CN102065637B - Packaging structure with magnetic element and forming method of the packaging structure - Google Patents
Packaging structure with magnetic element and forming method of the packaging structure Download PDFInfo
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- CN102065637B CN102065637B CN 201010147321 CN201010147321A CN102065637B CN 102065637 B CN102065637 B CN 102065637B CN 201010147321 CN201010147321 CN 201010147321 CN 201010147321 A CN201010147321 A CN 201010147321A CN 102065637 B CN102065637 B CN 102065637B
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
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- 238000004519 manufacturing process Methods 0.000 claims description 15
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- 230000002093 peripheral effect Effects 0.000 abstract 3
- 230000000149 penetrating effect Effects 0.000 abstract 2
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- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
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- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
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Abstract
The invention provides a packaging structure with a finger ring type magnetic element and a forming method of the packaging structure. The packaging structure comprises an insulating base plate including a finger ring type groove, an island part and a peripheral part both defined by the finger ring type groove. The finger ring type groove is horizontally located between the island part and the peripheral part. The packaging structure further comprises a finger ring type magnetic element disposed inside the finger ring type groove, an upper wiring layer located on the upper part of the insulating base plate, a lower wiring layer located on the lower part of the insulating base plate, internal electric through holes vertically penetrating the island part and connecting the upper wiring layer and the lower wiring layer, and external electric through holes vertically penetrating the peripheral part and connecting the upper wiring layer and the lower wiring layer. Wherein, the internal electric through holes, the external electric through holes, the upper wiring layer and the lower wiring layer form a conductive coil which encircles the finger ring type magnetic element.
Description
Technical field
The present invention is about encapsulating structure, particularly about having the encapsulating structure that is incorporated into the magnetic element in the printed circuit board (PCB).
Background technology
It has been many inquiry purpose electronic component Development Technology in recent years that magnetic element is incorporated in printed circuit board (PCB) or the semiconductor platform.
The profile of Figure 1A to Fig. 1 C shows traditional method for making that magnetic element is embedded in the printed circuit board (PCB).Shown in Figure 1A, an insulated substrate 100 at first is provided, this insulated substrate 100 can be general epoxy resin glass plate.Form a groove 110 in insulated substrate 100.Then, as shown in Figure 1B, finger ring shape magnetic element 120 is inserted groove 110.Then, shown in Fig. 1 C, epoxy resin coating packaging adhesive material 130 covers magnetic element 120 and groove 110 is filled up and is cured.After glue material 130 to be packaged solidified, contraposition was holed copper facing to form via 140 at the packaging adhesive material 130 of the inside of finger ring shape magnetic element 120.Simultaneously, also contraposition is holed copper facing to form via 150 at the packaging adhesive material 130 of the outside of finger ring shape magnetic element 120.Form metal conductor on surface afterwards again and connect via 140 and 150, so just finish the making around the conductive coil of magnetic element 120.Finish the structure of boring after the copper facing shown in Fig. 1 C.
Conventional art provides a lot of similar above-described structures and the practice, and so these have various shortcomings unavoidably, and therefore the mode of more novel innovation need be arranged, and remedies the deficiency of conventional art.
Summary of the invention
The present invention finds that conventional art has the problem of dysplasia, is difficult to keep out severe environment or is difficult to support the stacked structure of possibility on it.For example packaging adhesive material 130 structures that the present invention finds as the via 140 of Fig. 1 C penetrates are also firm inadequately, and packaging adhesive material 130 also may apply stress improperly to magnetic element 120.Therefore, the present invention proposes to propose a plan at head it off in one side.
On the one hand, the invention provides a kind of encapsulating structure, comprise an insulated substrate, have a finger ring type groove and reach by the defined island part of this finger ring type groove and a periphery, this finger ring type groove is laterally between island part and periphery; One finger ring type magnetic element places this finger ring type groove; On one wiring layer be positioned at this insulated substrate top and once wiring layer be positioned at this insulated substrate below; Electric through-hole vertically penetrates this island part and connects and should go up wiring layer and this time wiring layer in one; And an outer electric through-hole vertically penetrates this periphery and connects and should go up wiring layer and this time wiring layer, wherein is somebody's turn to do interior electric through-hole, this outer electric through-hole, wiring layer and this time wiring layer form a conductive coil around this finger ring type magnetic element on this.
