CN102047160B - Integrated photonics device - Google Patents

Integrated photonics device Download PDF

Info

Publication number
CN102047160B
CN102047160B CN200980118444.2A CN200980118444A CN102047160B CN 102047160 B CN102047160 B CN 102047160B CN 200980118444 A CN200980118444 A CN 200980118444A CN 102047160 B CN102047160 B CN 102047160B
Authority
CN
China
Prior art keywords
grating coupler
coupling direction
integrated
coupling
waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980118444.2A
Other languages
Chinese (zh)
Other versions
CN102047160A (en
Inventor
J·施劳文
S·希尔林克
G·罗尔肯斯
D·范图洛特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universiteit Gent
Interuniversitair Microelektronica Centrum vzw IMEC
Imec Corp
Original Assignee
Universiteit Gent
Imec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universiteit Gent, Imec Corp filed Critical Universiteit Gent
Publication of CN102047160A publication Critical patent/CN102047160A/en
Application granted granted Critical
Publication of CN102047160B publication Critical patent/CN102047160B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/124Geodesic lenses or integrated gratings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/34Optical coupling means utilising prism or grating
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The present invention relates to an integrated photonic device (100) operatively coupleable with an optical element (300) in a first coupling direction. The integrated photonic device (100) comprises an integrated photonic waveguide (120) and a grating coupler (130) that is adapted for diffracting light from the waveguide (120) into a second coupling direction different from the first coupling direction. The integrated photonics device also comprises a refractive element (110) disposed adjacent the grating coupler (130) and adapted to refract the light emerging from the grating coupler (130) in the second coupling direction into the first coupling direction.

