CN102076169B - Flexible circuit board attaching structure and manufacturing method thereof - Google Patents
Flexible circuit board attaching structure and manufacturing method thereof Download PDFInfo
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- CN102076169B CN102076169B CN2011100266548A CN201110026654A CN102076169B CN 102076169 B CN102076169 B CN 102076169B CN 2011100266548 A CN2011100266548 A CN 2011100266548A CN 201110026654 A CN201110026654 A CN 201110026654A CN 102076169 B CN102076169 B CN 102076169B
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000012447 hatching Effects 0.000 description 4
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 3
- IUYHQGMDSZOPDZ-UHFFFAOYSA-N 2,3,4-trichlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 IUYHQGMDSZOPDZ-UHFFFAOYSA-N 0.000 description 3
- 208000004350 Strabismus Diseases 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000005352 clarification Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a flexible circuit board attaching structure which comprises a flexible circuit board and a substrate. The flexible circuit board comprises a plurality of first pins. The substrate comprises a plurality of second pins and a plurality of offset measurement marks. Each offset measuring mark is provided with a left reference point and a right reference point and is respectively arranged between two adjacent second pins. Each first pin is at least partially overlapped with and electrically connected with the corresponding second pin. The first left side of each first pin does not exceed the left side of a vertical extension line of the corresponding left reference point, and the first right side of each first pin does not exceed the right side of a vertical extension line of the corresponding right reference point.
Description
[technical field]
The invention relates to a kind of bonding structure of flexible PCB and the method for its making, refer to a kind of bonding structure and its manufacture method of flexible PCB of the side-play amount mark will with two datum marks especially.
[background technology]
Please refer to Fig. 1, Fig. 1 has illustrated the part enlarged diagram of the bonding structure of existing flexible PCB.As shown in Figure 1, the bonding structure 10 of existing flexible PCB comprises a flexible PCB 11 and a substrate 12.Flexible PCB 11 has a plurality of first pins 111, and substrate 12 has a plurality of second pins 121 and a plurality of side-play amount mark will 122.Because the thermal coefficient of expansion of flexible PCB 11, substrate 12, first pin 111 and second pin 121 is different with material behavior, when carrying out the hot pressing applying, is easy to generate the situation that the applying between first pin 111 and second pin 121 is squinted.The bonding structure 10 of existing flexible PCB needs through checking that first pin 111 and the relative position of side-play amount mark will 122 judge whether to fit normal after applying.For example, first pin 111 in the left side of side-play amount mark will 122 squints to the right and above side-play amount mark will 122, judge that then applying is defective if be positioned at; In like manner, first pin 111 on the right side of side-play amount mark will 122 squints left and above side-play amount mark will 122, judge that then applying is defective if be positioned at.Yet, along with the reduction of distance between first pin 111, can't judge whether first pin 111 fits normally through single side-play amount mark will 122, the accuracy that therefore how can effectively promote applying result inspection becomes the development priority of recent industry.
[summary of the invention]
Main purpose of the present invention is to provide a kind of bonding structure and method of its making of flexible PCB of the side-play amount mark will with two datum marks, judges in order to the result that fits fast, to save the manufacturing time.
A preferred embodiment of the present invention provides a kind of bonding structure of flexible PCB to comprise a flexible PCB and a substrate.Flexible PCB comprises many first pins, and each first pin has one first left side and one first right edge.Substrate comprises many second pins and a plurality of side-play amount mark will; Each second pin has one second left side and one second right edge; And two second adjacent pins have a spacing on a horizontal direction; Each side-play amount mark will is arranged at respectively between the second adjacent pin, and has a left datum mark and a right datum mark, and the left datum mark of each side-play amount mark will and right datum mark have a distance in the horizontal direction.Wherein, first pin and electric connection at least partly overlapping with the second corresponding pin.First left side is no more than the left side of a vertical extent line of corresponding left datum mark, and first right edge is no more than the right side of a vertical extent line of corresponding right datum mark.
