CN102061062B - Synthetic resin composition for cast-in-situ medium-voltage bus - Google Patents
Synthetic resin composition for cast-in-situ medium-voltage bus Download PDFInfo
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- CN102061062B CN102061062B CN2010105393263A CN201010539326A CN102061062B CN 102061062 B CN102061062 B CN 102061062B CN 2010105393263 A CN2010105393263 A CN 2010105393263A CN 201010539326 A CN201010539326 A CN 201010539326A CN 102061062 B CN102061062 B CN 102061062B
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Abstract
The invention discloses a synthetic resin composition for a cast-in-situ medium-voltage bus, which comprises the following components in percentage by weight: 45-50 percent of epoxy resin, 10-13 percent of polyamide curing agent, 5-10 percent of modified amine curing agent, 10-14 percent of quartz sand with grain diameter of 10-50 meshes, 8-11 percent of quartz sand with grain diameter of 50-80 meshes and 9-12 percent of quartz sand with grain diameter of 80-150 meshes, wherein the grain diameter of the quartz sand ranges from10 meshes to 150 meshes. The composition can be cast outside a copper conductor in situ and has the advantages of high impact resistance, less internal stress, difficult cracking and shedding and short curing time. The manufactured bus can be used for a 3-17.5KV medium-voltage power distributing system.
Description
Technical field
The present invention relates to a kind of insulating material, particularly be used for being cast in a kind of compound resin composition of pressing bus outer.
Background technology
In the existing power transmission technology, bus uses in electrical meanss such as power distribution cabinet, compensating tank, because its spacing is little; Do not reach insulating requirements by air isolation, therefore, need insulation layer be set on its surface; Epoxy resin is a kind of good insulation performance material of generally acknowledging at present, and its molecular structure is to be characteristic to contain active epoxide group in the molecular chain, after it mixes with corresponding anabolica; Can be cast in the bus surface, epoxide group and solidifying agent generation crosslinking reaction and form and have the cancellated superpolymer of three-dimensional, treat that it solidifies after; Can form good binding with bus, can play the good insulation performance effect.Not enough below it exists, one of which is because the coefficient of expansion of epoxy resin itself and be discrepant as the coefficient of expansion of the copper conductor of bus; When temperature rises; Can produce bigger internal stress between the two, cause epoxy resin cracking, distortion easily, influence the work reliability of electricinstallation.Its two, the fragility of epoxy resin is big, shock-resistant damage ability, resistance toheat is relatively poor relatively, is generally less than 170 ℃.
The Chinese patent DB discloses a kind of compound resin composition of pressing bus that is used for pouring into a mould; Its application number is: 200910213548.3; It is made up of epoxy resin, solidifying agent and silica sand, and wherein, the weight percent of epoxy resin in compsn is 45%-50%; The weight percent of solidifying agent in compsn is 12%-20%; Said quartz sand size is the 2-150 order; Wherein the weight percent of 2-10 purpose silica sand in compsn is 6%-11%; The weight percent of 10-50 order silica sand in compsn is 10-15%; The weight percent of 50-80 order silica sand in compsn is 6%-10%, and the weight percent of 80-150 order silica sand in compsn is 6%-11%.Said composition requires under vacuum environment, to stir preparation and pours into a mould, and site environment is difficult to reach requirement; And its set time is longer.
Summary of the invention
To the deficiency of prior art, the present invention provides a kind of compound resin composition that cast-in-site is pressed bus that is used for, and makes set time short, but cast on-site, and the insulation layer of the middle pressure bus after the cast is not easy to crack, shock-resistant and high temperature resistant.
For solving the problems of the technologies described above, technical scheme of the present invention is following: be used for the compound resin composition that cast-in-site is pressed bus, it is made up of epoxy resin, polyamide curing agent, modified amine curing agent and silica sand; The weight percent of epoxy resin in compsn is 45%-50%; The weight percent of polyamide curing agent in compsn is 10-13%; The weight percent of modified amine curing agent in compsn is 5-10%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 10-14%; The weight percent of 50-80 order silica sand in compsn is 8-11%, and the weight percent of 80-150 order silica sand in compsn is 9-12%.
