CN102108535A - Electrodeposition production technology for copper clad steel flat strip - Google Patents
Electrodeposition production technology for copper clad steel flat strip Download PDFInfo
- Publication number
- CN102108535A CN102108535A CN 201010566324 CN201010566324A CN102108535A CN 102108535 A CN102108535 A CN 102108535A CN 201010566324 CN201010566324 CN 201010566324 CN 201010566324 A CN201010566324 A CN 201010566324A CN 102108535 A CN102108535 A CN 102108535A
- Authority
- CN
- China
- Prior art keywords
- copper
- bandlet
- steel bandlet
- steel
- controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides an electrodeposition production technology for copper clad steel flat strip, which is characterized by comprising the following steps: (1) straightening and feeding; (2) pickling; (3) washing; (4) preprocessing electrodeposition; (5) washing; (6) postprocessing electrodeposition; (7) washing; (8) passivating; and (9) inverted type coiling. The invention has the following advantages: (1) multiple discs of copper clad steel flat strips can be fed for production simultaneously and inverted to be coiled and packaged, so that the production efficiency is high and both the transportation and the storage are convenient; and copper clad steel flat strips can be continuously and linearly produced, so that the requirements for great length can be met; (2) copper elements serving as anodes are placed in parallel on double sides of the steel flat strip at equal intervals, and the steel flat strips horizontally pass through fourteen plating tanks, so that the distribution of copper layers is uniform, and copper clad steel flat strips in which the copper layers have different thickness can be produced by controlling the concentration of main salt, current density and discharging speed.
Description
Technical field:
The present invention relates to a kind of production technique of copper sheathed steel bandlet, especially a kind of galvanic deposit production technique of copper sheathed steel bandlet.
Background technology:
Copper sheathed steel has had both the high-intensity mechanical property of steel and copper electric conductivity height, electrical property and corrosion resistance nature that contact resistance is little on performance, thereby replace traditional shaped steel or zinc-plated round steel as lighting proof strip with copper sheathed steel circle line and bandlet, conductivity and bleed off ability have not only been improved, and it is handsome in appearance, shelf time is long, has saved the upkeep cost of engineering; Be widely used at present in the earth work, adopted by each design institute and engineering construction unit gradually.
The production method of copper sheathed steel bandlet mainly is that oxygen free copper soaks casting at present, and the copper sheathed steel bandlet that this method is produced forms metallurgical binding between copper and the steel, can be combined into one securely; Be more advanced technology during present copper sheathed steel bandlet is made.But this method is because copper layer thickness is influenced by temperature of steel strips, copper liquid temperature, liquid level etc., and complex process is changed the specification difficulty; Its production unit and technology have only a few countries comparative maturities such as Japan, Korea S, the U.S..Soak casting production unit and the technology of China mainly rely on import, cause facility investment big, the cost height.
Summary of the invention:
The object of the present invention is to provide a kind of simple to operately, cost of equipment is low, production efficiency height, the production technique of the copper sheathed steel bandlet of good product quality.
Technical scheme of the present invention, a kind of galvanic deposit production technique of copper sheathed steel bandlet is characterized in that comprising the following steps:
1, alignment line sending will be through the steel bandlet alignment of deoxidation layer processing, vertical unwrapping wire;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled in the 200-250g/L scope, and current density is controlled at 15-25A/dm
2In the scope, remove the remaining oxide skin that stays after the previous step, and activation steel bandlet surface;
3, washing is removed steel bandlet surface because of the residual acid solution of pickling process;
4, pre-treatment galvanic deposit, the cyanide copper plating process of employing preplating, bath temperature is controlled in the 30-45 ℃ of scope, and current density is at 1.5-3.5A/dm
2In the scope, the steel bandlet is vertically by galvanic deposition cell, and anode copper coin parallel equidistant generates the steel bandlet with copper coating from being positioned over steel bandlet both sides;
5, washing, residual solution during the removal previous step is rapid;
6, thick processing galvanic deposit, the steel bandlet vertically passes through galvanic deposition cell, anode copper coin parallel equidistant is from being positioned over steel bandlet both sides, the steel bandlet is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce the copper sheathed steel bandlet, bath temperature is controlled in the 30-55 ℃ of scope herein, and current density is controlled at 5-30A/dm
2In the scope; By the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness;
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled in the 40-70 ℃ of scope;
9, inverted take-up one-tenth dish.
Preferably, the specification of the steel bandlet of described process deoxidation layer processing is 80mmX6mm.
Advantage of the present invention is as follows:
1, polydisc copper sheathed steel bandlet line sending simultaneously production, last inverted take-up one-tenth dish packing, so production efficiency height, transportation, convenient storage; The continuous straight line production of copper sheathed steel bandlet is so can satisfy the length demand.
2, as anodic copper coin parallel equidistant from being positioned over steel bandlet both sides, steel bandlet level is at the uniform velocity by 14 plating tanks, so copper plate is evenly distributed, by the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness.
Embodiment:
Below by embodiment, technical scheme of the present invention is described in further detail.
