CN102026481A - Superimposition structure for circuit board - Google Patents
Superimposition structure for circuit board Download PDFInfo
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- CN102026481A CN102026481A CN2009101738731A CN200910173873A CN102026481A CN 102026481 A CN102026481 A CN 102026481A CN 2009101738731 A CN2009101738731 A CN 2009101738731A CN 200910173873 A CN200910173873 A CN 200910173873A CN 102026481 A CN102026481 A CN 102026481A
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- substrate
- circuit board
- fixed part
- support
- weldment
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Abstract
The invention relates to a superimposition structure for a circuit board, which comprises a first substrate, a second substrate and a fixing piece, wherein a plurality of support welding pieces are arranged on the first substrate; the first substrate is arranged on the second substrate, and the support welding pieces are positioned between the first substrate and the second substrate to provide support force; and the fixing piece is used for connecting the first substrate and the second substrate fixedly, and the support welding pieces are positioned on the periphery of the fixing piece.
Description
Technical field
The present invention relates to a kind of circuit board, and particularly relevant for a kind of circuit board and stack architecture thereof with support weldment.
Background technology
Along with the increase of electronic building brick quantity, the size of circuit board is corresponding must to be increased, and holds electronic building brick so that more space to be provided, yet, when increasing the circuit board size, can have influence on the size and the design of product again.For head it off, thereby develop and a series of circuit board iterative structure.
The circuit board iterative structure comprises first substrate, second substrate and a plurality of insulated column.Insulated column is locked between first substrate and second substrate.Yet when operating personnel screwed insulated column at the use instrument of locking, regular meeting caused disappearances such as solder crack or strippable substrate, thereby, how under preferable safeguard measure, the injury of circuit board is reduced to minimum, the real emphasis of researching and developing for the present invention.
Summary of the invention
The invention provides a kind of circuit board iterative structure, the reliability when assembling in order to improve.
The present invention proposes a kind of circuit board iterative structure, comprises one first substrate, one second substrate and a fixture.First substrate has a plurality of support weldments, and first substrate is stacked at second substrate, and these support weldments between first substrate and second substrate and a support force is provided.Fixture is in order to affixed first substrate and second substrate, and these support weldments are to be positioned at around the fixture.
The present invention proposes a kind of circuit board, comprises a substrate, a plurality of support weldment and a fixture.Substrate has a fixed part.A plurality of support weldments be arranged at fixed part around.Fixture is in order to wear fixed part.
In one embodiment of this invention, above-mentioned support weldment is arranged in a circulus.
In one embodiment of this invention, the first above-mentioned substrate has one first fixed part, second substrate has one second fixed part, and fixture wears first fixed part and second fixed part so that first substrate is stacked at second fixed part of second substrate with first fixed part.First fixed part or second fixed part have a screw or a perforation.Fixture can be a screw, a rivet or a double-screw bolt.
In one embodiment of this invention, first substrate has one first assembly district, and this first fixed part is arranged at this first assembly district periphery.Support the periphery that weldment is arranged at first fixed part.
In one embodiment of this invention, the first above-mentioned assembly district has a plurality of signal weldments, and those support the height of the height of weldment greater than those signal weldments.
In one embodiment of this invention, the arranging density of those above-mentioned support weldments is greater than the arranging density of those signal weldments.
In one embodiment of this invention, those above-mentioned support weldments comprise solder sphere, welded post or soldering projection.
Based on above-mentioned, the present invention disposes a plurality of support weldments between first substrate and second substrate, when affixed first substrate of fixture and second substrate, supports weldment and provides a support force, so can avoid the injury of circuit board, improves the reliability of assembling.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Figure 1A illustrates the top view of the circuit board iterative structure of one embodiment of the invention.
Figure 1B illustrates the end view of the circuit board iterative structure of one embodiment of the invention.
Fig. 1 C is the enlarged diagram of the support weldment of Figure 1B.
Symbol description
200: 210: the first substrates of wiring board iterative structure
214: the first assembly districts of 212: the first fixed parts
220: signal weldment 230: fixture
240: support 250: the second substrates of weldment
254: the second assembly districts of 252: the second fixed parts
A: magnification region
Embodiment
Figure 1A and Figure 1B illustrate the top view and the end view of the circuit board iterative structure 200 of one embodiment of the invention.This circuit board iterative structure 200 comprises one first substrate 210, one second substrate 250 and a fixture 230.First substrate 210 has a plurality of support weldments 240, and first fixed part (for example being screw or perforation) 212 that can supply fixture 230 (for example screw, bolt or rivet) to pass, and second substrate 250 has second fixed part (for example being screw or perforation) 252 that can supply fixture 230 to pass, therefore first substrate 210 is stacked on second substrate 250 with the fixture 230 that passes first fixed part 212 and second fixed part 252, so that first substrate 210 firmly is fixed on second substrate 250.
From the above, damage in assembling operation for fear of first substrate 210 and second substrate 250, present embodiment disposes a plurality of support weldments 240 between first substrate 210 and second substrate 250.These support weldment 240 for example is to be disposed at first fixed part 212 solder sphere (solder ball), welded post (solder column) or soldering projection (solder bump) on every side, yet its weldment 220 differences with general transmission signals are to support weldment 240 and do not have electrical transfer function, only as structural supporting component.
A plurality of support weldments 240 be disposed at first fixed part 212 around, for example be arranged in a circulus around first fixed part 212, shown in Fig. 1 C.In addition, first substrate 210 has one first assembly district 214, and the first assembly district 214 has a plurality of signal weldments 220, in order to electrically connect first substrate 210 and second substrate 250.Also configurable one or more electronic building bricks, for example internal memory or processor in the first assembly district 214.In the present embodiment, the periphery in the first assembly district 214 for example is provided with four first fixed parts 212.Second substrate 250 has one second assembly district 254, and the periphery in the second assembly district 254 for example is provided with four second fixed parts 252, so that the position of first fixed part 212 and second fixed part 252 toward each other.Simultaneously, four fixtures 230 distinctly pass and are locked among first fixed part 212 and second fixed part 252.
On structure function, be immobilizated between first substrate 210 and second substrate 250 by supporting weldment 240, produce solder crack (tin point undercapacity in the time of can avoiding sealed two substrates, when bearing external force, easily cause solder crack) or Copper Foil peel off the situation of (Copper Foil of printed circuit board (PCB) and the base material of circuit board produce and peel off phenomenon).In the present embodiment, support mode that weldment 240 can utilize screen painting or plant ball be formed at first fixed part 220 around, and before being engaged to second substrate 250, make it become orbicule by reflow.In addition, in another embodiment, support weldment 240 and also can be made up of other material, its shape is not defined as orbicule.
As the enlarged diagram of Fig. 1 C, it is the bottom view of the magnification region of Figure 1B.A plurality of support weldments 240 are arranged in a circulus around first fixed part 212, and its quantity, height and size can be decided according to the demand of reality.For example, the height of support weldment 240 can be greater than the height of signal weldment 220.In addition, the arranging density of support weldment 240 can be greater than the arranging density of signal weldment 220.Certainly, the height that supports weldment 240 also can equal the height of signal weldment 220, and the arranging density of support weldment 240 also can be equal to or less than the arranging density of signal weldment 220, does not limit at this.
In sum, the present invention disposes a plurality of support weldments between first substrate and second substrate, when affixed first substrate of fixture and second substrate, support weldment and provide a support force between first substrate and second substrate, and these support weldments be welded in fixed part around, so can avoid the injury of circuit board, improve the reliability of assembling.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is when being as the criterion according to the content that claim defined.
Claims (18)
1. a circuit board iterative structure is characterized in that, comprising:
One first substrate has a plurality of support weldments;
One second substrate, this first substrate are to be stacked at this second substrate, and those support weldments is between this first substrate and this second substrate and a support force is provided; And
One fixture, in order to affixed this first substrate and this second substrate, and these support weldments are to be positioned at around this fixture.
