CN102097332A - Conduction hole structure of encapsulation substrate and manufacturing method thereof - Google Patents
Conduction hole structure of encapsulation substrate and manufacturing method thereof Download PDFInfo
- Publication number
- CN102097332A CN102097332A CN 200910201111 CN200910201111A CN102097332A CN 102097332 A CN102097332 A CN 102097332A CN 200910201111 CN200910201111 CN 200910201111 CN 200910201111 A CN200910201111 A CN 200910201111A CN 102097332 A CN102097332 A CN 102097332A
- Authority
- CN
- China
- Prior art keywords
- packaging
- base plate
- manhole
- hole
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a conduction hole structure of an encapsulation substrate and a manufacturing method thereof. Multiple mutually separated conductive paths are provided in the same circular through hole of the encapsulation substrate by the steps of circular drilling, hole plating and noncircular drilling in turn, so the total number of the through hole of the encapsulation substrate and the substrate area occupied by the through hole can be reduced to improve the circuit layout density of the encapsulation substrate by using the saved substrate area; and the manufacturing method is favorable for simplifying and accelerating the manufacturing flow of the high wiring density type encapsulation substrate so as to improve the production efficiency.
Description
[technical field]
The invention relates to a kind of through-hole structure and manufacture method thereof of base plate for packaging, particularly in the same manhole of base plate for packaging, form the through-hole structure of many conductive paths that are separated from each other and the manufacture method of described through-hole structure relevant for a kind of step by circular bore, plating hole and non-annular borehole in regular turn.
[background technology]
Now, the semiconductor packages industry is in order to satisfy the demand of various high-density packages, develop the packaging structure that various different types gradually, wherein many packaging structure kinds, for example ball grid array packaging structure (ballgrid array, BGA), the pin array packaging structure (pin grid array, PGA) or crosspoint array packaging structure (land grid array, LGA) etc., all be to be that encapsulation architecture is carried out on the basis with base plate for packaging (substrate).In above-mentioned packaging structure, a upper surface of described substrate carries at least one chip, and several connection pads of chip is electrically connected to several weld pads of the upper surface of described substrate by routing (wire bonding) or projection (bumping) manufacture process.Simultaneously, a lower surface of described substrate also must provide a large amount of weld pads, to weld several outputs.Described substrate can be the printed circuit board (PCB) of single or multiple lift, it is except providing surface lines (trace) layer to form the required weld pad on upper and lower surface, its inside also has at least one layer within the circuit and several micropores (via) or plated-through-hole (plating through hole, via structure such as PTH) is with the annexation of the weld pad of rearranging upper and lower surface.
Via on the general base plate for packaging comprises types such as blind hole, buried via hole and through hole.The way of tradition via is to use machine drilling or laser (laser) boring to manufacture.With machine drilling is example, and it uses the drill point of a high speed rotating to bore whole base plate, to form through hole.Because the rotation of drill point, therefore the through hole that is produced is all circle.Then, by in manhole, electroplating the layer of copper layer, to form via.So, the purpose that can realize utilizing via that the circuit of the different line layers of substrate is linked.
Moreover, in order to satisfy to the base plate for packaging configuration demand of densification day by day, industry has been developed the method that realizes many conductive paths in a via, and it is mainly by separating the conductive layer in the via, so that it can link different circuits respectively.Please refer to shown in Figure 1A, 1B and the 1C, it discloses the manufacture process schematic diagram that existing base plate for packaging forms through-hole structure, and its manufacture process comprises the following step: a base plate for packaging 1 is provided; Use machine drilling or laser drill on described base plate for packaging 1, to form at least one through hole 11; Utilize the inwall of electroplating at described through hole 11 to electroplate last layer conductive layer 12, for example copper layer; By several section parts of the described conductive layer 12 of laser ablation, several conductive paths 121 that its remaining section partly formed be separated from each other; And, described base plate for packaging 1 is carried out the patterning of surface metal-layer, to form a surface lines 13.
Yet, the above-mentioned manufacture process of many conductive paths 121 that realizes in same through hole 11 still has following problems on reality is used, for example: because board only possesses single laser aid usually, and laser aid all need carry out four processing to each through hole 11, thereby make laser aid expend a lot of process time when processing each through hole 11 in regular turn, not only make it make comparatively very complicated of flow process, also be unfavorable for promoting process velocity.Moreover, during several section parts by the described conductive layer 12 of laser ablation, if the aperture of the not good or described through hole 11 of laser incident angle is too small, its section that all may cause desire to be removed is partly removed not exclusively, also will cause the yields (yield) of described base plate for packaging 1 processing to reduce simultaneously.
