CN105504688A - Composite ceramic/epoxy resin composite material for F-class motor potting and preparing method thereof - Google Patents
Composite ceramic/epoxy resin composite material for F-class motor potting and preparing method thereof Download PDFInfo
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- CN105504688A CN105504688A CN201610011206.3A CN201610011206A CN105504688A CN 105504688 A CN105504688 A CN 105504688A CN 201610011206 A CN201610011206 A CN 201610011206A CN 105504688 A CN105504688 A CN 105504688A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention provides a composite ceramic/epoxy resin composite material for F-class motor potting and a preparing method thereof. The composite material is prepared from, by weight, 100 parts of cycloaliphatic epoxide resin, 128 parts of curing agent, 0.5-2 parts of accelerant, 10-20 parts of Qishi toughening agent and 150-250 parts of modified compound ceramic powder. The modified compound ceramic powder is prepared from modified silicon dioxide and modified aluminum nitride, wherein the mass ratio of modified silicon dioxide to modified aluminum nitride is (1:0.9)-(1:1.6), the grain size of modified silicon dioxide is 25-45 microns, the grain size of modified aluminum nitride is 4-15 microns, and both modified silicon dioxide and modified aluminum nitride are modified through silane coupling agent soaking. A middle temperature curing system is adopted, a large amount of inorganic filler is added, and the heat resistance of potting resin is improved.
Description
Technical field
The present invention relates to ceramic technology field, F level motor embedding composite ceramics/epoxy resin composite material being specifically related to a kind of low bulk high thermoconductivity and preparation method thereof.
Background technology
Epoxy resin has excellent mechanical property, adhesive property, corrosion resistance nature, insulating property, is widely used in the fields such as the bonding of electronic component, embedding, encapsulation.But the heat conductivility of epoxy resin is poor, and linear expansivity is higher, if as motor sealing resin use, its heat conductivility must be improved, reduce its linear expansivity.
Summary of the invention
The object of this invention is to provide a kind of low bulk and very high F level motor embedding composite ceramics/epoxy resin composite material of thermal conductivity and preparation method thereof.
The object of the invention is to be achieved through the following technical solutions:
A kind of F level motor embedding composite ceramics/epoxy resin composite material, it comprises cycloaliphatic epoxy resin 100 weight part, solidifying agent 128 weight part, promotor 0.5-2 weight part, strange scholar's toughner 10-20 weight part and modification composite ceramics powder 150-250 weight part; The composite ceramics powder of described modification comprises improved silica and modification aluminium nitride, the mass ratio of described improved silica and modification aluminium nitride is 1:0.9-1:1.6, the particle diameter of described improved silica is 25-45 μm, the particle diameter of modification aluminium nitride is 4-15 μm, and described improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
In such scheme, the immersion method of modifying of described improved silica and modification aluminium nitride is: first, and silane coupling agent is dissolved in appropriate aqueous ethanolic solution, then drips acetic acid, and pH value is adjusted to 3-5, and ultrasonic vibration is hydrolyzed; Then, complete in the coupling agent solution of hydrolysis by being added to after silicon-dioxide or aluminium nitride powder drying, at 60 DEG C of stirred in water bath process 2-4 hour, suction filtration, dry gained after surface treatment completes.
In such scheme, described silane coupling agent is KH-550, and the mass ratio of described silane coupling agent and described silicon-dioxide or aluminium nitride powder filler is 1-4:100.
In such scheme, described cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate.
In such scheme, described solidifying agent is methyl tetrahydro phthalic anhydride.
In such scheme, described promotor is 2,4,6-tri--(dimethylamino methyl) phenol.
In such scheme, described strange scholar's toughner is QS-N.
The preparation method of described F level motor embedding composite ceramics/epoxy resin composite material, it is characterized in that, described preparation method is by cycloaliphatic epoxy resin, solidifying agent, promotor, strange scholar's toughner obtains sealing resin system according to heating 20min after described proportion by weight mixing in 80 DEG C of air dry ovens, then composite for modification ceramics powder is mixed into described sealing resin system, heating under vacuum 30min and ultrasonic disperse process 30min is carried out again at 80 DEG C, then process is cured, described curing cycle is at 80 DEG C 2 hours, at 100 DEG C 2 hours, at 120 DEG C at 2 hours and 150 DEG C 6 hours.
