CN202056784U - Hardware bracket for assembling middle and small power LED lamps - Google Patents

Hardware bracket for assembling middle and small power LED lamps Download PDF

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Publication number
CN202056784U
CN202056784U CN2010206331541U CN201020633154U CN202056784U CN 202056784 U CN202056784 U CN 202056784U CN 2010206331541 U CN2010206331541 U CN 2010206331541U CN 201020633154 U CN201020633154 U CN 201020633154U CN 202056784 U CN202056784 U CN 202056784U
Authority
CN
China
Prior art keywords
hole
plastic cement
led lamp
wafer
seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206331541U
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Chinese (zh)
Inventor
蔡明波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd filed Critical DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2010206331541U priority Critical patent/CN202056784U/en
Application granted granted Critical
Publication of CN202056784U publication Critical patent/CN202056784U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a hardware bracket for assembling middle and small power LED lamps. A plurality of chip installing positions are punched on a thin metal sheet at intervals in an array manner by adopting an integrally-formed manner; the chip installing positions are the same in structure and respectively adopt the structure that a through hole is formed at the center of each chip installing position; a plastic seat for installing an optical lens is arranged in the through hole; an integrally-formed light reflecting cup is also arranged on the inner side of the plastic seat; a metal plate positioned in an inner hole of the plastic seat forms a chip placement area; the chip placement area is provided with at least two chip welding areas; a plate outside the plastic seat is punched into two pins corresponding to the chip welding areas; a polarity recognition hole is arranged on one of the pins; and a thicker heat dissipation and conduction seat is arranged in the hole of the plastic seat. The thicker heat dissipation and conduction seat arranged in an installing seat hole can dissipate the heat emitted by middle and small power light-emitting tubes to prolong the service life of the light-emitting tubes.

Description

Be used to assemble the five metals support of middle low power LED lamp
Technical field
The utility model relates to ligthing paraphernalia, is specifically related to a kind of five metals support that is used to assemble the LED lamp.
Background technology
In the prior art, when encapsulating light emitting LED lamp, if there is not a kind of support that can be used for assembling in enormous quantities, particularly when the luminous tube of assembling middle low power, then assembling up to waste time and energy, and efficient is low, and assembly quality is not high yet.
The utility model content
The purpose of this utility model is, at the above-mentioned defective of prior art, provides a kind of five metals support that is used to assemble the LED lamp, adopts the LED lamp of this support assembling middle low power, and assembly quality is good, the production efficiency height.
The technical scheme that the utility model provides is as follows: construct a kind of five metals support that is used to assemble the LED lamp, be that the mode by array adopts integrated mode on a thin metal blank, a plurality of wafers installation position that the interval punching out becomes, the structure of each installation position is identical, the structure of installation position is as follows: its center is a through hole, be provided with a plastic cement seat that is used to install optical lens in the through hole, also be provided with integrated reflector in described plastic cement seat inboard, the sheet metal that is arranged in described plastic cement seat endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones, sheet material in described plastic cement seat outside is had and corresponding two pins in described wafer weld zone by punching out, a pin is provided with the polarity identification hole therein, and being provided with a thickness in the hole of described plastic cement seat is the heat radiation conduction seat of 5-20 millimeter.
Heat radiation conduction seat.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with four wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins of punching out and described four wafer weld zones, and a pin is provided with the polarity identification hole therein.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.
Stating the five metals support that is used for assembling the LED lamp, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
At the above-mentioned five metals support that is used for assembling the LED lamp, the thickness of described plastic cement seat can be selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
The utlity model has following advantage: by adopting the installation position of a plurality of arrays of sheet metal punching out, can be poised for battle a plurality of installation positions that list simultaneously and carry out the wafer installation, simultaneously, integrated pin and relevant mount pad in the installation position, further improved packaging efficiency, by adjusting number of pins and wafer Wiring area, can be packaged into the LED lamp that can send multiple coloured light, the thick heat radiation conduction seat that is arranged in the mount pad hole can distribute the heat that luminous tube sent of middle low power as far as possible, prolongs the service life of luminous tube.
Description of drawings
Fig. 1 is the front view that the utility model is used to assemble the five metals support of middle low power LED lamp;
Fig. 2 is the structural front view of two installation positions in the support shown in Figure 1;
Fig. 3 is the side view of Fig. 2;
Fig. 4 is the rearview of Fig. 2.
The specific embodiment
With reference to Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, a kind of five metals support that is used to assemble middle low power LED lamp is provided, be that the mode by array adopts integrated mode on a thin metal blank 1, a plurality of wafers installation position 102 that the interval punching out becomes, the structure of each installation position 102 is identical, the structure of installation position 102 is as follows: its center is a through hole, be provided with a plastic cement seat 2 that is used to install optical lens in the through hole, also be provided with integrated reflector 201 in described plastic cement seat 2 inboards, the sheet metal that is arranged in described plastic cement seat 2 endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones 105, sheet material in described plastic cement seat 2 outsides is had and corresponding two pins 103 in described wafer weld zone by punching out, a pin is provided with polarity identification hole 104 therein, being provided with a thickness in the hole of described plastic cement seat 2 is the heat radiation conduction seat 3 of 5-20 millimeter, is convenient to the luminous tube heat radiation of middle low power.
At the above-mentioned five metals support that is used for assembling middle low power LED lamp, be provided with four wafer weld zones 105 at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins 103 of punching out and described four wafer weld zones, and a pin is provided with polarity identification hole 104 therein.
At the above-mentioned five metals support that is used for assembling the LED lamp, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.By driving different pins and wafer Wiring area, can be packaged into the LED lamp that can send multiple coloured light, the thick heat radiation conduction seat 3 that is arranged in the mount pad hole can be with the heat that powerful luminous tube sent
At the above-mentioned five metals support that is used for assembling the LED lamp, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
At the above-mentioned five metals support that is used for assembling the LED lamp, the thickness A of described plastic cement seat 2 is selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
At the above-mentioned five metals support that is used for assembling the LED lamp, described polarity sign hole 104 can also be with one of following sign replacement: various icons, various breach.
At the above-mentioned five metals support that is used for assembling the LED lamp, the contour shape of described plastic cement seat 2 can be one of following shape: circle, and square.

