CN102031375B - Indium tin oxide thin film recycling method and substrate recycling method - Google Patents
Indium tin oxide thin film recycling method and substrate recycling method Download PDFInfo
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- CN102031375B CN102031375B CN201010513266A CN201010513266A CN102031375B CN 102031375 B CN102031375 B CN 102031375B CN 201010513266 A CN201010513266 A CN 201010513266A CN 201010513266 A CN201010513266 A CN 201010513266A CN 102031375 B CN102031375 B CN 102031375B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention provides an indium tin oxide thin film recycling method, which comprises the following steps of: providing an object to be recycled, which is provided with an indium tin oxide thin film; making alkali liquor contact the indium tin oxide thin film to separate the indium tin oxide thin film from the object to be recycled and mix the indium tin oxide thin film into the alkali liquor, wherein the alkali liquor comprises ingredients of potassium hydroxide and/or sodium hydroxide; collecting the mixture of the separated indium tin oxide thin film and the alkali liquor, and filtering the mixture of the separated indium tin oxide thin film and the alkali liquor to obtain indium-containing powder. The invention also provides a substrate recycling method. In the invention, the alkali liquor contacts the indium tin oxide thin film to separate the indium tin oxide thin film from the object to be recycled and mix the indium tin oxide thin film into the alkali liquor, so the goal of recycling the indium tin oxide thin film or the substrate is achieved.
Description
Technical field
The present invention relates to the recovery method of a kind of indium (Indium), and relate in particular to the recovery method of a kind of indium and tin oxide film (ITO thin film).
Background technology
Because conventional cathode ray tube such as flat-panel screens have in light weight and volume is little (cathode ray tube, the CRT) indicating meter of the manufacturing advantage that is beyond one's reach, so flat-panel screens has become the main flow of indicating meter in recent years.General common flat-panel screens comprises liquid-crystal display, organic electro-luminescent display, plasma display, electrophoretic display device (EPD) etc., and these indicating meters adopt the material of indium tin oxide as its pixel electrode mostly.And in the production process of existing flat-panel screens, the etch process of indium and tin oxide film is to use oxalic acid (Oxalic acid) to carry out mostly.In detail; Do not pass through its structure of indium and tin oxide film not densification as yet of tempering process (annealing process) as yet; So can be, and can produce oxalic acid indium ion (In (C with the oxalic acid reaction as yet through the indium and tin oxide film of tempering process by the etching of oxalic acid institute
2O
4)
2 -), and oxalic acid indium ion (In (C
2O
4)
2 -) can carry out the recovery of indium through resin tower.
Yet oxalic acid only can not pass through the indium and tin oxide film of tempering process as yet in order to etching, can't be in order to etch structures through the densification indium and tin oxide film of (through tempering process).If want the indium and tin oxide film of etching through tempering process, the dealer can use (the FeCl of salt iron system usually
3+ HCl) etching reagent, chloroazotic acid (HNO
3+ HCl) or nitric acid is that etching reagent carries out, but because it is aforementioned in order to the resin tower that reclaims indium and be not suitable for and contain nitric acid (HNO
3) solution of composition, and does not still have that to utilize resin tower to handle salt iron be that the technology of solution exists at present, so be (FeCl through the indium and tin oxide film of tempering process by salt iron at present
3+ HCl) etching reagent, chloroazotic acid (HNO
3+ HCl) or nitric acid is can be dissolved in the etching reagent behind the etchant etching, and the phosphide element that is dissolved in the above-mentioned etching reagent can't reclaim at present.
Summary of the invention
The present invention provides a kind of recovery method of indium and tin oxide film, to reclaim the indium in the indium and tin oxide film effectively.
The present invention provides a kind of recovery method of substrate in addition, to remove the film on the substrate.
