CN103823913A - Method for arranging jointing parts of circuit board - Google Patents
Method for arranging jointing parts of circuit board Download PDFInfo
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- CN103823913A CN103823913A CN201210470203.8A CN201210470203A CN103823913A CN 103823913 A CN103823913 A CN 103823913A CN 201210470203 A CN201210470203 A CN 201210470203A CN 103823913 A CN103823913 A CN 103823913A
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Abstract
Disclosed is a method for arranging jointing parts of a circuit board. The method is suitable for electronic devices. The method includes receiving a configuration instruction; placing the jointing parts at a starting position in a layout chart of the circuit board; starting from the starting position, sequentially and automatically placing other jointing parts, wherein distance between any two adjacent jointing parts is within a configuration distance range; checking whether distances between the jointing parts and multiple electronic parts meet specified specification or not, and if not, automatically adjusting jointing positions of the jointing parts on the layout chart according to the specified specification.
Description
Technical field
The invention relates to a kind of layout (Layout) of circuit board, and relate to especially a kind of assembling parts method for arranging of circuit board.
Background technology
Generally speaking,, in the design of printed circuit board (PCB) (Printed Circuit Board, PCB), inevitably need planned waste limit.At present, mostly using coil type automatically to engage (TapeAutomated Bonding, TAB) part (beneath abbreviation TAB part) realizes between printed circuit board (PCB) and waste material limit and connecting.That is, TAB part is connecting waste material limit, and making waste material limit is that P.e.c. combination provides support in (Printed CircuitAssembly, PCA) time.After P.e.c. has combined, the effect on waste material limit also just disappears, and therefore just needs waste material sideline judge to remove.
Producing on line, be generally to utilize drill point cutting machine to cut out to remove waste material limit.Accordingly, when the position of TAB placing part will have influence on cutting, whether can damage the electronic component having assembled.For example, if TAB placing part is too many, represent that the spacing between TAB part is too close, will increase the time of cutting; If TAB placing part very little, anchorage force can be not enough.Therefore while, figure in layout, just should consider in advance the putting position of TAB part.
Traditionally, the position of TAB part is to be decided in its sole discretion by layout slip-stick artist, checks that whether the position of TAB placing part is suitable more afterwards by brilliance design (designfor excellence, DFx) slip-stick artist., after manually first putting TAB part, more manually measure TAB part apart from the safe distance between other electronic components.If DFx slip-stick artist finds that the position of TAB placing part is inappropriate, problem is fed back to layout slip-stick artist, use and modify.To expend the much time one time thus, efficiency is not high.
Summary of the invention
The invention provides a kind of assembling parts method for arranging of circuit board, can robotization check whether the position that assembling parts is put meets appointment specification.
The present invention proposes a kind of assembling parts method for arranging of circuit board, is suitable for an electronic installation.In the method, receive configuration-direct, an assembling parts is wherein placed to the reference position in the layout of circuit board, and from reference position, sequentially automatically place all the other assembling parts, wherein the distance between any two adjacent assembling parts is in a configuration distance range; Afterwards, check whether the distance between assembling parts and multiple electronic component meets appointment specification, if the incongruent appointment specification of assembling parts, according to specifying specification automatically to adjust the bonding station of assembling parts on layout.
In one embodiment of this invention, said method more comprises: assembling parts is placed on to the bonding station in layout, increases the scope that extends out that engages.To in joint extends out scope, there is the assembling parts of electronic component, be judged to be not meet appointment specification.
In one embodiment of this invention, to extend out scope be for example 0.04 inch (inch) to above-mentioned joint.
In one embodiment of this invention, said method more comprises: each electronic component is placed on to the part position in layout, increases part and extend out scope.If there is assembling parts in part extends out scope, judge that above-mentioned assembling parts does not meet appointment specification.