Die, be necessary to provide a kind of through-hole structure and manufacture method thereof of base plate for packaging, to solve the existing in prior technology problem.
[summary of the invention]
Main purpose of the present invention is to provide a kind of through-hole structure and manufacture method thereof of base plate for packaging, it provides many conductive paths that are separated from each other by the step of circular bore, plating hole and non-annular borehole in regular turn in the same manhole of base plate for packaging, thereby help simplifying and quickening the making flow process of high wiring density base plate for packaging, to improve its production efficiency.
Secondary objective of the present invention is to provide a kind of through-hole structure and manufacture method thereof of base plate for packaging, wherein have many conductive paths that are separated from each other in each manhole of base plate for packaging, thereby help reducing the via total quantity of base plate for packaging and the substrate area that takies thereof, so that the substrate area of saving is used to improve the configuration density of base plate for packaging.
Another object of the present invention is to provide a kind of through-hole structure and manufacture method thereof of base plate for packaging, it provides many conductive paths that are separated from each other by circular bore, plating hole, non-annular borehole and the step of plating the hole once more in regular turn in the same manhole of base plate for packaging, punching die coefficient of losses when the processing mode that wherein plates for the second time the hole helps reducing non-annular borehole relatively, and reduce punching burr problem, be beneficial to improve the conductive path yields.
For reaching aforementioned purpose of the present invention, the invention provides a kind of manufacture method of through-hole structure of base plate for packaging, it is characterized in that: described manufacture method comprises step: a base plate for packaging is provided; On described base plate for packaging, form at least one manhole; The corresponding circular conductive part that forms in described manhole; And, utilize a punching die with noncircular cross section to come the described substrate of punching press to form a non-circular through hole, described non-circular through hole is slit at least two remainders that are separated from each other and forms at least two conductive paths corresponding to described manhole and with the described circular current-carrying part of described manhole inside.
In one embodiment of this invention, when forming described manhole, select to utilize a drill point or a laser aid to form described manhole.
In one embodiment of this invention, when forming described circular conductive part, select to utilize plating or electroless-plating mode to form described circular conductive part, wherein said circular conductive part is selected only to be formed on the inwall of described manhole or is filled up described manhole, and promptly described circular conductive part is the circular conductive pole that a metal level or that is attached to the inwall of described manhole fills up described manhole.
In one embodiment of this invention, when forming described circular conductive part, select to utilize mode of printing to form described circular conductive part, wherein said circular conductive part fills up described manhole.
In one embodiment of this invention, when forming described non-circular through hole, utilize a punching die with noncircular cross section to form described non-circular through hole.
In one embodiment of this invention, the shape of the noncircular cross section of described punching die is selected from cross, M shape, rectangle, triangle, square, star, flower shape or ellipse.
In one embodiment of this invention, after forming described conductive path, other comprises: described conductive path is further thickened processing.
It is in one embodiment of this invention, described that to thicken processing be select to use to electroplate or the technology of electroless-plating.
In one embodiment of this invention, after forming described conductive path, other comprises: at least one surface at described base plate for packaging forms at least one surface lines layer.
Moreover, the invention provides the through-hole structure of another kind of base plate for packaging, it is characterized in that: described through-hole structure comprises: a manhole is formed on the base plate for packaging; At least two separating tanks, it is separated from each other and is arranged with around the internal face that is formed on described manhole along the direction vertical with base plan; And at least two conductive paths are respectively formed on the internal face of the described manhole between each two adjacent described separating tank.
In one embodiment of this invention, described at least two conductive paths are to be attached to the metal level of inwall of described manhole or the bonding jumper that extends to the through hole center along the inwall of described manhole.
In one embodiment of this invention, described conductive path comprises a thickened section in addition.
[description of drawings]
Figure 1A, 1B and 1C are the schematic diagrames that an existing base plate for packaging forms the manufacture process of through-hole structure.
Fig. 2 A, 2B, 2C and 2D are the through-hole structure of first embodiment of the invention base plate for packaging and the schematic diagram of manufacture method thereof.
