CN102049729A - 一种研磨方法 - Google Patents
一种研磨方法 Download PDFInfo
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- CN102049729A CN102049729A CN2009101983945A CN200910198394A CN102049729A CN 102049729 A CN102049729 A CN 102049729A CN 2009101983945 A CN2009101983945 A CN 2009101983945A CN 200910198394 A CN200910198394 A CN 200910198394A CN 102049729 A CN102049729 A CN 102049729A
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CN200910198394.5A CN102049729B (zh) | 2009-11-06 | 2009-11-06 | 一种研磨方法 |
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CN102049729A true CN102049729A (zh) | 2011-05-11 |
CN102049729B CN102049729B (zh) | 2014-07-02 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312792A (zh) * | 2016-11-09 | 2017-01-11 | 上海华力微电子有限公司 | 一种动态调整安全研磨时间限的方法 |
CN113524019A (zh) * | 2021-07-27 | 2021-10-22 | 福建北电新材料科技有限公司 | 化学机械抛光方法 |
CN116533133A (zh) * | 2023-07-07 | 2023-08-04 | 合肥晶合集成电路股份有限公司 | 研磨方法、研磨控制系统及研磨系统 |
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CN101256952A (zh) * | 2008-03-27 | 2008-09-03 | 薛松生 | 晶片抛光方法与晶片抛光设备 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106312792A (zh) * | 2016-11-09 | 2017-01-11 | 上海华力微电子有限公司 | 一种动态调整安全研磨时间限的方法 |
CN106312792B (zh) * | 2016-11-09 | 2018-06-26 | 上海华力微电子有限公司 | 一种动态调整安全研磨时间限的方法 |
CN113524019A (zh) * | 2021-07-27 | 2021-10-22 | 福建北电新材料科技有限公司 | 化学机械抛光方法 |
CN116533133A (zh) * | 2023-07-07 | 2023-08-04 | 合肥晶合集成电路股份有限公司 | 研磨方法、研磨控制系统及研磨系统 |
CN116533133B (zh) * | 2023-07-07 | 2023-09-22 | 合肥晶合集成电路股份有限公司 | 研磨方法、研磨控制系统及研磨系统 |
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CN102049729B (zh) | 2014-07-02 |
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