In one embodiment of this invention, above-mentioned each electronic component is placed on to the part position in layout, increases the step that part extends out scope and comprise: judge the part height of each electronic component, extend out scope to set the part that each electronic component is corresponding.For example, in the time judging that part height is less than or equal to the first height (being 0.1 inch), the distance that setting part extends out scope is more than or equal to the first distance (being for example 0.04 inch); For example, in the time judging that part height is greater than the first height and is less than or equal to the second height (being 0.06 inch), the distance that setting part extends out scope is more than or equal to second distance (being for example 0.06 inch); And in the time judging that part height is greater than the second height, the distance that setting part extends out scope is more than or equal to the 3rd distance (being for example 0.2 inch).Wherein second is highly greater than the first height, and second distance is greater than the first distance, and the 3rd distance is greater than second distance.
In one embodiment of this invention, said method, more comprises: in the time of the described assembling parts of each placement automatically, judge whether the bonding station of described assembling parts has exceeded the configure boundaries of layout.Above-mentioned bonding station is to be started by reference position, and the distance between the cumulative described assembling parts according to arranging obtains.If bonding station has exceeded the configure boundaries of layout, stop placing described assembling parts.
In one embodiment of this invention, above-mentioned configuration distance range is for being more than or equal to 1 inch, and is less than or equal to 2 inches.
In one embodiment of this invention, if the incongruent appointment specification of above-mentioned assembling parts also can be pointed out notification message.
In one embodiment of this invention, above-mentioned assembling parts is for example the automatic assembling parts of coil type.
Based on above-mentioned, after placing the bonding station of first assembling parts, just can automatically place another assembling parts every a configuration distance, then check respectively whether the bonding station of other assembling parts meets appointment specification, if just do not met according to specifying specification to finely tune.Accordingly, put correctly the position by assembling parts that can be correct fast, has improved the quality of design simultaneously and promoted the efficiency designing.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the process flow diagram according to the assembling parts method for arranging of the circuit board of first embodiment of the invention.
Fig. 2 A ~ Fig. 2 C is the part schematic diagram that is disposed at circuit board according to the assembling parts of first embodiment of the invention.
Fig. 3 is the process flow diagram according to the assembling parts method for arranging of the circuit board of second embodiment of the invention.
Fig. 4 is the schematic diagram according to the installation region of the assembling parts of second embodiment of the invention.
Fig. 5 is the part schematic diagram according to the circuit board of second embodiment of the invention.
[main element symbol description]
201,500: circuit board
202: waste material limit
203,204,205:TAB part
206,207,501,502: electronic component
D1, d2, d3, d4: distance
410,503 ~ 506: assembling parts
511,512: part extends out scope
S105 ~ S115: the each step of assembling parts method for arranging of circuit board
S305 ~ S335: the each step of assembling parts method for arranging of circuit board
Embodiment
General in the time of the layout of design circuit plate, for the position of putting for connecting printed circuit board (PCB) (Printed Circuit Board, PCB) and the assembling parts on waste material limit, be all to design by manual type, but so the practice is quite time-consuming.For this reason, the present invention proposes a kind of assembling parts method for arranging of circuit board, can robotization check whether the position that assembling parts is put meets appointment specification.In order to make content of the present invention more clear, below the example that really can implement according to this as the present invention especially exemplified by embodiment.Down below in embodiment, respectively graphicly represent identical or equal inscape, member and processing with same-sign, and suitably the repetitive description thereof will be omitted.And beneath example is only not to invent for limiting for example, all features that example is described or its combination the nonessential essence that is limited to invention.
the first embodiment
Fig. 1 is the process flow diagram according to the assembling parts method for arranging of the circuit board of first embodiment of the invention.In the present embodiment, assembling parts method for arranging is to complete robotization by electronic installation.For example, at the storage element of electronic installation, one layout software (being for example Allegro) is installed, after mounting arrangement software, just can carries out the various functions in layout software by the processing unit of electronic installation.
Please refer to Fig. 1, in step S105, receive configuration-direct, one of them assembling parts is placed to the reference position in the layout of circuit board.For example, determined the reference position of first assembling parts by user, assign configuration-direct by an input block.In addition, can also be to be assigned voluntarily above-mentioned configuration-direct according to the layout type of electronic component by layout software.In the present embodiment, circuit board is for example printed circuit board (PCB), and assembling parts for example engages (Tape Automated Bonding, TAB) part (beneath abbreviation TAB part) automatically for coil type.