Description

Integrated photonic device
Technical field
The present invention relates to integrated photonics.The invention particularly relates to the optically-coupled between the waveguide on optical element and photonic integrated circuits.
Background of invention
Silicon-on-insulator (SOI) platform is because the compatibility of itself and complementary metal oxide semiconductor (CMOS) (CMOS) technique becomes the choosing of the hope of following ultra-compact photonic integrated circuits.High index of refraction difference between silicon core and oxide coating makes to manufacture short waveguide bend and highly integrated circuit becomes possibility.Efficient coupling between the waveguide of high index of refraction difference and optical fiber is extremely important, but can be because pattern size and model shape becomes difficult between waveguide basic mode and fiber mode compared with large mismatch.
The outer grating coupler of face can be for addressing this problem.Due to larger refractive index difference, this grating can very compact and broadband.In addition, the outer method of face can make polished surface become no longer necessary, and makes the wafer-level test of integrated photonic circuit become possibility.But this method has some inconvenience.First is not coupling efficiency limited between optical fiber and silicon waveguide mode.This can be by adopting bottom mirror to be redirected the light of refraction downwards, to be solved by application polysilicon coverture or by forming beveled.Second is not to need the long adiabatic taper of common 500 μ m magnitudes.
In the time that use face is coupled outward one is not mainly that the coupling (being substantially perpendicular to the coupling in the direction of centre plane of integrated optical circuit) of perpendicular often faces the larger second order Bragg reflection (for example,, in the time of coupling light between waveguide and optical fiber) that enters backward waveguide.Therefore, conventionally use off-normal (or departing from vertical) coupling.Off-normal coupling is carried out in approximately 10 ° of left and right of the normal with respect to integrated photonic circuit centre plane conventionally.When typical grating is that second order Bragg diffraction can cause larger reflection, thereby causes low coupling efficiency for ideal is vertical or substantially vertical coupled and when design.For second order Bragg reflection is formed to destructive interference, once proposed to use slit near grating.But this method is not entirely satisfactory, because reflection is just eliminated in narrower wavelength coverage.
In silicon, generate light very difficult, integrated optics assembly that therefore need to be based on other material on silicon integrated photonic circuit, such as comprising the semi-conductive optical module of III-V family.The example of these optical modules comprises light source, for example Vcsel or VCSEL.
On silicon integrated circuit the integrated first method based on the semi-conductive light source of III-V family be by direct combination or by intermediate polymer layer in conjunction with the part of III-V family semiconductor crystal wafer or this wafer is attached on treated Silicon Wafer.But the yield rate of current these techniques and reliability are very low, can not be commercial.Second method be by upside-down method of hull-section construction weld or metal for example, for example, in conjunction with coming integrated completed III-V family semiconductor devices, horizontal cavity laser instrument (distributed Feedback (DFB) laser instrument or Fabry-Perrault laser instrument) or vertical cavity laser (VCSEL).In this situation, from light source to the optical mode coupling of layer device most important.In the situation of horizontal cavity laser instrument, can and for arranging vertical raster coupling mechanism, lower circuit obtain this coupling by the angled surface of etching on horizontal cavity laser instrument.Horizontal cavity laser instrument is larger than vertical cavity laser inherently.Owing to needing more spaces on circuit, they are not too applicable to height miniaturization.In addition, on horizontal cavity laser instrument, the angled surface of etching is very complicated, expensive and process consuming time.Vertical cavity laser does not need angled surface to come to integrated circuit coupling light, but such as, to the directly vertical coupled special grating coupler that may need to allow perpendicular coupling of waveguide, the grating coupler described in " the High efficiency grating coupler between silicon-on-insulator waveguides and perfectly vertical optical fibers (the efficiency gratings coupling mechanism between silicon-on-insulator waveguide and desirable vertical fiber) " of optics letter (" Optics Letters ") the 32nd volume o. 11th in 2007 such as G.Roelkens.But this class grating coupler is realized not yet experimentally, and can not use in wider wavelength coverage.
Still need to be in wider wavelength coverage the coupling of perpendicular between the optical element of photonic integrated circuits and waveguide.Being coupled with of perpendicular is beneficial to fiber placing, and then reduces packaging cost, especially in the situation of one dimension or bidimensional fiber array.Vertical fiber is to being used the wafer-level test scheme of multifiber more useful.The coupling of perpendicular can be created more multimachine meeting such as the optical module of III-V family light source for combination on silicon photonic integrated circuits.
Summary of the invention
The object of this invention is to provide preferred approach and system for the optical coupled between optical element and integrated photonic device, and manufacture the method for this system.
Advantage is according to the embodiment of the present invention to provide system and method, uses by this integrated package to obtain preferred optical coupling, thereby avoids location or installation complicated or to mistake sensitivity.
The advantage of embodiments of the present invention is to obtain user-friendly system and method.
The advantage of embodiments of the present invention is to provide the method and system that for example, carries out high effective optical coupling between the optical element (Vcsel) that allows light conducting in integrated photonic device and the vertical direction at integrated photonic device.The advantage of these embodiments is in the situation that degree of reflection is lower, to be coupled.
Advantage is according to the embodiment of the present invention to provide the system that can use wafer scale manufacturing process easily to manufacture.
Advantage is according to the embodiment of the present invention to provide system and method, wherein can in much wide wavelength coverage, realize high effective optical coupling compared with the theory coupling that for example uses vertical raster coupling mechanism to obtain.
One aspect of the present invention is the integrated photonic device that can be coupled with optical element in the first coupling direction in operation, and this integrated photonic device comprises integrated photon waveguide; Grating coupler, is suitable for the optical diffraction of self-waveguide in the future and arrives the second coupling direction different from the first coupling direction; And refracting element, be arranged near grating coupler and be suitable for by the second coupling direction from the anaclasis of grating coupler to the first coupling direction.For example, the first coupling direction can be perpendicular to the centre plane of waveguide.For example, refracting element can be the wedge-shaped element integrated with grating coupler.The reversibility of the functional and light path based on optical module, refracting element is also suitable for the anaclasis from optical element in the first coupling direction to arrive the second coupling direction different from the first coupling direction, and grating coupler is suitable for the optical diffraction from the second coupling direction in integrated photon waveguide.Refracting element can be formed integrally as in integrated photonic device, and it can directly form in integrated photonic device, instead of separately makes or form, and then combines the remaining component of refracting element and integrated photonic device.Advantage is according to the embodiment of the present invention, compares the scheme of carrying out subsequent components combination, and as above manufacturing process is simpler and easy.Advantage is according to the embodiment of the present invention, forms refracting element (being that refracting element and grating coupler are integrated) and allow to carry out integrated with the integrated technology of reliable and cost-effective on grating coupler.Refracting element can directly contact with grating coupler.Refracting element can directly form valuably on grating coupler, or forms so that it firmly contacts with grating coupler such as the assembly by multiple middle layers or similar multiple flat beds on grating coupler.
In an embodiment of the invention, grating coupler is suitable for departing from vertically coupling light, and refracting element (for example wedge-shaped element) will depart from the direction of vertical anaclasis to perpendicular.
Refracting element can be made up of moldable material.Refracting element can be made up of polymkeric substance.
Refracting element can comprise multiple sub-elements, and each sub-element is suitable for the part from the light of grating coupler in the second coupling direction to be refracted to the first coupling direction.
Refracting element can comprise focusing refractive surface.
This device can also comprise the optical element of coupling with it.This optical element can be Vcsel.
Advantage is according to the embodiment of the present invention, can avoid using the couple prism separating.
In an embodiment of the invention, grating coupler is suitable for departing from vertical optically-coupled, and refracting element (for example wedge-shaped element) will depart from the direction of vertical anaclasis to perpendicular.
In an embodiment of the invention, refracting element is wedge-shaped element or the element with at least part of wedge shape, for example polymkeric substance wedge-shaped element, and departing between vertical grating coupler and optical element.Wedge-shaped element can be set single order Bragg diffraction is reflected into the vertical ripple that is coupled to the optical element of perpendicular positioning in operation, vice versa.Owing to departing from vertical Bragg diffraction, can avoid second order Bragg reflection.In a useful embodiment of the present invention, can use polymkeric substance wedge.These wedges can for example be made by the impression that uses mould, the mould that for example uses focused ion beam (FIB) etching to make.。
Specific implementations of the present invention for example provides, for example, between waveguide on integrated photonic circuit (circuit based on SOI) and optical element (optical fiber, light source or photodetector) the substantially vertically Apparatus and method for of coupling light, wherein than the scheme of prior art, can greatly reduce less desirable reflection, the second order Bragg reflection that for example enters backward waveguide or enter backward optical element.