Claims (7)

1. five metals support that is used to assemble middle low power LED lamp, be that the mode by array adopts integrated mode on a thin metal blank, a plurality of wafers installation position that the interval punching out becomes, the structure of each installation position is identical, it is characterized in that, the structure of installation position is as follows: its center is a through hole, be provided with a plastic cement seat that is used to install optical lens in the through hole, also be provided with integrated reflector in described plastic cement seat inboard, the sheet metal that is arranged in described plastic cement seat endoporus constitutes the wafer rest area, the wafer rest area is provided with at least two wafer weld zones, sheet material in described plastic cement seat outside is had and corresponding two pins in described wafer weld zone by punching out, a pin is provided with the polarity identification hole therein, and being provided with a thickness in the hole of described plastic cement seat is the heat radiation conduction seat of 5-20 millimeter.
2. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, be provided with four wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding four pins of punching out and described four wafer weld zones, and a pin is provided with the polarity identification hole therein.
3. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, be provided with six wafer weld zones at described wafer rest area, sheet material outside described plastic cement seat is by corresponding six pins of punching out and described six wafer weld zones, and a pin is provided with the polarity identification hole therein.
4. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, described sheet metal is provided with 10 of 2 rows or 3 and arranges 10 or 4 array chip installation positions of arranging 10, is interval with a plurality of locating holes on the sheet material between every row's array.
5. the five metals support that is used to assemble middle low power LED lamp according to claim 1, it is characterized in that, the thickness of described plastic cement seat can be selected in following scope as required: the 2-5 millimeter, the thickness of described thin metal blank can be selected in following scope: the 0.1-1 millimeter.
6. according to claim 1 or the 2 or 3 described five metals supports that are used to assemble middle low power LED lamp, it is characterized in that described polarity sign can be one of following: icon, breach, through hole.
7. the five metals support that is used to assemble middle low power LED lamp according to claim 6 is characterized in that the contour shape of described plastic cement seat can be one of following shape: circular, square.
CN2010206331541U 2010-11-29 2010-11-29 Hardware bracket for assembling middle and small power LED lamps Expired - Fee Related CN202056784U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206331541U CN202056784U (en) 2010-11-29 2010-11-29 Hardware bracket for assembling middle and small power LED lamps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206331541U CN202056784U (en) 2010-11-29 2010-11-29 Hardware bracket for assembling middle and small power LED lamps

Publications (1)

Publication Number Publication Date
CN202056784U true CN202056784U (en) 2011-11-30

Family

ID=45016757

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206331541U Expired - Fee Related CN202056784U (en) 2010-11-29 2010-11-29 Hardware bracket for assembling middle and small power LED lamps

Country Status (1)

Country Link
CN (1) CN202056784U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102095176A (en) * 2010-11-29 2011-06-15 东莞市驰明电子科技有限公司 Hardware bracket for assembling medium and low power LED lamps

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102095176A (en) * 2010-11-29 2011-06-15 东莞市驰明电子科技有限公司 Hardware bracket for assembling medium and low power LED lamps

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111130

Termination date: 20131129