The compsn that prescription of the present invention forms can be cast in outside the copper conductor after the on-the-spot allotment; Form insulation layer; Insulation layer after the curing is the cancellated superpolymer of three-dimensional; Silica sand is dispersed in the epoxy resin, fills good bonding between epoxy resin and the quartz sand particle via epoxy resin between big footpath particle and the path particle; The proportionlity of silica sand makes that most of quartz sand particles can be approaching each other; Compare with simple epoxy resin, transferring heat energy better is so that help the bus heat radiation at work; Make the temperature of the each several part of insulation layer reach consistent as early as possible simultaneously; Insulation layer self internal layer and outer field having a narrow range of temperature, internal stress is little, can guarantee that insulation layer can not ftracture; Owing to mixing of the silica sand that multiple different size is arranged, its coefficient of expansion is affected, be 0.0000176 (1/K); Equate with the coefficient of expansion of copper conductor, can stand violent temperature difference cataclysm, therefore; It is when being heated; Can expand with heat and contract with cold synchronously with copper conductor, also can not produce internal stress between the two, can guarantee that insulation layer can not peel off with copper conductor.Simultaneously,, improved the toughness of insulation layer, made it have good impact resistance because the adding of silica sand is arranged; A kind ofly be used for pouring into a mould the compound resin composition of pressing bus (application number: 200910213548.3) compare: this compsn has omitted partial element with existing; But technique effect can be suitable with prior art; Find after deliberation; Omit 2-10 purpose silica sand and the physicochemical property of product is not caused fairly obvious influence, also do not influence the transmission of heat; Said composition need can not constructed under vacuum environment; Can directly carry out site operation, reduce difficulty of construction, advantageously; Because the application of having saved 2-10 order silica sand; Make epoxy resin to react with solidifying agent better, make shorten 20% set time set time, obtained beyond thought effect than compsn of the prior art.The dielectric strength of the insulation layer of casting reaches 28KV/mm, has the good insulation performance performance; The bus of being poured into a mould can be used in the middle pressure power transmission and transformation system of 3KV-17.5KV, and its heat resistance is good, can tolerate 170-180 ℃ high temperature for a long time.
As preferred version of the present invention, the weight percent of said epoxy resin in compsn is 47.5%; The weight percent of polyamide curing agent in compsn is 11.63%; The weight percent of modified amine curing agent in compsn is 7.86%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 12.82%; The weight percent of 50-80 order silica sand in compsn is 9.63%, and the weight percent of 80-150 order silica sand in compsn is 10.56%.Bus according to the composition production of this prescription can obtain best mechanical property; Its insulation layer good toughness, shock-resistant, have good alkali resistance, acid resistance and anti-dissolubility; Simultaneously, the superior isolation characteristic that has high dielectric property, anti-surface leakage, anti-electric arc.
The polyamide curing agent product type can be Aradur 100; The modified amine curing agent product type can be Aradur 3229.Above-mentioned solidifying agent all can obtain from the public offering channel.
In the compsn of the present invention; But epoxy resin model GY783 gets through commercially available, and epoxy resin GY783 is a bisphenol A type epoxy resin; A kind of for the glycidyl ether based epoxy resin; Its oxirane value is 5.10-5.40Eq/kg, and epoxy equivalent (weight) is 185-196g/Eq, 25 ℃ of (mpa s): 800-1100 of viscosity.Bus according to the composition production of this prescription can obtain best mechanical property; Its insulation layer good toughness, shock-resistant, have good alkali resistance, acid resistance and anti-dissolubility; Simultaneously, the superior isolation characteristic that has high dielectric property, anti-surface leakage, anti-electric arc.
Embodiment
Embodiment 1
Be the preferred assembly side of the present invention: the weight percent of epoxy resin GY783 in compsn is 47.5%; The weight percent of polyamide curing agent Aradur 100 in compsn is 11.63%; The weight percent of modified amine curing agent Aradur 3229 in compsn is 7.86%: quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 12.82%; The weight percent of 50-80 order silica sand in compsn is 9.63%, and the weight percent of 80-150 order silica sand in compsn is 10.56%.
When pressing the bus cast in carrying out at the scene, need carry out the configuration of feed liquid earlier, at the scene under the environment with each component thorough mixing, need to stir 15-20 minute, mix the back in mould with the copper conductor periphery of its cast, this copper conductor is an oxygen free copper, treats to take out behind the curing molding; 4-5 hour set time.
Synthetic resins after the curing is for having the superior isolation material of high dielectric property, anti-surface leakage, anti-electric arc.Synthetic epoxy resin after the curing has good alkali resistance, acid resistance and anti-dissolubility, in the solution of PH=11, can soak the variation that physical chemical mechanism did not take place in 13 hours.Bus after the cast can effectively be resisted the erosion of various chemical, can in salt fog-zone, acid rain district and chemical plant, use; The most of moulds of resistant synthetic resin after the curing can be used under exacting terms; This synthetic resins is non-combustible material, and halide also can not work the mischief to environment and human body.
Embodiment 2
Another is used for the compound resin composition that cast-in-site is pressed bus; Form by epoxy resin, polyamide curing agent, modified amine curing agent and silica sand; Said epoxy resin is epoxy resin GY783, and polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; The weight percent of epoxy resin in compsn is 50%; The weight percent of polyamide curing agent in compsn is 13%; The weight percent of modified amine curing agent in compsn is 5%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 10%, and the weight percent of 50-80 order silica sand in compsn is 10%, and the weight percent of 80-150 order silica sand in compsn is 12%.
Its method of use is identical with embodiment 1.
Embodiment 3
The third is used for the compound resin composition that cast-in-site is pressed bus; Form by epoxy resin, polyamide curing agent, modified amine curing agent, silica sand; Said epoxy resin is epoxy resin GY783; Solidifying agent adopts polyamide curing agent Aradur 100 and modified amine curing agent Aradur 3229, and the weight percent of epoxy resin in compsn is 45%; The weight percent of polyamide curing agent in compsn is 13%; The weight percent of modified amine curing agent in compsn is 10%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 14%, and the weight percent of 50-80 order silica sand in compsn is 9%, and the weight percent of 80-150 order silica sand in compsn is 9%.
