CN102097317A - Method for manufacturing totally packaged switching power supply triode - Google Patents
Method for manufacturing totally packaged switching power supply triode Download PDFInfo
- Publication number
- CN102097317A CN102097317A CN2010105716109A CN201010571610A CN102097317A CN 102097317 A CN102097317 A CN 102097317A CN 2010105716109 A CN2010105716109 A CN 2010105716109A CN 201010571610 A CN201010571610 A CN 201010571610A CN 102097317 A CN102097317 A CN 102097317A
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- China
- Prior art keywords
- power supply
- switching power
- triode
- supply triode
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a method for manufacturing a totally packaged switching power supply triode, aiming to provide a switching power supply triode which increases the radiation power of elements, prompts the stability of products and saves the cost. The method for manufacturing the totally packaged switching power supply triode is characterized by comprising the following steps of arranging a product, after aluminum wires are bonded, on a shaping stamping rail, and applying the certain pressure on the foot of the triode to make the whole surface of a frame smooth, wherein the thickness of a plastic package material on the back surface of the molded power supply triode is 0.7mm. The invention is mainly applied to a power switch triode of a television circuit board.
Description
Technical field
The present invention relates to the production method of triode, relate in particular to a kind of production method of total incapsulation dress Switching Power Supply triode.
Background technology
Switching Power Supply is mainly used in TV set power switch; switch protections such as hardware electric tool; the sort circuit design requires electric current big usually; the electronic product that power is high; Switching Power Supply mainly contains the total incapsulation dress and partly seals the dress mode; the Switching Power Supply triode back side plastic packaging material general thickness that total incapsulation dress mode is produced is 0.9-1.0mm; its thickness has influenced the thermal diffusivity of Switching Power Supply greatly; dispel the heat when bad; again electronic product performance is produced greatly influence; therefore make full packet switch power be generally 68-70 ℃, under this condition, just do not guarantee the job stability of triode because of Temperature Influence.
Summary of the invention
The invention discloses the production method of a kind of total incapsulation dress Switching Power Supply triode, is that the heat radiation that produces of 0.9-1.0mm is bad in order to solve power supply triode back side plastic packaging material thickness that prior art produces, and temperature rise is fast, problems such as unstable properties.
For addressing the above problem, the technology of the present invention solution is: a kind of production method of total incapsulation dress Switching Power Supply triode, produce full packet switch power supply triode by chip being expanded sheet, bonding die, welding wire, bonding aluminium wire, preceding baking, mold pressing, curing, it is characterized in that: product is placed on the integer punching press track after carrying out the bonding aluminium wire, pin is applied certain pressure make whole framework surfacing.
Further, described pressure is 0.1mpa.
Further, its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
Further, its plastic packaging material thickness of described mold pressing is 0.7mm.
The invention has the beneficial effects as follows: the Switching Power Supply triode back side plastic packaging material thickness of producing by the present invention is 0.7mm, increased the radiating efficiency of total incapsulation dress switch triode, make its fin more near external device, having guaranteed that the heat on the fin can transmit faster and better comes, guaranteed the operating efficiency of components and parts, made the work that it can be more stable.
Embodiment
Below the specific embodiment of the present invention is described in further detail.
A kind of production method of total incapsulation dress Switching Power Supply triode, produce full packet switch power supply triode by chip being expanded sheet, bonding die, welding wire, bonding aluminium wire, preceding baking, mold pressing, curing, it is characterized in that: product is placed on the integer punching press track after carrying out the bonding aluminium wire, pin is applied certain pressure make whole framework surfacing.
Described pressure is 0.1mpa.
Its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
Its plastic packaging material thickness of described mold pressing is 0.7mm.
Chip is expanded successively after the operations such as sheet, bonding die, bonding aluminium wire the product that sets is placed on and carry out the punching press integer on the integer punching press track and handle, treat after integer is finished dealing with the product that sets to be put into baking oven with baking before 120 ℃ 4 hours.Before baking plastic packaging material is handled 170 ℃ temperatures system 160 seconds by mold pressing after finishing, the thickness that makes plastic packaging material on it is 0.7mm, again product is put into and promptly solidified after baking oven is smoked cooling in 48 hours with 165 ℃ temperature, surperficial burr removed thereafter, handle through sticking tin again, product after the processing must strict carry out the high pressure of 3500V and survey Insulation test, cuts muscle by the product process of Insulation test, gets final product packed and transported after the electrical quantity screening.