Fig. 3 A, 3B, 3C, 3D and 3E are the through-hole structure of second embodiment of the invention base plate for packaging and the schematic diagram of manufacture method thereof.
Fig. 4 A, 4B, 4C, 4D, 4E, 4F and 4G are the schematic diagrames of the through-hole structure of other embodiments of the invention base plate for packaging.
[embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and conjunction with figs. are described in detail below:
Please refer to shown in Fig. 2 A to 2C, it is the various packaging structures that the basis encapsulates that the base plate for packaging of first embodiment of the invention (substrate) can be applicable to the substrate, ball grid array packaging structure (ballgrid array for example, BGA), pin array packaging structure (pin grid array, PGA) or crosspoint array packaging structure (land grid array, but be not limited to this LGA) etc..The manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention mainly comprises: a base plate for packaging 2 is provided; On described base plate for packaging 2, form at least one manhole 21; The corresponding circular conductive part 22 that forms in described manhole 21; And, utilize a punching die 3 with noncircular cross section to come the described base plate for packaging of punching press 2 to form a non-circular through hole 23, described non-circular through hole 23 is divided at least two remainders that are separated from each other and forms at least two conductive paths 221 corresponding to described manhole 21 and with the described circular conductive part 22 of described manhole 21 inside.
Please refer to shown in Fig. 2 A, the manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention at first provides a base plate for packaging 2, wherein said base plate for packaging 2 can refer to the finished product or the semi-finished product of the printed circuit board (PCB) of single or multiple lift, if semi-finished product, after utilizing the inventive method to manufacture to finish through-hole structure, then can further increase layer again and form a multilayer board.Therefore, later use the inventive method is manufactured the upper and lower surface of the whole perforation printed circuit board (PCB) of finishing of through-hole structure possibility or is only run through between some layer of its inside, to select to electrically connect at least two layers circuit of printed circuit board (PCB).Moreover, described base plate for packaging 2 utilize subsequent step first being processed of the present invention thereon lower surface be pre-formed the not metal forming of patterning, Copper Foil etc. for example, but be not limited to this metal material.In some cases, described base plate for packaging 2 also may be the surface lines layer (not illustrating) that has been pre-formed patterning when this step.
Please refer to shown in Fig. 2 A, the manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention then forms at least one manhole 21 on described base plate for packaging 2, wherein the present invention can select to utilize a drill point to carry out machine drilling or utilize a laser (laser) device to carry out laser drill, to form described manhole 21.In addition, also may use the punching die (punch mold) of a circular cross-section to carry out punching press boring.In the present embodiment, the shape of described manhole 21 is meant utilizes machine drilling, laser drill or punching press boring to form, and suitable aperture of tool and approaching orbicular hole shape on geometry.After utilizing drill point, laser aid or punching die processing, described manhole 21 will connect the upper and lower surface of whole base plate for packaging 2.
Please refer to shown in Fig. 2 A, the manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention is the corresponding circular conductive part 22 that forms in described manhole 21 then.In the present embodiment, the present invention can select to utilize plating (electroplating), electroless-plating (electroless plating) or printing (printing) mode to form described circular conductive part.When using plating or electroless-plating mode, described circular conductive part 22 can be selected only to be formed on the inwall of described manhole 21 or fill up whole described manhole 21, and promptly described circular conductive part 22 is the circular conductive pole that a metal level or that is attached to the inwall of described manhole 21 fills up described manhole 21; Just described circular conductive part 22 can be hollow circular conductive part or solid circles conductive part.Perhaps, when using mode of printing, described circular conductive part 22 fills up whole described manhole 21, and just described circular conductive part 22 is solid circles conductive poles.In the present invention, the shape of described circular conductive part 22 for example is the positive tubular of hollow or solid right cylindrical roughly corresponding to described manhole 21.In the present embodiment, described circular conductive part 22 is to be hollow form, and its thickness can come change by the condition of adjusting plating or electroless-plating, and can be designed according to product demand, so do not limited.