On the other hand, the invention provides a kind of manufacture method of encapsulating structure, comprise providing an electricity to cover insulated substrate, this electricity covers the pre-defined finger ring type zone of insulated substrate, one island part and a periphery, this finger ring type zone are laterally between this island part and this periphery; Formation one interior electric through-hole vertically penetrates this island part and an outer electric through-hole vertically penetrates this periphery; Forming a finger ring type groove covers in this finger ring type zone of insulated substrate at this electricity; Provide a finger ring type magnetic element to place this finger ring type groove; Form on one wiring layer above this electricity covers insulated substrate and once wiring layer below this electricity covers insulated substrate; Make electric through-hole in this, this outer electric through-hole, wiring layer and this time wiring layer are electrically connected to constitute a conductive coil around this finger ring type magnetic element on this.
The present invention comprises that still other aspects are open in detail in the following embodiments to solve other problems and to merge above-mentioned each side.
Description of drawings
Figure 1A to 1C is for showing the profile of conventional package structure.
Fig. 2 A and 2B to Fig. 8 A and 8B are for showing top view and the profile of each step in its manufacturing process of an encapsulating structure according to first embodiment of the invention.
Fig. 9 is the top view according to another encapsulating structure of second embodiment of the present invention illustration.
Figure 10 A, 10B and Figure 11 are for showing following view and the profile of some step in its manufacturing process of another encapsulating structure according to the third embodiment of the present invention, wherein Figure 10 A is following view, and Figure 10 B is the profile along the dotted line I-I ' of Figure 10 A, and Figure 11 is the profile of the step of continuity Figure 10 B.
Figure 12 A and 12B to Figure 16 A and 16B are for showing top view and the profile of each step in its manufacturing process of another encapsulating structure according to fourth embodiment of the invention.
The main element symbol description
100 insulated substrates
110 grooves
120 ring-shaped magnetic elements
130 packaging adhesive materials
140 vias
150 vias
210 electricity cover insulated substrate
211 insulated substrates
212 upper conductor layer
213 lower conductor layer
210r finger ring type zone
210a island part
The 210b periphery
310a, the 310b through hole
Electric through-hole in the 410a
The outer electric through-hole of 410b
420 cap pads
510 finger ring type grooves
The 510a bottom
610 finger ring type magnetic elements
620 gaps
630 spaces
710 dielectric layers
720 conductive layers
Electric through-hole in the 811a upper strata
Electric through-hole outside the 811b upper strata
Electric through-hole in the 812a lower floor
Electric through-hole outside the 812b lower floor
Wiring layer on 821
822 times wiring layers
800,900,1100,1600 encapsulating structures
910 air vent holes
1022 times wiring layers
1210 insulated substrates
1210r finger ring type zone
1210a island part
The 1210b periphery
Electric through-hole in the 1510a
The outer electric through-hole of 1510b
Wiring layer on 1610
1620 times wiring layers
1630 air vent holes
Embodiment
Below with reference to accompanying drawing demonstration the preferred embodiments of the present invention.Similar components adopts the components identical symbol in the accompanying drawing.Should note presenting the present invention for clear, each element in the accompanying drawing is not the scale according to material object, and for avoiding fuzzy content of the present invention, below traditional spare part, associated materials and correlation processing technique thereof are also omitted in explanation.
Fig. 2 A and Fig. 2 B to Fig. 8 A and Fig. 8 B are for showing top view and the profile of each step in its manufacturing process of an encapsulating structure according to the present invention one first embodiment, the figure that indicates A is top view, and the figure that indicates B is the profile along the dotted line I-I ' of the figure that indicates A.