Embodiment 1
1, alignment line sending will be through the 80mmX6mm steel bandlet alignment of deoxidation layer processing, vertical unwrapping wire;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled at 200g/L, and current density is controlled at 15A/dm
2, remove the remaining oxide skin that stays after the previous step, and activation steel bandlet surface;
3, washing is removed steel bandlet surface because of the residual acid solution of pickling process;
4, pre-treatment galvanic deposit, the cyanide copper plating process of employing preplating, bath temperature is controlled at 30 ℃, and current density is at 1.5A/dm
2, the steel bandlet is vertically by galvanic deposition cell, and anode copper coin parallel equidistant generates the steel bandlet with copper coating from being positioned over steel bandlet both sides;
5, washing, residual solution during the removal previous step is rapid;
6, thick processing galvanic deposit, the steel bandlet vertically passes through galvanic deposition cell, anode copper coin parallel equidistant is from being positioned over steel bandlet both sides, the steel bandlet is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce the copper sheathed steel bandlet, bath temperature is controlled at 30 ℃ herein, and current density is controlled at 5A/dm
2By the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness;
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 40 ℃;
9, inverted take-up one-tenth dish.
Embodiment 2
1, alignment line sending will be through the 80mmX6mm steel bandlet alignment of deoxidation layer processing, vertical unwrapping wire;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulphuric acid soln is controlled at 230g/L, and current density is controlled at 20A/dm
2, remove the remaining oxide skin that stays after the previous step, and activation steel bandlet surface;
3, washing is removed steel bandlet surface because of the residual acid solution of pickling process;
4, pre-treatment galvanic deposit, the cyanide copper plating process of employing preplating, bath temperature is controlled at 40 ℃, and current density is at 2.5A/dm
2, the steel bandlet is vertically by galvanic deposition cell, and anode copper coin parallel equidistant generates the steel bandlet with copper coating from being positioned over steel bandlet both sides;
5, washing, residual solution during the removal previous step is rapid;
6, thick processing galvanic deposit, the steel bandlet vertically passes through galvanic deposition cell, anode copper coin parallel equidistant is from being positioned over steel bandlet both sides, the steel bandlet is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce the copper sheathed steel bandlet, bath temperature is controlled at 45 ℃ herein, and current density is 20A/dm
2By the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness;
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 55 ℃;
9, inverted take-up one-tenth dish.
Embodiment 3
1, alignment line sending will be through the 80mmX6mm steel bandlet alignment of deoxidation layer processing, vertical unwrapping wire;
2, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled in the 250g/L scope, and current density is controlled at 25A/dm
2In the scope, remove the remaining oxide skin that stays after the previous step, and activation steel bandlet surface;
3, washing is removed steel bandlet surface because of the residual acid solution of pickling process;
4, pre-treatment galvanic deposit, the cyanide copper plating process of employing preplating, bath temperature is controlled in 45 ℃ of scopes, and current density is at 3.5A/dm
2, the steel bandlet is vertically by galvanic deposition cell, and anode copper coin parallel equidistant generates the steel bandlet with copper coating from being positioned over steel bandlet both sides;
5, washing, residual solution during the removal previous step is rapid;
6, thick processing galvanic deposit, the steel bandlet vertically passes through galvanic deposition cell, anode copper coin parallel equidistant is from being positioned over steel bandlet both sides, the steel bandlet is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce the copper sheathed steel bandlet, bath temperature is controlled at 55 ℃ herein, and current density is controlled at 30A/dm
2By the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness;
7, washing, the electrodeposit liquid of removal remained on surface;
8, thermal inactivation is adopted in passivation, and temperature is controlled at 70 ℃;
9, inverted take-up one-tenth dish.
Specific embodiment described herein only is that the present invention is illustrated.The technician of the technical field of the invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Claims (2)
1. the galvanic deposit production technique of a copper sheathed steel bandlet is characterized in that comprising the following steps:
One, alignment line sending will be through the steel bandlet alignment of deoxidation layer processing, vertical unwrapping wire;
Two, sulphuric acid soln acid electrolysis is adopted in pickling, and sulfuric acid concentration is controlled in the 200-250g/L scope, and current density is controlled at 15-25A/dm
2In the scope, remove the remaining oxide skin that stays after the previous step, and activation steel bandlet surface;
Three, washing is removed steel bandlet surface because of the residual acid solution of pickling process;
Four, pre-treatment galvanic deposit, the cyanide copper plating process of employing preplating, bath temperature is controlled in the 30-45 ℃ of scope, and current density is at 1.5-3.5A/dm
2In the scope, the steel bandlet is vertically by galvanic deposition cell, and anode copper coin parallel equidistant generates the steel bandlet with copper coating from being positioned over steel bandlet both sides;
Five, washing, residual solution during the removal previous step is rapid;
Six, thick processing galvanic deposit, the steel bandlet vertically passes through galvanic deposition cell, anode copper coin parallel equidistant is from being positioned over steel bandlet both sides, the steel bandlet is continuously by 14 identical plating tanks, carry out the thick processing galvanic deposit of further vitriol and produce the copper sheathed steel bandlet, bath temperature is controlled in the 30-55 ℃ of scope herein, and current density is controlled at 5-30A/dm
2In the scope; By the control main salt concentration, current density and payingoff speed can prepare the copper sheathed steel bandlet of different Cu layer thickness;
Seven, washing, the electrodeposit liquid of removal remained on surface;
Eight, thermal inactivation is adopted in passivation, and temperature is controlled in the 40-70 ℃ of scope;
Nine, inverted take-up one-tenth dish.
