 | 2008-11-12 | 张荣良 | Technique for producing high-strength copper covered steel conductor for coaxial cable inner core wire |
-
2010
- 2010-11-30 CN CN 201010566325 patent/CN102108536A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5871391A (en) * | 1981-10-21 | 1983-04-28 | Kobe Steel Ltd | Method for electroplating steel wire for welding in copper sulfate bath |
CN2157838Y (en) * | 1993-06-30 | 1994-03-02 | 西安拉拔设备辅机厂 | Wire-winding up machine |
US20040247865A1 (en) * | 2001-07-27 | 2004-12-09 | Federico Pavan | Electrolytic process for depositing a layer of copper on a steel wire |
CN1913046A (en) * | 2006-08-03 | 2007-02-14 | 仲庆 | Preparation method of copper covered steel woven wire special for communication cable shielding layer |
CN201082905Y (en) * | 2007-07-09 | 2008-07-09 | 唐文玺 | Wire electric plating machine |
CN101303923A (en) * | 2008-07-07 | 2008-11-12 | 张荣良 | Technique for producing high-strength copper covered steel conductor for coaxial cable inner core wire |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109402681A (en) * | 2018-10-08 | 2019-03-01 | 湖北捷地安电气有限公司 | A kind of highly conductive multilayer materials of tight type |
CN111519224A (en) * | 2020-06-01 | 2020-08-11 | 合肥浩凌机械设计制造有限公司 | Post-processing method for electroplating molding in copper-clad wire manufacturing |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3684966B1 (en) | Method of producing an electrocatalyst | |
CN102059637A (en) | Mechanical steel wire scale removing method | |
CN102586838A (en) | On-line low temperature electrolysis phosphating method for steel wires | |
CN103325439A (en) | Tin-plated copper-coated brass wire and production method thereof and tin plating device | |
CN102108536A (en) | Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires | |
JPH0255516B2 (en) | ||
CN1230575C (en) | Continuous nickel plating process for stainless steel wire | |
JPH0214020A (en) | Metal fiber obtained by drawing metal bundle | |
CN104087993A (en) | Linear traction electro-deposition production technology for large-scale copper-clad steel wire rod used for grounding wire | |
CN103361663A (en) | Ultrasonic descaling method of steel wires | |
CN103628122A (en) | Coppered wire stripping and hanging process | |
CN102108535A (en) | Electrodeposition production technology for copper clad steel flat strip | |
CN104217820A (en) | Production and deep processing process of high-carbon steel strand | |
CN101307454A (en) | Production process of acid salt cyanideless electro-plating copper dural alclad magnesium alloy wire | |
CN103531302A (en) | Process for producing hard-state copper clad steel conductor by adopting welding cladding method | |
CN107604406A (en) | A kind of electroplating technology of high rigidity bolt | |
NL8205054A (en) | SOLDERED WIRE WITH NICKEL AND TIN LAYER. | |
WO2014132734A1 (en) | Surface-treated steel sheet manufacturing method | |
CN103177818A (en) | Production process of copper plating wire | |
CN203128675U (en) | Cathode plate for electrolytic copper powder | |
CN104630859A (en) | Continuous production technology of steel-core copper-coated wire under high current density | |
CN2196128Y (en) | Highly efficient multiple wire electroplating machine | |
CN102618901B (en) | With binding unit and the manufacture method thereof of zincium-rare earth coating | |
EP3093376B1 (en) | Process for continuous electrochemical tinning of an aluminium wire | |
TWI640652B (en) | Process for producing a wire made of a first metal and having a sheath layer made of a second metal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110629 |