According to a preferred embodiment of the present invention, other provides the method for the bonding structure of a making flexible PCB, comprises the following step.At first, a flexible PCB is provided, it comprises many first pins, and each first pin has a lower surface and a upper surface, and the lower surface of each first pin makes first pin respectively have a trapezoidal section shape greater than upper surface.Then, a substrate is provided, has many second pins, and a plurality of side-play amount mark will lays respectively between the second adjacent pin.Each second pin has one second left side and one second right edge; And the second adjacent pin has a spacing on a horizontal direction; Each side-play amount mark will has a left datum mark and a right datum mark, and the left datum mark of each side-play amount mark will and right datum mark have a distance in the horizontal direction.Subsequently, surface on first pin is fitted on the second corresponding pin surface and electric connection at least partly overlapping on first pin with the second corresponding pin.Follow again, utilize a vertical extent line and a vertical extent line of right datum mark of the left datum mark of each side-play amount mark will, carry out a skew and judge.Wherein, be positioned at the right side of vertical extent line of left datum mark of side-play amount mark will of the adjacent left-hand of corresponding second pin when first left side of each first pin, judge that then left side-play amount is up to specification.In addition, be positioned at the left side of vertical extent line of right datum mark of side-play amount mark will on the adjacent right side of corresponding second pin when first right edge of each first pin, judge that then right side-play amount is up to specification.
Flexible PCB bonding structure of the present invention is provided with one and has the side-play amount mark will of a left datum mark and a right datum mark between the two second adjacent pins on the substrate; Even under the distance situation of dwindling between the first adjacent pin; For example less than under 35 microns the situation; Still can bring into play the function of judging that the flexible PCB bonding structure is whether qualified, so can significantly save the detection time when manufacturing and promote the accuracy rate of judging.
Your, see also following about detailed description of the present invention and accompanying drawing in order to make juror can further understand characteristic of the present invention and technology contents.Yet appended icon only for reference with aid illustration usefulness, be not to be used for to the present invention's limitr in addition.
[description of drawings]
Fig. 1 is the local enlarged diagram of the bonding structure of existing flexible PCB.
Fig. 2 A is the local enlarged diagram of the flexible PCB bonding structure of a preferred embodiment of the present invention.
Fig. 2 B is the generalized section of the flexible PCB bonding structure that illustrates along the hatching line Y-Y ' of Fig. 2 A.
Fig. 3 A is a view on the flexible PCB bonding structure of a preferred embodiment of the present invention amplifies in the part under the applying skew situation.
Fig. 3 B is the generalized section of the flexible PCB bonding structure that illustrates along the hatching line Y-Y ' of Fig. 3 A.
Fig. 4 A is that the flexible PCB bonding structure is judged qualified sketch map left when squinting.
Fig. 4 B is that the flexible PCB bonding structure is judged qualified sketch map left when squinting.
Fig. 4 C is that the flexible PCB bonding structure is judged underproof sketch map left when squinting.
Fig. 5 A is that the flexible PCB bonding structure is judged qualified sketch map to the right when squinting.
Fig. 5 B is that the flexible PCB bonding structure is judged qualified sketch map to the right when squinting.
Fig. 5 C is that the flexible PCB bonding structure is judged underproof sketch map to the right when squinting.
[primary clustering symbol description]
10,20 flexible PCBs applying, 11,21 flexible PCBs
Structure
12,22 substrates, 111,211 first pins
121,221 second pins, 122,222 side-play amount mark will
The 211A first left side 211B first right edge
211C lower surface 211D upper surface
The 221A second left side 221B second right edge
The right datum mark of 222A left side datum mark 222B
The live width of A minimum overlay area B second pin
The following table of the second pin D, first pin that C is adjacent
Between wide apart from upper thread
Table G minimum overlay distance on E first pin
Live width on the face.
The following table of H peak excursion scope I first pin
Face and adjacent second
Distance between pin
J left side datum mark and right L1, L2 vertical extent line
Distance between datum mark
R1 first direction R2 second direction
[embodiment]
For making the general art of haveing the knack of technical field under the present invention a nearlyer step understand the present invention, the hereinafter spy enumerates preferred embodiment of the present invention, and cooperates appended icon, specifies constitution content of the present invention and the effect desiring to reach.