The present invention adding in a large number first by the composite ceramics powder of modification and silicon-dioxide and aluminium nitride, silicon-dioxide and aluminium nitride all have very high heat conductivility, wherein aluminium nitride is particularly evident, its high-melting-point and hardness are all higher, heat conductivility and the thermotolerance of sealing resin can be improved, reduce thermal expansivity.Both combinations can be played its respective advantage, the thermal property of material can be improved, the reduction of the isochrone coefficient of expansion is conducive to the unrelieved stress reducing the rear resin of solidification and metal interface, improves adhesive property, also can reduce high/low temperature in use procedure and change the thermal stresses caused.Secondly, the present invention is because employ mid-temperature-cure resin, and resin itself has higher thermotolerance, and the composite ceramics powder of modification has very high heat resistance, therefore this motor sealing resin has higher heat resistance (140 DEG C-165 DEG C).
Beneficial effect of the present invention is:
1) use intermediate temperature setting system, added high amount of inorganic filler simultaneously, improve the resistance toheat of sealing resin.
2) the adding of filler, reduce thermal expansivity, be conducive to reducing thermal stresses, thus improve cohesive force.
3) silicon-dioxide of specific dimensions and specified proportion and adding of aluminium nitride, substantially increase thermal conductivity, wherein small particle size filler fill up large particle size filler less than space, be conducive to forming complete heat conduction chain.Comprehensively improve thermotolerance, thermal conductivity, and the performance such as cohesive force.
Embodiment
For making content of the present invention, technical scheme and advantage clearly understand, set forth the present invention further below in conjunction with specific embodiment, these embodiments are only for illustration of the present invention, and the present invention is not limited only to following examples.
Embodiment 1
The present embodiment provides a kind of F level motor embedding composite ceramics/epoxy resin composite material, and it comprises cycloaliphatic epoxy resin 220g, solidifying agent 281g, promotor 1.1g, strange scholar's toughner 25g and the composite ceramics powder 330g of modification (wherein the mass ratio of improved silica and modification aluminium nitride is 1:1.6).The particle diameter of this improved silica is 25-45 μm, and the particle diameter of modification aluminium nitride is 4-15 μm, and this improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
In the present embodiment, this silane coupling agent is KH-550; Cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate; Promotor is 2,4,6-tri--(dimethylamino methyl) phenol; Strange scholar's toughner is QS-N.
The preparation method of described improved silica is:
1) SiO 2 powder surface preparation: take SiO 2 powder, in 80 DEG C of baking ovens, dry 3h is stand-by.
2) take the KH-550 silane coupling agent that dioxide-containing silica is 3%, be dissolved in appropriate aqueous ethanolic solution (water: alcohol=9:1), then drip acetic acid, pH value is adjusted to 3-5, ultrasonic vibration hydrolysis 30min.
3) silicon-dioxide of drying is inserted complete in the coupling agent solution of hydrolysis, high-speed stirring 2h-4h, then carry out drying treatment 12h, more modified silicon-dioxide is carried out milled processed.
The preparation method of described modification aluminium nitride is identical with the preparation method of above-mentioned improved silica.
The present embodiment also provides the preparation method of this F level motor embedding composite ceramics/epoxy resin composite material, comprises the steps:
1) sealing resin configuration: get 220g epoxy resin, 281g solidifying agent, 1.1g promotor, 25g toughner, stirs after mixing, in 80 degree of baking ovens, process 30 minutes, and heating reduces viscosity.
2) get 115g improved silica and 185g modification aluminium nitride, be added in the above-mentioned sealing resin prepared, stir 5 minutes, ultrasonic disperse 20min, 80 degree of baking oven for heating 30min, carry out removal of bubbles process.Again in an oven according to 80 DEG C of 2h, 100 DEG C of 3h, 120 DEG C of 2h, 150 DEG C of 6h operate, then naturally cooling in baking oven, obtain described F level motor embedding composite ceramics/epoxy resin composite material.
