CN102095176A - Hardware bracket for assembling medium and low power LED lamps - Google Patents
Hardware bracket for assembling medium and low power LED lamps Download PDFInfo
- Publication number
- CN102095176A CN102095176A CN2010105656377A CN201010565637A CN102095176A CN 102095176 A CN102095176 A CN 102095176A CN 2010105656377 A CN2010105656377 A CN 2010105656377A CN 201010565637 A CN201010565637 A CN 201010565637A CN 102095176 A CN102095176 A CN 102095176A
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- wafer
- hole
- low power
- plastic cement
- led lamp
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a hardware bracket for assembling medium and low power LED lamps. The hardware bracket is punched into a plurality of wafer installation sites at intervals in an array way and an integral forming way on a thin metal plate; each installation site is same in structure; the structure of each installation site is as follows: the center of the installation site is provided with a through hole; the through hole is internally provided with a plastic seat used for installing an optical lens; the inner side of the plastic seat is provided with an integrally formed reflection cup; the metal plate positioned in a hole inside the plastic seat forms a wafer placing area; the wafer placing area is provided with at least two wafer welding areas; a plate positioned outside the plastic seat is punched with two pins which correspond to the wafer welding areas; one of the pins is provided with a polarity identification hole; and the hole of the plastic seat is internally provided with a thicker heat-radiating conductive seat. The thicker heat-radiating conductive seat arranged in the hole of an installation seat can be used for radiating heat emitted by medium and low power light-emitting tubes as much as possible, therefore the service life of the medium and low power light-emitting tubes is prolonged.
Description
Technical field
The present invention relates to ligthing paraphernalia, be specifically related to a kind of five metals support that is used to assemble the LED lamp.
Background technology
In the prior art, when encapsulating light emitting LED lamp, if there is not a kind of support that can be used for assembling in enormous quantities, particularly when the luminous tube of assembling middle low power, then assembling up to waste time and energy, and efficient is low, and assembly quality is not high yet.
Summary of the invention
The objective of the invention is to, at the above-mentioned defective of prior art, provide a kind of five metals support that is used to assemble the LED lamp, adopt the LED lamp of this support assembling middle low power, assembly quality is good, the production efficiency height.
Technical scheme provided by the invention is as follows: construct a kind of five metals support that is used to assemble the LED lamp, be that the mode by array adopts integrated mode on a thin metal blank, a plurality of wafers installation position that the interval punching out becomes, the structure of each installation position is identical, the structure of installation position is as follows: its center is a through hole, be provided with a plastic cement seat that is used to install optical lens in the through hole, also be provided with integrated reflector in described plastic cement seat inboard, the sheet metal that is arranged in described plastic cement seat endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones, sheet material in described plastic cement seat outside is had and corresponding two pins in described wafer weld zone by punching out, a pin is provided with the polarity identification hole therein, and being provided with a thickness in the hole of described plastic cement seat is the heat radiation conduction seat of 5-20 millimeter.
Heat radiation conduction seat.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with four wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins of punching out and described four wafer weld zones, and a pin is provided with the polarity identification hole therein.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.
Stating the five metals support that is used for assembling the LED lamp, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
At the above-mentioned five metals support that is used for assembling the LED lamp, the thickness of described plastic cement seat can be selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
The present invention has following advantage: by adopting the installation position of a plurality of arrays of sheet metal punching out, can be poised for battle a plurality of installation positions that list simultaneously and carry out the wafer installation, simultaneously, integrated pin and relevant mount pad in the installation position, further improved packaging efficiency, by adjusting number of pins and wafer Wiring area, can be packaged into the LED lamp that can send multiple coloured light, the thick heat radiation conduction seat that is arranged in the mount pad hole can distribute the heat that luminous tube sent of middle low power as far as possible, prolongs the service life of luminous tube.
Description of drawings
Fig. 1 is the front view that the present invention is used to assemble the five metals support of middle low power LED lamp;
Fig. 2 is the structural front view of two installation positions in the support shown in Figure 1;
Fig. 3 is the side view of Fig. 2;
Fig. 4 is the rearview of Fig. 2.