2. the galvanic deposit production technique of a kind of copper sheathed steel bandlet according to claim 1 is characterized in that, the specification of the steel bandlet that described process deoxidation layer is handled is 80mmX6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010566324 CN102108535A (en) | 2010-11-30 | 2010-11-30 | Electrodeposition production technology for copper clad steel flat strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010566324 CN102108535A (en) | 2010-11-30 | 2010-11-30 | Electrodeposition production technology for copper clad steel flat strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102108535A true CN102108535A (en) | 2011-06-29 |
Family
ID=44172819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010566324 Pending CN102108535A (en) | 2010-11-30 | 2010-11-30 | Electrodeposition production technology for copper clad steel flat strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102108535A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104087994A (en) * | 2014-06-30 | 2014-10-08 | 江西百川电导体有限公司 | Method for preparing copper-clad steel bandlet by electrodeposition |
| CN109402681A (en) * | 2018-10-08 | 2019-03-01 | 湖北捷地安电气有限公司 | A kind of highly conductive multilayer materials of tight type |
| CN109440130A (en) * | 2018-11-29 | 2019-03-08 | 山东大学 | A kind of large-sized nanoporous BiVO4 light anode and the preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913046A (en) * | 2006-08-03 | 2007-02-14 | 仲庆 | Preparation method of copper covered steel woven wire special for communication cable shielding layer |
| CN101303923A (en) * | 2008-07-07 | 2008-11-12 | 张荣良 | Technique for producing high-strength copper covered steel conductor for coaxial cable inner core wire |
-
2010
- 2010-11-30 CN CN 201010566324 patent/CN102108535A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913046A (en) * | 2006-08-03 | 2007-02-14 | 仲庆 | Preparation method of copper covered steel woven wire special for communication cable shielding layer |
| CN101303923A (en) * | 2008-07-07 | 2008-11-12 | 张荣良 | Technique for producing high-strength copper covered steel conductor for coaxial cable inner core wire |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104087994A (en) * | 2014-06-30 | 2014-10-08 | 江西百川电导体有限公司 | Method for preparing copper-clad steel bandlet by electrodeposition |
| CN109402681A (en) * | 2018-10-08 | 2019-03-01 | 湖北捷地安电气有限公司 | A kind of highly conductive multilayer materials of tight type |
| CN109440130A (en) * | 2018-11-29 | 2019-03-08 | 山东大学 | A kind of large-sized nanoporous BiVO4 light anode and the preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9157165B2 (en) | Method of production of chemically treated steel sheet | |
| CN103603022B (en) | Steel Wire Heat Treatment electrolytic phosphating tinuous production equipment and technique | |
| CN102108535A (en) | Electrodeposition production technology for copper clad steel flat strip | |
| CN104195607A (en) | Manufacturing method of tin-copper double-layer electroplated steel plates | |
| CN109056016A (en) | Electroplating double-layer zinc technology | |
| EP0337517B1 (en) | Metal fibers obtained by bundled drawing | |
| JP4948654B2 (en) | Copper foil for negative electrode current collector of lithium ion secondary battery, manufacturing method thereof, negative electrode of lithium ion secondary battery, manufacturing method thereof | |
| CN103628122A (en) | Coppered wire stripping and hanging process | |
| CN114207191A (en) | Method and device for electrolytically coating steel strip by means of pulse technique | |
| CN205443463U (en) | Steel wire ladder pickling tooling | |
| JP5812041B2 (en) | Method for producing zinc-based electroplated steel sheet | |
| CN102324276A (en) | Production process of copper coated aluminum-magnesium bimetallic conductor | |
| CN102108536A (en) | Linear traction and electrodeposition production process of thick copper clad steel wires for grounding wires | |
| JP6081224B2 (en) | Manufacturing method of surface-treated steel sheet | |
| CN209836332U (en) | Zinc-coated steel electrodeposition production equipment for cable self-supporting wire | |
| CN104087994A (en) | Method for preparing copper-clad steel bandlet by electrodeposition | |
| CN107170527A (en) | A kind of compressor electric motor copper-clad aluminum conductor processing technology | |
| CN201678756U (en) | Insoluble anode structure | |
| CN104087993A (en) | Linear traction electro-deposition production technology for large-scale copper-clad steel wire rod used for grounding wire | |
| Brown | Electroplating with non-aqueous solutions | |
| CN110735158A (en) | Electroplating method | |
| CN210856398U (en) | Anode conductive round hole plate | |
| CN104630859A (en) | Continuous production technology of steel-core copper-coated wire under high current density | |
| CN215586970U (en) | Salt-fog-resistant alloy wire spraying device | |
| CN201793786U (en) | Solution tank device in surface treatment system of copper foil |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110629 |