Properties test is carried out, tensile strength, tensile-sbear strength to F level motor embedding composite ceramics/epoxy resin composite material of obtaining after solidification, to tensile strength, thermal conductivity, thermal expansivity, the test of second-order transition temperature performance as shown in Table 1 and Table 2:
Table 1 mechanical property
Table 2 thermal property
Embodiment 2
The present embodiment provides a kind of F level motor embedding composite ceramics/epoxy resin composite material, it comprises the composite ceramic powder 350g of epoxy resin 220g, solidifying agent 281g, promotor 1.1g, toughner 30g and modification, and (its ratio is 1:1.2, concrete content is silica 1 59g, aluminium nitride 191g), the particle diameter of improved silica is 25-45 μm, the particle diameter of modification aluminium nitride is 4-15 μm, and this improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
In the present embodiment, this silane coupling agent is KH-550; Cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate; Promotor is 2,4,6-tri--(dimethylamino methyl) phenol; Strange scholar's toughner is QS-N.
The preparation method of described improved silica is:
1) SiO 2 powder surface preparation: take SiO 2 powder, in 80 DEG C of baking ovens, dry 3h is stand-by.
2) take dioxide-containing silica be 3% KH ?550 silane coupling agents, be dissolved in appropriate aqueous ethanolic solution (water: alcohol=9:1), then drip acetic acid, pH value is adjusted to 3-5, ultrasonic vibration hydrolysis 30min.
3) silicon-dioxide of drying is inserted complete in the coupling agent solution of hydrolysis, high-speed stirring 2h-4h, then carry out drying treatment 12h, more modified silicon-dioxide is carried out milled processed.
The preparation method of described modification aluminium nitride is identical with the preparation method of above-mentioned improved silica.
The present embodiment also provides the preparation method of this F level motor embedding composite ceramics/epoxy resin composite material, comprises the steps:
1) sealing resin configuration: get 220g epoxy resin, 281g solidifying agent, 1.1g promotor, 30g toughner, stirs after mixing, in 80 degree of baking ovens, process 30 minutes, and heating reduces viscosity.
2) get 159g improved silica and 191g modification aluminium nitride, be added in the above-mentioned sealing resin prepared, stir 5 minutes, ultrasonic disperse 20min, 80 degree of baking oven for heating 30min, carry out removal of bubbles process.Again in an oven according to 80 DEG C of 2h, 100 DEG C of 3h, 120 DEG C of 2h, 150 DEG C of 6h operate, then naturally cooling in baking oven, obtain described F level motor embedding composite ceramics/epoxy resin composite material.
Properties test is carried out, tensile strength, tensile-sbear strength to F level motor embedding composite ceramics/epoxy resin composite material of obtaining after solidification, to tensile strength, thermal conductivity, thermal expansivity, the test of second-order transition temperature performance as shown in Table 3 and Table 4:
Table 3 mechanical property
Table 4 thermal property
Embodiment 3
The present embodiment provides a kind of F level motor embedding composite ceramics/epoxy resin composite material, it comprises the composite ceramic powder 400g of epoxy resin 220g, solidifying agent 281g, promotor 1.1g, toughner 36g and modification, and (its ratio is 1:1, concrete content is silicon-dioxide 200g, aluminium nitride 200g), the particle diameter of improved silica is 25-45 μm, the particle diameter of modification aluminium nitride is 4-15 μm, and this improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
In the present embodiment, this silane coupling agent is KH-550; Cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate; Promotor is 2,4,6-tri--(dimethylamino methyl) phenol; Strange scholar's toughner is QS-N.
The preparation method of described improved silica is:
1) SiO 2 powder surface preparation: take SiO 2 powder, in 80 DEG C of baking ovens, dry 3h is stand-by.
2) take the KH-550 silane coupling agent that dioxide-containing silica is 3%, be dissolved in appropriate aqueous ethanolic solution (water: alcohol=9:1), then drip acetic acid, pH value is adjusted to 3-5, ultrasonic vibration hydrolysis 30min.
3) silicon-dioxide of drying is inserted complete in the coupling agent solution of hydrolysis, high-speed stirring 2h-4h, then carry out drying treatment 12h, more modified silicon-dioxide is carried out milled processed.