At first, with reference to figure 2A and 2B, provide an electricity to cover insulated substrate 210, upper conductor layer 212 and lower conductor layer 213 that it comprises an insulated substrate 211 and covers insulated substrate 211.At this embodiment, insulated substrate 210 can be general epoxy resin glass plate (FR4).Upper conductor layer 212 and lower conductor layer 213 can be Copper Foil.The preferred thickness that electricity covers insulated substrate 210 generally can be between the scope of 0.5mm～6.0mm, but not as limit.The area that electricity covers insulated substrate 210 is decided on demand.Can cover the encapsulating structure that insulated substrate 210 is made one or more flush type magnetic elements at electricity, also can form All other routes simultaneously or imbed other element.For clearly demonstrating, only show dotted line X-X ' among the figure, Y-Y ' marks the fabrication region of single flush type magnetic element encapsulating structure.In addition, electricity covers also reserves in advance the position of placing the flush type magnetic element in advance on the insulated substrate 210, as the finger ring type zone 210r that is marked by dotted line r and r '.It is island part 210a that electricity covers the zone definitions that the regional 210r of relative finger ring type is inside on the insulated substrate 210; It is periphery 210b that electricity covers the zone definitions that the regional 210r of relative finger ring type is the outside on the insulated substrate 210.Finger ring type zone 210r is laterally between island part 210a and periphery 210b.
Then, with reference to figure 3A and Fig. 3 B, cover the island part 210a of insulated substrate 210 and periphery 210b at electricity and make respectively and vertically penetrate inner via hole 310a and the accessibke porosity 310b that electricity covers insulated substrate 210.Through hole 310a and 310b prolong the outer edge of finger ring type zone 210r and arrange, and its number can be decided on demand.Manufacture method can adopt machine drilling or laser drill or other appropriate technologies.The aperture of through hole 310a and 310b generally can be between the scope of 0.15mm～0.3mm, but not as limit.
With reference to figure 4A and 4B, finish boring after, can carry out step modes such as desmearing, de-smear and the electroplates in hole, but not as limit, with the electric through-hole 410a that is positioned at island part 210a in making and the outer electric through-hole 410b that is positioned at periphery 210b.Then, can carry out consent and plate cap layer steps such as (cap plating), and via image transfer and etching upper conductor layer 212 and lower conductor layer 213 be processed, to form each cap pad 420 that covers each electric through- hole 410a and 410b top and below.
With reference to figure 5A and 5B, behind electric through-hole 410a, outer electric through-hole 410b and the cap pad 420, can utilize machinery or chemistry or other suitable technique in finishing, remove insulated substrate 211 materials that are positioned at finger ring type zone 210r, to form a finger ring type groove 510.Finger ring type groove 510 is used for taking in finger ring type magnetic element 610 (see figure 6)s and it is imbedded in the insulated substrate 211 fully, so in this embodiment, the plane sizes of finger ring type groove 510 and volume are slightly larger than finger ring type magnetic element 610.When removing insulated substrate 211 material processing procedures, execution should notice that controlling depth is with insulated substrate 211 materials of the reserve part bottom 510a as finger ring type groove 510.
Then, with reference to figure 6A and 6B, finger ring type magnetic element 610 is seated in the finger ring type groove 510.It should be noted that " the finger ring type " of indication of the present invention means the structure of baked donut, comes exemplary illustration at this embodiment with two concentric vesica piscises." the finger ring type " of indication of the present invention is not limited to vesica piscis, and it also can be square finger ring, other multiangular finger rings or various suitable type shape.Magnetic element 610 can be from any magnetic material that is suitable as electromagnetic component, for example iron core (ferrite core).The finger ring type magnetic element general thickness of present embodiment can be between the scope of 0.8mm～3.0mm, but not as limit.
Same with reference to figure 6A and 6B, because plane sizes and the volume of finger ring type groove 510 are slightly larger than magnetic element 610, so after magnetic element 610 is placed in finger ring type groove 510, can form gap 620 between the inwall of magnetic element 610 and finger ring type groove 510.Simultaneously, also can make the degree of depth of finger ring type groove 510 be higher than the height of magnetic element 610, so after magnetic element 610 is inserted finger ring type groove 510, will still keep a space 630 of the upper surface that is lower than insulated substrate 211 above the upper surface of magnetic element 610.In this embodiment, gap 620 and space 630 are full of air.