Another aspect of the present invention be a kind of in the first coupling direction between integrated photon waveguide and optical element the method for coupling light, the method comprises: by grating coupler by coupling light in the second coupling direction from integrated photon waveguide; And by the second coupling direction from the anaclasis of grating coupler to the first coupling direction.The refracting element that use is integrated in the integrated photonic device that also comprises integrated photon waveguide carries out this refraction step.For example, the first coupling direction can be perpendicular to the centre plane of integrated photon waveguide.Can use near the refracting element being arranged on integrated photon waveguide to reflect.For example, refracting element can be the wedge-shaped element integrated with grating coupler.
On the other hand, the invention still further relates to a kind of use comprise integrated photon waveguide integrated photonic device come in the first coupling direction between integrated photon waveguide and optical element the method for coupling light, the method comprise use be integrated in integrated refracting element in integrated photonic device by the first coupling direction from the anaclasis of optical element to the second coupling direction, and will be refracted to the coupling light in integrated photon waveguide of the second coupling direction by grating coupler.
On the one hand, the invention still further relates to the method for being produced on the integrated photonic device that can be coupled with optical element in the first coupling direction, the method comprises that acquisition comprises the photonic device of integrated photon waveguide and grating coupler, is formed integrally as and is suitable for the refracting element to different directions by the anaclasis from grating coupler on grating coupler.
The advantage of specific implementations of the present invention is, the coupling of the perpendicular between these methods and device permission waveguide and optical element, and second order Bragg reflection is lower.Another advantage of specific implementations of the present invention is, the method can allow wafer scale manufacture.This make such as the optical element of for example vertical cavity laser of III-V family lasing light emitter can with photonic integrated circuits flip bonded at low cost.This also further allows optical fiber to be substantially perpendicularly coupled to photonic integrated circuits, thereby can simplify encapsulation and wafer scale diagnosis.
By reference to describing below and read accompanying drawing in detail, the present invention and feature and advantage thereof can be better understood.
Accompanying drawing summary
Fig. 1 illustrates according to the principle xsect of the integrated photonic device with the grating with wedge-shaped element of one embodiment of the present invention.
Fig. 2 illustrates the 3D view of the integrated photonic device shown in Fig. 1.
Fig. 3 illustrates by the power mark of the coupling of the grating coupler with wedge-shaped element for encouraging from silicon waveguide.
Fig. 4 a and 4b are according to the schematic diagram of the manufacture process of the mould that can be used for manufacturing integration photonic device of one embodiment of the present invention.
Fig. 5 a and 5b illustrate according to an embodiment of the present invention for refracting element being impressed on grating coupler to the manufacture process to form integrated photonic device.
Fig. 6 is illustrated in optical fiber-optical fiber power transmission of 5 devices that record in the same sample with impression PAK wedge.
Fig. 7 is illustrated in optical fiber-optical fiber power transmission of 6 devices that record in the same sample with impression SU-8 wedge.
Fig. 8 is illustrated in the grating coupler top with polymkeric substance refractive wedge and carries out the device after the flip-chip bonded of VCSEL.
Fig. 9 illustrates the transmission of the right optical fiber of 5 wedges on two different samples-optical fiber power.
Figure 10 is illustrated in the thermal cycle optical fiber of the device of Fig. 9 afterwards-optical fiber power transmission of 300 DEG C.
Figure 11 illustrates the example of integrated photonic device according to an embodiment of the present invention, and wherein refracting element comprises multiple sub-elements.
Figure 12 illustrate according to an embodiment of the present invention with thering is the integrated photonic device of refracting element that focuses on refractive surface.
Detailed description of the Invention
In the following detailed description, set forth numerous specific detail with provide to the present invention with and the thorough understanding that can how to implement in specific implementations.But, will understand, the present invention also can implement in the situation that there is no these specific detail.In other situation, well-known method, program and technology are not described in detail in order to avoid obscure the present invention.Although will describe the present invention for specific implementations and with reference to certain figures, with reference to being not limited to this.Accompanying drawing included and that describe is schematically and does not limit the scope of the invention herein.It shall yet further be noted that in the accompanying drawings, for purpose of explanation, the large I of some elements is exaggerated, therefore not drawn on scale.
In addition, the term first and second in instructions and claim etc. is used for distinguishing similar element, and not necessarily for the sequencing of description time, space, arrangement or any other mode.Be appreciated that these terms that so use are interchangeable in suitable situation, and embodiment of the present invention as herein described can be different from described herein or shown in other order operate.
And, term top in instructions and claims, bottom, on, under etc. for descriptive object, and not necessarily for describing relative position.Be appreciated that these terms that so use are interchangeable in suitable situation, and embodiment of the present invention as herein described can be different from described herein or shown in other direction operate.
Note, the term using in claims " comprises " should not be construed as limited to listed thereafter step or element; It does not get rid of other element or step.Thereby it should be interpreted as specifying and have described feature, entirety, step or the assembly quoted, exist or additional one or more further features, entirety, step or assembly or its combination but do not get rid of.Therefore, " a kind of equipment comprises A and B ", the scope of statement should not be limited to the equipment that only comprises assembly A and B like this.
In the context of the present invention, term " radiation " and " light " are for representing the electromagnetic radiation of wavelength in proper range, it is the electromagnetic radiation that wavelength for example, is not absorbed by material therefor (waveguide material), the for example electromagnetic radiation of wavelength between 1 μ m and 2 μ m, as near-infrared radiation (NIR) or short-wave infrared radiation (SWIR).
" vertically " or " normal " coupling for be illustrated in the direction of the determined centre plane perpendicular of the substrate that comprises waveguide (for example comprising the substrate of photonic integrated circuits) on by being optical coupling out waveguide or comprising the integrated photonic device of waveguide, as the same for the inside coupling of light." substantially vertical " coupling is used for representing vertical coupled most of light, at least 80%, preferably at least 90%, more preferably at least 95%.
Using the high refraction of term difference part, can be with reference to the system that is wherein greater than a refractive index unit such as the refringence between clad material and core material.Quoting low-index material part, can be with reference to the waveguide based on glass.Can also be with reference to the material system of the III-V family semiconductor material based on such as InP or GaAs.In these material systems, refractive index difference can be restricted to and be less than 1, be for example limited to refractive index unit 1/10th or a few tenths of.
Describe specific implementations of the present invention in detail for substantially vertical coupled particular condition below.But method of the present invention and device can be need to use in the application of the non-perpendicular coupling of optical element.In addition,, describe specific implementations of the present invention in detail for the particular condition of 1D second order grating coupling mechanism.But method of the present invention and device can be for the coupling mechanisms of other type.
In the context of the present invention, term " refracting element " refers to for the element from a direction to other direction refract light.For example, refracting element can be arranged near grating coupler, and is shaped as its upper surface and waveguide substrate is substantially not parallel.
In the context of the present invention, term " wedge " or " wedge-shaped element " are for being illustrated in the 3D structure that comprises at least part of triangle xsect on the face vertical with the determined centre plane of substrate at its place.Wedge or wedge-shaped element can also comprise multiple sub-elements of wedge shape.Wedge with on the face parallel by the determined centre plane of substrate, can be arbitrary shape, such as rectangle or circle.
Describe below the specific implementations of the inventive method and device in detail for silicon-on-insulator (SOI) material system.But these methods and device can use other material system, for example III-V family material system or low-refraction difference material system.
Particular aspects of the present invention relates to for example, for example, for example, method and device for coupling light (substantially vertical coupled) between waveguide (waveguide on integrated photonic circuit) and optical element (optical fiber, light source or photodetector).According to the embodiment of the present invention, a kind of integrated photonic device that can be coupled with optical element in the first coupling direction in operation is disclosed.Therefore, integrated photonic device comprises integrated photon waveguide and is suitable for the optical diffraction from this waveguide to the second grating coupler being coupled in direction different from the first coupling direction.It also comprise near grating coupler setting and be suitable for by the second coupling direction from the anaclasis of grating coupler the refracting element to the first coupling direction.With regard to the reversibility of light path, these assemblies are also suitable for reverse light path.Therefore, integrated can be on grating coupler, to be formed integrally as refracting element.Be formed integrally as and can be included in integrated refracting element in manufacture process, for example can be at wafer scale or the integrated refracting element of die-level.Refracting element can directly contact with grating coupler.This integrated photonic device can improve coupling efficiency.These embodiments preferably can be using light from be coupled to the application waveguide such as the laser instrument of Vcsel.Another Application is efficient and easy mechanical couplings between optical fiber and waveguide.The advantage of this coupling is to allow to locate perpendicular to each other such as optical fiber and waveguide, still has efficient coupling simultaneously.An embodiment of the method according to this invention is included in to depart between vertical grating coupler and optical element the wedge-shaped element such as polymkeric substance wedge is set, and this wedge-shaped element and grating coupler are integrated.For example, the refracting element such as wedge-shaped element can be set, single order Bragg diffraction is reflected into the vertical ripple of the optical element that is coupled to perpendicular positioning, vice versa.Owing to departing from vertical Bragg diffraction, can avoid second order Bragg reflection.