Please refer to shown in Fig. 2 B and the 2C, the manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention then utilizes a punching die 3 with noncircular cross section to come the described base plate for packaging of punching press 2 to form a non-circular through hole 23, and described non-circular through hole 23 is divided at least two remainders that are separated from each other and forms at least two conductive paths 221 corresponding to described manhole 21 and with the described circular conductive part 22 of described manhole 21 inside.In the present invention, the present invention can select to utilize a punching die 3 with noncircular cross section (cross section) to carry out non-annular borehole and form described non-circular through hole 23.In the present embodiment, the cross sectional shape of the non-circular cross sectional shape of described punching die 3 and described non-circular through hole 23 preferably is selected from cross or M shape, but is not limited to this.Described punching die 3 can be in order to carry out punch process to described base plate for packaging 2, to form a non-circular zone, and zone of cross or M shape etc. for example.Other non-circular cross sectional shape of described punching die 3 and described non-circular through hole 23 will be in hereinafter giving explanation in addition.The noncircular cross section of described punching die 3 preferably has radiation symmetry or monosymmetric shape, but is not limited to this.Moreover no matter use which kind of non-circular cross sectional shape to carry out non-annular borehole, the optimum seeking site that described punching die 3 is desired punching is to have the relation that concentric circles is arranged with described manhole 21 and circular conductive part 22, but is not limited to this.During utilizing described punching die 3 processing, described punching die 3 will connect the upper and lower surface of whole base plate for packaging 2.Moreover, each described punching die 3 all has a central part 31 and at least two extensions 32, in the present embodiment, described punching die 3 generally is cross, it has a central part 31 and four extensions 32, wherein said extension 32 is to be stretched out by described central part 31, and symmetric arrays is in four square position places of described central part 31.
In the present invention, the maximum cross-section diameter of described punching die 3 (i.e. length between the two relative extensions 32) is at least greater than the external diameter of (or equaling) described circular conductive part 22, that is at least greater than the internal diameter of (or equaling) described manhole 21.For example, in the present embodiment, described punching die 3 is a cross punching die, its maximum cross-section diameter is greater than the external diameter (or internal diameter of described manhole 21) of described circular conductive part 22, and therefore the punching of described punching die 3 action will cause several sections parts of the described circular conductive part 22 of removal and the neighbouring part of described base plate for packaging 2.Therefore, the outer margin contour of described non-circular through hole 23 has at least at 2 with the outer margin contour of described manhole 21 and overlaps (for example being 4 coincidences in the present embodiment), and described non-circular through hole 23 is divided into the described circular conductive part 22 of described manhole 21 inside at least two remainders that are separated from each other and forms at least two conductive paths 221, the extension 32 of just described punching die 3 will form at least two separating tanks 23 at the internal face of described manhole 21, make described circular conductive part 22 remaining at least two sections partly form at least two conductive paths 221 that are separated from each other simultaneously, the cross section of wherein said conductive path 221 is generally curved.With the angle of described base plate for packaging 2 structures, described at least two separating tanks 23 are to be separated from each other and being arranged with around the internal face that is formed on described manhole 21 along the direction symmetry (or asymmetric) vertical with base plan; And described at least two conductive paths 221 are respectively formed on the described manhole 21 remaining internal faces, and described conductive path 221 can not extend in the described separating tank 23.Described at least two conductive paths 221 are the metal level of the inwall that is attached to described manhole 21 or the bonding jumper that extends to the through hole center along the inwall of described manhole 21.So, first embodiment of the invention is promptly finished the manufacturing of through-hole structure of described base plate for packaging 2, and make in the same manhole 21 many conductive paths that are separated from each other 221 can be provided, thereby help simplifying and quickening the making flow process of high wiring density type base plate for packaging 2, to improve its production efficiency.Simultaneously, also help reducing the via total quantity of described base plate for packaging 2 and the substrate area that takies thereof, so that the substrate area of saving is used to improve the configuration density of described base plate for packaging 2.
Please refer to shown in Fig. 2 D, the manufacture method of the through-hole structure of the base plate for packaging of first embodiment of the invention is optionally after forming described conductive path 221, other comprises: at least one surface at described base plate for packaging 2 forms at least one surface lines layer 24, and it has several circuits and electrically connects different described conductive paths 221 respectively.For example, described base plate for packaging 2 lower surface thereon is pre-formed the not metal forming of patterning, Copper Foil etc. for example, and carry out the tradition design metallization processes to metal forming and can form described surface lines layer 24 this moment.But in some cases, described base plate for packaging 2 is the surface lines layers 24 that have been pre-formed patterning when the invention provides the step of described base plate for packaging 2.