The specific embodiment
With reference to Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, a kind of five metals support that is used to assemble middle low power LED lamp is provided, be that the mode by array adopts integrated mode on a thin metal blank 1, a plurality of wafers installation position 102 that the interval punching out becomes, the structure of each installation position 102 is identical, the structure of installation position 102 is as follows: its center is a through hole, be provided with a plastic cement seat 2 that is used to install optical lens in the through hole, also be provided with integrated reflector 201 in described plastic cement seat 2 inboards, the sheet metal that is arranged in described plastic cement seat 2 endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones 105, sheet material in described plastic cement seat 2 outsides is had and corresponding two pins 103 in described wafer weld zone by punching out, a pin is provided with polarity identification hole 104 therein, being provided with a thickness in the hole of described plastic cement seat 2 is the heat radiation conduction seat 3 of 5-20 millimeter, is convenient to the luminous tube heat radiation of middle low power.
At the above-mentioned five metals support that is used for assembling middle low power LED lamp, be provided with four wafer weld zones 105 at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins 103 of punching out and described four wafer weld zones, and a pin is provided with polarity identification hole 104 therein.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.By driving different pins and wafer Wiring area, can be packaged into the LED lamp that can send multiple coloured light, the thick heat radiation conduction seat 3 that is arranged in the mount pad hole can be with the heat that powerful luminous tube sent
At the above-mentioned five metals support that is used for assembling the LED lamp, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
At the above-mentioned five metals support that is used for assembling the LED lamp, the thickness A of described plastic cement seat 2 is selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
At the above-mentioned five metals support that is used for assembling the LED lamp, described polarity sign hole 104 can also be with one of following sign replacement: various icons, various breach.
At the above-mentioned five metals support that is used for assembling the LED lamp, the contour shape of described plastic cement seat 2 can be one of following shape: circle, and square.
Claims (7)
1. five metals support that is used to assemble middle low power LED lamp, be that the mode by array adopts integrated mode on a thin metal blank, a plurality of wafers installation position that the interval punching out becomes, the structure of each installation position is identical, it is characterized in that, the structure of installation position is as follows: its center is a through hole, be provided with a plastic cement seat that is used to install optical lens in the through hole, also be provided with integrated reflector in described plastic cement seat inboard, the sheet metal that is arranged in described plastic cement seat endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones, sheet material in described plastic cement seat outside is had and corresponding two pins in described wafer weld zone by punching out, a pin is provided with the polarity identification hole therein, and being provided with a thickness in the hole of described plastic cement seat is the heat radiation conduction seat of 5-20 millimeter.
2. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, be provided with four wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins of punching out and described four wafer weld zones, and a pin is provided with the polarity identification hole therein.
3. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.
4. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
5. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, the thickness of described plastic cement seat can be selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
6. according to claim 1 or the 2 or 3 described five metals supports that are used to assemble middle low power LED lamp, it is characterized in that described polarity sign can be one of following: icon, breach, through hole.
7. the five metals support that is used to assemble middle low power LED lamp according to claim 6 is characterized in that, the contour shape of described plastic cement seat can be one of following shape: circle (can be with straight flange), square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105656377A CN102095176A (en) | 2010-11-29 | 2010-11-29 | Hardware bracket for assembling medium and low power LED lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105656377A CN102095176A (en) | 2010-11-29 | 2010-11-29 | Hardware bracket for assembling medium and low power LED lamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102095176A true CN102095176A (en) | 2011-06-15 |
Family
ID=44128376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105656377A Pending CN102095176A (en) | 2010-11-29 | 2010-11-29 | Hardware bracket for assembling medium and low power LED lamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102095176A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201149874Y (en) * | 2008-01-15 | 2008-11-12 | 东莞市宏磊达电子塑胶有限公司 | High-power LED support |
| CN202056784U (en) * | 2010-11-29 | 2011-11-30 | 东莞市驰明电子科技有限公司 | Hardware bracket for assembling middle and small power LED lamps |
-
2010
- 2010-11-29 CN CN2010105656377A patent/CN102095176A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201149874Y (en) * | 2008-01-15 | 2008-11-12 | 东莞市宏磊达电子塑胶有限公司 | High-power LED support |
| CN202056784U (en) * | 2010-11-29 | 2011-11-30 | 东莞市驰明电子科技有限公司 | Hardware bracket for assembling middle and small power LED lamps |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110615 |