Describe the present invention in detail for the wedge of being made by polymeric material below.But any material that substantial transparent and refractive index are for example, from grating material (silicon) for example, with exterior conductive medium (air) different in wavelengths of interest scope all can be used for forming refracting element.As example, except polymkeric substance or the material based on polymkeric substance, refracting element also can be made up of oxide or nitride material.Oxide or nitride can be made up of for example gray scale etching or 3D etching.As described in detail below, another better method for making relate to impression/molded and plastic material become essential.Plastic material for example can be, such as curable materials (be originally liquid but can by the material of UV radiation or heat hardening).Plastic material can also be thermoplastic (for example, by heating and/or pressurizeing and soften in order to molded hard material).Polymkeric substance wedge can for example for example, be made by using the impression of mould (mould that, uses focused ion beam (FIB) etching to manufacture).
Fig. 1 illustrates according to the principle of the equipment 100 of one embodiment of the present invention, and equipment 100 comprises the refracting element 110 for polymkeric substance wedge in this example.Fig. 1 illustrates the xsect of waveguide, comprises sandwich layer 120 and the coating around sandwich layer, and coating is substrate 140 and peripheral air in this example.The waveguide of example is as shown in Figure 1 SOI (silicon-on-insulator) waveguide.In addition, show the grating coupler 130 forming in this example in silicon core layer, and in this example for the refracting element of polymkeric substance wedge 110 is formed integrally as at grating coupler 130 tops.Fig. 2 illustrates its 3D view.In the example shown, the shape of wedge on the face parallel with the centre plane of the substrate at its place is rectangle.But, in this embodiment of the present invention, also can adopt other shape, for example, as long as refracting element (wedge-shaped element) is positioned on grating.In order to mate better with dissimilar grating coupler or in order to reduce the volume of wedge, the shape of refracting element can be circular or oval.The size of wedge on the face parallel with integrated photonic circuit is preferably at least suitable with grating coupler, because if not, part light can not be refracted.The height of wedge, its with the direction of substrate centre plane perpendicular on size, be preferably less than 20 μ m, be more preferably less than 15 μ m, better the 10 μ m that are less than.In an embodiment of the invention, refracting element has from being greater than 0 degree to the angle of wedge (θ within the scope of approximately 45 degree i), for example (approximately) 5 degree are to the scope of (approximately) 45 degree (for example,, from (approximately) 10 degree to (approximately) 35 degree).Those skilled in the art can use the refractive index of expectation coupling angle, refracting element material and environment of coupling angle, the optical element of grating and Si Nieer (Snell) theorem to determine the suitable angle of wedge of refracting element.
As shown in Figure 1, (for example incide suprabasil light, the incident of the perpendicular shown in Fig. 1) be refracted element (for example polymkeric substance wedge) refraction, thereby at grating coupler place, (i.e. the interface from polymkeric substance wedge at grating coupler) obtains different incident directions, for example, depart from vertical incident.For purpose of explanation, for the light of initial perpendicular incident and draw this situation.Light is refracted into the refractive surface normal (θ at angle with refracting element t), thereby on grating coupler 130, obtain departing from vertical incident.Departing from vertical incident is conducive in the less optical coupled to silicon waveguide reflection.In reverse process, in the time being optical coupling out silicon waveguide, polymkeric substance wedge reflects into single order Bragg diffraction in the ripple of the perpendicular of the optical element (for example, optical fiber, light source or photodetector) that can be coupled to perpendicular location.
Be included in refracting element (for example wedge-shaped element) is set on conventional grating coupler according to device manufacture method of the present invention embodiment.The stamping technique that for example, can have the mould mould of wedge shape (for example comprise negative) of anti-shape or the negative shape of element to be formed by use is made this element.This stamping technique can be such as embossing technology.In one example, in first step, in the substrate that comprises grating coupler (for example integrated photonic device) or on mould (for example by distribution, spin coating or well known to a person skilled in the art any other suitable method) curable materials is set.Subsequently mould is contacted with the substrate that comprises grating coupler, make the curable materials negative shape wedge of fill mold substantially, thereby the negative shape wedge of mould is aimed at grating coupler.In next step, solidify this curable materials to form as the refracting element of solid polymer.Cured polymer material can comprise, for example, UV solidifies that (using UV irradiation), heat curing or UV solidify and the combination of heat curing.After solidifying, remove mould, and by using such as flip chip technology or well known to a person skilled in the art any other proper technology, the optical element 300 (as shown in Figure 8) such as optical fiber, light source or photodetector is installed on the wedge of grating coupler.One skilled in the art will recognize that, can on grating coupler, form refracting element by other method, such as hot pressing wedge shape in thermoplastic polymer's layer.
For purpose of explanation, the present invention is not limited to this, and the many examples that are applicable to the integrated photonic device with integrated refracting element with efficient coupling are provided.Example for the light of perpendicular incident is provided.According to the operation of device of the present invention by numerical simulation.For this simulation, suppose refractive index be 1.506 refraction polymer element be positioned at there are 20 wide 315nm, the grating coupler of the rectangular aperture of dark 70nm and the 351nm of being separated by.This coupling mechanism forms in the thick silicon layer of the 220nm at the thick oxide buffer layer top of 2 μ m.In 2D, simulate, this is better approximate to the wide waveguide of 10 μ m using in test.Carry out numerical evaluation by Fdtd Method (Finite Difference Time Domain, FDTD) method.
The first step, for example, the polymkeric substance (PAK polymkeric substance) that calculating is coated with refractive index 1.506 at the grating angle that is optical coupling out silicon waveguide of wavelength 1.55 μ m.Find for investigated configuration, this angle is is 8.6 ° with respect to substrate centre plane normal.Second step, by the θ that solves an equation it=8.6 ° and consider snell law, calculate angle θ i(with reference to Fig. 1).Find for given example this angle θ iequal 24.7 °.Use 15nm raster size, in omnirange photon emulation (Omnisim), check this design with FDTD.For the excitation from optical fiber, calculate the power mark being coupled between optical fiber and silicon waveguide.For the master grating coupling mechanism of optical fiber with 10 ° of off-normal location, the coupling efficiency calculating is 43%.For comprising wedge angle ibe 24.7 ° and have the setting of the structure as shown in Figure 1 of perpendicular positioning optical fiber, the coupling efficiency calculating is 49%.This means for coupled structure according to the present invention, expect that in theory coupling efficiency has small size raising.This point can be verified by calculating Fresnel equation.Find, in principle, to insert polymkeric substance wedge according to the present invention the power reflection of vertical incidence plane wave is reduced to 20% from 30%.Due to different angles and refractive index difference, this raising is declined by grating efficiency more or less and offsets.
Fig. 3 illustrates the power mark by the simulation grating coupler coupling with polymkeric substance wedge for the excitation from silicon waveguide.Show upwards (in the direction vertical with waveguide surface, enter air from waveguide), downwards (on the direction vertical with waveguide surface, under waveguide enters silicon oxide), (on the direction contrary with excitation orientation, enter backward waveguide) and through the power mark of (on excitation orientation, in waveguide) coupling backward.Find for the wavelength up to 1616nm, the reflection that enters backward waveguide is lower than-12dB.But the experiment reflection of expectation may be lower, because the scattered light in simulation process in wedge forms noise background.By by the artificial occlusion detector of thin gold ribbon, can obtain the reflection lower than-20dB.The so low wavelength coverage of retroeflection can for example, be widened departing from the lower operation of the vertical angle angle of 10 ° (be greater than under) by design grating coupler.Correspondingly, in an embodiment of the invention, the first coupling direction perpendicular, and the angle of the second coupling direction and normal is greater than 10 degree (for example, within the scope of 10-40 degree, or within the scope of 10-30 degree).In other embodiments, the angle of the second coupling direction and normal can be less than 10 degree, but is greater than 0 °.Also grating coupler can be designed to operate in less departing under vertical angle.