In addition, in other embodiments, the position of stamp hole can also be set between circuit board and waste material limit.So-called stamp hole is on circuit board, to bore some holes, after the assembling parts that object is to be convenient to circuit board completes, carries out the cutting between circuit board and waste material limit, and the shape after having cut is divided the hole of connection as stamp.
Then,, in step S110, from reference position, sequentially automatically place all the other assembling parts.At this, the distance between any two adjacent assembling parts is in a configuration distance range.With software implementation, for example, be to copy first assembling parts, and sticking every the distance of 2 inches (inch) using as another assembling parts, by that analogy.
Afterwards, in step S115, do not meet and specify specification in the distance between assembling parts and electronic component, according to specifying specification automatically to adjust the bonding station of assembling parts on layout.For example, in configuration distance range, adjust the bonding station of assembling parts, make it meet appointment specification.
With the specification requirement in brilliance design (design for excellence, DFx), the bonding station that TAB part is configured in circuit board at least will meet three conditions.First condition is, distance between two adjacent TAB parts will be at a configuration distance range, and this configures distance range for being more than or equal to 1 inch, and is less than or equal to 2 inches, the distance minimum between two adjacent TAB parts is 1 inch, is 2 inches to the maximum.Second condition be, the distance of the perforation part in TAB part and circuit board or surface mount part (Surface Mount Device, SMD) is greater than or equals 40 Mills (mil).The 3rd condition be, TAB part is greater than or equals 200 Mills to the distance of right angle (RightAngle) part of outstanding edges of boards or high connector.That is to say, with DFx specification, specify specification to comprise second condition and the 3rd condition.
Beneath bright for instance with regard to the distance in above-mentioned three conditions.Fig. 2 A ~ Fig. 2 C is the part schematic diagram that is disposed at circuit board according to the assembling parts of first embodiment of the invention.In Fig. 2 A, between circuit board 201 and waste material limit 202, be connected by TAB part 203,204,205.Wherein, the distance d1 between TAB part 203 and TAB part 204, and distance d2 between TAB part 204 and TAB part 205 is for example 2 inches.In Fig. 2 B, in circuit board 201 plates, there is electronic component 206, this electronic component 206 is for example surface mount part.Distance d3 between electronic component 206 and TAB part 204 is more than or equal to 40 Mills (mil).In Fig. 2 C, circuit board 201 has electronic component 207, and this electronic component 207 is for example for giving prominence to the right angle part of edges of boards.Distance d4 between electronic component 207 and TAB part 204 is more than or equal to 200 Mills (mil).
In the present embodiment, for example can be according to the specification of DFx, above-mentioned second condition and Article 3 part are included in to the data bank of electronic installation, carry out self-verifying for electronic installation., in data bank, store appointment specification.For example, according to the part position at other electronic component places in the bonding station of assembling parts and circuit board, calculate the distance between assembling parts and each electronic component, and the data in data bank compared is to judge whether to meet appointment specification.
the second embodiment
In the present embodiment, utilize between electronic component at a distance of producing the characteristic of interfering in the interior meeting of a distance, and each electronic component has the characteristic without probe area (no probe area) that can not add test point, assembling parts is placed on to the bonding station in layout, increase by one and engage the scope that extends out, and electronic component is placed on to the part position in layout, and increase part and extend out scope, can be convenient to by this check whether the distance between assembling parts and electronic component accords with appointment specification.,, by judging above-mentioned joint extends out in scope whether have other electronic components, check whether the distance between assembling parts and each electronic component meets appointment specification; Or, by judging part extends out in scope whether have assembling parts, check whether the distance between assembling parts and each electronic component meets appointment specification.Under lift again one example explanation.