With reference to figure 7A and 7B, finger ring type magnetic element 610 is seated in finger ring type groove 510 after, then form dielectric layer 710 and conductive layer 720 at the upper and lower sides of insulated substrate 211.Dielectric layer 710 and conductive layer 720 covering cap Cover Gaskets 420 and finger ring type groove 510.For instance, dielectric layer 710 can be insulating material that an epoxy resin film (bondply) or other organic substances make etc.Conductive layer 720 can be single face copper coin substrate or has the material of conduction property.In this embodiment, the epoxy resin film utilizes pressing to make two single face copper coin substrates be formed at the upper and lower sides of insulated substrate 211 by the epoxy resin film as an adhesive.The thickness of dielectric layer 710 and conductive layer 720 is the thinnest 0.05mm that can be generally, yet is not limited thereto, and can make any appropriate variation according to the customer requirement design.Note in this embodiment, by being flow model not with employed adhesion dielectric layer 710 (being the epoxy resin film), not having usually during pressing or have only the glue of minute quantity to produce.So in this embodiment, gap 620 and space 630 after the pressing still are full of air.Yet at other embodiment, adhesion dielectric layer 710 also can be the flow model material and makes, and flow model adhesion dielectric layer 710 might produce a considerable amount of glues when carrying out pressing, and this glue will flow in the gap 620, and or even fill up space 630.
With reference to figure 8A and 8B, after forming dielectric layer 710 and conductive layer 720, then carry out steps such as boring, desmearing, de-smear and the electroplates in hole making electric through-hole 811a in the upper strata, electric through-hole 812b outside electric through-hole 812a and the lower floor in electric through-hole 811b and the lower floor outside the upper strata.Electric through- hole 811a, 811b and electric through- hole 812a, 812b are electrically connected electric through- hole 410a, 410b by cap pad 420 respectively.Then, utilize image transfer and etched patternization to be positioned at the conductive layer 720 of insulated substrate 211 upper and lower sides.Conductive layer 720 behind the patterning comprises that wiring layer 821 reaches wiring layer 822 down.
Fig. 8 A and Fig. 8 B show the encapsulating structure 800 according to the first embodiment of the invention made.As shown in the figure, encapsulating structure 800 comprises insulated substrate 211, has a finger ring type groove 510 and reaches by finger ring type groove 510 defined island part 210a and periphery 210b.Finger ring type groove 510 is laterally between island part 210a and periphery 210b.Finger ring type magnetic element 610 places finger ring type groove 510.Fig. 8 A is represented by dotted lines the finger ring type magnetic element of imbedding in the encapsulating structure 800 610.Encapsulating structure 800 comprises that wiring layer 821 is positioned at insulated substrate 211 tops and following wiring layer 822 is positioned at insulated substrate 211 belows.Interior electric through-hole 410a vertically penetrates island part 210a and connects upward wiring layer 821 and wiring layer 822 down.Outer electric through-hole 410b vertically penetrates periphery 210b and connects upward wiring layer 821 and wiring layer 822 down.Interior electric through-hole 410a, outer electric through-hole 410b, last wiring layer 821 and following wiring layer 822 form a conductive coil around finger ring type magnetic element 610.In addition, encapsulating structure 800 also can comprise dielectric layer 710 between 821 of insulated substrate 211 and last wiring layers, in the upper strata outside electric through-hole 811a and the upper strata electric through-hole 811b penetrate dielectric layer 710 respectively so that interior electric through-hole 410a and outer electric through-hole 410b respectively electricity connect wiring layer 821 mutually.Encapsulating structure 800 comprises that also another dielectric layer 710 is positioned at 822 of insulated substrate 211 and following wiring layers, in the lower floor outside electric through-hole 812a and the lower floor electric through-hole 812b penetrate this dielectric layer 710 respectively so that interior electric through-hole 410a and the outer electric through-hole 410b electricity time wiring layer 822 that links to each other respectively.
