CN102074533B - 用于电子芯片散热的传热装置 - Google Patents
用于电子芯片散热的传热装置 Download PDFInfo
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- CN102074533B CN102074533B CN 201010583963 CN201010583963A CN102074533B CN 102074533 B CN102074533 B CN 102074533B CN 201010583963 CN201010583963 CN 201010583963 CN 201010583963 A CN201010583963 A CN 201010583963A CN 102074533 B CN102074533 B CN 102074533B
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- heat transfer
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- 230000017525 heat dissipation Effects 0.000 title abstract 2
- 239000012809 cooling fluid Substances 0.000 claims description 31
- 230000005855 radiation Effects 0.000 claims description 27
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 241001191009 Gymnomyza Species 0.000 description 1
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201010583963 CN102074533B (zh) | 2010-12-13 | 2010-12-13 | 用于电子芯片散热的传热装置 |
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CN 201010583963 CN102074533B (zh) | 2010-12-13 | 2010-12-13 | 用于电子芯片散热的传热装置 |
Publications (2)
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CN102074533A CN102074533A (zh) | 2011-05-25 |
CN102074533B true CN102074533B (zh) | 2012-12-26 |
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CN 201010583963 Expired - Fee Related CN102074533B (zh) | 2010-12-13 | 2010-12-13 | 用于电子芯片散热的传热装置 |
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CN (1) | CN102074533B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111991828B (zh) * | 2020-09-29 | 2022-04-15 | 广州市爱百伊生物技术有限公司 | 一种柔嫩修复精华液的提纯装置及方法 |
CN113137885A (zh) * | 2021-03-22 | 2021-07-20 | 广东工业大学 | 一种高速回流散热式均热板 |
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CN102074533A (zh) | 2011-05-25 |
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Owner name: CHANGZHOU SHENGFA LAMP BULB FACTORY Free format text: FORMER OWNER: ZHANG YU Effective date: 20140414 |
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Effective date of registration: 20140414 Address after: Wujin hi tech Industrial Development Zone, Changzhou City, Jiangsu Province, 213000 District Industrial Workshop No. 21 Vantaa Patentee after: CHANGZHOU SHENGFA BULB FACTORY Address before: 213000 No. 36 Xixia Town, Xinbei District, Jiangsu, Changzhou Patentee before: Zhang Yu |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20151213 |
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