Fig. 3 is the process flow diagram according to the assembling parts method for arranging of the circuit board of second embodiment of the invention.Identical with the first embodiment, be to complete robotization by electronic installation equally at the assembling parts method for arranging of the present embodiment.For example, at the storage element of electronic installation, one layout software (being for example Allegro) is installed, after mounting arrangement software, just can carries out the various functions in layout software by the processing unit of electronic installation.
Please refer to Fig. 1, in step S305, receive configuration-direct, one of them assembling parts is placed to the reference position in the layout of circuit board.Then,, in step S310, from reference position, sequentially automatically place all the other assembling parts.At this, the distance between any two adjacent assembling parts is in a configuration distance range.Above-mentioned steps S305 is identical with step S110 with the step S105 of the first embodiment respectively with step S310, therefore no longer describe in detail.
Then, execution step S315 and step S320, use the distance checking between assembling parts and electronic component and whether meet appointment specification.That is, can be placed on the bonding station in layout to assembling parts, increase the scope that extends out that engages, and, each electronic component is placed on to the part position in layout, increase part and extend out scope.
In step S315, judge at the joint of each assembling parts to extend out in scope, whether to there is electronic component.Under enumerate an example and illustrate to engage and extend out scope.Fig. 4 is the schematic diagram according to the installation region of the assembling parts of second embodiment of the invention (place bound).Please refer to Fig. 4, the width (i.e. reserved width) of the groove in the middle of assembling parts 410 is 0.125 inch, extends out a distance and is formed with the scope that extends out that engages from the edge of its bonding station.For example, the width of cutting bit is 0.063 inch, counts and extends out 0.04 inch from drill bit limit, is the scope that extends out that engages.If extend out and have electronic component in scope at the joint of assembling parts 410, represent that the distance between this assembling parts 410 and electronic component is less than the distance of regulation, so, in the time of the follow-up cutting of carrying out between circuit board and waste material limit, likely damage electronic component.
Accordingly, when there being electronic component to be less than 40 Mills from the distance of edges of boards, and when side has the assembling parts of placement just, now, assembling parts will be interfered with this electronic component, therefore, layout software also can further be pointed out a notification message, allows by this user learn that this place is to place assembling parts at present.
Return to Fig. 3, in step S315, if extend out in scope and have electronic component at the joint of assembling parts, execution step S325, according to specifying specification automatically to adjust the bonding station of assembling parts.For example, in configuration distance range, translation one fine setting distance (being for example 1 Mill or other numerals) gradually, and stop translation motion there is not electronic component in joint extends out scope time.Suppose that two distances between adjacent assembling parts are 2 inches to the maximum, minimum is 1 inch, configures distance range and is: be more than or equal to 1 inch, and be less than or equal to 2 inches.
Then, if extend out in scope and do not have electronic component at the joint of assembling parts, further perform step S320, judge at the part of electronic component to extend out in scope, whether to there is assembling parts.Under enumerate an example and illustrate that part extends out scope.Fig. 5 is the part schematic diagram according to the circuit board of second embodiment of the invention.Please refer to Fig. 5, circuit board 500 comprises not electronic component of label of assembling parts 503 ~ 506, electronic component 501, electronic component 502 and other.With the electronic component 501 on circuit board 500 and electronic component 502, it extends out a distance and is formed with that part extends out scope 511 and part extends out scope 512 from the edge of its part position respectively.
In addition, also can further judge the part height of each electronic component, use part corresponding to the each electronic component of setting and extend out scope.For example, for example, in the time judging that part height is less than or equal to the first height (being 0.1 inch), the distance that setting part extends out scope is more than or equal to the first distance (being for example 0.04 inch); For example, in the time judging that part height is greater than the first height and is less than or equal to the second height (being 0.06 inch), the distance that setting part extends out scope is more than or equal to second distance (being for example 0.06 inch); And in the time judging that part height is greater than the second height, the distance that setting part extends out scope is more than or equal to the 3rd distance (being for example 0.2 inch).Wherein second is highly greater than the first height, and second distance is greater than the first distance, and the 3rd distance is greater than second distance.
