CN102057487B - 具有多个钉扎方向的双轴磁场传感器及其生产方法 - Google Patents
具有多个钉扎方向的双轴磁场传感器及其生产方法 Download PDFInfo
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- CN102057487B CN102057487B CN200980121423.6A CN200980121423A CN102057487B CN 102057487 B CN102057487 B CN 102057487B CN 200980121423 A CN200980121423 A CN 200980121423A CN 102057487 B CN102057487 B CN 102057487B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/308—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices lift-off processes, e.g. ion milling, for trimming or patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/303—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation
- H01F41/304—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation using temporary decoupling, e.g. involving blocking, Néel or Curie temperature transitions by heat treatment in presence/absence of a magnetic field
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/117,396 US7965077B2 (en) | 2008-05-08 | 2008-05-08 | Two-axis magnetic field sensor with multiple pinning directions |
| US12/117,396 | 2008-05-08 | ||
| PCT/US2009/043354 WO2009137802A1 (en) | 2008-05-08 | 2009-05-08 | Two-axis magnetic field sensor with multiple pinning directions and method to produce the sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102057487A CN102057487A (zh) | 2011-05-11 |
| CN102057487B true CN102057487B (zh) | 2012-12-05 |
Family
ID=40852562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980121423.6A Active CN102057487B (zh) | 2008-05-08 | 2009-05-08 | 具有多个钉扎方向的双轴磁场传感器及其生产方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7965077B2 (enExample) |
| JP (1) | JP2011523506A (enExample) |
| CN (1) | CN102057487B (enExample) |
| DE (1) | DE112009001140T5 (enExample) |
| WO (1) | WO2009137802A1 (enExample) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8242776B2 (en) * | 2008-03-26 | 2012-08-14 | Everspin Technologies, Inc. | Magnetic sensor design for suppression of barkhausen noise |
| US8269486B2 (en) * | 2008-11-12 | 2012-09-18 | Infineon Technologies Ag | Magnetic sensor system and method |
| US8257596B2 (en) * | 2009-04-30 | 2012-09-04 | Everspin Technologies, Inc. | Two-axis magnetic field sensor with substantially orthogonal pinning directions |
| JP5250109B2 (ja) | 2009-06-12 | 2013-07-31 | アルプス・グリーンデバイス株式会社 | 磁気平衡式電流センサ |
| US8779764B2 (en) * | 2009-07-13 | 2014-07-15 | Hitachi Metals, Ltd. | Method for producing magnetoresistive effect element, magnetic sensor, rotation-angle detection device |
| US8284594B2 (en) | 2009-09-03 | 2012-10-09 | International Business Machines Corporation | Magnetic devices and structures |
| US8390283B2 (en) | 2009-09-25 | 2013-03-05 | Everspin Technologies, Inc. | Three axis magnetic field sensor |
| FR2954512B1 (fr) * | 2009-12-21 | 2012-05-25 | Commissariat Energie Atomique | Realisation d'un dispositif a structures magnetiques formees sur un meme substrat et ayant des orientations d'aimantation respectives differentes |
| WO2011111493A1 (ja) * | 2010-03-12 | 2011-09-15 | アルプス・グリーンデバイス株式会社 | 電流センサ |
| WO2011111648A1 (ja) | 2010-03-12 | 2011-09-15 | アルプス電気株式会社 | 磁気センサ及びそれを用いた磁気平衡式電流センサ |
| US8518734B2 (en) | 2010-03-31 | 2013-08-27 | Everspin Technologies, Inc. | Process integration of a single chip three axis magnetic field sensor |
| WO2012026255A1 (ja) | 2010-08-23 | 2012-03-01 | アルプス・グリーンデバイス株式会社 | 磁気平衡式電流センサ |
| US8508221B2 (en) * | 2010-08-30 | 2013-08-13 | Everspin Technologies, Inc. | Two-axis magnetic field sensor having reduced compensation angle for zero offset |
| DE102010055754A1 (de) * | 2010-12-22 | 2012-06-28 | Sensitec Gmbh | Magnetoresistives Sensorelement |
| CN202083786U (zh) * | 2011-01-07 | 2011-12-21 | 江苏多维科技有限公司 | 薄膜磁电阻传感元件、多个传感元件的组合及与该组合耦合的电子装置 |
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| CN102226836A (zh) * | 2011-04-06 | 2011-10-26 | 江苏多维科技有限公司 | 单一芯片桥式磁场传感器及其制备方法 |
