CN102027400B - The manufacture method of optical waveguide and optical waveguide - Google Patents

The manufacture method of optical waveguide and optical waveguide Download PDF

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Publication number
CN102027400B
CN102027400B CN200980117381.9A CN200980117381A CN102027400B CN 102027400 B CN102027400 B CN 102027400B CN 200980117381 A CN200980117381 A CN 200980117381A CN 102027400 B CN102027400 B CN 102027400B
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China
Prior art keywords
optical waveguide
formation resin
upper clad
resin
clad layer
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CN200980117381.9A
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Chinese (zh)
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CN102027400A (en
Inventor
柴田智章
山口正利
高桥敦之
落合雅美
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/44—Compression means for making articles of indefinite length
    • B29C43/46—Rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00663—Production of light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)

Abstract

The invention provides the manufacture method of optical waveguide, it has following operation: the covering formation resin that base material is formed is cured the operation forming lower clad, on this lower clad, stacked sandwich layer formation resin film forms the operation of sandwich layer, this sandwich layer is carried out the operation that exposure imaging forms core figure, and fold upper clad layer formation resin film in this core graphic design, this covering formation resin is cured, form the operation of upper clad layer, the invention provides when this upper clad layer formation resin film stacked, take the melt viscosity of this covering formation resin as the manufacture method of the optical waveguide of the stacked condition of form control of 100 ~ 200Pas, and by melt viscosity be 100 ~ 200Pas resin formed optical waveguide, there is provided and can manufacture optical waveguide with good throughput rate, and between sandwich layer and upper clad layer, do not remain the manufacture method of the optical waveguide of bubble.

Description

The manufacture method of optical waveguide and optical waveguide
Technical field
The present invention relates to manufacture method and the optical waveguide of optical waveguide, particularly can manufacture optical waveguide with good throughput rate and between sandwich layer and upper clad layer the manufacture method of the optical waveguide of residual bubble and optical waveguide.
Background technology
The increase of accompanying information capacity, not only in the communications field that main line or access are such, the information processing in router or server is also just in the optical interconnection technology of application light signal.Specifically, in order to make to use up in the short-range signal transmission between the plate in router or server unit or in plate, the optical/electrical mixed mounting substrate being compounded with light transmission path in electric distributing board is being developed.As light transmission path, preferably use higher than the distribution degree of freedom of optical fiber phase and can the optical waveguide of densification, wherein, the optical waveguide using the polymeric material of processability, economy excellence be likely.
Optical waveguide and electric distributing board coexist, therefore also high-fire resistance is required while requiring high transparent, as such optical waveguide material, someone proposes the scheme of fluorinated polyimide (such as non-patent literature 1), epoxy resin (such as patent documentation 1).
Fluorinated polyimide has the high-fire resistance of more than 300 DEG C and under wavelength 850nm, has the high transparent of 0.3dB/cm, but masking must more than 300 DEG C and several tens minutes to the heating condition of a few hours, the masking therefore on electric distributing board is difficult.In addition, fluorinated polyimide does not have photonasty, and therefore can not apply the optical waveguide facture based on photosensitive development, throughput rate, large areaization are poor.And then, be used in and substrate be coated with method that aqueous material is filmed to make optical waveguide, therefore control of film thickness is miscellaneous, and be aqueous before coating the resin solidification on substrate, resin flows on substrate, has that to be difficult to keep the homogeneity etc. of thickness to result from material shape be aqueous technical matters.
On the other hand, about the optical waveguide formation epoxy resin being added with Photoepolymerizationinitiater initiater in liquid epoxy resin, also have and form core figure by photosensitive development method and there is the resin of high transparent, high-fire resistance, but there is the same technical matters that is that cause because material is aqueous.
Therefore, stacked containing can the dry film of composition of radioactive ray polymerization on substrate, by irradiating the light of ormal weight and make regulation place carry out radiation-curing and while forming covering, form core grade by unexposed portion being carried out development as required, and then the covering formed for imbedding this core segment, the method manufacturing the optical waveguide of transmission characteristic excellence is useful.Use the method easily guarantee core imbed after the flatness of covering.In addition, be also suitable for manufacturing large-area optical waveguide.As the method pressing dry film on substrate upper strata, known Fig. 1 and Fig. 2 as patent documentation 2 is disclosed, the vacuum type laminating machine had by the vacuum chamber that can be formed relative to pair of block body dynamic is up and down used under reduced pressure to carry out stacked so-called vacuum lamination mode.
But, due to this bubble, during by light signal, there is the problem that loss becomes so greatly in the problem that the gas bubbles left entered when core segment is imbedded in existence is such between sandwich layer and upper clad layer.The distribution density of the core segment particularly in the past required, live width/distance between centers of tracks is 50 μm/about 200 μm, but when such as to make live width/distance between centers of tracks be the optical waveguide of the spacing of 50/ μm/50 μm narrow like this, the impact caused by bubble is larger.In addition, when imbedding core segment, require the flatness improving upper clad layer.
Patent documentation 1: Japanese Unexamined Patent Publication 6-228274 publication
Patent documentation 2: Japanese Unexamined Patent Publication 11-320682 publication
Non-patent literature 1: エ レ Network ト ロ ニ ク ス real dress Hui Chi (association's will installed by electronic equipment), Vol.7, N0.3, pp.213-218,2004 years
Summary of the invention
The problem that invention will solve
The present invention completes to solve above-mentioned problem, object be to provide a kind of can manufacture optical waveguide with good throughput rate and between sandwich layer and upper clad layer the manufacture method of the optical waveguide of residual bubble and optical waveguide.
Solve the method for problem
The present inventor etc. further investigate repeatedly in order to reach above-mentioned purpose, found that, aforementioned object can be realized by following several mode, thus complete the present invention, described mode is: when stacked upper clad layer formation resin film, controls stacked condition and makes the melt viscosity of this covering formation resin be 100 ~ 200Pas; The resin being 100 ~ 200Pas by melt viscosity time stacked forms upper clad layer; Or, by the upper clad layer formation resin film of upper clad layer formation resin stacked on supporting carrier film, be layered on core figure in the mode of this resin and this core pattern contact, heat thereafter.That is, the invention provides following technical scheme:
(1) manufacture method for optical waveguide, it has: the operation covering formation resin solidification that base material is formed being formed lower clad; Stacked sandwich layer formation resin film on this lower clad and form the operation of sandwich layer; This sandwich layer is carried out exposure imaging and forms the operation of core figure; And fold upper clad layer formation resin film in this core graphic design, by this covering formation resin solidification, form the operation of upper clad layer, wherein, during this upper clad layer formation resin film stacked, control stacked condition and make the melt viscosity of this covering formation resin be 100 ~ 200Pas.
(2) manufacture method of the optical waveguide Gen Ju (1), is characterized in that, the operation forming sandwich layer comprises: use the layer of rolls press with warm-up mill, sandwich layer formation resin film is heated the operation be crimped on lower clad.
(3) manufacture method of the optical waveguide Gen Ju (1), is characterized in that, when core graphic design folds upper clad layer formation resin film, uses plate laminating machine to carry out adding thermo-compressed under reduced atmosphere.
(4) optical waveguide, it is the optical waveguide stacking gradually lower clad, core figure and upper clad layer on base material, it is characterized in that, the resin that this upper clad layer is 100 ~ 200Pas by melt viscosity time stacked is formed.
(5) optical waveguide, it is the optical waveguide stacking gradually lower clad, core figure and upper clad layer on base material, it is characterized in that, the resin that this upper clad layer is 100 ~ 200Pas by melt viscosity when 40 ~ 130 DEG C is formed.
(6) optical waveguide, it is the optical waveguide stacking gradually lower clad, core figure and upper clad layer on base material, it is characterized in that, the resin that this upper clad layer is 100 ~ 200Pas by melt viscosity when 100 DEG C is formed.
(7) a kind of optical waveguide, it for stacking gradually the optical waveguide of lower clad, core figure and upper clad layer on base material, it is characterized in that, this upper clad layer by the raw polymer containing phenoxy resin system and two functional epoxy resins, 90 ~ 120 DEG C time melt viscosity be that the resin of 100 ~ 200Pas is formed.
(8) optical waveguide according to any one in claim 4 ~ 7, is characterized in that, above-mentioned melt viscosity is 120 ~ 180Pas.
(9) manufacture method for optical waveguide, it has following operation: be cured by the covering formation resin that base material is formed and form the operation of lower clad; Stacked sandwich layer formation resin film on this lower clad and form the operation of sandwich layer; This sandwich layer is carried out exposure imaging and forms the operation of core figure; And by the upper clad layer formation resin film of upper clad layer formation resin stacked on supporting carrier film, be layered in the operation on this core figure in the mode of this resin and this core pattern contact; Thereafter the operation heated is carried out; This covering formation resin is cured, forms the operation of upper clad layer.
(10) manufacture method of the optical waveguide Gen Ju (9), is characterized in that, the condition of heating is that temperature is in 40 ~ 200 DEG C.
Below, the manufacture method of (1) ~ (3) is sometimes referred to as the first manufacture method, the manufacture method of (9) ~ (10) is sometimes referred to as the second manufacture method.
Invention effect
By manufacture method of the present invention, optical waveguide can be manufactured with good throughput rate, and do not remain bubble between sandwich layer and upper clad layer.
Accompanying drawing explanation
Fig. 1 is the figure of the example that optical waveguide manufacture method of the present invention is described.
Fig. 2 is the figure that the covering formation resin film used in optical waveguide manufacture method of the present invention is described.