Accordingly, as long as the entity of assembling parts is not in part extends out scope, just represent that the bonding station of placing is to meet appointment specification.If have assembling parts and extend out scope at part, represent that the distance between this assembling parts and electronic component is less than the distance of regulation.
Return to Fig. 3, in step S320, if having assembling parts in part extends out scope, execution step S325, according to specifying specification automatically to adjust the bonding station of this assembling parts.For example, translation one fine setting distance makes the part that leaves electronic component at this assembling parts extend out scope.
In other embodiments, also can first perform step S320, then perform step S315; Or step S315, step S320 only select one and carry out, and do not limit at this.
Then, in the case of judging that the distance between assembling parts and electronic component meets appointment specification, as shown in step S330, in the time of each assembling parts of placement automatically, judge whether the bonding station (started by reference position, the distance between the cumulative assembling parts of sequentially arranging obtains) of assembling parts has exceeded the configure boundaries of layout., whether decision circuitry plate also has place can place assembling parts.If bonding station has exceeded the configure boundaries of layout, execution step S335, stops placing assembling parts.On the other hand, if bonding station not yet exceedes the configure boundaries of layout, return to execution step S310, sequentially automatically place all the other assembling parts.
Separately, if the incongruent appointment specification of above-mentioned assembling parts, that is, the "Yes" of the "Yes" of step S315 and step S320, after execution step S325 readjusts the bonding station of assembling parts, execution step S330.And, in the time judging the incongruent appointment specification of above-mentioned assembling parts, also can further point out a notification message, be for example message message or message language etc.
By repeating above-mentioned steps S310 ~ S330, just can realize the robotization that configures assembling parts on circuit board.Key point is the bonding station that first assembling parts configures, other assembling parts are as long as configure one by one, and coordinate above-mentioned appointment specification automatically to finely tune toward a direction (or simultaneously toward two relative directions) beginning apart from automatic every one.The reference position of above-mentioned first assembling parts can also be selected arbitrarily by electronic installation, checks whether will finely tune reference position more afterwards according to above-mentioned appointment specification.
In sum, by the implementation of above-described embodiment, reduce the time that this flow process of artificial design, inspection and modification is wasted, promoted design efficiency, can fast and correctly the bonding station of assembling parts be arranged on to suitable place.In addition, by the implementation of above-described embodiment, not only can promote the correctness of design, also can not increase cost.In addition, joint is extended out to scope or part and extend out scope and be shown on layout, make in range estimation more directly perceived.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on accompanying claim.
Claims (10)
1. an assembling parts method for arranging for circuit board, is suitable for an electronic installation, and the method comprises:
Receive a configuration-direct, by a plurality of assembling parts, one of them is placed to the reference position in a layout of a circuit board;
From this reference position, sequentially automatically place all the other those assembling parts, wherein the distance between any two adjacent assembling parts is in a configuration distance range;
Check whether the distance between multiple electronic components of each those assembling parts respectively and on this layout meets an appointment specification; And
If incongruent this appointment specification of described assembling parts, adjusts the bonding station of described assembling parts on this layout automatically according to this appointment specification.
2. the method for claim 1, is characterized in that, more comprises:
Each those assembling parts is placed on to this bonding station in this layout, increases by one and engage the scope that extends out;
Wherein, the step that checks this appointment the specification whether distance of each those assembling parts respectively and between those electronic components meet comprises:
In scope, there is one of them described assembling parts of those electronic components by extending out at this joint, be judged to be not meet this appointment specification.
3. method as claimed in claim 2, is characterized in that, it is to extend out 0.04 inch from the edge of this bonding station that this joint extends out scope.
4. the method for claim 1, is characterized in that, more comprises:
Each those electronic component is placed on to the part position in this layout, increases by a part and extend out scope;
Wherein, the step that checks this appointment the specification whether distance of each those assembling parts respectively and between those electronic components meet comprises:
By being positioned at this part and extending out the described assembling parts of scope, be judged to be not meet this appointment specification.