Please refer to shown in Fig. 3 A to 3E, the through-hole structure of the base plate for packaging of second embodiment of the invention and manufacture method thereof are similar in appearance to first embodiment of the invention, and continue to use same reference numbers, but the difference characteristic of second embodiment is: described second embodiment be in regular turn by circular bore, plating hole, non-annular borehole, plate the step that the hole thickens (and making surface circuit) once more many conductive paths that are separated from each other 221 be provided in the same manhole 21 of described base plate for packaging 2.In more detail, as shown in Figure 3A, present embodiment provides a base plate for packaging 2 equally earlier; And on described base plate for packaging 2, form at least one manhole 21.Then, when carrying out plating the hole first time, the present invention selects to utilize the electroless-plating mode to form described circular conductive part 22, wherein said circular conductive part 22 only is formed on the inwall of described manhole 21, and present embodiment preferably adopts the electroless-plating mode, makes the thickness of described circular conductive part 22 can be designed to be significantly less than the thickness of the circular conductive part 22 of first embodiment.Moreover, shown in Fig. 3 B and 3C, present embodiment utilizes a punching die 3 with noncircular cross section to come the described base plate for packaging 2 of punching press to form a non-circular through hole 23 equally, described non-circular through hole 23 is divided at least two remainders that are separated from each other and forms at least two conductive paths 221 corresponding to described manhole 21 and with the described circular conductive part 22 of described manhole 21 inside, just use 3 pairs of described circular conductive parts 22 of described punching die to carry out non-annular borehole, to remove several section parts of described circular conductive part 22, and forming at least two separating tanks 23 at the internal face of described manhole 21, described at least two separating tanks 23 make described circular conductive part 22 remaining at least two sections partly form at least two conductive paths 221 that are separated from each other.Then, shown in Fig. 3 D, after forming described conductive path 221, other comprises: further described conductive path 221 is further carried out a processing that thickens processing, so that described conductive path 221 comprises a thickened section 221 ' in addition, wherein saidly thicken processing and preferably select to use and electroplate or the technology of electroless-plating.In the present embodiment, the plating hole processing mode of above-mentioned secondary different phase only forms the circular conductive part 22 of thinner thickness at the beginning, therefore help reducing relatively the coefficient of losses that produced when described punching die 3 bored metal, and can reduce it and bore punch metal burr (burr) problem that is produced behind the metal.Then, plating hole processing the second time after non-circular punching then can be in order to improve the thickness of described conductive path 221, with the quality (quality) that increases described conductive path 221, and then improves the yields (yield) of described conductive path 221.At last, shown in Fig. 3 E, equally optionally form at least one surface lines layer 24 at least one surface of described base plate for packaging 2, it has several circuits and electrically connects different described conductive paths 221 respectively.
Please refer to shown in Fig. 4 A to 4G, the through-hole structure of the base plate for packaging of other embodiments of the invention and manufacture method thereof are similar in appearance to the present invention above-mentioned first or second embodiment, and continue to use same reference numbers, but the difference characteristic of these other embodiment is: the cross sectional shape of described punching die 3 and described non-circular through hole 23 is selected from the non-circular cross sectional shape that is different from above-mentioned first embodiment, and described circular conductive part 22 can to select be hollow circular conductive part or solid circles conductive part.
For example, shown in Fig. 4 A, the shape of cross section of described punching die 3 and described non-circular through hole 23 is selected from rectangle, that is has a central part 31 and two extensions 32 (shown in Fig. 2 B).Similar, shown in Fig. 4 B, 4C, 4D, 4E and 4F, the shape of cross section of described punching die 3 and described non-circular through hole 23 also can be selected from non-circular geometry such as triangle, square, star, flower shape or ellipse, that is has a central part 31 and at least two extensions 32 (shown in Fig. 2 B).The central part 31 of above-mentioned punching die 3 and at least two extensions 32 all can be in order to a part of internal faces of described manhole 21 of local excision and circular conductive part 22, to form functional similarity in the through-hole structure shown in Fig. 2 C, promptly described conductive path 221.