The preparation method of described modification aluminium nitride is identical with the preparation method of above-mentioned improved silica.
The present embodiment also provides the preparation method of this F level motor embedding composite ceramics/epoxy resin composite material, comprises the steps:
1) sealing resin configuration: get 220g epoxy resin, 281g solidifying agent, 1.1g promotor, 36g toughner, stirs after mixing, in 80 degree of baking ovens, process 30 minutes, and heating reduces viscosity.
2) get 200g improved silica and 200g modification aluminium nitride, be added in the above-mentioned sealing resin prepared, stir 5 minutes, ultrasonic disperse 20min, 80 degree of baking oven for heating 30min, carry out removal of bubbles process.Again in an oven according to 80 DEG C of 2h, 100 DEG C of 3h, 120 DEG C of 2h, 150 DEG C of 6h operate, then naturally cooling in baking oven, obtain described F level motor embedding composite ceramics/epoxy resin composite material.
Properties test is carried out, tensile strength, tensile-sbear strength to F level motor embedding composite ceramics/epoxy resin composite material of obtaining after solidification, to tensile strength, thermal conductivity, thermal expansivity, the test of second-order transition temperature performance as shown in table 5 and table 6:
Table 5 mechanical property
Table 6 thermal property
Embodiment 4
The present embodiment provides a kind of F level motor embedding composite ceramics/epoxy resin composite material, it comprises the composite ceramic powder 500g of epoxy resin 220g, solidifying agent 281g, promotor 4g, toughner 42g and modification, and (its ratio is 1:0.9, concrete content is silicon-dioxide 263g, aluminium nitride 237g), the particle diameter of improved silica is 25-45 μm, the particle diameter of modification aluminium nitride is 4-15 μm, and this improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
In the present embodiment, this silane coupling agent is KH-550; Cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate; Promotor is 2,4,6-tri--(dimethylamino methyl) phenol; Strange scholar's toughner is QS-N.
The preparation method of described improved silica is:
1) SiO 2 powder surface preparation: take SiO 2 powder, in 80 DEG C of baking ovens, dry 3h is stand-by.
2) take the KH-550 silane coupling agent that dioxide-containing silica is 3%, be dissolved in appropriate aqueous ethanolic solution (water: alcohol=9:1), then drip acetic acid, pH value is adjusted to 3-5, ultrasonic vibration hydrolysis 30min.
3) silicon-dioxide of drying is inserted complete in the coupling agent solution of hydrolysis, high-speed stirring 2h-4h, then carry out drying treatment 12h, more modified silicon-dioxide is carried out milled processed.
The preparation method of described modification aluminium nitride is identical with the preparation method of above-mentioned improved silica.
The present embodiment also provides the preparation method of this F level motor embedding composite ceramics/epoxy resin composite material, comprises the steps:
1) sealing resin configuration: get 220g epoxy resin, 281g solidifying agent, 4g part promotor, 42g toughner, stirs after mixing, in 80 degree of baking ovens, process 30 minutes, and heating reduces viscosity.
2) get 263g improved silica and 237g modification aluminium nitride, be added in the above-mentioned sealing resin prepared, stir 5 minutes, ultrasonic disperse 20min, 80 degree of baking oven for heating 30min, carry out removal of bubbles process.Again in an oven according to 80 DEG C of 2h, 100 DEG C of 3h, 120 DEG C of 2h, 150 DEG C of 6h operate, then naturally cooling in baking oven, obtain described F level motor embedding composite ceramics/epoxy resin composite material.
Properties test is carried out, tensile strength, tensile-sbear strength to the F level motor embedding composite ceramics/epoxy resin composite material obtained after solidification, to tensile strength, thermal conductivity, thermal expansivity, the test of second-order transition temperature performance is as shown in table 7 and table 8:
Table 7 mechanical property
Table 8 thermal property
Claims (8)
1. F level motor embedding composite ceramics/epoxy resin composite material, it is characterized in that, it comprises cycloaliphatic epoxy resin 100 weight part, solidifying agent 128 weight part, promotor 0.5-2 weight part, strange scholar's toughner 10-20 weight part and modification composite ceramics powder 150-250 weight part; The composite ceramics powder of described modification comprises improved silica and modification aluminium nitride, the mass ratio of described improved silica and modification aluminium nitride is 1:0.9-1:1.6, the particle diameter of described improved silica is 25-45 μm, the particle diameter of modification aluminium nitride is 4-15 μm, and described improved silica and modification aluminium nitride are all utilize silane coupling agent to carry out immersion modification.
2. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, the immersion method of modifying of described improved silica and modification aluminium nitride is: first, silane coupling agent is dissolved in appropriate aqueous ethanolic solution, then acetic acid is dripped, pH value is adjusted to 3-5, and ultrasonic vibration is hydrolyzed; Then, complete in the coupling agent solution of hydrolysis by being added to after silicon-dioxide or aluminium nitride powder drying, at 60 DEG C of stirred in water bath process 2-4 hour, suction filtration, dry gained after surface treatment completes.
3. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 2, it is characterized in that, described silane coupling agent is KH-550, and the mass ratio of described silane coupling agent and described silicon-dioxide or aluminium nitride powder is 1-4:100.
4. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, described cycloaliphatic epoxy resin is 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl manthanoate.
5. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, described solidifying agent is methyl tetrahydro phthalic anhydride.
6. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, described promotor is 2,4,6-tri--(dimethylamino methyl) phenol.
7. F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, described strange scholar's toughner is QS-N.
8. the preparation method of F level motor embedding composite ceramics/epoxy resin composite material as claimed in claim 1, it is characterized in that, described preparation method is by cycloaliphatic epoxy resin, solidifying agent, promotor, strange scholar's toughner obtains sealing resin system according to heating 20min after described proportion by weight mixing in 80 DEG C of air dry ovens, then composite for modification ceramics powder is mixed into described sealing resin system, heating under vacuum 30min and ultrasonic disperse process 30min is carried out again at 80 DEG C, then process is cured, described curing cycle is at 80 DEG C 2 hours, at 100 DEG C 2 hours, at 120 DEG C at 2 hours and 150 DEG C 6 hours.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106633073A (en) * | 2016-12-28 | 2017-05-10 | 广东昭信照明科技有限公司 | Thermosetting ceramic injection molding material and preparation method thereof |
WO2022120907A1 (en) * | 2020-12-09 | 2022-06-16 | 深圳先进技术研究院 | Silica modification method, silica filler, and epoxy resin composite material |
CN114702788A (en) * | 2022-04-25 | 2022-07-05 | 叶金蕊 | Super-high voltage resistant insulating resin and preparation method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111370773B (en) * | 2020-03-19 | 2020-11-06 | 苏州清陶新能源科技有限公司 | All-solid-state stacked battery |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102779922A (en) * | 2012-05-24 | 2012-11-14 | 杭州电子科技大学 | Aluminum substrate used for packaging LED (Light Emitting Diode) |
WO2013123648A1 (en) * | 2012-02-22 | 2013-08-29 | Abb Technology Ltd. | Curable epoxy composition with milled glass fiber |
CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
-
2016
- 2016-01-08 CN CN201610011206.3A patent/CN105504688B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013123648A1 (en) * | 2012-02-22 | 2013-08-29 | Abb Technology Ltd. | Curable epoxy composition with milled glass fiber |
CN102779922A (en) * | 2012-05-24 | 2012-11-14 | 杭州电子科技大学 | Aluminum substrate used for packaging LED (Light Emitting Diode) |
CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
黄志彬: "导热透明有机硅灌封胶的制备与性能研究", 《中国优秀硕士学位论文全文数据库 工程科技I辑》 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106633073A (en) * | 2016-12-28 | 2017-05-10 | 广东昭信照明科技有限公司 | Thermosetting ceramic injection molding material and preparation method thereof |
WO2022120907A1 (en) * | 2020-12-09 | 2022-06-16 | 深圳先进技术研究院 | Silica modification method, silica filler, and epoxy resin composite material |
CN114702788A (en) * | 2022-04-25 | 2022-07-05 | 叶金蕊 | Super-high voltage resistant insulating resin and preparation method thereof |
CN114702788B (en) * | 2022-04-25 | 2022-09-27 | 叶金蕊 | Super-high voltage resistant insulating resin and preparation method thereof |
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