Claims (4)
1. the production method of total incapsulation dress Switching Power Supply triode, produce full packet switch power supply triode by chip being expanded sheet, bonding die, welding wire, bonding aluminium wire, preceding baking, mold pressing, curing, it is characterized in that: product is placed on the integer punching press track after carrying out the bonding aluminium wire, pin is applied certain pressure make whole framework surfacing.
2. the production method of total incapsulation dress Switching Power Supply triode according to claim 1, it is characterized in that: described pressure is 0.1mpa.
3. the production method of total incapsulation dress Switching Power Supply triode according to claim 1, it is characterized in that: its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
4. the production method of total incapsulation dress Switching Power Supply triode according to claim 1, it is characterized in that: its plastic packaging material thickness of described mold pressing is 0.7mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010571610.9A CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010571610.9A CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102097317A true CN102097317A (en) | 2011-06-15 |
| CN102097317B CN102097317B (en) | 2015-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010571610.9A Active CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102097317B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162194A (en) * | 1996-02-26 | 1997-10-15 | 摩托罗拉公司 | Method for mfg. electronic element with organic substrate |
| US20040262372A1 (en) * | 2003-06-26 | 2004-12-30 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| TW200504902A (en) * | 2003-07-25 | 2005-02-01 | Shinkawa Kk | Wire-bonding method |
| CN201134427Y (en) * | 2007-12-27 | 2008-10-15 | 上海旭福电子有限公司 | Insulated reinforced packaging structure with radiating fin exposed outside |
| CN101404261A (en) * | 2008-10-28 | 2009-04-08 | 深圳市晶导电子有限公司 | Triode and manufacturing method thereof |
-
2010
- 2010-12-01 CN CN201010571610.9A patent/CN102097317B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162194A (en) * | 1996-02-26 | 1997-10-15 | 摩托罗拉公司 | Method for mfg. electronic element with organic substrate |
| US20040262372A1 (en) * | 2003-06-26 | 2004-12-30 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| TW200504902A (en) * | 2003-07-25 | 2005-02-01 | Shinkawa Kk | Wire-bonding method |
| CN201134427Y (en) * | 2007-12-27 | 2008-10-15 | 上海旭福电子有限公司 | Insulated reinforced packaging structure with radiating fin exposed outside |
| CN101404261A (en) * | 2008-10-28 | 2009-04-08 | 深圳市晶导电子有限公司 | Triode and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102097317B (en) | 2015-04-29 |
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| ASS | Succession or assignment of patent right |
Owner name: FOSHAN NANHAI HONGQIAN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHUANG YUQIAO Effective date: 20130128 |
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Free format text: CORRECT: ADDRESS; FROM: 528200 FOSHAN, GUANGDONG PROVINCE TO: 528000 FOSHAN, GUANGDONG PROVINCE |
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Effective date of registration: 20130128 Address after: 528000, room 3, building 1, Nanhai digital new town, Nanhai Road, Nanhai District, Foshan, Guicheng, Guangdong 1107, China Applicant after: Foshan Nanhai Hongqian Electronic Co., Ltd. Address before: 528200, Foshan, Guangdong Province Nanhai District Guicheng street, South Road, No. 39, Jiangnan, 1202 homes, Wang Yuan, room 15 Applicant before: Zhuang Yuqiao |
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| CP03 | Change of name, title or address |
Address after: 528216 Guangdong province Foshan City Danzao Town Nanhai District Xin'an community the Bund Jinning No. 3 Patentee after: Guangdong macro dried Polytron Technologies Inc Address before: 528000, room 3, building 1, Nanhai digital new town, Nanhai Road, Nanhai District, Foshan, Guicheng, Guangdong 1107, China Patentee before: Foshan Nanhai Hongqian Electronic Co., Ltd. |