The present invention provides a kind of recovery method of indium and tin oxide film.At first, a thing to be recycled is provided, this thing to be recycled has an indium and tin oxide film; Then; One alkali lye is contacted with indium and tin oxide film, so that indium and tin oxide film is peeled off and is mixed in the alkali lye from thing to be recycled, wherein the composition of alkali lye comprises Pottasium Hydroxide and/or sodium hydroxide.Afterwards, collect the indium and tin oxide film and the mixture of alkali lye peel off, and filtration and obtain the powder that contains indium in the mixture of indium and tin oxide film and alkali lye.
In one embodiment of this invention, aforesaid thing to be recycled is a colored optical filtering substrates, and indium and tin oxide film is the common electrode on the colored optical filtering substrates.
In one embodiment of this invention, aforesaid thing to be recycled is an active assembly array substrate, and indium and tin oxide film is a plurality of pixel electrodes on the active assembly array substrate.
In one embodiment of this invention, the composition of aforesaid alkali lye comprises potassium hydroxide aqueous solution, ether alcohol kind solvent, alcamines solvent, alcoholic solvent and interface promoting agent.
In one embodiment of this invention, the temperature of aforesaid alkali lye is between 20 ℃ to 75 ℃.
In one embodiment of this invention, time of contacting with indium and tin oxide film of aforesaid alkali lye is between 20 seconds to 300 seconds.
In one embodiment of this invention, aforesaid alkali lye can further make an acid solution contact with indium and tin oxide film, on thing to be recycled, to remove residual indium and tin oxide film with after indium and tin oxide film contacts.
In one embodiment of this invention, aforesaid residual indium and tin oxide film and acid liquid reaction and be dissolved in the acid solution.
In one embodiment of this invention, the composition of aforesaid acid solution comprises the (FeCl of salt iron system
3+ HCl) solution, chloroazotic acid (HNO
3+ HCl) or nitric acid is solution.
The present invention provides a kind of recovery method of substrate in addition.At first, an element substrate is provided, this device substrate comprises a substrate, a plurality of element film and an indium and tin oxide film, and this indium and tin oxide film is covered on substrate and the element film.Then, an alkali lye is contacted with indium and tin oxide film, so that indium and tin oxide film is peeled off and is mixed in the alkali lye from the element film, wherein the composition of alkali lye comprises Pottasium Hydroxide and/or sodium hydroxide.Then, an acid solution is contacted with indium and tin oxide film, on substrate, to remove residual indium and tin oxide film.Afterwards, use alkali lye to remove aforesaid element film.
In one embodiment of this invention, aforesaid element film comprises a plurality of colored filter film or a plurality of active member.
In one embodiment of this invention, aforesaid indium and tin oxide film when colored filter film is peeled off, colored filter film and the alkaline reaction of part and being dissolved in this alkali lye.
In one embodiment of this invention, the recovery method of aforesaid substrate can further comprise collects the indium and tin oxide film and the mixture of alkali lye peel off, and filtration and obtain the powder that contains indium in the mixture of indium and tin oxide film and alkali lye.
The present invention adopts alkali lye to contact with indium and tin oxide film, makes indium and tin oxide film on thing to be recycled (like substrate), peel off and be mixed in the alkali lye, to reach the purpose that indium and tin oxide film or substrate reclaim.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the schema of the indium and tin oxide film recovery method of first embodiment of the invention;
Fig. 2 is the schema of the substrate collecting method of second embodiment of the invention;
Fig. 3 A to Fig. 3 D is the flow process diagrammatic cross-section of the substrate collecting method of second embodiment of the invention.