Please refer to Fig. 2 A and Fig. 2 B, Fig. 2 A has illustrated the part enlarged diagram of the flexible PCB bonding structure of the present invention's one preferred embodiment, and Fig. 2 B is the generalized section of the flexible PCB bonding structure that illustrates along the hatching line Y-Y ' of Fig. 2 A.For offering some clarification on the characteristic of preferred embodiment of the present invention, the part assembly is omitted in the drawings.Shown in Fig. 2 A and 2B, the flexible PCB bonding structure 20 of present embodiment comprises a flexible PCB 21 (Fig. 2 A does not show) and a substrate 22 (Fig. 2 A does not show).Flexible PCB 21 has many first pins 211, and each first pin 211 has one first left side 211A and one first right edge 211B.Substrate 22 has many second pins 221 and a plurality of side-play amount mark will 222.Each second pin 221 has one second left side 221A and one second right edge 221B, and two second adjacent pins 221 have a spacing C on a horizontal direction.Each side-play amount mark will 222 is arranged at respectively between the two second adjacent pins 221; And have a left datum mark 222A and a right datum mark 222B, and the left datum mark 222A of each side-play amount mark will 222 and right datum mark 222B have one in the horizontal direction apart from J.Wherein, first pin 211 and electric connection at least partly overlapping with the second corresponding pin 221.The first left side 211A is no more than the left side of the vertical extent line L1 of corresponding left datum mark 222A, and the first right edge 211B is no more than the right side of the vertical extent line L2 of corresponding right datum mark 222B.What be worth explanation is, first pin 211 is preferable is covered by each corresponding second pin 221 fully for each, but not as limit.For example, the applying meeting of each first pin 211 and each corresponding second pin 221 causes the situation of the skew of fitting because of the bit errors of board in the dimensional tolerance of each assembly or the processing procedure.
Please refer to Fig. 3 A and Fig. 3 B; View on the flexible PCB bonding structure that Fig. 3 A has illustrated a preferred embodiment of the present invention amplifies in the part under the applying skew situation, Fig. 3 B have illustrated in Fig. 3 A the generalized section of the flexible PCB bonding structure that illustrates along hatching line Y-Y '.In the present embodiment, each first pin 211 has an a lower surface 211C and a upper surface 211D, and lower surface 211C makes each first pin 211 have one for trapezoidal section shape, shown in Fig. 3 B greater than upper surface 211D.Surperficial 211D and each corresponding second pin 221 fit on each first pin 211, and corresponding second pin 221 of each first pin 211 and each is electrically connected.Surperficial 211D and each corresponding second pin 221 have a minimum overlay area A on each first pin 211, and each second pin 221 has a length W along a vertical direction.Therefore, formula 1 capable of using calculate 221 of each first pin 211 and each corresponding second pins minimum overlay apart from G.In the present embodiment; The minimum overlay area A refers to that first pin 211 can reach the predetermined required minimum overlay area of electric connection standard with corresponding second pin 221, so minimum overlay refers to that apart from G first pin 211 can reach the predetermined required minimum overlay distance of electric connection standard with corresponding second pin 221.In the present embodiment; Minimum overlay apart from G greater than 0 micron (μ m); And be less than or equal to 8 microns (μ m), and preferable between 4 microns (μ m) and 5 microns (μ m), but change and the live width of visual first pin 211 and second pin 221 is different not as limit.For example, surperficial 211D and each corresponding second pin 221 have a minimum overlay area A and can be 4000 square microns (μ m on each first pin 211
2), each second pin 221 length W vertically can be 1000 microns (μ m), and then the minimum overlay of 221 of each first pin 211 and each corresponding second pins is 4 microns (μ m) apart from G, but does not exceed with above-mentioned numerical value.
In addition, in the present embodiment, surperficial 211D has one in the horizontal direction apart from E on each first pin 211, and the second left side 221A and the second right edge 221B of each second pin 221 have one in the horizontal direction apart from B.Each first pin 211 and each corresponding second pin 221 are on a first direction R1, and for example to the right direction has a permissible peak excursion scope H.In other words, the applying skew that each first pin 211 of flexible PCB bonding structure 20 and each corresponding second pin 221 cause because of the bit errors of board in the dimensional tolerance of each assembly or the processing procedure all can be accepted in this peak excursion scope H.Utilize the above-mentioned formula 1 of formula 2 collocation can calculate each first pin 211 and the permissible peak excursion scope H of each corresponding second pin 221 on first direction R1.What be worth explanation is, is example with the first direction in the present embodiment, but not as limit.For example, each first pin 211 and each corresponding second pin 221 be at a second direction R2, left direction for example, and peak excursion scope H also can use formula 2 collocation formula 1 to calculate.What be worth explanation is that in the present embodiment, peak excursion scope H is between 0 micron (μ m) and 15 microns (μ m), and is preferable between 8 microns (μ m) and 13 microns (μ m), but do not exceed with above-mentioned numerical value.
