CN101104784A - Composite laminated board high temperature resistant adhesive and preparation method thereof - Google Patents
Composite laminated board high temperature resistant adhesive and preparation method thereof Download PDFInfo
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- CN101104784A CN101104784A CNA2007100255265A CN200710025526A CN101104784A CN 101104784 A CN101104784 A CN 101104784A CN A2007100255265 A CNA2007100255265 A CN A2007100255265A CN 200710025526 A CN200710025526 A CN 200710025526A CN 101104784 A CN101104784 A CN 101104784A
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Abstract
The invention discloses a high-temperature resistant adhesive for composite press-accumulate plate, introducing a multi-curing system with a curing agent of carboxyl terminated polyester into a curing system containing epoxy resin and phenolic resin. The adhesive comprises15-60 wt% epoxy, 0-15 wt% phthalic anhydride, 1-40 wt% carboxyl terminal group or anhydride polyester, 5-60 wt% phenolic resin, 0.1-6 wt% imidazoline, 1-40 wt% tung oil anhydride, l0-8 wt% 2,6-di-tert-butylpheno and 0-60 wt% silicon powder. The invention provides a simple preparation method, wherein the curing system is provided with good adhesion, waterproofness, isolation, and heat-resistance by optimizing the material. The adhesive can be widely used for insulating copper clad laminate and transformer core plate as well as the compositing and laminating of materials and the preparation of special FRP.
Description
Technical field
The present invention relates to a kind of adhesive material, more particularly, the present invention relates to a kind of composite laminated board high temperature resistant adhesive, and further also relate to the preparation method of this composite laminated board high temperature resistant adhesive.
Background technology
In recent years, along with the development of electronic industry, the multiple stratification of device miniaturization, circuit, densification, miniaturization also fast development are got up, and the circuit transmission can reach GHz or MHz with wave frequency.As seen, ε is more little from signal velocity V=C/ ε 1/2 (wherein C is the light velocity, and ε is a relative permittivity) formula, and then signal velocity is fast more; Signal propagation loss α=Ktg α * f from circuit (wherein K is a constant, and f is a frequencies of propagation) formula as seen, under constant dielectric loss condition, the frequency that the more little permission of tg α is propagated is high more: otherwise, under certain frequencies of propagation, dielectric loss is more little, and then propagation loss is just more little.This has lower specific inductivity and medium consumption factor with regard to an urgent demand insulcrete.And because machine is worked for a long time to the thermotolerance of insulcrete, have higher requirement in aspects such as interlayer adhesion.
Traditional veneer sheet tackiness agent mainly contains: resol, unsaturated polyester, Resins, epoxy, casein glue, silicone resin, diphenyl ether and modification diphenyl ether and bimaleimide resin.
But still there is certain problem in present stage, concrete real row as following patent:
(1) be catalyzer with alkali in the patent [CN1477172], prepared high temperature resistant silicone adhesive, though this tackiness agent resistance to elevated temperatures is good, its insulating property can reduce .. and use toluene is made solvent, contaminate environment because of specific inductivity under the effect of its catalyzer etc. increases.
(2) the Diels-Alder adducts that the traditional resol of utilization and the unsaturated dienophile reaction of olefinic that is surpassed 50% by perhalogeno cyclic conjugated diene hydrocarbon and contents of ethylene generate in the patent [CN1065672] etc. is a raw material reaction., because the existence of unsaturated link(age) is arranged, have very big contraction energy in the cross-linking process, mechanical property that makes material etc. is subjected to bigger influence, and bounding force is lower.
Summary of the invention
Technical problem the present invention is directed to the material of being developed at present and invents open question still, overcome the shortcoming that above patent exists, adopted high temperature resistant and all good tung oil acid anhydride of insulating property and traditional resol, end carboxyl or acid anhydrides vibrin are formed polynary curing system, molecular structure (structure of phenyl ring rigid structure and alkane) and molecular weight by the control polyester, and the introducing tung oil acid anhydride in this system, it cooperates with other raw material, can make the colloid bright in color, vibrin insulation bounding force improves greatly, and whole system is being mixed the mutual network structure that passes of synergy formation.Make it have very high internal cohesive energy, and solvent-free, save cost, plurality of advantages such as environmental protection.
Technical scheme purpose of the present invention is achieved by following technical proposals.
Composite laminated board high temperature resistant adhesive of the present invention, it mainly is the polyester that has added end carboxyl or acid anhydrides in containing resol+Resins, epoxy, makes this molecular structure be:
Wherein R is fragrance or aliphatic polyester compound, also comprises ehter bond, poly-key and hydroxy functional group in molecular structure R, introduces these groups and can improve cohesive force in molecule.Simultaneously, it is good to obtain temperature tolerance, bounding force height, apparent glossy sub-translucent insulating laminated sheet.Make this curing system have good bonding, waterproof, insulation, heat resistance by optimizing materials.
Its compositional range of composite laminated board high temperature resistant adhesive of the present invention (by mass percentage) is as follows: Resins, epoxy 15-60%, Tetra hydro Phthalic anhydride 0-15%, terminal carboxyl polyester 1-40%, resol 5-60%, tetrahydroglyoxaline 0.1-6%, tung oil acid anhydride 1-40%, 2,6-di-tert-butylphenol 0-8%, silicon powder 0-60%.
The method for preparing composite laminated board high temperature resistant adhesive of the present invention is, after resin and each component and solvent are mixed, adds an amount of filler again, processes on grinding plant then, makes the filler grain particle diameter evenly not have caking, sieves packing at last.
