CN102026472A - Surface installation module - Google Patents
Surface installation module Download PDFInfo
- Publication number
- CN102026472A CN102026472A CN2009101955767A CN200910195576A CN102026472A CN 102026472 A CN102026472 A CN 102026472A CN 2009101955767 A CN2009101955767 A CN 2009101955767A CN 200910195576 A CN200910195576 A CN 200910195576A CN 102026472 A CN102026472 A CN 102026472A
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- circuit board
- groups
- reinforcement
- pad
- group
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Abstract
The invention discloses a surface installation module which comprises a process edge, a circuit board, a plurality of bonding pad groups, a plurality of first reinforcing rib groups and a plurality of second reinforcing rib groups, wherein the circuit board is positioned in the process edge, and a hollow area is arranged between the circuit board and the process edge; the bonding pad groups are arranged at the edge of the circuit board; the first reinforcing rib groups are spaced with the bonding pad groups and connected between the process edge and the circuit board; and the second reinforcing rib groups correspond to the bonding pad groups and are connected between the process edge and the circuit board. Accordingly, the connection between the circuit board and the process edge is realized by two kinds of reinforcing rib groups so that the circuit board is provided with more warping resistant stress points, thereby improving the warping resistant design of the circuit board in a lower-cost and convenient way and effectively solving the problem of warping deformation of the circuit board.
Description
Technical field
The present invention relates to mounted on surface (SMT) technical field, particularly relate to a kind of mounted on surface module with ruggedized construction.
Background technology
The circuit board that adopts mounted on surface (SMT) technology to encapsulate more and more is subjected to client's favor at present, but the problem of buckling deformation can take place this kind circuit board inevitably.And the buckling deformation of circuit board very easily causes getting loose even damaging of the components and parts installed on the circuit board and printed circuit thereof, thereby causes the qualification rate of product and the decline in useful life, also can cause this circuit board weldability can decline.
Summary of the invention
The object of the present invention is to provide a kind of mounted on surface (SMT) module, it has ruggedized construction, to improve the buckling deformation problem of circuit board in the existing SMT module.
For solving above technical problem, the invention provides a kind of mounted on surface module, it comprises: the technology limit; Circuit board is positioned within the described technology limit, is vacancy section between itself and circuit board and the technology limit; A plurality of pad groups are arranged at the edge of described circuit board; A plurality of first reinforcement groups are provided with at interval with described a plurality of pad groups, and are connected between described technology limit and the circuit board; A plurality of second reinforcement groups with the corresponding setting of described a plurality of pad groups, and are connected between described technology limit and the circuit board.
Further, reinforcement in the described second reinforcement group and the pad in the described pad group are crisscross arranged.
Further, the broadband of the reinforcement in the described second reinforcement group equals the spacing between adjacent two pads in the described pad group.
In sum, being connected by two class reinforcement groups between above circuit board and the technology limit realizes, make that the anti-warpage stress point of circuit board is more, thereby lower and convenient mode has increased the anti-warpage design of circuit board with a kind of cost, has effectively solved the problem of circuit board buckling deformation.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the front schematic view of mounted on surface (SMT) module according to a preferred embodiment of the present invention;
Fig. 2 is the reverse side schematic diagram of mounted on surface (SMT) module according to a preferred embodiment of the present invention.
Embodiment
Please refer to Fig. 1 and Fig. 2, it is respectively the front and the reverse side schematic diagram of mounted on surface (SMT) module according to a preferred embodiment of the present invention.As shown in the figure, this SMT module comprises technology limit 10 and circuit board 20, and wherein circuit board 20 is positioned within the technology limit 10, and is vacancy section 30 between circuit board 20 and the technology limit 10.The edge of circuit board 20 is provided with a plurality of pad groups 40 (clear in order to scheme, only mark three groups in the drawings, the pad group of other three groups of symmetries no longer marks at this).Be connected with a plurality of second reinforcement groups 60 by a plurality of first reinforcement groups 50 between circuit board 20 and the technology limit 10, wherein, a plurality of first reinforcement groups 50 are provided with at interval with a plurality of pad groups 40, a plurality of second reinforcement groups 60 are (clear in order to scheme, only mark three groups in the drawings, the pad group of other three groups of symmetries no longer marks at this) with a plurality of pad group 40 corresponding settings.
The technology limit 10 of circuit board 20 peripheries makes things convenient for SMT machine paster and is provided with, and the electronics spare part can not be installed in it; Circuit board 20 can be arranged in pairs or groups solid element and is designed to a single-clad board or double-sided printed-circuit board.If only do not paste components and parts and be single-clad board at front subsides components and parts, the back side; Be double-sided printed-circuit board if all paste components and parts at front and back.No matter single-clad board or double-sided printed-circuit board all are that the pad (pad) on the back side contacts with respective pad on the customer service circuit plate when being installed on the customer service circuit plate.
In this example, being connected by two class reinforcement groups between circuit board 20 and the technology limit 10 realizes, wherein the first reinforcement group 50 often is arranged at the place, stamp hole 70 places on the circuit board 20, and every corresponding stamp hole 70 is provided with one first reinforcement.The second reinforcement group 60 is provided with corresponding to the pad group 40 on the circuit board 20.Because pad group 40 and stamp hole 70 interval and the comparatively average edges that are arranged at circuit board 20, so, what reinforcement was also comparatively average is distributed between circuit board 20 and the technology limit 10, like this, just lower and convenient mode has increased the anti-warpage design of circuit board 20 with a kind of cost, and because circuit board 20 anti-warpage stress points are more, so effectively solved the problem of circuit board buckling deformation.
In a preferred embodiment, reinforcement in the second reinforcement group 60 and the pad in the pad group 40 are crisscross arranged.And preferable, the broadband of the reinforcement in the second reinforcement group 60 equals the spacing between adjacent two pads in the pad group.For example, at present more common a kind of SMT module, two stamp hole 70 center distance are 1.0mm, and two stamp hole 70 back gauge minimum distances are 0.5mm; And the pad width is 0.9mm, and the spacing between two pads is 0.6mm.So can increase width between two pads is the reinforcement of 0.6mm.
Certainly, the width of the reinforcement in the second reinforcement group 60 is preferable be spacing between adjacent two pads, like this, has utilized the distance between two pads to greatest extent, makes anti-warpage ability the best of this structure.Yet the present invention is not as limit, and the width of the reinforcement in the second reinforcement group 60 also can be less than the adjacent pad spacing, and those skilled in the art can design as required.
In addition, the preferable pad with in the pad group 40 of the reinforcement in the second reinforcement group 60 is crisscross arranged, and so, has made full use of the zone between per two pads in the pad group 40, makes anti-warpage ability the best.Yet the present invention is not as limit, and those skilled in the art can in each pad group 40 region, select the zone between some pads that reinforcement is set according to the design needs.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (3)
1. a mounted on surface module is characterized in that, comprising:
The technology limit;
Circuit board is positioned within the described technology limit, and is vacancy section between circuit board and the technology limit;
A plurality of pad groups are arranged at the edge of described circuit board;
A plurality of first reinforcement groups are provided with at interval with described a plurality of pad groups, and are connected between described technology limit and the circuit board;
A plurality of second reinforcement groups with the corresponding setting of described a plurality of pad groups, and are connected between described technology limit and the circuit board.
2. mounted on surface module according to claim 1 is characterized in that, reinforcement in the described second reinforcement group and the pad in the described pad group are crisscross arranged.
3. mounted on surface module according to claim 1 is characterized in that, the broadband of the reinforcement in the described second reinforcement group equals the spacing between adjacent two pads in the described pad group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101955767A CN102026472A (en) | 2009-09-11 | 2009-09-11 | Surface installation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101955767A CN102026472A (en) | 2009-09-11 | 2009-09-11 | Surface installation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102026472A true CN102026472A (en) | 2011-04-20 |
Family
ID=43867123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101955767A Pending CN102026472A (en) | 2009-09-11 | 2009-09-11 | Surface installation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102026472A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423142A (en) * | 2021-12-13 | 2022-04-29 | 湖南省方正达电子科技有限公司 | Three-dimensional assembled ceramic circuit board and preparation method thereof |
-
2009
- 2009-09-11 CN CN2009101955767A patent/CN102026472A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423142A (en) * | 2021-12-13 | 2022-04-29 | 湖南省方正达电子科技有限公司 | Three-dimensional assembled ceramic circuit board and preparation method thereof |
| CN114423142B (en) * | 2021-12-13 | 2023-12-12 | 湖南省方正达电子科技有限公司 | Three-dimensional assembled ceramic circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110420 |