In addition, the lower surface 211C of each first pin 211 has a live width D.The second left side 221A and the second right edge 221B of each second pin 221 have a live width B in the horizontal direction, and each 221 adjacent of second pin has a spacing C.Each side-play amount mark will 222 is arranged at respectively between each second adjacent pin 221.In the present embodiment, each side-play amount mark will 222 is by triangle pattern and another the inverted triangle pattern be combined into just put, and these two triangle patterns are provided with a dislocation mode on horizontal direction, but not as limit.For example, side-play amount mark will 222 also can be at least one geometry that two datum marks are provided.In the present embodiment,, make the left datum mark 222A of each side-play amount mark will 222 and right datum mark 222B have one in the horizontal direction, in order to whether qualified skew the function of judge fitting to be provided apart from J through the mode that this kind shifts to install.In the present embodiment, utilize between 221 of the peak excursion scope H, each second pin 221 live width B, each adjacent second pin in the horizontal direction define each side-play amount mark will 222 apart from the relativeness between the live width D of the lower surface 211C of C and each first pin 211 left datum mark 222A and right datum mark 222B in the horizontal direction apart from J.In other words, the left datum mark 222A of each side-play amount mark will 222 and right datum mark 222B calculating in the horizontal direction apart from J formula 3 capable of using.In addition, in the present embodiment, summit on the following summit that the left datum mark 222A of side-play amount mark will 222 and right datum mark 222B are respectively inverted triangle pattern and the triangle pattern of just putting, but not as limit.
In addition, in the present embodiment, on first direction R1, lower surface 211C and each corresponding 221 adjacent of second pin of each first pin 211 have one apart from I.Utilize the second left side 221A and the second right edge 221B the defining in the horizontal direction of live width D, second pin 221 of the lower surface of first pin 211 apart from the peak excursion scope H apart from 221 of C and first pin 211 and corresponding second pins between 221 of the B, adjacent two second pins apart from I.In other words, the lower surface 211C of each first pin 211 and each corresponding 221 adjacent of second pin have one and calculate apart from I formula 4 capable of using.What be worth explanation is, is example with first direction R1 in the present embodiment, but not as limit.For example, on second direction, also can use formula 4 to calculate apart from I and try to achieve.
Through above-mentioned formula, can calculate the left datum mark 222A of side-play amount mark will 222 and the position of right datum mark 222B, and as the bonding structure of judging flexible PCB benchmark whether up to specification.Bonding structure and its decision method of the making flexible PCB of present embodiment comprise the following step.At first; One flexible PCB 21 is provided; It comprises many first pins 211, and each first pin 211 has a lower surface 211C and a upper surface 211D, and the lower surface 211C of first pin 211 makes first pin 211 respectively have a trapezoidal section shape greater than upper surface 211D.Then, a substrate 22 is provided, it comprises many second pins 221, and a plurality of side-play amount mark will 222 lays respectively between the second adjacent pin 221.Each second pin 221 has one second left side 221A and one second right edge 221B; And the second adjacent pin 221 has a spacing C on a horizontal direction; Each side-play amount mark will has a left datum mark 222A and a right datum mark 222B, and the left datum mark 222A of each side-play amount mark will 222 and right datum mark 222B have one in the horizontal direction apart from J.Subsequently, surperficial 211D on first pin 211 is fitted on the second corresponding pin 221, surperficial 211D and corresponding second the pin 221 overlapping and electric connection of part at least on first pin 211 promptly form the bonding structure 20 of flexible PCB.Hereinafter will utilize a vertical extent line and the vertical extent line of right datum mark 222B of the left datum mark 222A of each side-play amount mark will 222 to the present invention, carry out the various situations that a skew skew judges and describe.