Fig. 9 is the top view according to another encapsulating structure 900 of second embodiment of the present invention illustration.The difference of the second embodiment encapsulating structure 900 and the first embodiment encapsulating structure 800 is, encapsulating structure 900 comprises that also forming an air vent hole 910 penetrates dielectric layer 710 between 821 of insulated substrate 211 and last wiring layers.Air vent hole 910 is communicated to finger ring type groove 510 and exposes beneath magnetic element 610.In this embodiment, between the inwall of magnetic element 610 and finger ring type groove 510 the gap that forms 620 and above-mentioned interval 630 be full of air.Air vent hole 910 can make gap 620 and the air at interval avoid whereby causing plate bursting under high pressure manufacturing process with extraneous the communication.
In addition, should notice that the disclosed method of first embodiment for forming through hole 310a and 310b (as Fig. 3 A and 3B) earlier, forms finger ring type groove 510 (as Fig. 5 A and 5B) again.The present invention also comprises formation finger ring type groove 510 earlier, forms the embodiment of through hole 310a and 310b again.In other words, the present invention includes the various embodiment that the order of each step shown in first embodiment done suitably to exchange change.
Figure 10 A, Figure 10 B and Figure 11 are according to the step in encapsulating structure 1100 its manufacturing process of third embodiment of the present invention demonstration tool magnetic element.Wherein Figure 10 A is following view.Figure 10 B is the profile along the dotted line I-I ' of Figure 10 A, and Figure 11 is the profile of the step of continuity Figure 10 B.The difference of the 3rd embodiment and first embodiment is, the both sides up and down of the insulated substrate 211 of first embodiment form dielectric layer 710 and conductive layer 720 (seeing Fig. 7 A and 7B) respectively, but only form dielectric layer 710 and conductive layer 720 in that side (being upside) of the insulated substrate 211 that exposes finger ring type groove 510 at the 3rd embodiment.In other words, the downside of insulated substrate 211 is because possess the insulated substrate material of bottom 510a, the dielectric layer 710 of Therefore, omited lower floor.
Therefore, shown in the profile of Figure 10 B, the following wiring layer 1022 of the 3rd embodiment is formed directly on insulated substrate 211 surfaces of bottom 510a.Figure 10 A shows that the pattern of following wiring layer 1022 is similar to aforesaid following wiring layer 822.The step of wiring layer 1022 all could before or after finger ring type groove 510 forms under forming.This embodiment example is illustrated in finger ring type groove 510 and forms the wiring layer 1022 down of making before.In other words, namely the step shown in the hookup 3B descends wiring layer 1022 to make, and its structure of finishing is found in Figure 10 A and 10B.After the step of hookup 10A, with reference to the encapsulating structure 1100 that can finish in each step described in first embodiment as shown in figure 11.
Figure 12 A and Figure 12 B to Figure 16 A and Figure 16 B are for showing top view and the profile of each step in encapsulating structure 1600 its manufacturing process according to the present invention 1 the 4th embodiment, the figure that indicates A is top view, and the figure that indicates B is the profile along the dotted line I-I ' of the figure that indicates A.The encapsulating structure 1600 of the 4th embodiment is the structure with two conductive layers, and the encapsulating structure 800 of first embodiment is to have the structure of four layers of conductive layer, and 1100 of the encapsulating structures of the 3rd embodiment are to have the structure of three layers of conductive layer.
