CN102092102B - 晶块粘棒切片工艺 - Google Patents
晶块粘棒切片工艺 Download PDFInfo
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- CN102092102B CN102092102B CN201010298878XA CN201010298878A CN102092102B CN 102092102 B CN102092102 B CN 102092102B CN 201010298878X A CN201010298878X A CN 201010298878XA CN 201010298878 A CN201010298878 A CN 201010298878A CN 102092102 B CN102092102 B CN 102092102B
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000013078 crystal Substances 0.000 claims abstract description 77
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 8
- 239000011265 semifinished product Substances 0.000 claims abstract description 6
- 238000002266 amputation Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 9
- 239000010703 silicon Substances 0.000 abstract description 9
- 239000012634 fragment Substances 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 4
- 229910000831 Steel Inorganic materials 0.000 description 6
- 235000013312 flour Nutrition 0.000 description 6
- 238000003801 milling Methods 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 230000009194 climbing Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000000275 quality assurance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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CN201010298878XA CN102092102B (zh) | 2010-10-08 | 2010-10-08 | 晶块粘棒切片工艺 |
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CN201010298878XA CN102092102B (zh) | 2010-10-08 | 2010-10-08 | 晶块粘棒切片工艺 |
Publications (2)
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CN102092102A CN102092102A (zh) | 2011-06-15 |
CN102092102B true CN102092102B (zh) | 2013-11-20 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294757A (zh) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的单晶短棒拼接方法 |
CN103538157B (zh) * | 2011-12-31 | 2015-09-09 | 英利能源(中国)有限公司 | 晶体硅块的切割方法 |
CN103407008A (zh) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | 晶棒切割的改进方法 |
CN103552165B (zh) * | 2013-11-08 | 2015-07-15 | 江西赛维Ldk太阳能高科技有限公司 | 断线报废硅块的处理方法 |
CN107968049A (zh) * | 2017-11-24 | 2018-04-27 | 苏州阿特斯阳光电力科技有限公司 | 一种太阳能电池片的切割方法 |
CN109808087B (zh) * | 2019-01-30 | 2021-01-26 | 无锡中环应用材料有限公司 | 一种硅棒的粘棒方法 |
CN110524410B (zh) * | 2019-09-12 | 2021-02-26 | 中国电子科技集团公司第二十六研究所 | 一种批量加工闪烁体晶条的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6258754B1 (en) * | 1998-07-16 | 2001-07-10 | Superconductive Components, Inc. | Large, strongly linked superconducting monoliths and process for making the same |
CN101550603A (zh) * | 2009-04-01 | 2009-10-07 | 汪昌伟 | 一种硅单晶棒的拼棒装置 |
CN101728259A (zh) * | 2008-10-15 | 2010-06-09 | 硅电子股份公司 | 同时将半导体材料复合棒切割成多个晶片的方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60227423A (ja) * | 1984-04-26 | 1985-11-12 | Fujitsu Ltd | インゴツトの接着方法 |
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- 2010-10-08 CN CN201010298878XA patent/CN102092102B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6258754B1 (en) * | 1998-07-16 | 2001-07-10 | Superconductive Components, Inc. | Large, strongly linked superconducting monoliths and process for making the same |
CN101728259A (zh) * | 2008-10-15 | 2010-06-09 | 硅电子股份公司 | 同时将半导体材料复合棒切割成多个晶片的方法 |
CN101550603A (zh) * | 2009-04-01 | 2009-10-07 | 汪昌伟 | 一种硅单晶棒的拼棒装置 |
Non-Patent Citations (1)
Title |
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JP昭60-227423A 1985.11.12 |
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CN102092102A (zh) | 2011-06-15 |
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Address after: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Patentee after: TRINASOLAR Co.,Ltd. Address before: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Patentee before: trina solar Ltd. |
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Address after: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Patentee after: trina solar Ltd. Address before: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou Patentee before: CHANGZHOU TRINA SOLAR ENERGY Co.,Ltd. |
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