5. method as claimed in claim 4, is characterized in that, each those electronic component is placed on to this part position in this layout, increases the step that this part extends out scope and comprises:
Judge a part height of each those electronic component, extend out scope to set this part that each those electronic component is corresponding, comprising:
When judging that this part height was less than or equal to for one first when height, set the distance that this part extends out scope and be more than or equal to one first distance;
When judging that this part height is greater than this first height and was less than or equal to for one second when height, set the distance that this part extends out scope and be more than or equal to a second distance, wherein this second is highly greater than this first height, and this second distance is greater than this first distance; And
When judging that this part height is greater than this second when height, set the distance that this part extends out scope and be more than or equal to one the 3rd distance, wherein the 3rd distance is greater than this second distance.
6. method as claimed in claim 5, is characterized in that, this first is highly 0.1 inch, and this second is highly 0.2 inch, and this first distance is 0.04 inch, and this second distance is 0.06 inch, and the 3rd distance is 0.2 inch.
7. the method for claim 1, is characterized in that, this configuration distance range is for being more than or equal to 1 inch, and is less than or equal to 2 inches.
8. the method for claim 1, is characterized in that, more comprises:
In the time of the described assembling parts of each placement automatically, judge whether the bonding station of described assembling parts has exceeded the configure boundaries of this layout, wherein this bonding station is to be started by this reference position, and the distance between the cumulative described assembling parts of sequentially arranging obtains; And
If this bonding station has exceeded the configure boundaries of this layout, stop placing described assembling parts.
9. the method for claim 1, is characterized in that, if incongruent this appointment specification of described assembling parts more comprises:
Point out a notification message.
10. the method for claim 1, is characterized in that, described assembling parts is the automatic assembling parts of coil type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210470203.8A CN103823913A (en) | 2012-11-19 | 2012-11-19 | Method for arranging jointing parts of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210470203.8A CN103823913A (en) | 2012-11-19 | 2012-11-19 | Method for arranging jointing parts of circuit board |
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| CN103823913A true CN103823913A (en) | 2014-05-28 |
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| CN201210470203.8A Pending CN103823913A (en) | 2012-11-19 | 2012-11-19 | Method for arranging jointing parts of circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107728037A (en) * | 2016-08-11 | 2018-02-23 | 英业达科技有限公司 | Power signal lines check device and method |
| CN109270084A (en) * | 2018-11-02 | 2019-01-25 | 郑州云海信息技术有限公司 | The method, apparatus and medium of PCB mass are determined based on detection ICT measuring point |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1987874A (en) * | 2005-12-21 | 2007-06-27 | 英业达股份有限公司 | Method for verifying part placing distance with dynamic regulation part height parameter |
| US20080077898A1 (en) * | 2006-09-27 | 2008-03-27 | Cadence Design Systems, Inc. | Placer with wires for RF and analog design |
| CN101221971A (en) * | 2007-01-11 | 2008-07-16 | 奇晶光电股份有限公司 | Plane display device and its testing method |
| CN102479274A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Method for setting routing line width of printed circuit board |
-
2012
- 2012-11-19 CN CN201210470203.8A patent/CN103823913A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1987874A (en) * | 2005-12-21 | 2007-06-27 | 英业达股份有限公司 | Method for verifying part placing distance with dynamic regulation part height parameter |
| US20080077898A1 (en) * | 2006-09-27 | 2008-03-27 | Cadence Design Systems, Inc. | Placer with wires for RF and analog design |
| CN101221971A (en) * | 2007-01-11 | 2008-07-16 | 奇晶光电股份有限公司 | Plane display device and its testing method |
| CN102479274A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Method for setting routing line width of printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107728037A (en) * | 2016-08-11 | 2018-02-23 | 英业达科技有限公司 | Power signal lines check device and method |
| CN109270084A (en) * | 2018-11-02 | 2019-01-25 | 郑州云海信息技术有限公司 | The method, apparatus and medium of PCB mass are determined based on detection ICT measuring point |
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Application publication date: 20140528 |