At first, with reference to figure 12A and 12B, provide an insulated substrate 1210, it comprises that a finger ring type groove 510 is in order to take in a finger ring type magnetic element.At this embodiment, insulated substrate 1210 can be general epoxy resin glass plate (FR4), or moulding material liquid crystal polymer for example, or suitable material wherein.The preferred thickness of insulated substrate 1210 generally can be between the scope of 0.5mm～6.0mm, but not as limit.The area of insulated substrate 1210 is decided on demand.Can make the encapsulating structure of one or more flush type magnetic elements at insulated substrate 1210, also can form All other routes simultaneously or imbed other element.For clearly demonstrating, only show dotted line X-X ' among the figure, Y-Y ' marks the fabrication region of single flush type magnetic element encapsulating structure.Shown in Figure 12 A, insulated substrate 1210 is definition one finger ring type zone 1210r between dotted line r and r '.Insulated substrate 1210 relative finger ring type zone 1210r are island part 1210a for inner zone definitions; Relative finger ring type zone 1210r is periphery 1210b for outside zone definitions on the insulated substrate 1210.Finger ring type zone 1210r is for laterally between island part 1210a and periphery 1210b.Finger ring type groove 510 is used for taking in finger ring type magnetic element and it is imbedded in the insulated substrate 1210 fully, so in this embodiment, the plane sizes of finger ring type groove 510 and volume are slightly larger than finger ring type magnetic element.Can utilize machinery or chemistry or other suitable technique, remove insulated substrate 1210 materials that are positioned at finger ring type zone 1210r, to form finger ring type groove 510.Should notice when forming finger ring type groove 510 processing procedures that controlling depth is with insulated substrate 1210 materials of the reserve part bottom 510a as finger ring type groove 510.
Then, with reference to figure 6A and 6B, finger ring type magnetic element 610 is seated in the finger ring type groove 510.It should be noted that " the finger ring type " of indication of the present invention means the structure of baked donut, comes exemplary illustration at this embodiment with two concentric vesica piscises." the finger ring type " of indication of the present invention is not limited to vesica piscis, and it also can be square finger ring, other multiangular finger rings or various suitable type shape.Magnetic element 610 can be from any magnetic material that is suitable as electromagnetic component, for example magnetic ferrites core (ferrite core).The finger ring type magnetic element general thickness of present embodiment can be between the scope of 0.8mm～3.0mm, but not as limit.
Then, with reference to figure 13A and 13B, put finger ring type magnetic element 610 in finger ring type groove 510.The finger ring type magnetic element 610 that this embodiment uses can be with reference to described in first embodiment.Because plane sizes and the volume of finger ring type groove 510 are slightly larger than magnetic element 610, so after magnetic element 610 is placed in finger ring type groove 510, can form gap 620 between the inwall of magnetic element 610 and finger ring type groove 510.Simultaneously, also can make the degree of depth of finger ring type groove 510 be higher than the height of magnetic element 610, so after magnetic element 610 is inserted finger ring type groove 510, will still keep a space 630 of the upper surface that is lower than insulated substrate 211 above the upper surface of magnetic element 610.In this embodiment, gap 620 and space 630 are full of air.
With reference to figure 14A and Figure 14 B, finger ring type magnetic element 610 is seated in finger ring type groove 510 after, then form dielectric layer 710 and conductive layer 720 at the upper and lower sides of insulated substrate 211.The material of dielectric layer 710 and conductive layer 720 can be with reference to described in first embodiment.In this embodiment, dielectric layer 710 be the epoxy resin film as an adhesive, utilize pressing to make two single face copper coin substrates be formed on the upper and lower sides of insulated substrate 1210 by the epoxy resin film.Note in this embodiment, by being flow model not with employed adhesion dielectric layer 710 (being the epoxy resin film), not having usually during pressing or have only the glue of minute quantity to produce.So in this embodiment, gap 620 and space 630 after the pressing still are full of air.Yet at other embodiment, adhesion dielectric layer 710 also can be the flow model material and makes, and flow model adhesion dielectric layer 710 might produce a considerable amount of glues when carrying out pressing, and this glue will flow in the gap 620, and or even fill up space 630.