Beneficial effect advantage of the present invention and beneficial effect are:
1) the finished product internal cohesive energy bounding force height made from this tackiness agent.
2) product color after bonding is good.
3) insulativity energy consumption, electrical loss disappears, and thermal value is low.
The invention belongs to the composite material forming field, this composite laminated board high temperature resistant adhesive is widely used in the copper-clad plate of insulating, transformer central layer etc. also can be applicable to the composite laminate processing of material, the fields such as preparation of special glass steel.
Embodiment
Provide embodiments of the invention and preparation process below.
Embodiment 1:
It is as follows that this tackiness agent is prepared from (quality percentage composition) ratio in following set of dispense ratio:
Resins, epoxy: terminal carboxyl polyester: resol: tung oil acid anhydride: tetrahydroglyoxaline: Tetra hydro Phthalic anhydride: 2,6-di-tert-butylphenol: silicon powder=25: 10: 15: 8: 0.2: 2: 0.5: 39.3.
Preparation process of the present invention: after resin and each component and solvent mixed, add an amount of filler again, on grinding plant, process then, make the filler grain particle diameter evenly not have caking, sieve packing at last.
Embodiment 2:
It is as follows that this tackiness agent is prepared from (quality percentage composition) ratio in following set of dispense ratio:
Resins, epoxy: polyester: resol: tung oil acid anhydride: tetrahydroglyoxaline: Tetra hydro Phthalic anhydride: 2,6-di-tert-butylphenol: silicon powder=25: 5: 15: 15: 0.2: 1: 0.5: 38.3.
Preparation process is with embodiment 1.
Embodiment 3:
It is as follows that this tackiness agent is prepared from (quality percentage composition) ratio in following set of dispense ratio:
Resins, epoxy: polyester: resol: tung oil acid anhydride: tetrahydroglyoxaline: Tetra hydro Phthalic anhydride: 2,6-di-tert-butylphenol :=40: 15: 25: 15: 0.5: 4: 0.5.
Preparation process is with embodiment 1.
Described embodiment only is used to illustrate technical solution of the present invention, is not limited to the present invention.
Claims (3)
1. a composite laminated board high temperature resistant adhesive comprises following component (by mass percentage): Resins, epoxy 15-60%, Tetra hydro Phthalic anhydride 0-15%, end carboxyl or acid anhydrides polyester 1-40%, resol 5-60%, tetrahydroglyoxaline 0.1-6%, tung oil acid anhydride 1-40%, 2,6-di-tert-butylphenol 0-8% and silicon powder 0-60%.
2. composite laminated board high temperature resistant adhesive according to claim 1 is characterized in that, has added the polyester of end carboxyl or acid anhydrides in containing resol+Resins, epoxy, makes this molecular structure be:
HOCO-R-COOH
Wherein R is fragrance or aliphatic polyester compound, also comprises ehter bond, poly-key and hydroxy functional group in molecular structure R.
3. a method for preparing the described composite laminated board high temperature resistant of claim 1 bonding mixture is characterized in that, after resin and each component and solvent are mixed, add an amount of filler again, on grinding plant, process then, make the filler grain particle diameter evenly not have caking, sieve packing at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100255265A CN101104784A (en) | 2007-08-03 | 2007-08-03 | Composite laminated board high temperature resistant adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100255265A CN101104784A (en) | 2007-08-03 | 2007-08-03 | Composite laminated board high temperature resistant adhesive and preparation method thereof |
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| CN101104784A true CN101104784A (en) | 2008-01-16 |
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| CNA2007100255265A Pending CN101104784A (en) | 2007-08-03 | 2007-08-03 | Composite laminated board high temperature resistant adhesive and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343521B (en) * | 2008-08-15 | 2011-11-02 | 济南大学 | Preparation method for functional single-sided laminated sheet glue |
| CN102757755A (en) * | 2012-07-17 | 2012-10-31 | 湖南高华环保股份有限公司 | Preparation method for high-temperature resistant, leak-proof and corrosion-resistant adhesive |
| CN105567146A (en) * | 2016-03-22 | 2016-05-11 | 广州日高新材料科技有限公司 | Epoxy single-component electronic adhesive and preparation method thereof |
| CN113292900A (en) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | Aluminum-based copper-clad plate silk-screen printing insulating glue and silk-screen printing method |
-
2007
- 2007-08-03 CN CNA2007100255265A patent/CN101104784A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343521B (en) * | 2008-08-15 | 2011-11-02 | 济南大学 | Preparation method for functional single-sided laminated sheet glue |
| CN102757755A (en) * | 2012-07-17 | 2012-10-31 | 湖南高华环保股份有限公司 | Preparation method for high-temperature resistant, leak-proof and corrosion-resistant adhesive |
| CN102757755B (en) * | 2012-07-17 | 2013-12-04 | 湖南高华环保股份有限公司 | Preparation method for high-temperature resistant, leak-proof and corrosion-resistant adhesive |
| CN105567146A (en) * | 2016-03-22 | 2016-05-11 | 广州日高新材料科技有限公司 | Epoxy single-component electronic adhesive and preparation method thereof |
| CN105567146B (en) * | 2016-03-22 | 2018-03-02 | 广州日高新材料科技有限公司 | Epoxy one-component electronics adhesive and preparation method thereof |
| CN113292900A (en) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | Aluminum-based copper-clad plate silk-screen printing insulating glue and silk-screen printing method |
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Open date: 20080116 |