Moreover, shown in Fig. 4 G, the cross section of described punching die 3 and described non-circular through hole 23 is selected from above-mentioned arbitrary shape, other how much symmetrical non-circular appearance or asymmetric non-circular appearance, for example be selected from cross, it has a central part 31 and four elongated hole portions 32 (shown in Fig. 2 B); Simultaneously, described circular conductive part 22 can utilize printing or plating mode to form solid shape.After the central part 31 of described punching die 3 reaches a part of internal face of described manhole 21 of at least two extensions 32 local excisions and circular conductive part 22, can form functional similarity in the through-hole structure shown in Fig. 2 C, promptly described conductive path 221.The various embodiment that the present invention discloses at Fig. 2 A to 4G can be according to product demand phase double replacement shape or combination, so long as form described manhole 21 earlier, then form the circular conductive part 22 of correspondingly-shaped again, and utilize described punching die 3 to carry out non-annular borehole technology again, all belong to technological concept of the present invention.
As mentioned above, through-hole structure compared to existing base plate for packaging is by laser the conductive layer 12 in the described through hole 11 to be separated into several conductive paths 121, cause and expend a lot of process time, make it make comparatively very complicated of flow process, be unfavorable for promoting process velocity and be difficult for improving the shortcomings such as yields that described base plate for packaging 1 is processed, the manufacture method of the through-hole structure of the base plate for packaging of the present invention of Fig. 2 A to 4G is passed through circular bore in regular turn, the step of plating hole and non-annular borehole provides many conductive paths that are separated from each other 221 in the same manhole 21 of described base plate for packaging 2, it helps simplifying and quickening the making flow process of high wiring density base plate for packaging really, to improve its production efficiency.Moreover, also help reducing the via total quantity of described base plate for packaging 2 and the substrate area that takies thereof, so that the substrate area of saving is used to improve the configuration density of described base plate for packaging 2.In addition, shown in Fig. 3 A to 3E, the present invention also can be in regular turn by circular bore, plating hole, non-annular borehole and plate the step that the hole thickens once more many conductive paths that are separated from each other 221 are provided in the same manhole 21 of described base plate for packaging 2, wherein the processing mode that thickens of secondary plating hole helps reducing relatively coefficient of losses, the reduction punching burr problem of described punching die 3 and improves the yields of described conductive path 221.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (10)
1. the manufacture method of the through-hole structure of a base plate for packaging, it is characterized in that: described manufacture method comprises step:
One base plate for packaging is provided;
On described base plate for packaging, form at least one manhole;
The corresponding circular conductive part that forms in described manhole; And
Utilize a punching die with noncircular cross section to come the described base plate for packaging of punching press to form a non-circular through hole, described non-circular through hole is slit at least two remainders that are separated from each other and forms at least two conductive paths corresponding to described manhole and with the described circular current-carrying part of described manhole inside.
2. the manufacture method of the through-hole structure of base plate for packaging as claimed in claim 1 is characterized in that: described circular conductive part is one to be attached to the metal level of the inwall of described manhole.
3. the manufacture method of the through-hole structure of base plate for packaging as claimed in claim 1, it is characterized in that: described circular conductive part is the circular conductive pole that fills up described manhole.
4. as the manufacture method of the through-hole structure of claim 1,2 or 3 described base plate for packaging, it is characterized in that: when forming described circular conductive part, select to utilize plating, electroless-plating or mode of printing to form described circular conductive part.
5. the manufacture method of the through-hole structure of base plate for packaging as claimed in claim 1, it is characterized in that: the shape of the noncircular cross section of described punching die is selected from cross, M shape, rectangle, triangle, square, star, flower shape or ellipse.
6. the manufacture method of the through-hole structure of base plate for packaging as claimed in claim 1 is characterized in that: after forming described conductive path, other comprises: described conductive path is further thickened processing.
7. as the manufacture method of the through-hole structure of claim 1 or 6 described base plate for packaging, it is characterized in that: after forming described conductive path, other comprises: at least one surface at described base plate for packaging forms at least one surface lines layer.
8. the through-hole structure of a base plate for packaging, it is characterized in that: described through-hole structure comprises:
One manhole is formed on the base plate for packaging;
At least two separating tanks, it is separated from each other and is arranged with around the internal face that is formed on described manhole along the direction vertical with base plan; And
At least two conductive paths are respectively formed on the internal face of the described manhole between each two adjacent described separating tank.