For purpose of explanation, below, will the example of integrated device method for making and the optional step of making mould be described.For example, can be by impress to make the polymkeric substance wedge according to one embodiment of the present invention with mould.This mould 200 comprises that size is generally the recessed region 210 of 15x15x8 micron, and this district inclusion becomes the face of special angle to form negative shape wedge with respect to mold surface.For example, can use FIB (focused ion beam) etching to make mould.In the time using the UV curable materials of for example UV curable polymer and so on to form wedge-shaped element, for the mould 200 that impresses these elements preferably to UV light printing opacity.For example, light-transparent substrate 220 (substrate of glass such as quartz substrate) can be for making this mould.But for fear of the charging problem in the FIB of mould etching process, light-transparent substrate 220 is preferably coated with conductive layer 230, such as metal level.Test as follows, wherein first cover for making the substrate of glass of mould with the thick Ti layer of 100nm that is electrically connected to sample stage in FIB vacuum chamber.Peel off to limit the position that forms the position of wedge and print off the align structures for impressing (referring to Fig. 4 a) with photoetching and Ti.Etching glass substrate is used to form wedge structure (referring to Fig. 4 b).The etching of substrate of glass can be carried out with the focusing gallium ion beam (7nA, 30keV) of normal incident by scanning.Image recognition is for being registered to by ion beam milling the position being limited in substrate of glass by Ti strip step.By this method, robotization ground 60 wedges of etching in single substrate of glass.These wedges have the rectangular cross section that is of a size of 14 μ mx16 μ m on determined parallel plane by photonic integrated circuits, and the high 8 μ m of wedge.The required time amounts to and is about each wedge shape 15 minutes.Accurate angled wedge shape (making 24.7 degree angles, be better than ± 1 degree of precision) and smooth (roughness is less than 5nm) bottom of mould can obtain by the dosage changing in etching rectangle.Ion beam etching mask forms by separating 160 long linear arrays of 100nm and 14 μ m.They are digitally scanned, and wherein step-length 200nm and dead time are variable (from 1.2mC/cm 2to 30.965mC/cm 2, stepping 0.1872mC/cm 2).Repeat this process 60 times; Therefore, the dosage of the darkest line is 1.86C/cm 2.This technique can be carried out by the Raith scanning generator that is connected to FEI Nova Nanolab 600.Preferably, this process is checked with iteration and is carried out by cross section.While finding the maximum available beam electric current as use 20nA, angled etched concave bottom portion (corresponding to optically smooth plane of refraction) is no longer smooth, and this may be beam quality compared with low and cause.The experiment of the larger angle of wedge shows, for the angle of wedge that is greater than approximately 45 °, can form ripple, thereby can not obtain smooth plane of refraction.
Although the FIB of mould makes the optical loss problem of having avoided inherently, these problems remain disadvantageous in the time using printing opacity mould.For example, for example, if the etched process of the penetrability of mould (for example, for UV transmission) reduces (greatly reducing), polymkeric substance exposes and becomes very difficult through etching mould.But, do not observe this class effect.
Can use such as stamping technique, make the refracting element such as polymkeric substance wedge by mould.In this example, after the recessed region 210 of etching, prepare quartz molds 200 for impression by carrying out anti-adhesion processing.For first group of wedge, first use Ti layer 230 and the negative shape wedge 210 of the silicon dioxide layer overlay pattern that 100nm is thick by plasma deposition.Then, mould is immersed in the pentane solution (0.1%) of (13 fluoro-1,1,2,2-tetrahydrochysene octyl group) trichlorosilane, use subsequently acetone, isopropyl alcohol and deionized water rinsing.Use thin silicon dioxide sedimentary deposit, because this anti-adhesion is processed design for monox.The advantage of patterning Ti layer is, can not penetrate Ti layer because UV exposes, and the region between wedge is also unexposed, after making to solidify, does not have residual polymeric layer between wedge.But but find (between wedge, there is no residual polymeric layer) in this case, removing mould or subsequently in flushing process, be easy to make wedge to come off from silicon (substrate of silicon-on-insulator).For second group of wedge, by Ti layer is removed to (among the HF of dilution) completely and directly carries out the anti-adhesion processing of mould at quartz from mould, yield rate is greatly improved.After solidifying, between wedge, leave residual layer (referring to Fig. 5 b).The thickness of this residual polyalcohol layer depends on the viscosity of institute's applied pressure in moulding process and polymkeric substance.In the context of the present invention, only characterized the wedge with residual layer.
Therefore, the example of the method for making of integrated photonic device comprises acquisition photonic device, and this photonic device comprises integrated photon waveguide and introduces the grating coupler on it.These photonic devices can be made by conventional manufacturing technology, for example conventional wafer scale manufacturing technology.The method is also included in the refracting element of formation such as wedge-shaped element on grating coupler.Test with two kinds of different UV curable polymers, form wedge: PAK (from the PAK-01 of Toyo Gosei company limited) and SU8 (from the SU8-10 of MicroChem).On sample, aim at mould (aiming at the grating coupler on sample by the negative shape wedge in mould) and before sample top die, on the sample of waveguide that comprises grating belt, scatter two kinds of polymkeric substance.Then, see through mould and polymkeric substance is exposed under UV light (on Karl Suss MA6, carrying out), as shown in Figure 5 a.The SU8 photoresist using is more more tacky than PAK material, and therefore after removing mould, expection can obtain the thicker residual layer (example as shown in Figure 5 b) near wedge.After removing mask, by sample floodlight exposure (flood expose) 5 minutes under UV optical fiber lamp.
In order to determine the coupling efficiency of the coupled structure (as shown in Figure 5 b) made, to by superluminescence LED (SLED) or the TE polarized light that generated by tunable laser source, carry out the transmission measurement of fiber-to-fiber.The single-mode fiber that is connected to SLED or tunable laser source is positioned on the first grating coupler; Another optical fiber is positioned on the second grating coupler in same waveguide and is connected to spectroanalysis instrument or photoelectric detector.According to obtained transmission spectrum, calculate the optical fiber of single grating coupler to the coupling efficiency of waveguide.This coupled structure comprises according to two grating couplers making by photoetching of one embodiment of the present invention (having above-described size in the substrate that comprises optical integrated circuit, be that grating coupler has 20 wide 315nm, dark 70nm, separates the rectangular aperture of 315nm, in the silicon layer that 220nm is thick on the thick oxide buffer layer top of 2 μ m, form) and polymkeric substance wedge.In this integrated circuit, light is conducted by the wide straight silicon waveguide of 10 μ m, and gradual change enters the wide silk of about 500nm.In the situation that two optical fiber depart from perpendicular positioning (becoming 10 ° of angles with respect to normal position), first the grating coupler with polymkeric substance wedge is not carried out to reference measure.Then, by slant optical fiber to desirable method line position and be positioned at grating coupler with polymkeric substance wedge top.
Fig. 6 and Fig. 7 illustrate the right measurement result of different wedges on two samples respectively with impression PAK wedge and SU8 wedge.The laser instrument that is 1mW for output power, illustrates the power (taking dBm as unit) recording.As can be known from the results, in the situation of PAK wedge, there is not the unfavorable result of coupling efficiency.For SU8 wedge, coupling efficiency has loss slightly.This may be relevant to thicker residual layer.
Fig. 9 illustrates 5 different wedges on two samples with SU8 and PAK wedge the optical fiber recording to optical coupling efficiency.Measurement result shown in Fig. 9 is by obtaining as photodetector as light source, with spectroanalysis instrument with SLED.Cause the loss of 13dB, the i.e. about 6.5dB of each coupling mechanism with the coupling of 10 ° of off-normal optical fiber.By optical fiber being vertically located in to PAK wedge top, obtain the coupling efficiency improving slightly (each coupling mechanism 5 to 6dB).On the other hand, SU8 wedge shows lower coupling efficiency more or less.This can be owing to because SU8 causes residual polyalcohol layer between wedge thicker and also may be owing to some misalignment than PAK viscosity is higher.But as can be known from the results, the angled plane of refraction of wedge has good optical quality.This show can be in quartz the smooth structure of FIB grinding optical.
Make the flip bonded of Vertical Launch laser instrument become possibility according to the polymkeric substance wedge of embodiment of the present invention.But, the thermal cycle of this technique between conventionally needing 240 DEG C to 300 DEG C.In order to assess the thermal stability of two kinds of polymkeric substance, will on two kinds of aerial baking trays of sample, at 300 DEG C, toast 5 minutes.Afterwards, again measuring optical fiber to Optical Fiber Transmission (in this situation, with tunable laser as light source).Result is shown in Figure 10.PAK polymkeric substance wedge presents coupling efficiency to be reduced, but value does not drop to reference under coupling mechanism.SU8 wedge does not present coupling efficiency to be reduced.Known based on this, SU8 polymkeric substance has better thermal stability.In the time using the lower SU8 of viscosity, can obtain higher coupling efficiency by SU8 wedge.For example, this can be by mixing it to obtain with appropriate solvent.
In an illustrative embodiments, refracting element can have multiple sub-elements 400, and sub-element has the refractive surface that is suitable for separately the part from the light of grating coupler in the second coupling direction to be refracted to the first coupling direction, as shown in figure 11.The latter allows to reduce the thickness of used refracting element 110, because can be configured to multiple little refraction sub-elements 400.This less thickness has not only reduced the material that uses or easier scale to adapt with the size of grating coupler, and reduces the height (from the centre plane of integrated photonic device 100) of refracting element 110.
In another illustrative embodiments, as shown in figure 12, refracting element 110 also has the refractive surface 450 of amendment.Refractive surface 450 is not to allow the flat surfaces to the first fixing coupling direction by all anaclasis in the second coupling direction, and refractive surface 450 is the curved surfaces with prism function.Like this, this surface can redirect incident ray, and has additional focusing effect.This refractive surface can be suitable for regulating there is size difference between for example optical element and grating coupler time the size of light beam.Can use the tortuous reflective surface of fabrication techniques as above, for example impression, embossing etc.In addition or as an alternative, can also use the refractive surface of previously having made such as the technology subsequent treatment of laser burn to form this refractive surface 450.
As mentioned above and described in appended claims, the present invention also comprises the method for light conducting between integrated photon waveguide and optical element.This method comprises, multiple or repertoire of the assembly described in above aspects.The invention still further relates to the method for making the integrated photonic device described in as above aspects.