| CN102621504B (zh) * | 2011-04-21 | 2013-09-04 | 江苏多维科技有限公司 | 单片参考全桥磁场传感器 |
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| CN102426344B (zh) | 2011-08-30 | 2013-08-21 | 江苏多维科技有限公司 | 三轴磁场传感器 |
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| US20140028307A1 (en) * | 2012-07-26 | 2014-01-30 | Udo Ausserlechner | Magnetoresistive sensor systems and methods having a yaw angle between premagnetization and magnetic field directions |
| US20150069555A1 (en) * | 2013-09-09 | 2015-03-12 | Shintaro SAKAI | Magnetic memory |
| JP6304989B2 (ja) * | 2013-09-24 | 2018-04-04 | 株式会社東芝 | 圧力センサ、マイクロフォン、血圧センサ、タッチパネル、圧力センサの製造方法、および圧力センサの製造装置 |
| US9618589B2 (en) * | 2013-10-18 | 2017-04-11 | Infineon Technologies Ag | First and second magneto-resistive sensors formed by first and second sections of a layer stack |
| CN103592608B (zh) * | 2013-10-21 | 2015-12-23 | 江苏多维科技有限公司 | 一种用于高强度磁场的推挽桥式磁传感器 |
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| CN104677266B (zh) * | 2015-01-20 | 2017-11-10 | 江苏多维科技有限公司 | 强磁场误差校准的磁电阻角度传感器及其校准方法 |
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| CN110050355B (zh) * | 2016-12-06 | 2023-06-23 | 艾沃思宾技术公司 | 磁阻设备及其方法 |
| US10663537B2 (en) * | 2017-04-07 | 2020-05-26 | Crocus Technology Sa | Magnetic sensor cell for measuring one- and two-dimensional magnetic fields and method for measuring said magnetic fields using the magnetic sensor cell |
| JP6510100B2 (ja) * | 2018-02-28 | 2019-05-08 | 株式会社東芝 | 圧力センサ、マイクロフォン、血圧センサ、タッチパネル |
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| JP7106103B2 (ja) * | 2018-07-02 | 2022-07-26 | 国立大学法人東北大学 | 磁気センサ装置およびその製造方法 |
| JP6881413B2 (ja) * | 2018-10-15 | 2021-06-02 | Tdk株式会社 | 磁気センサ |
| US11415645B2 (en) * | 2019-08-23 | 2022-08-16 | Western Digital Technologies, Inc. | Magnetic sensor array with one TMR stack having two free layers |
| US11513175B2 (en) * | 2020-02-11 | 2022-11-29 | Globalfoundries Singapore Pte. Ltd. | Tunnel magnetoresistance sensor devices and methods of forming the same |
| DE102021202924A1 (de) | 2021-03-25 | 2022-09-29 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren für ein lokales Modifizieren einer Schichteigenschaft, Verfahren zum Herstellen einer magnetoresistiven Sensoreinrichtung und magnetoresistive Sensoreinrichtung |
| JP7735068B2 (ja) * | 2021-03-31 | 2025-09-08 | 本田技研工業株式会社 | 薄膜センサ |
| CN116106801B (zh) * | 2023-04-14 | 2023-06-20 | 珠海多创科技有限公司 | 磁阻传感器、磁传感装置及其制备方法 |
| CN116930833B (zh) * | 2023-09-18 | 2024-01-12 | 江苏多维科技有限公司 | 磁传感器及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1171606A (zh) * | 1996-07-18 | 1998-01-28 | 三洋电机株式会社 | 磁阻薄膜 |
| CN1191317A (zh) * | 1997-02-19 | 1998-08-26 | 日本电气株式会社 | 铁磁体传感器 |
| CN2591723Y (zh) * | 2002-12-24 | 2003-12-10 | 中国科学院物理研究所 | 具有叠层铁磁层的钉扎薄膜 |
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-
2008
- 2008-05-08 US US12/117,396 patent/US7965077B2/en active Active
-
2009
- 2009-05-08 DE DE112009001140T patent/DE112009001140T5/de active Pending
- 2009-05-08 CN CN200980121423.6A patent/CN102057487B/zh active Active
- 2009-05-08 WO PCT/US2009/043354 patent/WO2009137802A1/en not_active Ceased
- 2009-05-08 JP JP2011508715A patent/JP2011523506A/ja active Pending
-
2011
- 2011-02-08 US US13/023,260 patent/US8237437B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171606A (zh) * | 1996-07-18 | 1998-01-28 | 三洋电机株式会社 | 磁阻薄膜 |
| CN1191317A (zh) * | 1997-02-19 | 1998-08-26 | 日本电气株式会社 | 铁磁体传感器 |
| CN2591723Y (zh) * | 2002-12-24 | 2003-12-10 | 中国科学院物理研究所 | 具有叠层铁磁层的钉扎薄膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009137802A1 (en) | 2009-11-12 |
| US20110121826A1 (en) | 2011-05-26 |
| US8237437B2 (en) | 2012-08-07 |
| US20090279212A1 (en) | 2009-11-12 |
| JP2011523506A (ja) | 2011-08-11 |
| CN102057487A (zh) | 2011-05-11 |
| DE112009001140T5 (de) | 2011-06-09 |
| US7965077B2 (en) | 2011-06-21 |
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