Wherein, Reference numeral:
S110~S140: the step of indium and tin oxide film recovery method
S210~S260: the step of substrate collecting method
300: colored optical filtering substrates
310: colored filter film
320: common electrode
SUB: substrate
BM: black matrix
OC: dielectric layer
PS: separation material
P: orientation projection
Embodiment
[first embodiment]
Fig. 1 is the schema of the indium and tin oxide film recovery method of first embodiment of the invention.Please with reference to Fig. 1, the recovery method of the indium and tin oxide film of present embodiment comprises the following steps (S110~S140).At first; One thing to be recycled is provided; This thing to be recycled has an indium and tin oxide film (step S110), then, an alkali lye is contacted with indium and tin oxide film; So that indium and tin oxide film is peeled off and is mixed in the alkali lye from thing to be recycled, wherein the composition of alkali lye comprises strong basicity compositions (step S120) such as Pottasium Hydroxide and/or sodium hydroxide.Afterwards, collect the indium and tin oxide film and the mixture of alkali lye peel off, and filtration and obtain the powder (step S130) that contains indium in the mixture of indium and tin oxide film and alkali lye.In addition, obtaining the powder (after the step S130) that contains indium, can carry out follow-up indium and reclaim action (step S140).Below will carry out detailed description to step S110~step S140.
In the present embodiment, the mentioned thing to be recycled of step S110 is for example for being a colored optical filtering substrates, and the common electrode that this colored optical filtering substrates has, and this common electrode is an indium and tin oxide film.It must be colored optical filtering substrates that present embodiment does not limit thing to be recycled, and other thing to be recycled with indium and tin oxide film also can adopt the recovery method of present embodiment.In other feasible embodiment, among the step S110 mentioned thing to be recycled can be one have a plurality of pixel electrodes active component array base board (like thin-film transistor array base-plate), and these pixel electrodes are indium and tin oxide film.Perhaps, thing to be recycled for example is the solar base plate with a plurality of transparency electrodes, and wherein solar base plate has a plurality of solar units, and these transparency electrodes for example are indium and tin oxide films.In addition, thing to be recycled for example is the wafer with a plurality of transparency electrodes, and wherein wafer has a plurality of circuit units, and these transparency electrodes for example are indium and tin oxide film.
In step S120, alkali lye for example adopts the mode of sprinkling (spray) or immersion to provide to the indium and tin oxide film of thing to be recycled, and the staple of employed alkali lye is the mixture of Pottasium Hydroxide, sodium hydroxide or Pottasium Hydroxide and sodium hydroxide.Wherein, the function of alkali lye is in order to the key knot ability of the indium and tin oxide film that destroys thing to be recycled and the indium and tin oxide film below film that is positioned at thing to be recycled and/or is positioned at the structure of the indium and tin oxide film below film of thing to be recycled.Except Pottasium Hydroxide, sodium hydroxide, also can add other composition in the alkali lye, for example one of them person such as ether alcohol kind solvent, alcamines solvent, alcoholic solvent and/or interface promoting agent.Each additive major function of giving an example above-mentioned is described below (1) monoethanolamine (MEA): softening organic polymer makes it to be easy to peel off glass substrate.(2) N-N-methyl 2-pyrrolidone N-(NMP): softening organic polymer makes it to be easy to peel off glass substrate.(3) trolamine (TEA): be mainly used in help and be dissolved with the organic polymer photoresist material in water.(4) Virahol (IPA): be mainly used in help N-N-methyl 2-pyrrolidone N-(MEA) solvent and N-N-methyl 2-pyrrolidone N-(NMP) solvent and water and dissolve each other.(5) butyl glycol ether (BC) is mainly used in wetting softening organic polymer, makes it to be easy to peel off glass substrate.Aforesaid alkali lye is when adding above-mentioned composition; Can let the organic polymer generation swelling and the surface tissue of indium and tin oxide film below softening; The indium and tin oxide film that causes the top loss of adhesion with therebetween, and then quicken indium and tin oxide film and peel off the speed that comes off.Be noted that,, just can not need in the alkali lye add other composition, but can look the product of each company's manufacturing and decide additive if the indium and tin oxide film of thing to be recycled below does not have organic polymer.In the present embodiment, when alkali lye was potassium hydroxide solution, its concentration for example was in fact more than or equal to 7%wt; When alkali lye was sodium hydroxide solution, its concentration for example was in fact more than or equal to 3%wt.The concentration of alkali lye is high more, and the effect that indium and tin oxide film is peeled off is good more.In addition, the temperature of alkali lye for example is approximately between between the 20C to 75C, and the time that alkali lye contacts with indium and tin oxide film for example is approximately between 120 seconds to 300 seconds.Being about the potassium hydroxide solution that 7%wt, temperature be about 30 degree Celsius with concentration is example; Indium and tin oxide film is contacting the phenomenon that the back just be full of cracks occurred, peels off in about 240 seconds with potassium hydroxide solution, obvious potassium hydroxide solution has good stripping ability for indium and tin oxide film.Being about the sodium hydroxide solution that 3%wt, temperature be about 60 degree Celsius with concentration is example; Indium and tin oxide film is contacting the phenomenon that the back just be full of cracks occurred, peels off in about 120 seconds with sodium hydroxide solution, obvious sodium hydroxide solution has good stripping ability equally for indium and tin oxide film.Following table record be the situation of peeling off of concentration of lye, alkali liquid temperature, alkali lye and indium and tin oxide film duration of contact and indium and tin oxide film.
Moreover; In other embodiment; The highly basic components and concentration of the embodiment of the invention reaches one of them kind interpolation composition of the embodiment of the invention as stated if alkali lye comprises as stated; And when cooperating the alkali liquid temperature of the embodiment of the invention as stated, alkali lye contacts with indium and tin oxide film and can produce that the time of peeling off effect can change to a little for example is approximately between 20 seconds to 300 seconds.
Merit attention to such an extent that be, the temperature of alkali lye is high more, and the effect that indium and tin oxide film is peeled off is good more, and the time that alkali lye contacts with indium and tin oxide film is long more, and the effect that indium and tin oxide film is peeled off is good more.
Hold above-mentionedly, those skilled in the art can adopt different concentration of lye and temperature, and time of contacting with indium and tin oxide film of control alkali lye, so that indium and tin oxide film presents different extent of exfoliation.
Present embodiment adopts alkali lye that indium and tin oxide film is peeled off and is different from existing oxalic acid etch process; No matter be indium and tin oxide film (structure is comparatively fine and close) through tempering process and the indium and tin oxide film (structure is not finer and close) that does not pass through tempering process, the employed alkali lye of present embodiment all can make it peel off.In addition; With after alkali lye contacts, the phenomenon that indium and tin oxide film can occur chapping also produces peeling off of small area gradually, afterwards at indium and tin oxide film; Indium and tin oxide film can produce larger area and peel off, till most indium and tin oxide film is all peeled off from thing to be recycled.At this moment, indium and tin oxide film can be mixed in the alkali lye, but can not be dissolved in the alkali lye, and the indium and tin oxide film that is mixed in the alkali lye can present Powdered or tiny bulk.Because the indium and tin oxide film that is mixed in the alkali lye can not be dissolved in alkali lye, therefore need not adopt the mode (resin tower) of IX to carry out the indium recovery.
In the present embodiment; If still can't indium and tin oxide film be removed after alkali lye contacts with indium and tin oxide film; Then optionally be to use an acid solution; And this acid solution is sprayed on the indium and tin oxide film of thing to be recycled, so that indium and tin oxide film residual on the thing to be recycled is removed.For example, the composition of aforesaid acid solution comprises the (FeCl of salt iron system
3+ HCl) solution, chloroazotic acid (HNO
3+ HCl) or nitric acid is solution.It should be noted that acid solution can be dissolved in the acid solution with residual indium and tin oxide film reaction.
In step S130 and step S140, can collect the indium and tin oxide film of peeling off (Powdered or tiny blocky indium tin oxide) through centrifugation systems or filtering system, with mixture separation with indium and tin oxide film and alkali lye.In the broadest sense, these Powdered or tiny blocky indium tin oxides are the powder that contains indium, and these powder that contain indium can offer thick indium and reclaim manufacturer and carry out follow-up purifying.
[second embodiment]
Fig. 2 is the schema of the substrate collecting method of second embodiment of the invention.Please with reference to Fig. 2, the substrate collecting method of present embodiment comprises the following steps (S210~S240).At first, an element substrate is provided, this device substrate comprises a substrate, a plurality of element film and an indium and tin oxide film, and this indium and tin oxide film is covered on substrate and the element film (step S210).Then, an alkali lye is contacted with indium and tin oxide film, so that indium and tin oxide film is peeled off and is mixed in the alkali lye from the element film, wherein the composition of alkali lye comprises strong basicity compositions (step S220) such as Pottasium Hydroxide and/or sodium hydroxide.Then, an acid solution is contacted with indium and tin oxide film, on substrate, to remove residual indium and tin oxide film (step S230).Afterwards, use alkali lye to remove aforesaid element film (step S240).Preferably, can remove aforesaid element film (step S240) fully.If the aforementioned components film, still have when residual, can cooperate other to remove step again and come to remove fully, for example: grinding steps, dissolving step or other appropriate steps or above-mentioned combination.
In the present embodiment; The mentioned device substrate of step S210 for example is the colored optical filtering substrates that comprises a plurality of colored filter film and common electrode (being indium and tin oxide film); Or comprise the active component array base board of a plurality of active members and pixel electrode (being indium and tin oxide film), like thin-film transistor array base-plate.Perhaps, thing to be recycled for example is the solar base plate with a plurality of transparency electrodes, and wherein solar base plate has a plurality of solar units, and these transparency electrodes for example are indium and tin oxide films.In addition, thing to be recycled for example is the wafer with a plurality of transparency electrodes, and wherein wafer has a plurality of circuit units, and these transparency electrodes for example are indium and tin oxide film.To be example with the colored optical filtering substrates with a plurality of colored filter film and common electrode below, collocation Fig. 2 and Fig. 3 A to Fig. 3 D carry out detailed explanation, but are not limited thereto.
Please with reference to Fig. 2 and Fig. 3 A, at first, a colored optical filtering substrates 300 (step 210) is provided, this colored optical filtering substrates 300 has a plurality of colored filter film 310 and common electrode 320, and colored filter film 310 all is positioned on the substrate SUB with common electrode 320.Can know from Fig. 3 A; Except colored filter film 310 and common electrode 320; Colored optical filtering substrates 300 also optionally comprises black matrix B M, dielectric layer OC etc., and wherein colored filter film 310, black matrix B M and dielectric layer OC can be regarded as aforesaid element film.In addition, according to the application of different kenels, colored optical filtering substrates 300 optionally is provided with separation material PS and/or orientation projection on common electrode 320.
Then please with reference to Fig. 2 and Fig. 3 B, alkali lye is contacted with common electrode 320 on the colored optical filtering substrates 300, so that common electrode 320 is peeled off and is mixed in the alkali lye from dielectric layer OC, wherein the composition of alkali lye comprises Pottasium Hydroxide and/or sodium hydroxide (step S220).In step S220, alkali lye for example adopts the mode of sprinkling (spray) or immersion to provide to the indium and tin oxide film of thing to be recycled, and the staple of employed alkali lye is the mixture of Pottasium Hydroxide, sodium hydroxide or Pottasium Hydroxide and sodium hydroxide.Wherein, the function of alkali lye is in order to the key knot ability of the indium and tin oxide film that destroys thing to be recycled and the indium and tin oxide film below film that is positioned at thing to be recycled and/or is positioned at the structure of the indium and tin oxide film below film of thing to be recycled.Except Pottasium Hydroxide, sodium hydroxide, also can add other composition in the alkali lye, like ether alcohol kind solvent, alcamines solvent, alcoholic solvent and/or interface promoting agent etc., its relevant composition function repeats no more described in first embodiment.Be noted that,, just can not need in the alkali lye add other composition, but can look the product of each company's manufacturing and decide additive if the indium and tin oxide film of thing to be recycled below does not have organic polymer.It should be noted that; When using alkali lye to divest common electrode 320; Separation material PS and orientation projection can be peeled off along with common electrode 320 in the lump; And when using alkali lye to divest common electrode 320, alkali lye might further make the element (like film colored filter film 310, black matrix B M, dielectric layer OC) of part be removed.
Can know that from Fig. 3 B the common electrode 320 of part can directly contact with substrate SUB, and be not easy to be divested that the common electrode 320 that therefore need be directed against this part done further processing, after will being specified in common electrode 320 that substrate SUB directly contact.
The time that contacts with indium and tin oxide film about concentration, temperature, the alkali lye of alkali lye and the situation of peeling off of indium and tin oxide film have been specified among first embodiment, so no longer repeat in this.
Then please with reference to Fig. 2 and Fig. 3 C; With after alkali lye contacts, do not divested smoothly with the common electrode 320 that substrate SUB directly contacts, present embodiment adopts acid solution; And acid solution is contacted with residual common electrode 320, on substrate SUB, to remove residual common electrode 320 (step S230).
Then please with reference to Fig. 2 and Fig. 3 D; Because element film (film colored filter film 310, black matrix B M, dielectric layer OC) is not removed in step S220 fully; Therefore; Present embodiment can reuse alkali lye to remove aforesaid element film (step S240), preferably, can remove aforesaid element film (step S240) fully.If the aforementioned components film, still have when residual, can cooperate other to remove step again and come to remove fully, for example: grinding steps, dissolving step or other appropriate steps or above-mentioned combination.To obtain the substrate SUB of the no film in surface, and this substrate SUB can supply recycling (step S260).
In the substrate collecting method of present embodiment; Can collect the indium and tin oxide film of peeling off (Powdered or tiny blocky indium tin oxide) through centrifugation systems or filtering system; With mixture separation, to reach the purpose (step S250) that indium reclaims with indium and tin oxide film and alkali lye.In the broadest sense, these Powdered or tiny blocky indium tin oxides are the powder that contains indium, and these powder that contain indium can offer thick indium and reclaim manufacturer and carry out follow-up purifying.
Previous embodiment of the present invention adopts alkali lye to contact with indium and tin oxide film, so that indium and tin oxide film peels off on thing to be recycled (like substrate) and be mixed in the alkali lye, and then reaches the purpose of indium and tin oxide film or substrate recovery.
Therefore; Previous embodiment of the present invention adopts alkali lye and transparent conductive material; For example: the single or multiple lift structure of indium tin oxide, indium tin germanium oxide compound, indium-zinc oxide, aluminium zinc oxide or other suitable material or above-mentioned materials, all can be by the purpose of enforcement method of the present invention with transparent conductive material or substrate recovery.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (18)
1. the recovery method of an indium and tin oxide film is characterized in that, comprising:
One thing to be recycled is provided, and this thing to be recycled has an indium and tin oxide film;
One alkali lye is contacted with this indium and tin oxide film, so that this indium and tin oxide film is peeled off and is mixed in this alkali lye from this thing to be recycled, wherein the composition of this alkali lye comprises Pottasium Hydroxide and/or sodium hydroxide; And
This indium and tin oxide film that collection is peeled off and the mixture of this alkali lye, and in the mixture of this indium and tin oxide film and this alkali lye, filter and obtain the powder that contains indium.
2. the recovery method of indium and tin oxide film according to claim 1 is characterized in that, this thing to be recycled is a colored optical filtering substrates, and this indium and tin oxide film is the common electrode on this colored optical filtering substrates.
3. the recovery method of indium and tin oxide film according to claim 1 is characterized in that, this thing to be recycled is an active component array base board, and this indium and tin oxide film is a plurality of pixel electrodes on this active component array base board.