Claims (9)

1. the integrated photonic device (100) that energy is coupled in operation with optical element (300) in the first coupling direction, described integrated photonic device (100) comprising:
-integrated photon waveguide (120);
-grating coupler (130), is suitable for the optical diffraction from described waveguide (120) to the second coupling direction different from described the first coupling direction; And
-refracting element (110), it is integrally made in described integrated photonic device (100) by directly form described refracting element (110) in described integrated photonic device (100), wherein, described refracting element (110) is arranged near described grating coupler (130) and directly contacts with described grating coupler (130), and described refracting element (110) is suitable in described the first coupling direction, arriving described the second coupling direction from the anaclasis of described optical element (300), and be suitable in described the second coupling direction, arriving described the first coupling direction from the anaclasis of described grating coupler (130),
Wherein, described grating coupler (130) comprises the grating in the core layer that is formed on described waveguide (120).
2. device as claimed in claim 1 (100), is characterized in that, described the first coupling direction is vertical with the centre plane of described waveguide (120).
3. device as claimed in claim 1 or 2 (100), is characterized in that, described refracting element (110) is the wedge-shaped element integrated with described grating coupler (130).
4. as the device as described in 1 or 2 (100) in claim, it is characterized in that, described refracting element (110) is made up of moldable material.
5. device as claimed in claim 4 (100), is characterized in that, described refracting element (110) is made up of polymkeric substance.
6. device as claimed in claim 1 or 2 (100), it is characterized in that, described refracting element (110) comprises multiple sub-elements (400), and each sub-element (400) is suitable in described the second coupling direction, being refracted to described the first coupling direction from a part for the light of described grating coupler (130).
7. device as claimed in claim 1 or 2 (100), is characterized in that, described refracting element (110) comprises focusing refractive surface (450).
8. device as claimed in claim 1 or 2 (100), described device also comprises the optical element (300) of coupling with it, described optical element (300) is Vcsel.
9. for comprising a method for coupling light between the integrated photonic device of integrated photon waveguide and optical element in the first coupling direction, described method comprises:
By grating coupler, the optical diffraction from described integrated photon waveguide is arrived to the second coupling direction different from described the first coupling direction; And
With being integrated in described integrated photonic device, and the integrated refracting element directly contacting with described grating coupler will arrive described the second coupling direction from the anaclasis of described optical element in described the first coupling direction, and will in described the second coupling direction, arrive described the first coupling direction from the anaclasis of described grating coupler
Wherein, described grating coupler comprises the grating in the core layer that is formed on described waveguide.
CN200980118444.2A 2008-05-19 2009-05-19 Integrated photonics device Active CN102047160B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5440108P 2008-05-19 2008-05-19
US61/054,401 2008-05-19
US14377509P 2009-01-10 2009-01-10
US61/143,775 2009-01-10
PCT/EP2009/056049 WO2009141332A1 (en) 2008-05-19 2009-05-19 Integrated photonics device