Its method of use is identical with embodiment 1.
Embodiment 4
The 4th kind is used for the compound resin composition that cast-in-site is pressed bus; Form by epoxy resin, polyamide curing agent, modified amine curing agent, silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229, and the weight percent of epoxy resin in compsn is 48%; The weight percent of polyamide curing agent in compsn is 10%; The weight percent of modified amine curing agent in compsn is 9%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 10%, and the weight percent of 50-80 order silica sand in compsn is 11%, and the weight percent of 80-150 order silica sand in compsn is 12%.
Its method of use is identical with embodiment 1.
Embodiment 5
The 5th kind is used for the compound resin composition that cast-in-site is pressed bus; Form by epoxy resin, polyamide curing agent, modified amine curing agent, silica sand; Said epoxy resin is the glycidyl ester based epoxy resin, and the weight percent of epoxy resin in compsn is 45%; The weight percent of polyamide curing agent in compsn is 12%; The weight percent of modified amine curing agent in compsn is 7%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 14%, and the weight percent of 50-80 order silica sand in compsn is 11%, and the weight percent of 80-150 order silica sand in compsn is 11%.
Embodiment 6
The 6th kind is used for the compound resin composition that cast-in-site is pressed bus; Form by epoxy resin, polyamide curing agent, modified amine curing agent, silica sand; Said epoxy resin is the glycidyl ester based epoxy resin, and the weight percent of epoxy resin in compsn is 50%; The weight percent of polyamide curing agent in compsn is 10%; The weight percent of modified amine curing agent in compsn is 8%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 12%, and the weight percent of 50-80 order silica sand in compsn is 11%, and the weight percent of 80-150 order silica sand in compsn is 9%.
To detect after compsn among above-mentioned each embodiment and the sampling of the composition epoxy resin in the prior art curing, can obtain the listed various parameters of following table:
Table one (physicals)
Table two (after processing bus)
Can find out that from above table the compsn of embodiments of the invention 1 has more outstanding electric and physicals, the compsn of all the other proportion relations is slightly poorer than the compsn among the embodiment 1, but with prior art in composition epoxy resin suitable.After the component of having omitted part particle diameter minimum, still can reach the effect suitable, but obviously shorten its set time with prior art.
The present invention is not limited to the foregoing description; Epoxy resin in the foregoing description can be substituted by other epoxy resin and solidifying agent commonly used in the prior art, and for example epoxy resin can adopt other model in glycidyl ether based epoxy resin, the glycidyl ester based epoxy resin to replace; Polyamide curing agent, modified amine curing agent can adopt the corresponding solidifying agent of other brands to replace, and its effect is suitable basically.
Claims (4)
1. be used for cast-in-site and press the compound resin composition of bus, it is characterized in that forming by epoxy resin, polyamide curing agent, modified amine curing agent and silica sand; The weight percent of epoxy resin in compsn is 45%-50%; The weight percent of polyamide curing agent in compsn is 10-13%; The weight percent of modified amine curing agent in compsn is 5-10%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 10-14%; The weight percent of 50-80 order silica sand in compsn is 8-11%, and the weight percent of 80-150 order silica sand in compsn is 9-12%.
2. the compound resin composition that is used for cast-in-site pressure bus according to claim 1 is characterized in that the weight percent of epoxy resin in compsn is 47.5%; The weight percent of polyamide curing agent in compsn is 11.63%; The weight percent of modified amine curing agent in compsn is 7.86%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 12.82%; The weight percent of 50-80 order silica sand in compsn is 9.63%, and the weight percent of 80-150 order silica sand in compsn is 10.56%.
3. the compound resin composition that is used for cast-in-site pressure bus according to claim 1 and 2 is characterized in that said polyamide curing agent product type is Aradur 100; The modified amine curing agent product type is Aradur 3229.
4. the compound resin composition that is used for cast-in-site pressure bus according to claim 1 and 2 is characterized in that said epoxy resin model is GY783.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105393263A CN102061062B (en) | 2010-11-11 | 2010-11-11 | Synthetic resin composition for cast-in-situ medium-voltage bus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105393263A CN102061062B (en) | 2010-11-11 | 2010-11-11 | Synthetic resin composition for cast-in-situ medium-voltage bus |
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| Publication Number | Publication Date |
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| CN102061062A CN102061062A (en) | 2011-05-18 |
| CN102061062B true CN102061062B (en) | 2012-05-30 |
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| CN105623195A (en) * | 2016-03-21 | 2016-06-01 | 镇江西门子母线有限公司 | Synthetic resin polymer for pouring of fire-proof medium-voltage bus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101698740A (en) * | 2009-11-06 | 2010-04-28 | 镇江西门子母线有限公司 | Synthetic resin composite for pouring middle-voltage bus bar |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101698740A (en) * | 2009-11-06 | 2010-04-28 | 镇江西门子母线有限公司 | Synthetic resin composite for pouring middle-voltage bus bar |
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