CN114423142A - Three-dimensional assembled ceramic circuit board and preparation method thereof - Google Patents
Three-dimensional assembled ceramic circuit board and preparation method thereof Download PDFInfo
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- CN114423142A CN114423142A CN202111521522.2A CN202111521522A CN114423142A CN 114423142 A CN114423142 A CN 114423142A CN 202111521522 A CN202111521522 A CN 202111521522A CN 114423142 A CN114423142 A CN 114423142A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 173
- 238000002360 preparation method Methods 0.000 title abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 118
- 229910052802 copper Inorganic materials 0.000 claims abstract description 106
- 239000010949 copper Substances 0.000 claims abstract description 106
- 238000000034 method Methods 0.000 claims abstract description 57
- 230000008569 process Effects 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000000926 separation method Methods 0.000 claims abstract description 27
- 238000013461 design Methods 0.000 claims description 14
- 238000010586 diagram Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention discloses a three-dimensional assembled ceramic circuit board and a preparation method thereof, relating to the technical field of circuit boards and comprising a ceramic circuit board main body, wherein a process edge is arranged on the side edge of the ceramic circuit board main body; the process edge comprises a ceramic substrate in the middle and a copper layer positioned on the ceramic substrate; the copper layer is connected with circuit copper extending from the ceramic circuit board main body; the bottom of the circuit copper is free of a ceramic substrate; the process edge, the ceramic circuit board main body and the circuit copper surrounding area form a ceramic separation plate; and a breaking groove for removing the ceramic separation plate is arranged at the joint of the ceramic separation plate and the ceramic circuit board main body and/or the process edge. According to the invention, the ceramic circuit board is provided with the suspended copper strip, after the ceramic separating plate and the process edge are removed, the copper strip can be bent and deformed to be connected with other devices, so that three-dimensional assembly is formed, manual welding of pins of the copper strip is not needed, the operation process of the three-dimensional ceramic circuit board is greatly simplified, and the production efficiency and the product quality are improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a three-dimensional assembled ceramic circuit board and a preparation method thereof.
Background
With the gradual deepening of electronic technology in each application field, the high integration of circuit boards becomes a necessary trend, the high-integration packaging module requires a good heat dissipation bearing system, and the disadvantage of the traditional circuit board in heat conductivity coefficient becomes a bottleneck restricting the development of electronic technology. With the higher requirement of some high-power electrical appliances on the heat conduction index of the bearing circuit board, the circuit substrate is gradually prepared by adopting materials with good heat dissipation performance, such as metal or ceramic, and the heat conduction coefficient of the ceramic substrate can reach about 220W/M.K according to the difference of the preparation method and the material formula.
The three-dimensional assembly of the circuit board means that the circuit board is formed into an assembly mode of stacking up and down, so that the space occupancy rate is reduced, and the circuit integration effect is improved. At present, after a ceramic circuit board is pasted with components, pins are needed to be welded manually and are used for butting other components to form a solid circuit board.
However, the manual welding of the pins on the ceramic circuit board is complex in operation, which results in low production efficiency, high cost and unstable product quality.
Disclosure of Invention
Aiming at the problems, the invention provides the three-dimensional assembled ceramic circuit board and the preparation method thereof, so that the ceramic circuit board is provided with the suspended copper strip, after the ceramic separating plate and the process edge are removed, the copper strip can be bent and deformed to be connected with other devices to form three-dimensional assembly, the pins of the copper strip are not required to be welded manually, the operation process of the three-dimensional ceramic circuit board is greatly simplified, and the production efficiency and the product quality are improved.
In order to achieve the purpose, the invention adopts the technical scheme that: a three-dimensional assembled ceramic circuit board comprises a ceramic circuit board main body, wherein a process edge is arranged on the side edge of the ceramic circuit board main body; the process edge comprises a ceramic substrate in the middle and a copper layer positioned on the ceramic substrate; circuit copper is connected between the copper layer and the wiring terminal on the ceramic circuit board main body; the bottom of the circuit copper is free of a ceramic substrate; the process edge, the ceramic circuit board main body and the circuit copper surrounding area form a ceramic separation plate; and a breaking groove for removing the ceramic separating plate is arranged at the joint of the ceramic separating plate and the ceramic circuit board main body and/or the process edge.