Please refer to Fig. 4 A, Fig. 4 B and Fig. 4 C.Fig. 4 A and Fig. 4 B have illustrated the flexible PCB bonding structure and when squinting, have judged qualified sketch map left, and Fig. 4 C has illustrated the flexible PCB bonding structure and when squinting, judged underproof sketch map left.Shown in Fig. 4 A and Fig. 4 B; Be positioned at the right side of vertical extent line L1 of left datum mark 222A of side-play amount mark will 222 of the adjacent left-hand of corresponding second pin 221 as the first left side 211A of each first pin 211; Or when the first left side 211A of each first pin 211 is positioned on the vertical extent line L1 of left datum mark 222A of side-play amount mark will of adjacent left-hand of corresponding second pin 221, then judge to be that left side-play amount is up to specification.On the other hand; Shown in Fig. 4 C; When the first left side 211A of each first pin 211 was positioned at the left side of vertical extent line L1 of left datum mark 222A of side-play amount mark will 222 of adjacent left-hand of corresponding second pin 221, then the left side-play amount of the bonding structure 20 of this flexible PCB was judged defective.
Please again with reference to figure 5A, Fig. 5 B and Fig. 5 C.Fig. 5 A and Fig. 5 B have illustrated the bonding structure of flexible PCB and when squinting, have judged qualified sketch map to the right, and Fig. 5 C has illustrated the bonding structure of flexible PCB and when squinting, judged underproof sketch map to the right.Be positioned at the left side of vertical extent line L2 of right datum mark 222B of side-play amount mark will 222 on the adjacent right side of corresponding second pin 221 as the first right edge 211B of each first pin 211, like Fig. 5 A; Or when the first right edge 211B of each first pin 211 is positioned on the vertical extent line L2 of right datum mark 222B of side-play amount mark will 222 on adjacent right side of corresponding second pin 221; Shown in Fig. 5 B; The bonding structure 20 of then judging this flexible PCB is for qualified, and promptly right side-play amount is up to specification.On the other hand; When the first right edge 211B of each first pin 211 is positioned at the right side of vertical extent line L2 of right datum mark 222B of side-play amount mark will 222 on adjacent right side of corresponding second pin 221; Shown in Fig. 5 C; The bonding structure 20 of then judging this flexible PCB is for defective, and promptly right side-play amount exceeds specification.
In sum; Flexible PCB bonding structure of the present invention is provided with one and has the side-play amount mark will of a left datum mark and a right datum mark between each adjacent second pin on the substrate; Can bring into play the function of judging that the flexible PCB bonding structure is whether qualified, so can significantly save the detection time when manufacturing.
The above is merely preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (8)
1. the bonding structure of a flexible PCB comprises:
One flexible PCB comprises many first pins, and respectively this first pin has one first left side and one first right edge; And
One substrate; Comprise many second pins and a plurality of side-play amount mark will; Respectively this second pin has one second left side and one second right edge, and two adjacent said second pins have a spacing on a horizontal direction, and respectively this side-play amount mark will is arranged at respectively between two adjacent said second pins; And have a left datum mark and a right datum mark, and respectively this left side datum mark and this right side datum mark of this side-play amount mark will have a distance on this horizontal direction;
Wherein, Respectively this first pin and electric connection at least partly overlapping with this corresponding second pin; This first left side is no more than the left side of a corresponding vertical extent line that should left side datum mark, and this first right edge is no more than the right side of a corresponding vertical extent line that should right side datum mark.
2. the bonding structure of flexible PCB according to claim 1; It is characterized in that; Respectively this side-play amount mark will comprises a triangle pattern and the inverted triangle pattern just put, and this triangle pattern of just putting is to be the dislocation mode to be provided with on this horizontal direction with this inverted triangle pattern.
3. the bonding structure of flexible PCB according to claim 2 is characterized in that, respectively this left side datum mark of this side-play amount mark will and this right side datum mark be respectively the summit of this inverted triangle pattern and triangle pattern that this is just being put one on the summit.
4. the bonding structure of flexible PCB according to claim 1; It is characterized in that; Respectively this first pin has an a lower surface and a upper surface; This lower surface makes this first pin respectively have a trapezoidal section shape greater than this upper surface, and respectively this upper surface of this first pin fits on corresponding this second pin.