9. the through-hole structure of base plate for packaging as claimed in claim 8 is characterized in that: described at least two conductive paths are to be attached to the metal level of inwall of described manhole or the bonding jumper that extends to the through hole center along the inwall of described manhole.
10. the through-hole structure of base plate for packaging as claimed in claim 8, it is characterized in that: described conductive path comprises a thickened section in addition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910201111 CN102097332B (en) | 2009-12-15 | 2009-12-15 | Conduction hole structure of encapsulation substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910201111 CN102097332B (en) | 2009-12-15 | 2009-12-15 | Conduction hole structure of encapsulation substrate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102097332A true CN102097332A (en) | 2011-06-15 |
| CN102097332B CN102097332B (en) | 2013-01-02 |
Family
ID=44130354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910201111 Active CN102097332B (en) | 2009-12-15 | 2009-12-15 | Conduction hole structure of encapsulation substrate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102097332B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541139A (en) * | 2018-03-31 | 2018-09-14 | 深圳市实锐泰科技有限公司 | A kind of PCB via holes production method and PCB |
-
2009
- 2009-12-15 CN CN 200910201111 patent/CN102097332B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541139A (en) * | 2018-03-31 | 2018-09-14 | 深圳市实锐泰科技有限公司 | A kind of PCB via holes production method and PCB |
| CN108541139B (en) * | 2018-03-31 | 2020-04-17 | 深圳市实锐泰科技有限公司 | PCB (printed circuit board) via hole manufacturing method and PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102097332B (en) | 2013-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103887250B (en) | Electromagnetically compatible chip for electrical conductivity | |
| KR100279036B1 (en) | Method of forming raised metallic contacts on electrical circuits for permanent bonding | |
| CN103943600B (en) | Novel termination between chip and substrate and connection | |
| US9059152B2 (en) | Wiring substrate and manufacturing method of the same | |
| DE102014111829B4 (en) | A semiconductor module and a method for its fabrication through advanced embedding technologies | |
| DE102008039388A1 (en) | Stacked semiconductor chips | |
| CN102324418A (en) | Semiconductor component packaging structure and its manufacturing approach | |
| CN103887279A (en) | Three-dimensional fan-out type wafer level package structure and manufacturing process | |
| CN103178044B (en) | There is the multi-layer support structure that integration is metal-cored | |
| CN102097330B (en) | Conduction structure of encapsulation substrate and manufacturing method thereof | |
| CN103021984A (en) | Wafer level packaging structure and manufacturing method thereof | |
| CN110164839A (en) | A kind of the fan-out package structure and method of high-density line insertion transfer | |
| US20110266671A1 (en) | Substrate for a semiconductor package and manufacturing method thereof | |
| CN110459521A (en) | Crystal-coated packing substrate plate and electronic packing piece | |
| CN116110807A (en) | Method for manufacturing semiconductor device and corresponding semiconductor device | |
| CN105161474A (en) | Fan-out packaging structure and production technology thereof | |
| CN102097332B (en) | Conduction hole structure of encapsulation substrate and manufacturing method thereof | |
| CN108684160A (en) | A kind of multistage blind hole HDI board manufacturing methods | |
| CN102054813B (en) | Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof | |
| CN106129052A (en) | Two-way integrated embedded type chip reroutes board structure and preparation method thereof | |
| CN102097329B (en) | Embedded conduction structure of encapsulation substrate and manufacturing method thereof | |
| JP2009135321A (en) | Multilayer wiring board and method of manufacturing the same, and semiconductor device | |
| CN104659021A (en) | Three-dimensional wafer level fan-out PoP encapsulating structure and preparation method for encapsulating structure | |
| JP7257273B2 (en) | Printed wiring board and manufacturing method thereof | |
| US20230199957A1 (en) | Multilayer substrate and manufacturing method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: ADVANCED SEMICONDUCTOR (SHANGHAI) CO., LTD. Free format text: FORMER NAME: ADVANCED SEMICONDUCTOR ENGINEERING (SHANGHAI) INC. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Shanghai Jinke Road, Pudong New Area Zhangjiang hi tech Park No. 2300 Patentee after: Advanced Semiconductor (Shanghai) Co., Ltd. Address before: 201203 Shanghai Jinke Road, Pudong New Area Zhangjiang hi tech Park No. 2300 Patentee before: Advanced Semiconductor (Shanghai), Inc. |