Publications (2)

Publication Number Publication Date
CN102047160A CN102047160A (en) 2011-05-04
CN102047160B true CN102047160B (en) 2014-11-19

Family

ID=40957841

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980118444.2A Active CN102047160B (en) 2008-05-19 2009-05-19 Integrated photonics device

Country Status (4)

Country Link
US (1) US8731349B2 (en)
EP (1) EP2281215B1 (en)
CN (1) CN102047160B (en)
WO (1) WO2009141332A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101845514B1 (en) * 2010-12-17 2018-04-04 삼성전자주식회사 Optical modulator with reduced size and optical transmitter having the same
EP2535749A1 (en) 2011-06-17 2012-12-19 Caliopa NV Optical interposer
EP2626731B1 (en) * 2012-02-07 2016-02-03 Huawei Technologies Co., Ltd. An optical coupling arrangement
KR20150034193A (en) * 2012-07-26 2015-04-02 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. Optical engine
US10209445B2 (en) * 2012-07-30 2019-02-19 Hewlett Packard Enterprise Development Lp Method of fabricating a compact photonics platform
EP2880480A4 (en) * 2012-07-30 2016-04-20 Hewlett Packard Development Co Compact photonic platforms
EP2746828B1 (en) 2012-12-19 2019-08-21 Huawei Technologies Co., Ltd. Optical interposer
KR102027189B1 (en) * 2013-02-22 2019-10-01 한국전자통신연구원 optical device module and optical communication network system used the same
KR102043704B1 (en) * 2013-07-02 2019-11-12 한국전자통신연구원 optical device module, optical communication apparatus, and computer system used the same
DE102013219625B3 (en) * 2013-09-27 2015-01-22 Carl Zeiss Ag Spectacle lens for a display device which can be placed on the head of a user and generates an image, and a display device with such a spectacle lens
US20150117817A1 (en) * 2013-10-25 2015-04-30 Forelux Inc. Optical device for redirecting incident electromagnetic wave
US9239507B2 (en) * 2013-10-25 2016-01-19 Forelux Inc. Grating based optical coupler
CN103985942B (en) * 2014-05-15 2016-03-30 南京航空航天大学 A kind of rectangular waveguide is to domino plasma waveguide transducer
US9465175B2 (en) * 2014-07-23 2016-10-11 Sifotonics Technologies Co., Ltd. Integrated lens-array-on-substrate for optical coupling system and fabrication method thereof
DE102014219663A1 (en) * 2014-09-29 2016-03-31 Ihp Gmbh - Innovations For High Performance Microelectronics / Leibniz-Institut Für Innovative Mikroelektronik Photonically integrated chip, optical component with photonically integrated chip and method for its production
US9746608B1 (en) * 2014-12-11 2017-08-29 Partow Technologies, Llc. Integrated optical assembly apparatus and integrated fabrication method for coupling optical energy
CA2972327A1 (en) * 2014-12-29 2016-07-07 Imec Vzw Light coupler
US10215986B2 (en) 2016-05-16 2019-02-26 Microsoft Technology Licensing, Llc Wedges for light transformation
KR102654870B1 (en) * 2016-11-09 2024-04-05 삼성전자주식회사 Backlight unit for 3D image display and method of manufacturing the backlight unit
CN106950660A (en) * 2017-05-22 2017-07-14 湖南城市学院 The coupling process of VCSEL lasers and optical grating construction in silicon-based photonics integration circuit
US11448823B1 (en) * 2017-08-18 2022-09-20 Acacia Communications, Inc. Method, system, and apparatus for a LiDAR sensor with a large grating
TW202204951A (en) * 2018-11-07 2022-02-01 美商應用材料股份有限公司 Depth-modulated slanted gratings using gray-tone lithography and slant etch
US11163120B2 (en) * 2018-11-16 2021-11-02 Ayar Labs, Inc. Fiber attach enabled wafer level fanout
US11249261B2 (en) 2019-08-30 2022-02-15 Oprocessor Inc Optical module and optical communication network system having the same
CN111045154A (en) * 2019-12-13 2020-04-21 中山大学 Waveguide-to-fiber three-dimensional polymer vertical coupler
US20240004142A1 (en) * 2020-12-14 2024-01-04 Mitsubishi Electric Corporation Grating coupler
CN114815057A (en) * 2022-05-05 2022-07-29 武汉大学 Focusing type vertical grating coupler and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3883221A (en) * 1974-02-01 1975-05-13 Bell Telephone Labor Inc Portable prism-grating coupler
CN1480929A (en) * 2002-09-02 2004-03-10 三星电子株式会社 Integrated optical pick-up with coupler