Fig. 3 is the figure that the sandwich layer formation resin film used in the manufacture method of optical waveguide of the present invention is described.
Fig. 4 is the figure of an other example of the manufacture method that optical waveguide of the present invention is described.
Fig. 5 is the microphotograph after upper clad layer lamination, before heating.
Fig. 6 is the microphotograph after upper clad layer lamination, after heating.
Symbol description
1: base material
2: lower clad
3: sandwich layer
4: supporting carrier film (sandwich layer is formed and uses)
5: layer of rolls press
6: vacuum pressed laminating machine
7: photomask
8: core figure
9: upper clad layer
10: supporting carrier film (covering is formed and uses)
11: protective film (protective seam)
20: covering formation resin
30: sandwich layer formation resin
40: silicon substrate
200: covering formation resin film
300: sandwich layer formation resin film
Embodiment
By the optical waveguide that the present invention manufactures, such as, as shown in Fig. 1 (g), it is the optical waveguide on base material 1 with lower clad 2, core figure 8 and upper clad layer 9, sandwich layer formation resin film (Fig. 3 of a high index of refraction can be used, 300) the covering formation resin of and two low-refractions, preferably uses covering to be formed and makes of resin film (Fig. 2,200).By using film-like material, the distinctive throughput rate of liquid material, problem corresponding to large area can be solved.
(base material)
As the kind of base material 1, be not particularly limited, can use such as, FR-4 substrate, polyimide, semiconductor substrate, silicon substrate, glass substrate etc.
In addition, by using film as base material 1, optical waveguide flexibility and obdurability can be given.As the material of film, be not particularly limited, from the view point of having flexibility, obdurability, suitably can enumerate the polyester of polyethylene terephthalate, polybutylene terephthalate, PEN etc., tygon, polypropylene, polyamide, aromatic poly amide, polycarbonate, polyphenylene oxide, polyether sulfides, polyarylate, liquid crystal polymer, polysulfones, polyethersulfone, polyetheretherketone, polyetherimide, polyamidoimide, polyimide etc.
The thickness of film, suitably can change according to the flexibility as object, is preferably 5 ~ 250 μm.Have when more than 5 μm and easily obtain the such advantage of obdurability, when less than 250 μm, sufficient flexibility can be obtained.
As the base material 1 that Fig. 1 represents, the supporting carrier film 10 used in the manufacture process of covering formation resin film 200 described later can be used in.Now, as covering formation resin film 200, after optical waveguide makes, become when the outside of covering has the form of support, preferably on the supporting carrier film 10 implementing bonding process, covering formation resin 20 is filmed.Thus, the bonding force of lower clad 2 and base material 1 can be improved, and suppress lower clad 2 bad with the stripping of base material 1.So-called bonding process here, refers to the coarse processing etc. by easy adhering resin coating, corona treatment, sandblasting etc., improve supporting carrier film 10 with its on the process of the bonding force of covering formation resin 20 that formed.On the other hand, after making optical waveguide, when becoming the form peeling off support, demoulding process can be carried out as required for supporting carrier film.
In addition, can base material be had in the outside of upper clad layer, as the kind of this base material, the material same with above-mentioned base material 1 can be enumerated, such as, can enumerate as Fig. 1 (f) be shown in the supporting carrier film 10 etc. used in the manufacture process of covering formation resin film 200 described later.
The macromolecule layer of core figure and covering can be had at the one or two sides laminated multi-layer of above-mentioned base material 1, make multilayer lightguide.
And then, electric distribution can be set on above-mentioned base material 1, now, the material being previously provided with electric distribution can be used as base material 1.Or, after manufacture optical waveguide, base material 1 can form electric distribution.Thus, base material 1 has the signal transmission line of metal wiring and both signal transmission lines of optical waveguide, separately can use both, can easily carry out at a high speed and the signal transmission of long distance fast.
(covering formation resin and covering formation resin film)
Below, the covering formation resin used in the present invention and covering formation resin film (Fig. 2,200) are described in detail.
As the covering formation resin used in the present invention, as long as than core refractive rate low and resin combination that is that be cured by light or heat, be not particularly limited, can be applicable to using compositions of thermosetting resin, photosensitive polymer combination.More suitably, covering formation resin is formed preferably by the resin combination containing (A) raw polymer (being also sometimes called binder polymer), (B) photopolymerizable compound and (C) Photoepolymerizationinitiater initiater.In addition, the resin combination used in covering formation resin, in upper clad layer 9 and lower clad 2, the composition that this resin combination contains can be the same or different, and the refractive index of this resin combination can be the same or different.
(A) used herein raw polymer is for the formation of covering and guarantees the material of the intensity of this covering, as long as this this object can be reached be not particularly limited, phenoxy resin, epoxy resin, (methyl) acryl resin, polycarbonate resin, polyarylate resin, polyetheramides, polyetherimide, polyethersulfone etc. can be enumerated, or their derivant etc.These raw polymers can a kind of or mixing more than two kinds uses separately.In above-mentioned illustrative raw polymer, high from the view point of thermotolerance, preferred main chain has aromatic backbone, is particularly preferably phenoxy resin.In addition, from the view point of can carry out three-dimensional cross-linked, improve thermotolerance, be preferably epoxy resin, being particularly preferably is at room temperature the epoxy resin of solid forms.And then, with the intermiscibility of (B) photopolymerizable compound of explained later, be important for the transparency guaranteeing covering formation resin, by this point, be preferably above-mentioned phenoxy resin and (methyl) acryl resin.In addition, here so-called (methyl) acryl resin represents acryl resin and methacrylic resin.
In phenoxy resin, containing bisphenol-A, bisphenol A type epoxy compound or their derivant and Bisphenol F, bisphenol F type epoxy compound or their the derivant resin as copolymerization composition Component units, because thermotolerance, adaptation and dissolubility are excellent preferably.As the derivant of bisphenol-A or bisphenol A type epoxy compound, be applicable to enumerating tetrabromobisphenol A, tetrabromobisphenol A type epoxy compound etc.In addition, as the derivant of Bisphenol F or bisphenol F type epoxy compound, can be applicable to enumerating tetrabromobisphenol F, tetrabromobisphenol F type epoxy compound etc.As the concrete example of bisphenol-A/Bisphenol F copolymerization mould assembly phenoxy resin, Dongdu can be enumerated and change into " Fei Nuotuo (the Off エ ノ ト-ト) YP-70 (trade name) that (strain) manufacture.
As the epoxy resin of solid at room temperature form, " Ai Potuo (エ Port ト-ト) YD-7020, Ai Potuo YD-7019, Ai Potuo YD-7017 " (being trade name) that such as Dongdu chemistry (strain) manufactures can be enumerated, the bisphenol A type epoxy resin such as " Ai Piketuo (エ ピ コ-ト) 1010, Ai Piketuo 1009, Ai Piketuo 1008 " (being trade name) that japan epoxy resin (strain) manufactures.
Then, as (B) photopolymerizable compound, as long as the compound be polymerized is carried out in the irradiation by light such as ultraviolets, have no particular limits, the compound with ethene unsaturated group, the compound etc. in molecule with more than 2 epoxy radicals can be enumerated in molecule.
As the compound in molecule with ethene unsaturated group, (methyl) acrylate, vinylidene halide, vinyl ether, vinylpyridine, vinylphenol etc. can be enumerated, in these materials, from the view point of the transparency and thermotolerance, be preferably (methyl) acrylate.
As (methyl) acrylate, any one in the multi-functional material of more than mono-functional, two functionalities, trifunctional can be used.In addition, so-called (methyl) acrylate, represents acrylate and methacrylate here.
As the compound in molecule with more than 2 epoxy radicals, two senses of bisphenol A type epoxy resin etc. or multifunctional aromatic glycidyl ether can be enumerated, two senses of polyglycol type epoxy resins etc. or multifunctional aliphatic glycidyl ether, two sense ester ring type glycidol ethers of bisphenol-A epoxy resin etc., two sense aromatic series ethylene oxidic esters of o-phthalic acid diglycidyl ester etc., two sense ester ring type ethylene oxidic esters of tetrahydrophthalic acid 2-glycidyl ester etc., N, two senses of N-diglycidylaniline etc. or multifunctional aromatic series glycidyl amine, the two sense alicyclic epoxy resins of alicyclic diepoxy carboxylate etc., two sense hetero ring type epoxy resin, multifunctional hetero ring type epoxy resin, two senses or multifunctional containing epoxy silicone etc.These (B) photopolymerizable compound, can be used alone or combine more than two kinds uses.
Then, as the Photoepolymerizationinitiater initiater of (C) composition, be not particularly limited, such as initiating agent when using epoxy compound in (B) composition, aryl diazonium salts, diaryl group iodized salt can be enumerated, triarylsulfonium salt, triallyl selenium salt, dialkylphenacylsulfonium salts, dialkyl group-4-hydroxyphenylsulfonium salts, sulphonic acid ester etc.
In addition, as initiating agent when using in molecule the compound with ethene unsaturated group in (B) composition, the aromatic ketone of benzophenone etc. can be enumerated, the quinones of 2-EAQ etc., the benzoin ether compound of benzoin methyl ether etc., the benzoin compound of benzoin etc., the dibenzoyl derivant of dibenzoyl dimethyl acetal etc., 2-(Chloro-O-Phenyl)-4, 2 of 5-diphenyl-imidazole dipolymer etc., 4, 5-triarylimidazoles dipolymer, the benzimidazole of 2-mercaptobenzimidazole etc., two (2, 4, 6-trimethylbenzoyl) phosphinoxides of phenyl phosphine oxide etc., the acridine derivatives of 9-phenylacridine etc., N-phenylglycine, N-phenylglycine derivant, coumarin series compounds etc.In addition, also thioxanthones based compound and tertiary amine compound can be combined as the combination of diethyl thioxanthone and dimethylaminobenzoic acid.In addition, from the view point of the transparency improving sandwich layer and covering, in above-claimed cpd, be preferably aromatic ketone and phosphinoxides.These (C) Photoepolymerizationinitiater initiaters, can be used alone or composition more than two kinds use.
(A) use level of raw polymer, is preferably 5 ~ 80 quality % relative to the total amount of (A) composition and (B) composition.In addition, the use level of (B) photopolymerizable compound, is preferably 95 ~ 20 quality % relative to the total amount of (A) and (B) composition.
As the use level of this (A) composition and (B) composition, when (A) composition is more than 5 quality %, (B) composition is below 95 quality %, easily resin combination can be carried out filming.On the other hand, (A) composition is below 80 quality %, (B) composition is when being more than 20 quality %, easily can make (A) raw polymer crosslinking curing, when forming optical waveguide, figure formative is improved, and photocuring reaction carries out fully.From the view point of above, as the use level of this (A) composition and (B) composition, be more preferably (A) composition 10 ~ 75 quality %, (B) composition 90 ~ 25 quality %, more preferably (A) composition 20 ~ 70 quality %, (B) composition 80 ~ 30 quality %.
(C) use level of Photoepolymerizationinitiater initiater, relative to total amount 100 mass parts of (A) composition and (B) composition, is preferably 0.1 ~ 10 mass parts.When this use level is more than 0.1 mass parts, light sensitivity is abundant, and when being below 10 mass parts on the other hand, the absorption on the top layer at photosensitive polymer combination during exposure does not increase, and inner photocuring becomes abundant.And then when using as optical waveguide, loss will be caused to increase because of the impact of the light absorption of polymerization initiator self, be therefore suitable.From the view point of above, the use level of (C) Photoepolymerizationinitiater initiater is more preferably 0.2 ~ 5 mass parts.
In addition, in addition can also be as required, in covering formation resin, not bring dysgenic ratio to add the so-called adjuvants such as antioxidant, anti-yellowing agent, ultraviolet light absorber, visible light absorber, colorant, plastifier, stabilizing agent, filling agent to effect of the present invention.
Covering is formed with resin film (Fig. 2,200), by being dissolved in solvent by the resin combination containing above-mentioned (A) ~ (C) composition, coating on above-mentioned supporting carrier film 10, except desolventizing, can easily manufacture.
The supporting carrier film 10 used in the manufacture process of covering formation resin film 200, is not particularly limited for its material, can uses various material.From the view point of as the flexibility of supporting carrier film and obdurability, the membraneous material can similarly enumerated as above-mentioned base material 1 carries out illustrative material.
The thickness of supporting carrier film 10, suitably can change according to the flexibility as object, is preferably 5 ~ 250 μm.Can obdurability be obtained when more than 5 μm, when less than 250 μm, sufficient flexibility can be obtained.In addition, when heating, the thickness of supporting carrier film 10 preferably 5 ~ 40 μm.Sufficient obdurability can be obtained when more than 5 μm, when less than 40 μm, heating-up temperature not set comparatively higher position and can eliminate bubble.
Now, from the view point of the covering formation protection of resin film 200, manufacture with roll time crimpiness etc., protective film 11 of can fitting on covering formation resin film 200 as required.As protective film 11, can use with as supporting carrier film 10 the identical material of the material that exemplifies out, also can carry out demoulding process, antistatic treatment as required.
As the solvent here used, as long as the solvent of this resin combination of solubilized is not particularly limited, can use such as, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, DMA, propylene glycol monomethyl ether, propylene glycol monomethyl ether, cyclohexanone, METHYLPYRROLIDONE equal solvent or their mixed solvent.Solid component concentration in resin solution is preferably about 30 ~ 80 quality %.
About the thickness of lower clad 2 and upper clad layer 9 (hreinafter referred to as covering 2,9), be preferably the scope of 5 ~ 500 μm according to dried thickness.When more than 5 μm, the necessary cladding thickness of closed light can be guaranteed, when less than 500 μm, easily control thickness equably.From the view point of above, the thickness of covering 2,9, is more preferably the scope of 10 ~ 100 μm.
In addition, about the thickness of covering 2,9, at the lower clad 2 of initial formation with for imbedding in the upper clad layer 9 of core figure, can be the same or different, in order to imbed core figure, the thickness of upper clad layer 9 is preferably thick than the thickness of sandwich layer 3.
(sandwich layer formation resin film)
Then, the sandwich layer formation resin film (Fig. 3,300) used in the present invention is described in detail.
As the sandwich layer formation resin 30 forming sandwich layer formation resin film 300, the refractive index ratio covering 2,9 being designed to sandwich layer 3 is high, and can use the resin combination forming core figure 8 by active ray, photosensitive polymer combination is applicable.Specifically, the resin combination that preferred use is same with the composition used in above-mentioned covering formation resin, that is, preferably use containing above-mentioned (A), (B) and (C) composition, and the resin combination as required containing above-mentioned any composition.
Sandwich layer is formed with resin film 300, by the resin combination containing above-mentioned (A) ~ (C) composition being dissolved in solvent and coating supporting carrier film 4, easily manufacture except desolventizing.As solvent, as long as the solvent of this resin combination of solubilized, be not particularly limited, similarly can be used as the solvent and illustrative solvent that use in the manufacture of covering formation resin film.In addition, the solid component concentration in resin solution, is preferably about 30 ~ 80 quality % usually.
Thickness for sandwich layer formation resin film 300 is not particularly limited, and the thickness of dried sandwich layer 3 is adjusted to 10 ~ 100 μm usually.When the thickness of this film is more than 10 μm, position tolerance on fit is had to expand such advantage in emitting element after being formed with optical waveguide or the combination of optical fiber, when less than 100 μm, in the emitting element after being formed with optical waveguide or the combination of optical fiber, be improved the advantage that joint efficiency is such.From the view point of above, the thickness of this film more preferably scope of 30 ~ 70 μm.
The supporting carrier film 4 used in the manufacture process of sandwich layer formation resin film 300, it is the supporting carrier film supporting sandwich layer formation resin 30, its material is not particularly limited, from the view point of easily peeling off sandwich layer formation resin 30 afterwards and there is thermotolerance and solvent resistance, the polyester, polypropylene, tygon etc. of enumerating polyethylene terephthalate etc. can be applicable to.
The thickness of supporting carrier film 4 is preferably 5 ~ 50 μm.When more than 5 μm, have and easily obtain as the such advantage of the intensity of supporting carrier film 4, when less than 50 μm, the gap smaller of mask when being formed with figure, has and can form the such advantage of finer figure.From the view point of above, the thickness of supporting carrier film 4 is more preferably the scope of 10 ~ 40 μm, is particularly preferably 15 ~ 30 μm.
From the view point of the protection of sandwich layer formation resin film 300, manufacture with roll time crimpiness etc., protective film 11 of can fitting on sandwich layer formation resin film 300 as required.As protective film 11, the material same with the material exemplified as supporting carrier film 4 can be used, also can carry out demoulding process, antistatic treatment as required.
(manufacture method of optical waveguide)
Below, the manufacture method for optical waveguide of the present invention carries out describing in detail (with reference to Fig. 1).In addition, in following Production Example, specifically describe the example using covering formation resin film (Fig. 2,200) and sandwich layer to form embodiment when using resin film (Fig. 3,300).
First, as the first operation, use to be formed by covering and formed with resin film (Fig. 2,200) with the covering that resin 20 and supporting carrier film 10 are formed, solidify covering formation resin 20 by light or heating, form lower clad 2 (Fig. 1 (a)).Now, above-mentioned supporting carrier film 10 becomes the base material 1 of the lower clad 2 that Fig. 1 (a) represents.
By the condition that light or heating are cured, the kind according to covering formation resin changes, but preferably makes the solvent used in the manufacture process of covering formation resin film be vaporized, and does not solidify to guarantee the adaptation with sandwich layer 3 completely.This be in order to when preventing the upper clad layer below stacked because of harmful effect that solvent erosion etc. causes.
Such as, contain phenoxy resin system as raw polymer, when containing the covering formation resin of two functional epoxy resins as photopolymerizable compound, can be cured under temperature 90 ~ 150 DEG C, the condition of about 10 ~ 120 minutes.
This lower clad 2, from the view point of the adaptation with sandwich layer described later, does not preferably have difference of height (section is poor) and smooth on the surface of the stacked side of sandwich layer.In addition, by using covering formation resin film, the surface of covering 2 can be guaranteed.
As shown in Figure 2, when the opposition side of the supporting carrier film 10 of covering formation resin film 200 arranges protective film 11, after peeling off this protective film, solidify covering formation resin 20 by light or heating, form covering 2.Now, preferred covering formation resin 20 is filmed on the supporting carrier film 10 implementing bonding process.On the other hand, about protective film 11, preferably not implementing abutting edge reason to easily peel off from covering formation resin film 200, can implement demoulding process as required yet.
Then, by the second operation described in detail, lower clad 2 forms sandwich layer 3 below.In this second operation, on lower clad 2, stacked sandwich layer formation resin film 300, forms the sandwich layer 3 higher than the refractive index of lower clad 2.
Specifically, as the second operation, sandwich layer formation resin film 300 that lower clad 2 is fitted, stacked sandwich layer 3.Layer of rolls press, plate laminating machine can be used in stacked.
Such as, when using layer of rolls press 5 (Fig. 1 (b)), from the view point of raising adaptation and tracing ability, preferred limit is carried out crimping limit and is carried out lamination, when crimping, preferably uses the laminating machine limit heating edge with warm-up mill to crimp.When using layer of rolls press, the laminating temperature being involved in bubble is preferably the scope of room temperature (25 DEG C) ~ 100 DEG C.During temperature higher than room temperature, the adaptation of lower clad and sandwich layer is improved, and when more than 40 DEG C, can further improve closing force.On the other hand, when less than 100 DEG C, sandwich layer does not flow when layer of rolls is folded, and can obtain necessary thickness.From the view point of above, the more preferably scope of 40 ~ 100 DEG C.Pressure is preferably 0.2 ~ 0.9MPa.Laminate speed is preferably 0.1 ~ 3 m/min, these conditions limit not processed especially.
On the other hand, when using plate laminating machine 6 (Fig. 1 (c)), from the view point of raising adaptation and tracing ability, when adding thermo-compressed, preferably carry out under reduced atmosphere.In addition, so-called plate laminating machine, refers to and is held between pair of plates by stacking material in the present invention, by adding locating back to carry out the laminating machine crimped.As plate laminating machine, such as, can be applicable to using the vacuum pressure type laminating machine as recorded in patent documentation 2.As the upper limit of the vacuum tightness of decompression yardstick, be preferably below 10000Pa, more preferably below 1000Pa.Expect that vacuum tightness is lower from the viewpoint of adaptation and tracing ability.On the other hand, about the lower limit of vacuum tightness, (vacuumize) time of needs, preferred about 10Pa from the viewpoint of throughput rate.Heating-up temperature is preferably 40 ~ 130 DEG C, and crimping pressure is preferably 0.1 ~ 1.0MPa (1 ~ 10kgf/cm 2), these conditions limit not processed especially.
Layer of rolls press can be used from the viewpoint of bubble when reducing stacked, plate laminating machine can be used from the viewpoint of adaptation, flatness.In addition, as required can and use these laminating machinees.
Sandwich layer is formed with resin film 300, from the view point of operability, is preferably formed by sandwich layer and forms with resin 30 and supporting carrier film 4, now, carries out lamination with sandwich layer formation resin 30 covering 2 side that faces toward.In addition, sandwich layer formation resin film 300 can be formed by sandwich layer and form separately with resin 30.
As shown in Figure 3, when the opposition side of the base material of sandwich layer formation resin film 300 arranges protective film 11, after peeling off protective film 11, lamination sandwich layer is formed with resin film 300.Now, protective film 11 and supporting carrier film 4, preferably not carrying out bonding process to easily peel off from sandwich layer formation resin film 300, can implement demoulding process as required.
Then, as the 3rd operation, sandwich layer 3 is carried out exposure imaging, form the core figure 8 (Fig. 1 (d), (e)) of optical waveguide.Specifically, irradiated with image shape by photomask pattern 7 active ray.As the light source of active ray, such as can enumerate carbon arc lamp, mercury vapour arc lamp, ultrahigh pressure mercury lamp, high-pressure sodium lamp, xenon lamp etc. can the conventional lights of effective irradiation ultraviolet radiation.In addition, other also can use photograph planar lamp bubble, sunlamp etc. effectively can irradiate the light source of visible ray.
Then, when the supporting carrier film 4 of sandwich layer formation resin film 300 remains, peel off supporting carrier film 4, developed by unexposed portions of removing such as wet developments, form core figure 8.During wet development, use the organic solvent system developer solution being suitable for above-mentioned film composition, developed by known methods such as spray, shake dipping, brushing, blade coatings.
As organic solvent system developer solution, can enumerate such as, 1-METHYLPYRROLIDONE, N, dinethylformamide, DMA, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, gamma-butyrolacton, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, propylene glycol monomethyl ether etc.In addition, as required can also with the developing method of more than two kinds.
As the mode of development, can enumerate such as, the spray such as impregnation method, alr mode (paddling), high-pressure spraying mode mode, brush mode, blade coating mode etc., high-pressure spraying mode is best suited for resolution for improving.
As the process after development, carry out heating (preferably 110 ~ 150 DEG C, about 10 ~ 120 minutes) or the 0.1 ~ 1000mJ/cm of about 60 ~ 250 DEG C as required 2the exposure of left and right, can be vaporized solvent thus and not produce the erosion caused by solvent, and solidification core figure 8 uses further.
Then, as the 4th operation, lamination is for imbedding the covering formation resin film 200 of core figure 8.About lamination, covering formation resin film 200 by covering formed form with resin 20 and supporting carrier film 10 time, carry out lamination with covering formation resin 20 towards core figure 8 side.The thickness of covering 9 now, the preferred thickness than sandwich layer 3 is large as previously mentioned.
Lamination preferably adds thermo-compressed covering formation resin film 200 (Fig. 1 (f)) under reduced atmosphere.Here, from the view point of raising adaptation and tracing ability, the 4th operation is preferably carried out when adding thermo-compressed under reduced atmosphere.Plate laminating machine 6 is preferably used to carry out adding thermo-compressed under reduced atmosphere further.The upper limit as the vacuum tightness of decompression yardstick is preferably below 10000Pa, more preferably below 1000Pa.Expect that vacuum tightness is lower from the viewpoint of adaptation and tracing ability.On the other hand, from the viewpoint of throughput rate, (vacuumize) time of needs, the lower limit of vacuum tightness is preferably about 10Pa.Heating-up temperature is preferably 40 ~ 130 DEG C, and crimping pressure is preferably 0.1 ~ 1.0MPa (1 ~ 10kgf/cm 2), but these conditions limit not processed especially.
In addition, when adding thermo-compressed covering formation resin film 200, use stainless steel (SUS) plate to crimp at least one party, preferably two sides, thickness becomes even thus, can form smooth upper clad layer compared with during use rubber slab.
As shown in Figure 2, when the opposition side of the supporting carrier film 10 of covering formation resin film 200 arranges protective film 11, after peeling off protective film 11, lamination covering formation resin film 200 is also cured by light or heating, forms covering 9 thus.Now, preferred covering formation resin 20 is filmed on the supporting carrier film 10 implementing bonding process.On the other hand, protective film 11 does not preferably carry out bonding process to easily peel off from covering formation resin film 200, can implement demoulding process as required.
In the first manufacture method of the present invention, when stacked upper clad layer formation resin film, the stacked condition of necessary control temperature, pressure and time etc., make the melt viscosity of this covering formation resin be 100 ~ 200Pas, preferred molten viscosity is 120 ~ 180Pas.By with in the stacked condition of the form control of this range of viscosities, make not residual bubble between core and upper clad layer.When being greater than 200Pas, the high and residual bubble of resin viscosity.On the other hand, when being less than 100Pas, resin viscosity is low, therefore produces the problem of the outflow of resin, flatness variation.In addition, melt viscosity when preferred above-mentioned melt viscosity is 40 ~ 130 DEG C.During higher than 40 DEG C, can be made into the low and resin film of operability excellence of viscous at room temperature.On the other hand, during lower than 130 DEG C, the advantage of throughput rate excellence is had.From these viewpoints, more preferably above-mentioned melt viscosity is the melt viscosity of 50 ~ 100 DEG C, more preferably the melt viscosity of 100 DEG C.By becoming the melt viscosity of such temperature range, can obtain the optical waveguide of residual bubble between sandwich layer and upper clad layer, in addition, the operability of resin film is also excellent.
In addition, optical waveguide of the present invention is the optical waveguide sequentially laminated with lower clad, core figure and upper clad layer on base material, and wherein, the resin that this upper clad layer is 100 ~ 200Pas by melt viscosity time stacked is formed.
In addition, this optical waveguide is the optical waveguide sequentially laminated with lower clad, core figure and upper clad layer on base material, wherein, this upper clad layer can be that the resin of 100 ~ 200Pas is formed by melt viscosity when 40 ~ 130 DEG C, preferably 100 DEG C, preferably above-mentioned upper clad layer by the raw polymer containing phenoxy resin system and two functional epoxy resins and 90 ~ 120 DEG C time melt viscosity be the optical waveguide that the resin of 100 ~ 200Pas is formed.In addition, preferred above-mentioned melt viscosity is 120 ~ 180Pas.
Above-mentioned melt viscosity is 100 ~ 200Pas, is preferably the resin of 120 ~ 180Pas, and the selection of the raw polymer that the composition by suitably adjusting as resin uses, the kind (structure, molecular weight, glass transition temperature, viscosity etc.) of polymerizable compound, their compounding ratio etc. obtain.
Such as, as raw polymer, the epoxy resin, (methyl) acrylate copolymer, acrylic rubber, polyurethane, polyimide, polyamide, polyamidoimide, polysiloxane etc. of phenoxy resin system, solid at room temperature form can be enumerated.Here, about the molecular weight of raw polymer, in order to become the form of resin film, number-average molecular weight is preferably more than 5000, and more preferably 10, more than 000, be particularly preferably more than 30000.About the upper limit of number-average molecular weight, limit not processed especially, from the view point of the intermiscibility with polymerizable compound composition, is preferably less than 1000000, more preferably less than 900000, is particularly preferably less than 800000.In addition, number-average molecular weight of the present invention is measured by gel permeation chromatography (GPC), carries out the value of polystyrene standard conversion.
As polymerizable compound, limit not processed especially, such as, can use in molecule the compound with ethene unsaturated group.(methyl) acrylate, vinylidene halide, vinyl ether, vinylpyridine, vinylphenol etc. can be enumerated particularly, from the view point of the transparency and thermotolerance in them, (methyl) acrylate can be enumerated as preferred material.As (methyl) acrylate, any one in mono-functional, two functionalities, trifunctional's material can be used.In addition, here so-called (methyl) acrylate, represents acrylate and methacrylate.
In addition, also preferably containing the compound in molecule with more than two epoxy radicals.Particularly, two sense aromatic glycidyl ethers of bisphenol A type epoxy resin, tetrabromobisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-A D type epoxy resin, naphthalene type epoxy resin etc. can be enumerated; The multifunctional aromatic glycidyl ether of phenol novolak type epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene phenol epoxy resin, four phenolic group ethane type epoxy resin etc.; Two functional aliphatic's glycidol ethers of polyglycol type epoxy resins, polypropylene glycol type epoxy resin, neopentyl glycol type epoxy resin, hexanediol type epoxy resin etc.; Two sense ester ring type glycidol ethers of bisphenol-A epoxy resin etc.; The multifunctional aliphatic glycidyl ether of trimethylolpropane type epoxy resin, sorbitol-type epoxy resin, glycerol type epoxy resin etc.; Two sense aromatic series ethylene oxidic esters of o-phthalic acid diglycidyl ester etc.; Two sense ester ring type ethylene oxidic esters of tetrahydrophthalic acid 2-glycidyl ester, hexahydrophthalic acid 2-glycidyl ester etc.; Two sense aromatic series glycidyl amines of N, N-diglycidylaniline, N, N-diglycidyl 5-trifluoromethylaniline etc.; N, N, N ', the multifunctional aromatic series glycidyl amine of N '-four glycidyl group-4,4-diaminodiphenyl-methane, 1,3-two (N, N-glycidyl-amino methyl) cyclohexane, N, N, O-triglycidyl group para-aminophenol etc.; Two sense alicyclic epoxy resins of alicyclic diepoxy acetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxylate, vinyl titanium dioxide cyclohexene etc.; Two sense hetero ring type epoxy resin of diglycidylhydantoin etc.; The multifunctional hetero ring type epoxy resin of triglycidyl group isocyanuric acid ester etc.; Two senses or multifunctional containing epoxy silicone etc. of organopolysiloxane type epoxy resin etc.
These polymerizable compounds, its molecular weight is about 100 ~ 2000 usually, more preferably about 150 ~ 1000, be aqueous compound under being applicable to using room temperature.These compounds separately or can combine more than two kinds uses in addition, and then also can combinationally use with other polymerizable compound.In addition, the molecular weight of polymerizable compound of the present invention measures by GPC method or mass analysis.
The compounding ratio of raw polymer and polymerizable compound is 10 ~ 80 quality % relative to the total amount preferred feedstock polymkeric substance of these compositions.Easily form of film is formed during more than 10 quality %.On the other hand, during below 80 quality %, easily melt viscosity during lamination is adjusted to the scope of 100 ~ 200Pas, the reaction of polymerizable compound can fully be carried out in addition.From the scope of these viewpoints more preferably 20 ~ 70 quality %.
In addition, in the present invention, the melt viscosity of upper clad layer formation resin, by preparing the test sample that thickness is 200 ~ 500 μm, with the circular flat board of 1 couple of diameter 2cm clamped sample abreast, measure with programming rate 5 DEG C/min with Measurement of Dynamic Viscoelasticity device (TA instrument company system, ARES-2KSTD).And then, specifically, measure under the condition of shearing frequency 1Hz, strain 5% (anglec of rotation 9 degree).
Here, test sample is by operating acquisition as follows: such as, by the method same with embodiment 1 described later, on the supporting carrier film of polyamide film etc., coating, dry covering formation resin, then the protective film of demoulding PET film etc. is attached, after making covering formation resin film, peel off protective film and supporting carrier film and take out covering formation resin bed, overlap multiple covering formation resin bed, use vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system, MVLP-500), after below 500Pa vacuumizes, by at pressure 0.4MPa, temperature 50 C, carry out pressurizeing to obtain under the condition in second time 30.The number of plies of the covering formation resin bed that adjustment overlaps, makes the thickness after pressurizeing be in the scope of 200 ~ 500 μm.
In the second manufacture method of the present invention, after stacked covering formation resin film 200, heat.As the condition preferable temperature 40 DEG C ~ 200 DEG C heated, more preferably 50 ~ 100 DEG C.When more than 40 DEG C, not residual bubble between sandwich layer 3 and upper clad layer 9.When less than 200 DEG C, covering formation resin does not solidify, and in addition, lower clad, core be not swelling due to the residual solvent that contains in upper clad layer formation resin film etc., peel off.As the time of heating, preferably 15 ~ 120 minutes.Time in this time range, not residual bubble, in addition, also can not sacrifice operability.From these viewpoints, heating treatment time is more preferably 20 ~ 60 minutes.
After this, first and second manufacture method is all same with the first operation, be cured as described above by light or heating, the covering formation resin 20 of covering formation resin film 200 is cured, carries out the 5th operation (Fig. 1 (g)) forming upper clad layer 9.
Embodiment
Then, embodiment is used to further describe the present invention.
Embodiment 1 (the first manufacture method)
(making of covering formation resin film)
In the polyethylene bottle of wide-mouth, weigh the phenoxy resin (trade name: Off エ ノ ト-ト YP-70 as (A) raw polymer (binder polymer), Toto Kasei KK's system, number-average molecular weight 43000) 48 mass parts, as alicyclic diepoxy carboxylate's (trade name: KRM-2110 of (B) photopolymerizable compound, molecular weight: 252, Asahi Denka Kogyo K. K's system) 49.6 mass parts, as the triphenylsulfonium hexafluoro antimonate (trade name: SP-170 of (C) Photoepolymerizationinitiater initiater, Asahi Denka Kogyo K. K's system) 2 mass parts, as the SP-100 (trade name of sensitizer, Asahi Denka Kogyo K. K's system) 0.4 mass parts, as propylene glycol monomethyl ether 40 mass parts of organic solvent, use mechanical stirrer, turning axle and screw propeller, temperature 25 DEG C, under the condition of rotation number 400rpm, stir 6 hours, blending covering is formed uses resin varnish A.Thereafter, use the polyflon filtrator (trade name: PF020 in 2 μm, aperture, Yan Hua Toyo Co., Ltd. system), under the condition of temperature 25 DEG C, pressure 0.4MPa, carry out pressure filtration, and then use vacuum pump and bell-jar under the condition of degree of decompression 50mmHg, carry out 15 minutes vacuum deaerators.
By covering formation resin varnish A obtained above, with coating machine (multilayer coater TM-MC, Co., Ltd.'s open country machine) coat polyamide film (trade name: nicozon (ミ Network ト ロ Application), Dongli Ltd.'s system, thickness: 12 μm) corona treatment face on, drying 10 minutes at 80 DEG C, thereafter at 100 DEG C dry 10 minutes, then the demoulding PET film (trade name: general rex (ピ ユ mono-レ Star Network ス) A31 as protective film is attached using stripping surface towards the form of resin side, Di Ren DuPont Film Co., Ltd., thickness: 25 μm), obtain covering formation resin film.Now the thickness of resin bed can at random adjust by regulating the gap of coating machine, carries out in the present embodiment regulating making the thickness after solidifying be lower clad 25 μm, upper clad layer 80 μm.
(making of sandwich layer formation resin film)
As (A) raw polymer (binder polymer), use phenoxy resin (trade name: Off エ ノ ト mono-ト YP-70, Toto Kasei KK's system) 26 mass parts, as (B) photopolymerizable compound, use 9, two [4-(2-acryloyloxyethoxy) phenyl] fluorenes (trade name: A-BPEF of 9-, chemical industry Co., Ltd. of Xin Zhong village system) 36 mass parts and bisphenol-a epoxy acrylate (trade name: EA-1020, chemical industry Co., Ltd. of Xin Zhong village system) 36 mass parts, as (C) Photoepolymerizationinitiater initiater, use two (2, 4, 6-trimethylbenzoyl) phenyl phosphine oxide (trade name: Irgacure819, Ciba Specialty Chemicals's system) 1 mass parts and 1-[4-(2-hydroxyl-oxethyl) phenyl]-2-hydroxy-2-methyl-1-propane-1-ketone (trade name: Irgacure2959, Ciba Specialty Chemicals's system) 1 mass parts, as organic solvent, use propylene glycol monomethyl ether 40 mass parts, in addition, sandwich layer formation resin varnish B is concocted under the method same with above-mentioned Production Example and condition.Thereafter, pressure filtration under the method same with above-mentioned Production Example and condition, and then carry out vacuum deaerator.
By the method same with above-mentioned Production Example; by sandwich layer formation resin varnish B obtained above; in PET film (trade name: CosmoshineA1517; Toyo Boseki K.K's system; thickness: 16 μm) non-process face on to carry out coating dry, then attach the demoulding PET film (trade name: general rex A31, Di Ren DuPont Film Co., Ltd. as protective film using stripping surface towards the form of resin side; thickness: 25 μm), obtain sandwich layer formation resin film.The gap adjusting coating machine in the present embodiment makes the thickness after solidifying be 50 μm.
[making of optical waveguide]
About the method for making of optical waveguide, below, reference Fig. 1 is while be described.
The protective film of lower clad formation resin film obtained above and demoulding PET film (general rex A31) are peeled off; 1J/cm is irradiated by resin side (opposition side of supporting carrier film) with ultraviolet exposure machine (ORC Mfg. Co., Ltd.'s system, EXM-1172) 2ultraviolet (wavelength 365nm), then by carrying out heating for 10 minutes at 80 DEG C, forms lower clad 2 (with reference to Fig. 1 (a)).
Then, on this lower clad 2, use layer of rolls press (Hitachi Chemical Co., Ltd.'s system, HLM-1500) under the condition of pressure 0.4MPa, temperature 50 C, laminate speed 0.2 m/min, lamination above-mentioned sandwich layer formation resin film, forms sandwich layer 30 (with reference to Fig. 1 (b)).
Then, by the minus photomask 7 of live width/distance between centers of tracks=50 μm/75 μm, figure radical 12, the long 125mm of figure, 0.8J/cm is irradiated with above-mentioned ultraviolet exposure machine 2ultraviolet (wavelength 365nm) (with reference to Fig. 1 (d)), then heats after 5 minutes 80 DEG C of exposures.Thereafter, peel off the PET film as supporting carrier film, use developer solution (propylene glycol monomethyl ether/DMA=8/2, mass ratio), develop core figure (with reference to Fig. 1 (e)).Then, use cleansing solution (isopropyl alcohol) to wash, carry out 10 minutes heat dryings at 100 DEG C.
Then, as upper clad layer, be used as vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system of plate laminating machine, MVLP-500), after being evacuated to below 500Pa, under pressure 0.4MPa, temperature 100 DEG C, the condition in second pressing time 30, lamination above-mentioned covering formation resin film (with reference to Fig. 1 (f)).In addition, the melt viscosity of upper clad layer formation resin film during temperature 100 DEG C is 170Pas.Thereafter, irradiation 25J/cm is added up on two sides 2after ultraviolet (wavelength 365nm), by carrying out heating for 1 hour at 160 DEG C, forming upper clad layer 9, making the flexible optical waveguides (with reference to Fig. 1 (g)) that supporting carrier film is configured at outside.And then in order to peel off polyamide film, this flexible optical waveguides is processed 24 hours under the hot and humid condition of 85 DEG C/85%, make the flexible optical waveguides eliminating supporting carrier film.
For the flexible optical waveguides made like this, under the microscope of multiplying power 50 times, carry out visual examination, confirm that the bubble being connected to core is 0.
In addition, light source uses surface-emitting laser ((EXFO Co., Ltd. system of 850nm, FLS-300-01-VCL), by the Q82214 that optical sensor uses Advantest company limited to manufacture, by cutback method (measure waveguide long by 5,3,2cm, incident optical: GI-50/125 multimode optical fiber (NA=0.20), outgoing optical fiber: SI-114/125 (NA=0.22)) measure the loss of the optical waveguide made, result is 0.05dB/cm.
Comparative example 1
Laminating temperature when upper clad layer is in embodiment 1 formed is carry out under the condition of 60 DEG C, 65 DEG C, 80 DEG C, 90 DEG C, and in addition, operation makes flexible optical waveguides similarly to Example 1.Temperature 60 C, 65 DEG C, 80 DEG C, 90 DEG C time the melt viscosity of upper clad layer formation resin film be respectively 1720Pas, 1180Pas, 445Pas, 260Pas.In the flexible optical waveguides made under these conditions, be connected to the gas bubbles left more than 5 of the size more than 5 μm of core.
In addition, light source uses surface-emitting laser ((EXFO Co., Ltd. system of 850nm, FLS-300-01-VCL), by the Q82214 that optical sensor uses Advantest company limited to manufacture, by cutback method (measure waveguide long by 5,3,2cm, incident optical: GI-50/125 multimode optical fiber (NA=0.20), outgoing optical fiber: SI-114/125 (NA=0.22)) measure the loss of optical waveguide made, result is 0.1dB/cm, and the known loss that causes due to bubble is deteriorated.
Embodiment 2 (the first manufacture method)
(making of covering formation resin film)
In the polyethylene bottle of wide-mouth, weigh the phenoxy resin (trade name: Off エ ノ ト-ト YP-70 as (A) raw polymer (binder polymer), Toto Kasei KK's system) 50 mass parts, as alicyclic diepoxy carboxylate's (trade name: KRM-2110 of (B) photopolymerizable compound, molecular weight: 252, Asahi Denka Kogyo K. K's system) 50 mass parts, as the triphenylsulfonium hexafluoro antimonate (trade name: SP-170 of (C) Photoepolymerizationinitiater initiater, Asahi Denka Kogyo K. K's system) 2 mass parts, as propylene glycol monomethyl ether 40 mass parts of organic solvent, use mechanical stirrer, turning axle and screw propeller, temperature 25 DEG C, under the condition of rotation number 400rpm, stir 6 hours, blending covering is formed uses resin varnish C.Thereafter, use the polyflon filtrator (trade name: PF020 in 2 μm, aperture, Yan Hua Toyo Co., Ltd. system), under the condition of temperature 25 DEG C, pressure 0.4MPa, carry out pressure filtration, and then use vacuum pump and bell-jar under the condition of degree of decompression 50mmHg, carry out 15 minutes vacuum deaerators.
By covering formation resin varnish C obtained above, with coating machine (multilayer coater TM-MC, Co., Ltd.'s open country machine) coat PET film (trade name: CosmoshineA4100, Toyo Boseki K.K's system, thickness: 50 μm) non-process face on, drying 10 minutes at 80 DEG C, thereafter at 100 DEG C dry 10 minutes, then the demoulding PET film (trade name: general rex A31 as protective film is attached using stripping surface towards the form of resin side, Di Ren DuPont Film Co., Ltd., thickness: 25 μm), obtain covering formation resin film.Now the thickness of resin bed can at random adjust by regulating the gap of coating machine, carries out in the present embodiment regulating making the thickness after solidifying be lower clad 30 μm, upper clad layer 60 μm.
(making of sandwich layer formation resin film)
Sandwich layer formation resin varnish B is concocted under method similarly to Example 1 and condition.Thereafter, under the method same with above-mentioned Production Example and condition, pressure filtration is entered and is carried out vacuum deaerator.
By the method same with above-mentioned Production Example; by sandwich layer formation resin varnish B obtained above; in PET film (trade name: CosmoshineA1517; Toyo Boseki K.K's system; thickness: 16 μm) non-process face on to carry out coating dry, then attach the demoulding PET film (trade name: general rex A31, Di Ren DuPont Film Co., Ltd. as protective film using stripping surface towards the form of resin side; thickness: 25 μm), obtain sandwich layer formation resin film.Adjust the gap of coating machine in the present embodiment, make the thickness after solidifying be 40 μm.
[making of optical waveguide]
About the method for making of optical waveguide, be below described.
Silicon substrate 40 (thickness 0.625mm, with oxide film 1 μm, Mitsubishi Materials (strain) system) passes through spin-coating method, by silane coupling agent (Dong Li DOW CORNING Co., Ltd. system [Z6040]), be coated with in 500rpm/10 second and then under the condition in 1500rpm/30 second, carry out thereafter the heating of 120 DEG C/3 minutes on hot plate.In addition, spin coating uses " 1H-D2 " that MIKASA company limited manufactures.Then; peel off the protective film of the covering formation resin film of above-mentioned making; covering formation resin bed is made to be contacted with the silane coupled silicon substrate processed; with layer of rolls press (Hitachi Chemical Co., Ltd.'s system; HLM-1500), 80 DEG C, 0.5MPa, transporting velocity 0.5m condition under carry out roll laminating.Thereafter, 1J/cm is irradiated with ultraviolet exposure machine (ORC Mfg. Co., Ltd.'s system, EXM-1172) from resin side (opposition side of supporting carrier film) 2ultraviolet (wavelength 365nm), after peeling off the PET film (CosmoshineA4100) as supporting carrier film, carries out heating for 60 minutes at 120 DEG C, forms lower clad 2 (with reference to Fig. 4 (a)) thus.
Then, on this lower clad 2, use layer of rolls press (Hitachi Chemical Co., Ltd.'s system, HLM-1500), under the condition of pressure 0.4MPa, temperature 50 C, laminate speed 0.2 m/min, lamination above-mentioned sandwich layer formation resin film, forms sandwich layer 30 (with reference to Fig. 4 (b)).
Then, by the minus photomask 7 of live width/distance between centers of tracks=50 μm/75 μm, figure radical 12, the long 125mm of figure, 0.8J/cm is irradiated with above-mentioned ultraviolet exposure machine 2ultraviolet (wavelength 365nm) (with reference to Fig. 4 (c)), then heats after 5 minutes 80 DEG C of exposures.Thereafter, peel off the PET film as supporting carrier film, use developer solution (propylene glycol monomethyl ether/DMA=8/2, mass ratio), develop core figure (with reference to Fig. 4 (d)).Then, use cleansing solution (isopropyl alcohol) to wash, carry out 60 minutes heat dryings at 120 DEG C.
Then, as upper clad layer, be used as vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system of plate laminating machine, MVLP-500), after being evacuated to below 500Pa, under pressure 0.4MPa, temperature 100 DEG C, the condition in second pressing time 30, lamination above-mentioned covering formation resin film (with reference to Fig. 4 (e)).In addition, the melt viscosity of upper clad layer formation resin film during temperature 100 DEG C is 121Pas.Thereafter, 1J/cm is irradiated 2after ultraviolet (wavelength 365nm), by carrying out heating for 1 hour at 160 DEG C, form upper clad layer 9 (with reference to Fig. 4 (f)).
For the flexible optical waveguides made like this, under the microscope of multiplying power 50 times, carry out visual examination, confirm that the bubble being connected to core is 0.
In addition, the loss of the optical waveguide of time-and-motion study making similarly to Example 1, result is 0.05dB/cm.
Comparative example 2
Laminating temperature when upper clad layer is in example 2 formed is carry out under the condition of 60 DEG C, 70 DEG C, 80 DEG C, 90 DEG C, and in addition, operation makes flexible optical waveguides similarly to Example 2.Temperature 60 C, 65 DEG C, 80 DEG C, 90 DEG C time the melt viscosity of upper clad layer formation resin film be respectively 1670Pas, 842Pas, 383Pas, 233Pas.In the flexible optical waveguides made under these conditions, the size being connected to core is the gas bubbles left more than 5 of more than 5 μm.
In addition, the loss of optical waveguide that makes of time-and-motion study similarly to Example 1, result is 0.1dB/cm, knownly causes loss deterioration due to bubble.
Embodiment 3 (the second manufacture method)
(making of covering formation resin film)
In the polyethylene bottle of wide-mouth, weigh the phenoxy resin (trade name: Off エ ノ ト-ト YP-70 as (A) raw polymer (binder polymer), Toto Kasei KK's system) 48 mass parts, as alicyclic diepoxy carboxylate's (trade name: KRM-2110 of (B) photopolymerizable compound, molecular weight: 252, Asahi Denka Kogyo K. K's system) 49.6 mass parts, as the triphenylsulfonium hexafluoro antimonate (trade name: SP-170 of (C) Photoepolymerizationinitiater initiater, Asahi Denka Kogyo K. K's system) 2 mass parts, as the SP-100 (trade name of sensitizer, Asahi Denka Kogyo K. K's system) 0.4 mass parts, as propylene glycol monomethyl ether 40 mass parts of organic solvent, use mechanical stirrer, turning axle and screw propeller, temperature 25 DEG C, under the condition of rotation number 400rpm, stir 6 hours, blending covering is formed uses resin varnish A.Thereafter, use the polyflon filtrator (trade name: PF020 in 2 μm, aperture, Yan Hua Toyo Co., Ltd. system), under the condition of temperature 25 DEG C, pressure 0.4MPa, carry out pressure filtration, and then use vacuum pump and bell-jar under the condition of degree of decompression 50mmHg, carry out 15 minutes vacuum deaerators.
By covering formation resin varnish A obtained above, with coating machine (multilayer coater TM-MC, Co., Ltd.'s open country machine) coat polyamide film (trade name: nicozon, Dongli Ltd.'s system, thickness: 12 μm) corona treatment face on, drying 10 minutes at 80 DEG C, thereafter at 100 DEG C dry 10 minutes, then the demoulding PET film (trade name: general rex A31 as protective film is attached using stripping surface towards the form of resin side, Di Ren DuPont Film Co., Ltd., thickness: 25 μm), obtain covering formation resin film.Now the thickness of resin bed can at random adjust by regulating the gap of coating machine, carries out in the present embodiment regulating making the thickness after solidifying be lower clad 25 μm, upper clad layer 80 μm.
(making of sandwich layer formation resin film)
As (A) raw polymer (binder polymer), use phenoxy resin (trade name: Off エ ノ ト mono-ト YP-70, Toto Kasei KK's system) 26 mass parts, as (B) photopolymerizable compound, use 9, two [4-(2-acryloyloxyethoxy) phenyl] fluorenes (trade name: A-BPEF of 9-, chemical industry Co., Ltd. of Xin Zhong village system) 36 mass parts and bisphenol-a epoxy acrylate (trade name: EA-1020, chemical industry Co., Ltd. of Xin Zhong village system) 36 mass parts, as (C) Photoepolymerizationinitiater initiater, use two (2, 4, 6-trimethylbenzoyl) phenyl phosphine oxide (trade name: Irgacure819, Ciba Specialty Chemicals's system) 1 mass parts and 1-[4-(2-hydroxyl-oxethyl) phenyl]-2-hydroxy-2-methyl-1-propane-1-ketone (trade name: Irgacure2959, Ciba Specialty Chemicals's system) 1 mass parts, as organic solvent, use propylene glycol monomethyl ether 40 mass parts, in addition, sandwich layer formation resin varnish B is concocted under the method same with above-mentioned Production Example and condition.Thereafter, pressure filtration under the method same with above-mentioned Production Example and condition, and then carry out vacuum deaerator.
By the method same with above-mentioned Production Example; by sandwich layer formation resin varnish B obtained above; in PET film (trade name: CosmoshineA1517; Toyo Boseki K.K's system; thickness: 16 μm) non-process face on to carry out coating dry; then attach as the demoulding PET film (trade name: general rex A31 as protective film using stripping surface towards the form of resin side; Di Ren DuPont Film Co., Ltd.; thickness: 25 μm), obtain sandwich layer formation resin film.The gap adjusting coating machine in the present embodiment makes the thickness after solidifying be 70 μm.
[making of optical waveguide]
About the method for making of optical waveguide, below, reference Fig. 1 is while be described.
The protective film of lower clad formation resin film obtained above and demoulding PET film (general rex A31) are peeled off; 1J/cm is irradiated from resin side (opposition side of supporting carrier film) with ultraviolet exposure machine (ORC Mfg. Co., Ltd.'s system, EXM-1172) 2ultraviolet (wavelength 365nm), then by carrying out heating for 10 minutes at 80 DEG C, forms lower clad 2 (with reference to Fig. 1 (a)).
Then, on this lower clad 2, use layer of rolls press (Hitachi Chemical Co., Ltd.'s system, HLM-1500) under the condition of pressure 0.4MPa, temperature 50 C, laminate speed 0.2 m/min, lamination above-mentioned sandwich layer formation resin film, forms sandwich layer 30 (with reference to Fig. 1 (b)).
Then, by the minus photomask 7 of live width/distance between centers of tracks=80 μm/170 μm, figure radical 8, the long 125mm of figure, 0.8J/cm is irradiated with above-mentioned ultraviolet exposure machine 2ultraviolet (wavelength 365nm) (with reference to Fig. 1 (d)), then heats after 5 minutes 80 DEG C of exposures.Thereafter, peel off the PET film as supporting carrier film, use developer solution (propylene glycol monomethyl ether/DMA=8/2, mass ratio), develop core figure (with reference to Fig. 1 (e)).Then, use cleansing solution (isopropyl alcohol) to wash, carry out 10 minutes heat dryings at 100 DEG C.
Then, as upper clad layer, be used as vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system of plate laminating machine, MVLP-500), after being evacuated to below 500Pa, under pressure 0.4MPa, temperature 60 C, the condition in second pressing time 30, lamination above-mentioned covering formation resin film (with reference to Fig. 1 (f)).Now, under the microscope of multiplying power 100 times, carry out visual examination, result, the bubble being connected to core has 4 (with reference to Fig. 5) in upper clad layer.
Then, heating 30 minutes in 50 DEG C in heating furnace to make this bubble collapse, similarly carrying out visual examination under the microscope, result bubble collapse (with reference to Fig. 6).
Thereafter, irradiation 25J/cm is added up on two sides 2after ultraviolet (wavelength 365nm), by carrying out heating for 1 hour at 160 DEG C, forming upper clad layer 9, producing the flexible optical waveguides (with reference to Fig. 1 (g)) that supporting carrier film is configured at outside.And then in order to peel off polyamide film, this flexible optical waveguides is processed 24 hours under the hot and humid condition of 85 DEG C/85%, make the flexible optical waveguides eliminating supporting carrier film.
In addition, light source uses surface-emitting laser ((the EXFO Inc. of 850nm, FLS-300-01-VCL), by the Q82214 that optical sensor uses Advantest company limited to manufacture, by cutback method (measure waveguide long by 5,3,2cm, incident optical: GI-50/125 multimode optical fiber (NA=0.20), outgoing optical fiber: SI-114/125 (NA=0.22)) measure the loss of the optical waveguide made, result is 0.05dB/cm.
In addition, when the heating-up temperature after upper clad layer lamination is 60 DEG C, 70 DEG C, 80 DEG C, 90 DEG C, 100 DEG C, also bubble collapse can be confirmed.
Comparative example 3
Except not carrying out the heating after upper clad layer lamination, make optical waveguide with optical waveguide formation resin film similarly to Example 3 and operation.Its result, bubble residual after upper clad layer lamination still remains.The loss of the optical waveguide made under this condition is 0.1dB/cm, known due to bubble cause loss deterioration.
Embodiment 4 (the second manufacture method)
(making of covering formation resin film)
In the polyethylene bottle of wide-mouth, weigh the phenoxy resin (trade name: Off エ ノ ト-ト YP-70 as (A) raw polymer (binder polymer), Toto Kasei KK's system) 50 mass parts, as alicyclic diepoxy carboxylate's (trade name: KRM-2110 of (B) photopolymerizable compound, molecular weight: 252, Asahi Denka Kogyo K. K's system) 50 mass parts, as the triphenylsulfonium hexafluoro antimonate (trade name: SP-170 of (C) Photoepolymerizationinitiater initiater, Asahi Denka Kogyo K. K's system) 2 mass parts, as propylene glycol monomethyl ether 40 mass parts of organic solvent, use mechanical stirrer, turning axle and screw propeller, temperature 25 DEG C, under the condition of rotation number 400rpm, stir 6 hours, blending covering is formed uses resin varnish C.Thereafter, use the polyflon filtrator (trade name: PF020 in 2 μm, aperture, Yan Hua Toyo Co., Ltd. system), under the condition of temperature 25 DEG C, pressure 0.4MPa, carry out pressure filtration, and then use vacuum pump and bell-jar under the condition of degree of decompression 50mmHg, carry out 15 minutes vacuum deaerators.
By covering formation resin varnish C obtained above, with coating machine (multilayer coater TM-MC, Co., Ltd.'s open country machine) coat PET film (trade name: CosmoshineA1517, Toyo Boseki K.K's system, thickness: 16 μm) easy to be bonding treated side on, drying 10 minutes at 80 DEG C, thereafter at 100 DEG C dry 10 minutes, then the demoulding PET film (trade name: general rex A31 as protective film is attached using stripping surface towards the form of resin side, Di Ren DuPont Film Co., Ltd., thickness: 25 μm), obtain covering formation resin film.Now the thickness of resin bed can at random adjust by regulating the gap of coating machine, carries out in the present embodiment regulating making the thickness after solidifying be lower clad 30 μm, upper clad layer 80 μm.
(making of sandwich layer formation resin film)
Sandwich layer formation resin film is obtained under method similarly to Example 3 and condition.The gap of adjustment coating machine makes the thickness in the present embodiment after solidification be 50 μm.
[making of optical waveguide]
About the method for making of optical waveguide, below, reference Fig. 1 is while be described.
The protective film of lower clad formation resin film 2 obtained above and demoulding PET film (general rex A31) are peeled off; 1J/cm is irradiated from resin side (opposition side of supporting carrier film) with ultraviolet exposure machine (ORC Mfg. Co., Ltd.'s system, EXM-1172) 2ultraviolet (wavelength 365nm), then by carrying out heating for 10 minutes at 80 DEG C, forms lower clad 2 (with reference to Fig. 1 (a)).
Then, on this lower clad 2, use layer of rolls press (Hitachi Chemical Co., Ltd.'s system, HLM-1500), under the condition of pressure 0.4MPa, temperature 50 C, laminate speed 0.2 m/min, lamination above-mentioned sandwich layer formation resin film, forms sandwich layer 30 (with reference to Fig. 1 (b)).
Then, by the minus photomask 7 of live width/distance between centers of tracks=50 μm/250 μm, figure radical 12, the long 125mm of figure, 0.8J/cm is irradiated with above-mentioned ultraviolet exposure machine 2ultraviolet (wavelength 365nm) (with reference to Fig. 1 (d)), then heats after 5 minutes 80 DEG C of exposures.Thereafter, peel off the PET film as supporting carrier film, use developer solution (propylene glycol monomethyl ether/DMA=8/2, mass ratio), develop core figure (with reference to Fig. 1 (e)).Then, use cleansing solution (isopropyl alcohol) to wash, carry out 10 minutes heat dryings at 100 DEG C.
Then, as upper clad layer, be used as vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system of plate laminating machine, MVLP-500), after being evacuated to below 500Pa, under pressure 0.4MPa, temperature 60 C, the condition in second pressing time 30, lamination above-mentioned covering formation resin film 1 (with reference to Fig. 1 (f)).Now, under the microscope of multiplying power 100 times, carry out visual examination, the bubble that result is connected to core has 3 in upper clad layer.
Then, heat 30 minutes in 50 DEG C in heating furnace to make this bubble collapse, bubble collapse.
Thereafter, irradiation 6J/cm is added up on two sides 2after ultraviolet (wavelength 365nm), by carrying out heating for 1 hour at 120 DEG C, forming upper clad layer 9, producing the flexible optical waveguides (with reference to Fig. 1 (g)) that supporting carrier film is configured at outside.
Light source uses surface-emitting laser ((EXFO Co., Ltd. system of 850nm, FLS-300-01-VCL), by the Q82214 that optical sensor uses Advantest company limited to manufacture, by cutback method (measure waveguide long by 5,3,2cm, incident optical: GI-50/125 multimode optical fiber (NA=0.20), outgoing optical fiber: SI-114/125 (NA=0.22)) measure the loss of optical waveguide made, result is 0.05dB/cm.
In addition, when the heating-up temperature after upper clad layer lamination is 60 DEG C, 70 DEG C, 80 DEG C, 90 DEG C, 100 DEG C, also bubble collapse can be confirmed.
Comparative example 4
Except not carrying out the heating after upper clad layer lamination, make optical waveguide with optical waveguide formation resin film similarly to Example 4 and operation.Its result, bubble residual after upper clad layer lamination still remains.The loss of the optical waveguide made under this condition is 0.1dB/cm, known due to bubble cause loss deterioration.
Embodiment 5 (the second manufacture method)
By the supporting carrier film of covering formation resin film in embodiment 4, replace with the PET film (trade name: general rex A31, Di Ren DuPont Film Co., Ltd. uses non-process face) of thickness 25 μm, in addition, optical waveguide is made similarly to Example 2.Now, after upper clad layer lamination, under the microscope of multiplying power 100 times, carry out visual examination, result, the bubble being connected to core has 4 in upper clad layer.Now, be 50 DEG C, 60 DEG C, 70 DEG C, 80 DEG C, 90 DEG C, 100 DEG C by the heating-up temperature after making upper clad layer lamination and also can make bubble collapse.
Comparative example 5
Except not carrying out the heating after upper clad layer lamination, make optical waveguide with optical waveguide formation resin film similarly to Example 5 and operation.Its result, bubble residual after upper clad layer lamination still remains.
Embodiment 6 (the second manufacture method)
By the supporting carrier film of covering formation resin film in embodiment 3, replace with the aromatic poly amide film (trade name: nicozon, Dongli Ltd. use corona treatment face) of thickness 9 μm, in addition, optical waveguide is made similarly to Example 3.Now, after upper clad layer lamination, under the microscope of multiplying power 100 times, carry out visual examination, result, the bubble being connected to core has 1 in upper clad layer.Now, by the heating-up temperature after making upper clad layer lamination be 40 DEG C, the heat time is can make bubble collapse in 60 minutes.
Comparative example 6
Except not carrying out the heating after upper clad layer lamination, make optical waveguide with optical waveguide formation resin film similarly to Example 6 and operation.Its result, bubble residual after upper clad layer lamination still remains.
The result of embodiment 3 ~ 6 and comparative example 3 ~ 6 is shown in table 1.
[table 1]
1) size being connected to core is the bubble of more than 5 μm
Utilizability in industry
As described above in detail, by manufacture method of the present invention, can optical waveguide be manufactured with good throughput rate and do not remain bubble between sandwich layer and upper clad layer.Particularly by the second manufacture method, can manufacture optical waveguide with good throughput rate and do not remain bubble between sandwich layer and upper clad layer, upper clad layer be smooth.
Therefore, the manufacture method as the high optical waveguide of practicality is very useful.

Claims (7)

1. a manufacture method for optical waveguide, is characterized in that, has: the operation covering formation resin solidification that base material is formed being formed lower clad; Stacked sandwich layer formation resin film on this lower clad and form the operation of sandwich layer; Exposure imaging is carried out to this sandwich layer and forms the operation of core figure; And fold upper clad layer formation resin film in this core graphic design, by this covering formation resin solidification, form the operation of upper clad layer,
During this upper clad layer formation resin film stacked, control stacked condition, make the melt viscosity of this covering formation resin 100 DEG C time be 120 ~ 180Pas.
2. the manufacture method of optical waveguide according to claim 1, is characterized in that, the operation forming sandwich layer comprises: use the layer of rolls press with warm-up mill, sandwich layer formation resin film is heated the operation be crimped on lower clad.
3. the manufacture method of optical waveguide according to claim 1 and 2, is characterized in that, when core graphic design folds upper clad layer formation resin film, uses plate laminating machine to carry out adding thermo-compressed under reduced atmosphere.
4. an optical waveguide, it is the optical waveguide sequentially laminated with lower clad, core figure and upper clad layer on base material, it is characterized in that, the resin that this upper clad layer is 120 ~ 180Pas by melt viscosity time stacked 100 DEG C time is formed.
5. an optical waveguide, it is the optical waveguide sequentially laminated with lower clad, core figure and upper clad layer on base material, it is characterized in that, the resin that this upper clad layer is 120 ~ 180Pas by melt viscosity when 100 DEG C is formed.
6. an optical waveguide, it is the optical waveguide sequentially laminated with lower clad, core figure and upper clad layer on base material, it is characterized in that, this upper clad layer by the raw polymer containing phenoxy resin system and two functional epoxy resins and 100 DEG C time melt viscosity be that the resin of 120 ~ 180Pas is formed.
7. a manufacture method for optical waveguide, is characterized in that, has: the operation covering formation resin solidification that base material is formed being formed lower clad; Stacked sandwich layer formation resin film on this lower clad and form the operation of sandwich layer; Exposure imaging is carried out to this sandwich layer and forms the operation of core figure; And, by the upper clad layer formation resin film of upper clad layer formation resin stacked on supporting carrier film, be layered in the operation on this core figure in the mode of this resin and this core pattern contact; Thereafter, under the condition of temperature 40 ~ 100 DEG C, carry out the operation of the heating of 15 ~ 120 minutes; By this covering formation resin solidification, form the operation of upper clad layer.
CN200980117381.9A 2008-05-13 2009-05-12 The manufacture method of optical waveguide and optical waveguide Expired - Fee Related CN102027400B (en)

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