2. circuit board iterative structure according to claim 1 is characterized in that, those support weldment and are arranged in a circulus.
3. circuit board iterative structure according to claim 1, it is characterized in that, first substrate has one first fixed part, and this second substrate has one second fixed part, and this fixture is to wear this first fixed part and this second fixed part so that this first substrate is stacked at this second substrate.
4. circuit board iterative structure according to claim 3 is characterized in that, this first fixed part or this second fixed part have a screw or a perforation.
5. circuit board iterative structure according to claim 1 is characterized in that, this fixture is a screw, a rivet or a double-screw bolt.
6. circuit board iterative structure according to claim 3 is characterized in that, this first substrate has one first assembly district, and this first fixed part is arranged at this first assembly district periphery.
7. circuit board iterative structure according to claim 3 is characterized in that, those support weldment is the periphery that is arranged at this first fixed part.
8. circuit board iterative structure according to claim 6 is characterized in that, this first assembly district has a plurality of signal weldments, and those support the height of the height of weldment greater than those signal weldments.
9. circuit board iterative structure according to claim 8 is characterized in that, those support the arranging density of the arranging density of weldment greater than those signal weldments.
10. circuit board iterative structure according to claim 1 is characterized in that, those support weldment and comprise solder sphere, welded post or soldering projection.
11. a circuit board is characterized in that, comprising:
One substrate has a fixed part;
A plurality of support weldments, be arranged at this fixed part around; And
One fixture is in order to wear this fixed part.
12. circuit board according to claim 11 is characterized in that, this fixed part has a screw or a perforation.
13. circuit board according to claim 11 is characterized in that, this fixture is a screw, a rivet or a double-screw bolt.
14. circuit board according to claim 11 is characterized in that, this substrate has an assembly district, and this fixed part is arranged at this assembly district periphery.
15. circuit board according to claim 14 is characterized in that, this assembly district has a plurality of signal weldments, and those support the height of the height of weldment greater than those signal weldments.
16. circuit board according to claim 15 is characterized in that, those support the arranging density of the arranging density of weldment greater than those signal weldments.
17. circuit board according to claim 11 is characterized in that, those support weldment and comprise solder sphere, welded post or soldering projection.
18. circuit board according to claim 11 is characterized in that, those support weldment is to arrange to form a circulus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101738731A CN102026481A (en) | 2009-09-18 | 2009-09-18 | Superimposition structure for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101738731A CN102026481A (en) | 2009-09-18 | 2009-09-18 | Superimposition structure for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102026481A true CN102026481A (en) | 2011-04-20 |
Family
ID=43867126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101738731A Pending CN102026481A (en) | 2009-09-18 | 2009-09-18 | Superimposition structure for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102026481A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021051983A1 (en) * | 2019-09-18 | 2021-03-25 | 华为技术有限公司 | Circuit assembly and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076561A (en) * | 2000-08-24 | 2002-03-15 | Sony Corp | Solid circuit board device and manufacturing method therefor |
| CN1419803A (en) * | 2000-02-18 | 2003-05-21 | Incep技术公司 | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US20070161266A1 (en) * | 2004-09-29 | 2007-07-12 | Murata Manufacturing Co., Ltd. | Stacked module and manufacturing method thereof |
-
2009
- 2009-09-18 CN CN2009101738731A patent/CN102026481A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1419803A (en) * | 2000-02-18 | 2003-05-21 | Incep技术公司 | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| JP2002076561A (en) * | 2000-08-24 | 2002-03-15 | Sony Corp | Solid circuit board device and manufacturing method therefor |
| US20070161266A1 (en) * | 2004-09-29 | 2007-07-12 | Murata Manufacturing Co., Ltd. | Stacked module and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021051983A1 (en) * | 2019-09-18 | 2021-03-25 | 华为技术有限公司 | Circuit assembly and electronic device |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110420 |