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176004A (en) * 1981-04-23 1982-10-29 Agency Of Ind Science & Technol Manufacture of optical element
US5208882A (en) * 1991-11-14 1993-05-04 Eastman Kodak Company Hybrid thin film optical waveguide structure having a grating coupler and a tapered waveguide film
US7123794B2 (en) * 2000-03-16 2006-10-17 Lightsmyth Technologies Inc Distributed optical structures designed by computed interference between simulated optical signals
US6912330B2 (en) * 2001-05-17 2005-06-28 Sioptical Inc. Integrated optical/electronic circuits and associated methods of simultaneous generation thereof
US6658173B2 (en) * 2001-05-17 2003-12-02 Optronx, Inc. Interferometer and method of making same
US6898352B2 (en) * 2001-05-17 2005-05-24 Sioptical, Inc. Optical waveguide circuit including passive optical waveguide device combined with active optical waveguide device, and method for making same
US20030174946A1 (en) * 2002-03-14 2003-09-18 Jean-Francois Viens Superstructure photonic band-gap grating add-drop filter
US6813405B1 (en) * 2002-03-29 2004-11-02 Teem Photonics Compact apparatus and method for integrated photonic devices having folded directional couplers
US20030185514A1 (en) * 2002-03-29 2003-10-02 Bendett Mark P. Method and apparatus for tapping a waveguide on a substrate
GB0208255D0 (en) * 2002-04-10 2002-05-22 Imec Inter Uni Micro Electr Photonic crystal based fiber-to-waveguide coupler for polarisation independent photonic integrated circuits
US7355162B2 (en) * 2002-07-02 2008-04-08 Optitune Plc Optical wavelength measuring device using guiding body and diffractive structure
US7155085B2 (en) * 2002-11-13 2006-12-26 Battelle Memorial Institute Amplifying wavelength division mux/demux
GB2396705B (en) * 2002-12-23 2006-05-03 Univ Surrey Optical coupler
US7031571B2 (en) * 2003-03-21 2006-04-18 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Industry Through The Communications Research Centre Canada Bragg grating and method of producing a Bragg grating using an ultrafast laser
US7058261B2 (en) * 2003-09-04 2006-06-06 Sioptical, Inc. Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling
US7181103B1 (en) * 2004-02-20 2007-02-20 Lightsmyth Technologies Inc Optical interconnect structures incorporating sets of diffractive elements
US7397987B2 (en) * 2004-05-06 2008-07-08 California Institute Of Technology Resonantly enhanced grating coupler
JP2008002914A (en) * 2006-06-21 2008-01-10 Fujitsu Ltd Temperature-independent optical wavelength discrimination apparatus and optical wavelength discrimination method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3883221A (en) * 1974-02-01 1975-05-13 Bell Telephone Labor Inc Portable prism-grating coupler
CN1480929A (en) * 2002-09-02 2004-03-10 三星电子株式会社 Integrated optical pick-up with coupler

Also Published As

Publication number Publication date
US8731349B2 (en) 2014-05-20
EP2281215A1 (en) 2011-02-09
WO2009141332A1 (en) 2009-11-26
US20110075970A1 (en) 2011-03-31
EP2281215B1 (en) 2013-10-02
CN102047160A (en) 2011-05-04

Similar Documents

Publication Publication Date Title
CN102047160B (en) Integrated photonics device
US20220011677A1 (en) Method for producing an optical system and optical system
JP7130001B2 (en) Photonic chip with integrated collimation structure
Snyder et al. Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers
US20150177459A1 (en) Radiation Coupler
Hoppe et al. Ultra-efficient silicon-on-insulator grating couplers with backside metal mirrors
CN107532967B (en) System for testing performance of optical device and method for testing optical device
JP2007528516A (en) Photonic crystal sensor
TW201331650A (en) Vertical optical coupler for planar photonic circuits
US20110064354A1 (en) Opto-electric hybrid module and method of manufacturing the same
Cho et al. Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits
Wang et al. InP-based grating antennas for high-resolution optical beam steering
Helman et al. Misalignment-tolerant surface-normal low-voltage modulator for optical interconnects
CN115210622A (en) Positioning of optical coupling points
Israel et al. Photonic plug for scalable silicon photonics packaging
JP2000066064A (en) Optical transmission element, manufacturing method thereof, and optical transmission module
CN114609722A (en) Integrated light source based on light deflection modulation and preparation method thereof
Jokerst et al. Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
JP2004309552A (en) Optical circuit member and its manufacturing method
Missinne et al. Silicon photonic temperature sensor: from photonic integrated chip to fully packaged miniature probe
Schrauwen et al. Polymer wedge for perfectly vertical light coupling to silicon
Van Laere et al. Compact focusing grating couplers between optical fibers and silicon-on-insulator photonic wire waveguides
JPH09269429A (en) Optical waveguide device, its manufacture and optical scanner
Weyers et al. Electro-optical co-integration platform for high-density hybrid systems–SILHOUETTE
Maidment Development of an Integrated Multispectral LIDAR in Silicon Photonics

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant