CN102034690A - Pretreatment method for electronic packaging - Google Patents
Pretreatment method for electronic packaging Download PDFInfo
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- CN102034690A CN102034690A CN 201010534765 CN201010534765A CN102034690A CN 102034690 A CN102034690 A CN 102034690A CN 201010534765 CN201010534765 CN 201010534765 CN 201010534765 A CN201010534765 A CN 201010534765A CN 102034690 A CN102034690 A CN 102034690A
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- electronic packaging
- cleaning
- cleaning equipment
- preprocess method
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Abstract
The invention relates to a pretreatment method for electronic packaging. The method comprises the following steps: (1) inspecting the feeding of a wafer and then sticking the wafer; (2) using a plasma cleaning device to clean the wafer; and (3) cutting the wafer after plasma cleaning. As the plasma cleaning device is adopted for cleaning the wafer before the wafer is cut, the cleaning efficiency is improved, and the packaging productivity can be further improved; and simultaneously, the cleaning effect is excellent, the adhesion force of a packaging material can be improved, and the delamination phenomenon of packaged products can be avoided almost.
Description
Technical field
The present invention relates to a kind of Electronic Packaging preprocess method.
Background technology
In the existing Electronic Packaging technology, wafer-level package commonly used is to encapsulate one by one after the wafer cutting, because the chip surface cleanliness factor is relatively poor, the adhesive force of encapsulating material in the follow-up encapsulation process of cutting is affected, surperficial delamination appears in product after the encapsulation easily, and reliability is lower.Especially in lead-free product, this phenomenon is more obvious.Therefore need it is cleaned to improve the cleanliness factor of chip surface, further improve the adhesive force of encapsulating material, improve the quality of products.But because the restriction of cleaning equipment has influenced the efficient of cleaning, promptly influenced the efficient of encapsulation, reduced production capacity.
Summary of the invention
The preprocess method that the purpose of this invention is to provide the higher Electronic Packaging of a kind of production capacity.
For achieving the above object, the technical solution used in the present invention is as follows.
A kind of Electronic Packaging preprocess method comprises the steps:
(1) glutinous wafer after the charging of check wafer;
(2) make electricity consumption slurry cleaning equipment clean described wafer;
(3) the electricity slurry cleans the described wafer of back cutting.
Preferably, in the described step (2), a kind of as in the mist of oxygen, argon gas, oxygen and argon gas of the gas that described electricity slurry cleaning equipment uses.
Preferably, in the described step (2), described electricity slurry cleaning equipment adopts chemical method to clean described wafer.
Because the technique scheme utilization, the present invention compared with prior art has following advantage: 1, because the present invention adopts electricity slurry cleaning equipment cleaning wafer before cutting crystal wafer, improved cleaning efficiency, and then improved the encapsulation production capacity.2, because the present invention adopts electricity slurry cleaning wafer, and cleaning performance is good, has improved the adhesive force of encapsulating material, encapsulating products delamination can occur hardly.
Description of drawings
Accompanying drawing 1 is the flow chart of embodiments of the invention one.
Embodiment
Below in conjunction with embodiment shown in the drawings the present invention is further described.
Embodiment one: shown in accompanying drawing 1.
A kind of Electronic Packaging preprocess method comprises the steps:
(1) glutinous wafer after the charging of check wafer;
(2) make electricity consumption slurry cleaning equipment adopt the chemical method cleaning wafer, in the process of cleaning, a kind of as in the mist of oxygen, argon gas, oxygen and argon gas of the gas that electricity slurry cleaning equipment uses;
(3) the electricity slurry cleans the back cutting crystal wafer.
After finishing above-mentioned pre-treatment step, the wafer after the cutting is encapsulated, obtain encapsulating products.
Owing to before the cutting step of wafer, adopt electricity slurry cleaning wafer, improved cleaning efficiency, further improved production capacity, simultaneously, crystal column surface cleanliness factor through cleaning is improved, the adhesive force of encapsulating material is improved when making encapsulation, and the product after the encapsulation is not prone to delamination after tested, and stability gets a promotion.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (3)
1. Electronic Packaging preprocess method, it is characterized in that: described Electronic Packaging preprocess method comprises the steps:
(1) glutinous wafer after the charging of check wafer;
(2) make electricity consumption slurry cleaning equipment clean described wafer;
(3) the electricity slurry cleans the described wafer of back cutting.
2. Electronic Packaging preprocess method according to claim 1 is characterized in that: in the described step (2), and a kind of as in the mist of oxygen, argon gas, oxygen and argon gas of the gas that described electricity slurry cleaning equipment uses.
3. according to the Electronic Packaging preprocess method described in the claim 1, it is characterized in that: in the described step (2), described electricity slurry cleaning equipment adopts chemical method to clean described wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010534765 CN102034690A (en) | 2010-11-08 | 2010-11-08 | Pretreatment method for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010534765 CN102034690A (en) | 2010-11-08 | 2010-11-08 | Pretreatment method for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102034690A true CN102034690A (en) | 2011-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010534765 Pending CN102034690A (en) | 2010-11-08 | 2010-11-08 | Pretreatment method for electronic packaging |
Country Status (1)
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| CN (1) | CN102034690A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834236A (en) * | 2019-04-22 | 2020-10-27 | 无锡华润安盛科技有限公司 | Semiconductor packaging method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833758A (en) * | 1995-02-07 | 1998-11-10 | Harris Corporation | Method for cleaning semiconductor wafers to improve dice to substrate solderability |
| JP2002190463A (en) * | 2000-12-22 | 2002-07-05 | Sanyo Electric Co Ltd | Method for manufacturing semiconductor component and plasma cleaning device |
| CN101748395A (en) * | 2008-12-01 | 2010-06-23 | 靖邦科技有限公司 | Wafer reduction type powerless chemical gilding method |
| CN101840871A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Wafer-level chip size package method |
-
2010
- 2010-11-08 CN CN 201010534765 patent/CN102034690A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833758A (en) * | 1995-02-07 | 1998-11-10 | Harris Corporation | Method for cleaning semiconductor wafers to improve dice to substrate solderability |
| JP2002190463A (en) * | 2000-12-22 | 2002-07-05 | Sanyo Electric Co Ltd | Method for manufacturing semiconductor component and plasma cleaning device |
| CN101748395A (en) * | 2008-12-01 | 2010-06-23 | 靖邦科技有限公司 | Wafer reduction type powerless chemical gilding method |
| CN101840871A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Wafer-level chip size package method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834236A (en) * | 2019-04-22 | 2020-10-27 | 无锡华润安盛科技有限公司 | Semiconductor packaging method |
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Application publication date: 20110427 |