4. the recovery method of indium and tin oxide film according to claim 1 is characterized in that, the composition of this alkali lye comprises potassium hydroxide aqueous solution, ether alcohol kind solvent, alcamines solvent, alcoholic solvent and interface promoting agent.
5. the recovery method of indium and tin oxide film according to claim 1 is characterized in that, the temperature of this alkali lye is between 20 ℃ to 75 ℃.
6. the recovery method of indium and tin oxide film according to claim 1 is characterized in that, the time that this alkali lye contacts with this indium and tin oxide film is between 20 seconds to 300 seconds.
7. the recovery method of indium and tin oxide film according to claim 1; It is characterized in that;, more comprise an acid solution is contacted with this indium and tin oxide film, with after this indium and tin oxide film contacts at this alkali lye to remove this residual indium and tin oxide film on this thing to be recycled certainly.
8. the recovery method of indium and tin oxide film according to claim 7 is characterized in that, this residual indium and tin oxide film and this acid liquid reaction also are dissolved in this acid solution.
9. the recovery method of indium and tin oxide film according to claim 7 is characterized in that, the composition of this acid solution comprises that salt iron is that solution, chloroazotic acid or nitric acid are solution, and wherein, said salt iron is that solution is FeCl
3+ HCl solution.
10. the recovery method of a substrate is characterized in that, comprising:
One element substrate is provided, and this device substrate comprises a substrate, a plurality of element film and an indium and tin oxide film, and this indium and tin oxide film is covered on this substrate and those element films;
One alkali lye is contacted with this indium and tin oxide film, so that this indium and tin oxide film is peeled off and is mixed in this alkali lye from those element films, wherein the composition of this alkali lye comprises Pottasium Hydroxide and/or sodium hydroxide;
One acid solution is contacted, to remove this residual indium and tin oxide film on this substrate certainly with this indium and tin oxide film; And
Use this alkali lye to remove those element films.
11. the recovery method of substrate according to claim 10 is characterized in that, the composition of this alkali lye comprises potassium hydroxide aqueous solution, ether alcohol kind solvent, alcamines solvent, alcoholic solvent and interface promoting agent.
12. the recovery method of substrate according to claim 10 is characterized in that, the temperature of this alkali lye is between 20 ℃ to 75 ℃.
13. the recovery method of substrate according to claim 10 is characterized in that, the time that this alkali lye contacts with this indium and tin oxide film is between 20 seconds to 300 seconds.
14. the recovery method of substrate according to claim 10 is characterized in that, this residual indium and tin oxide film and this acid liquid reaction also are dissolved in this acid solution.
15. the recovery method of substrate according to claim 10 is characterized in that, the composition of this acid solution comprises that salt iron is that solution, chloroazotic acid or nitric acid are solution, and wherein, said salt iron is that solution is FeCl
3+ HCl solution.
16. the recovery method of substrate according to claim 10 is characterized in that, those element films comprise a plurality of colored filter film or a plurality of active member.
17. the recovery method of substrate according to claim 16 is characterized in that, when this indium and tin oxide film is peeled off from those colored filter film, and those colored filter film and this alkaline reaction of part and being dissolved in this alkali lye.
18. the recovery method of substrate according to claim 10 is characterized in that, more comprises collecting this indium and tin oxide film and the mixture of this alkali lye peel off, and filtration and obtain the powder that contains indium in the mixture of this indium and tin oxide film and this alkali lye.
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CN101611174A (en) * | 2007-02-16 | 2009-12-23 | 日矿金属株式会社 | From the waste material that contains conductive oxide, reclaim the method for precious metals |
CN101701340A (en) * | 2009-11-20 | 2010-05-05 | 北京科技大学 | Method for reclaiming tin alloys from ITO scrap materials |
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CN101701340A (en) * | 2009-11-20 | 2010-05-05 | 北京科技大学 | Method for reclaiming tin alloys from ITO scrap materials |
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