5. the bonding structure of flexible PCB according to claim 4 is characterized in that, respectively an overlap distance G coincidence formula 1 of this upper surface of this first pin and corresponding respectively this second pin:
formula 1
Wherein A is a minimum contact area of this upper surface with corresponding respectively this second pin of respectively this first pin, and W be respectively this second pin along a length of a vertical direction.
6. the bonding structure of flexible PCB according to claim 5 is characterized in that, respectively this first pin is with respect to a peak excursion scope H coincidence formula 2 of this corresponding second pin respectively:
Wherein B is this second left side of respectively this second pin and the distance between this second right edge, and E be respectively this first pin this upper surface one on live width.
7. the bonding structure of flexible PCB according to claim 6 is characterized in that, respectively this left side datum mark of this side-play amount mark will and this right side datum mark at this of this horizontal direction apart from J coincidence formula 3:
Wherein C is adjacent two said second pins this spacing on this horizontal direction, and D is the live width of this lower surface of respectively this first pin.
8. method of making the bonding structure of flexible PCB comprises:
One flexible PCB is provided; It comprises many first pins; Respectively this first pin has an a lower surface and a upper surface, and this lower surface makes this first pin respectively have a trapezoidal section shape greater than this upper surface, and respectively this first pin has one first left side and one first right edge;
One substrate is provided; It comprises many second pins; And a plurality of side-play amount mark will lay respectively between two adjacent said second pins, and respectively this second pin has one second left side and one second right edge, and adjacent said second pin has a spacing on a horizontal direction; Respectively this side-play amount mark will has a left datum mark and a right datum mark, and respectively this left side datum mark and this right side datum mark of this side-play amount mark will have a distance on this horizontal direction;
This upper surface of said first pin is fitted on corresponding said second pin, and respectively this upper surface and electric connection at least partly overlapping with this corresponding second pin of this first pin; And
Utilize respectively a vertical extent line of this left side datum mark of this side-play amount mark will and a vertical extent line of this right side datum mark, carry out a bias criterion;
Wherein, when this first left side of this first pin respectively is positioned at the right side of this vertical extent line of this left side datum mark of this side-play amount mark will of the adjacent left-hand of corresponding this second pin, judge that then left side-play amount is up to specification; And
Wherein, when this first right edge of this first pin respectively is positioned at the left side of this vertical extent line of this right side datum mark of this side-play amount mark will on the adjacent right side of corresponding this second pin, judge that then right side-play amount is up to specification.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99143447A TWI384912B (en) | 2010-12-13 | 2010-12-13 | Attachment structure of flexible circuit board and method of making the same |
| TW099143447 | 2010-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102076169A CN102076169A (en) | 2011-05-25 |
| CN102076169B true CN102076169B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100266548A Expired - Fee Related CN102076169B (en) | 2010-12-13 | 2011-01-17 | Flexible circuit board attaching structure and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102076169B (en) |
| TW (1) | TWI384912B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060112A (en) * | 2007-06-11 | 2007-10-24 | 友达光电股份有限公司 | Baseplate alignment system and its alignment method |
| CN101146402A (en) * | 2007-10-29 | 2008-03-19 | 友达光电股份有限公司 | Circuit welding pad structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3727645B2 (en) * | 2002-10-28 | 2005-12-14 | 松下電器産業株式会社 | Wiring board connection structure and liquid crystal display panel connection structure |
| GB0517929D0 (en) * | 2005-09-02 | 2005-10-12 | Xaar Technology Ltd | Method of printing |
-
2010
- 2010-12-13 TW TW99143447A patent/TWI384912B/en not_active IP Right Cessation
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2011
- 2011-01-17 CN CN2011100266548A patent/CN102076169B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060112A (en) * | 2007-06-11 | 2007-10-24 | 友达光电股份有限公司 | Baseplate alignment system and its alignment method |
| CN101146402A (en) * | 2007-10-29 | 2008-03-19 | 友达光电股份有限公司 | Circuit welding pad structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102076169A (en) | 2011-05-25 |
| TW201225755A (en) | 2012-06-16 |
| TWI384912B (en) | 2013-02-01 |
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