Then, with reference to figure 15A and Figure 15 B, behind formation dielectric layer 710 and the conductive layer 720, then carry out steps such as boring, desmearing, de-smear and the electroplates in hole with electric through-hole 1510a in making and outer electric through-hole 1510b.Interior electric through-hole 1510a and outer electric through-hole 1510b penetrate insulated substrate 1210 and dielectric layer 710 and conductive layer 720 up and down respectively.Then, with reference to figure 16A and Figure 16 B, utilize image transfer and etched patternization to be positioned at the conductive layer 720 of insulated substrate 1210 upper and lower sides.Conductive layer 720 behind the patterning comprises that wiring layer 1610 reaches wiring layer 1620 down.Notice also optionally forming in this embodiment that an air vent hole 1630 penetrates dielectric layer 710 and lead to finger ring type groove 510.Air vent hole 1630 can make the external communication of finger ring type groove 510 and encapsulating structure 1600.Air vent hole 1630 may expose magnetic element 610.In this embodiment, between the inwall of magnetic element 610 and finger ring type groove 510 the gap that forms 620 and above-mentioned between be full of air every 630.Air vent hole 1630 can make gap 620 and the air in the interval 630 avoid whereby causing plate bursting under high pressure manufacturing process with extraneous the communication.
The above is the preferred embodiments of the present invention only, is not in order to limit scope of the present invention; All other do not break away from the equivalence of finishing under the spirit disclosed in this invention and changes or modification, all should be included in the present invention.
Claims (5)
1. encapsulating structure comprises:
One insulated substrate has a finger ring type groove and by the defined island part of this finger ring type groove and a periphery, this finger ring type groove is laterally between island part and periphery;
One finger ring type magnetic element places this finger ring type groove, and wherein a space is between an inwall and this finger ring type magnetic element of this finger ring type groove, and described space is full of air;
On one wiring layer be positioned at this insulated substrate top and once wiring layer be positioned at this insulated substrate below;
One dielectric layer is arranged at this insulated substrate and should goes up between wiring layer or between this insulated substrate and this time wiring layer;
Interior cap pad and outer cap pad are respectively formed between described dielectric layer and the described insulated substrate;
Electric through-hole in one, vertically penetrate this island part with connect described in the cap pad, and further penetrate this dielectric layer and should go up maybe this time wiring layer of wiring layer to connect; And
One outer electric through-hole vertically penetrates this periphery connecting described outer cap pad, and further penetrates this dielectric layer and should go up maybe this time wiring layer of wiring layer to connect,
Wherein be somebody's turn to do interior cap pad and be somebody's turn to do outer cap pad and cover this interior electric through-hole respectively and be somebody's turn to do outer electric through-hole; And
Wherein should in electric through-hole, this outer electric through-hole, wiring layer and this time wiring layer form a conductive coil around this finger ring type magnetic element on this.
2. encapsulating structure comprises:
One insulated substrate has a finger ring type groove and by the defined island part of this finger ring type groove and a periphery, this finger ring type groove is laterally between island part and periphery;
One finger ring type magnetic element places this finger ring type groove;
On one wiring layer be positioned at this insulated substrate top and once wiring layer be positioned at this insulated substrate below;
Electric through-hole vertically penetrates this island part and connects and should go up wiring layer and this time wiring layer in one;
One outer electric through-hole vertically penetrates this periphery and connects should go up wiring layer and this time wiring layer, wherein should interior electric through-hole, this outer electric through-hole, wiring layer and this time wiring layer form a conductive coil around this finger ring type magnetic element on this;
One dielectric layer is between this insulated substrate and should go up between wiring layer, electric through-hole and should penetrate this dielectric layer by outer electric through-hole in this; And
One air vent hole penetrates this dielectric layer so that this finger ring type groove is communicated to the outside of this encapsulating structure.
3. the manufacture method of an encapsulating structure comprises:
Provide an electricity to cover insulated substrate, this electricity covers the pre-defined finger ring type zone of insulated substrate, island part and a periphery, and this finger ring type zone is laterally between this island part and this periphery;
Formation one interior electric through-hole vertically penetrates this island part and an outer electric through-hole vertically penetrates this periphery;
Forming a finger ring type groove covers in this finger ring type zone of insulated substrate in this electricity;
Provide a finger ring type magnetic element to place this finger ring type groove, wherein a space is between an inwall and this finger ring type magnetic element of this finger ring type groove, and described space is full of air;
Form and cover electric through-hole and the interior cap pad that is somebody's turn to do outer electric through-hole and outer cap pad in this respectively;
Form on one wiring layer above this electricity covers insulated substrate and once wiring layer below this electricity covers insulated substrate, wherein a dielectric layer be arranged at this electricity cover insulated substrate with should between wiring layer or this electricity cover between insulated substrate and this time wiring layer; And
Make electric through-hole in this, cap pad in this, wiring layer, this outer cap pad, this outer electric through-hole and this time wiring layer are electrically connected to constitute a conductive coil around this finger ring type magnetic element on this.
4. the manufacture method of encapsulating structure according to claim 3 wherein after this finger ring type magnetic element places the step of this finger ring type groove, comprises that also forming described dielectric layer covers on the insulated substrate or down at this electricity.
5. the manufacture method of an encapsulating structure comprises:
Provide an electricity to cover insulated substrate, this electricity covers the pre-defined finger ring type zone of insulated substrate, island part and a periphery, and this finger ring type zone is laterally between this island part and this periphery;
Formation one interior electric through-hole vertically penetrates this island part and an outer electric through-hole vertically penetrates this periphery;
Forming a finger ring type groove covers in this finger ring type zone of insulated substrate in this electricity;
Provide a finger ring type magnetic element to place this finger ring type groove;
Form on one wiring layer above this electricity covers insulated substrate and once wiring layer below this electricity covers insulated substrate, wherein a dielectric layer be arranged at this electricity cover insulated substrate with should between wiring layer or this electricity cover between insulated substrate and this time wiring layer;
Make electric through-hole in this, wiring layer, this outer electric through-hole and this time wiring layer are electrically connected to constitute a conductive coil around this finger ring type magnetic element on this; And
Form that an air vent hole penetrates this dielectric layer so that this finger ring type groove is communicated to the outside of this encapsulating structure.
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| CN200910220916.7 | 2009-11-12 | ||
| US12/699,777 | 2010-02-03 | ||
| US12/699,777 US8581114B2 (en) | 2009-11-12 | 2010-02-03 | Packaged structure having magnetic component and method thereof |
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| CN102065637A CN102065637A (en) | 2011-05-18 |
| CN102065637B true CN102065637B (en) | 2013-07-10 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20140259643A1 (en) * | 2012-09-28 | 2014-09-18 | Multi-Fineline Electronix, Inc. | Method of applying a stress relieving material to an embedded magnetic component |
| CN103813632B (en) * | 2012-11-14 | 2016-12-21 | 健鼎（无锡）电子有限公司 | Circuit board package structure and manufacture method thereof |
| JP5554868B1 (en) * | 2013-07-03 | 2014-07-23 | 太陽誘電株式会社 | Manufacturing method of substrate with cavity |
| CN104684251B (en) * | 2013-11-27 | 2017-09-19 | 健鼎（无锡）电子有限公司 | Circuit board package structure and its manufacture method |
| US9824811B2 (en) * | 2014-12-19 | 2017-11-21 | Texas Instruments Incorporated | Embedded coil assembly and method of making |
| CN106793555B (en) * | 2015-11-23 | 2019-02-12 | 健鼎（无锡）电子有限公司 | Circuit board package structure and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5781091A (en) * | 1995-07-24 | 1998-07-14 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
| US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
| US7436282B2 (en) * | 2004-12-07 | 2008-10-14 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6990729B2 (en) * | 2003-09-05 | 2006-01-31 | Harris Corporation | Method for forming an inductor |
| RU2007120247A (en) * | 2004-12-07 | 2009-01-20 | Малти-Файнлайн Электроникс, Инк. (Us) | MINIATURE CIRCUITS, INDUCTIVE ELEMENTS AND METHODS OF THEIR PRODUCTION |
| US7477128B2 (en) * | 2005-09-22 | 2009-01-13 | Radial Electronics, Inc. | Magnetic components |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5781091A (en) * | 1995-07-24 | 1998-07-14 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
| US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
| US7436282B2 (en) * | 2004-12-07 | 2008-10-14 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
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| CN102065637A (en) | 2011-05-18 |
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