The beneficial effects of the above technical scheme are: the ceramic separation plate has the fixing effect on the process side and the protection effect on the suspended circuit copper, and the process side has the fixing effect on the circuit copper, so that the circuit copper is prevented from being collided and deformed to influence the subsequent use before the circuit board is not used; and after the ceramic separation plate is removed, the circuit copper can be freely bent to assemble the three-dimensional circuit board. Compared with the traditional three-dimensional circuit board which needs to weld pins manually, the three-dimensional assembled ceramic circuit board provided by the invention is provided with copper pins which can be deformed as required, so that the operation process of the three-dimensional ceramic circuit board is greatly simplified, and the production efficiency and the product quality are improved.
As a further improvement of the technical scheme, the depth of the breaking groove is 1/3 the thickness of the ceramic substrate.
The beneficial effect of the improvement is as follows: after the pulling groove is arranged, the technical edge can be easily separated from the ceramic separating plate and the ceramic circuit board main body through hand strength. 1/3 with the preferred ceramic substrate thickness can ensure the connection firmness of the ceramic separating plate and the ceramic circuit board main body and can be conveniently separated by hand strength when in use.
As a further improvement of the above technical solution, the process edges are connected to form a frame body to enclose the ceramic circuit board main body.
The beneficial effect of the improvement is as follows: the process edges are connected with each other to form a frame body, so that the structure of the process edges is more stable.
As a further improvement of the technical scheme, the terminals on the ceramic circuit board main body are distributed at the edge position of the board body.
The beneficial effect of the improvement is as follows: the distribution of circuit copper can be convenient for circuit copper is more rationally distributed in ceramic circuit board main part border position, is convenient for be connected with the technology limit.
As a further improvement of the technical scheme, corners are arranged on two sides of the connecting position of the circuit copper and the terminal position on the ceramic circuit board.
The beneficial effect of the improvement is as follows: the structural stability of circuit copper and wiring end position can be improved, and the circuit copper is difficult to break when being bent.
As a further improvement of the technical scheme, the two sides of the joint of the circuit copper and the copper layer are provided with breaking grooves.
The beneficial effect of the improvement is as follows: the separation operation of the circuit copper and the process edge can be conveniently carried out.
As a further improvement of the technical scheme, the thickness of the circuit copper is 0.3-0.5 mm.
The beneficial effect of the improvement is as follows: the circuit copper is not easy to deform and break when being bent, the strength of the pins is improved, and high-current and high-power conduction is realized.
The beneficial effect of the improvement is as follows:
the preparation method applied to the three-dimensional assembled ceramic circuit board comprises the following steps:
firstly, graphic design: designing a process edge on the side edge of the original circuit pattern; circuit copper is connected between the process edge and a terminal on the circuit diagram to form a design pattern;
secondly, processing the ceramic circuit board according to the design pattern to form an etched ceramic circuit board;
thirdly, engraving: removing the ceramic substrate at the bottom of the circuit copper by using a carving machine;
fourthly, marking out: scribing and cutting are carried out along the joint of the ceramic separation plate, the ceramic circuit board main body and the process, so that a breaking groove is formed at the joint of the ceramic separation plate, the ceramic circuit board main body and the process edge.
As a further improvement of the above preparation method:
fifthly, forming: and on the basis of the fourth step, removing the process edge, separating the circuit copper from the copper layer, removing the ceramic separating plate, reserving the circuit copper extending out of the ceramic circuit board main body, and bending the circuit copper to the upper side or the lower side of the ceramic circuit board main body to form the connecting terminal.
Compared with the prior art, the invention has the advantages that:
1. one section of the circuit of the ceramic circuit board is suspended, and can be bent and deformed to be connected with other parts during assembly, so that three-dimensional assembly is formed. The copper thickness of the circuit is 0.3-0.5 mm. The purpose is as follows: the ceramic circuit board is provided with the copper strips, manual welding is eliminated, and the three-dimensional assembly function is realized.
2. After the components are pasted on the product in batches mechanically, the technical side is removed, and three-dimensional installation is carried out.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic top view of a three-dimensional ceramic circuit board according to the present invention;
FIG. 3 is a schematic side sectional view of a three-dimensional ceramic circuit board according to the present invention;
FIG. 4 is a schematic side view of a bent copper wire pin according to the present invention;
FIG. 5 is another structural diagram of a three-dimensional ceramic circuit board according to the present invention.
In the figure: 1. a ceramic circuit board main body; 2. a ceramic separator plate; 3. copper of the circuit; 4. a process edge; 5. breaking the groove; 6. turning an angle; 7. breaking the groove; 41. a ceramic substrate; 42. a copper layer.
Detailed Description
In order that those skilled in the art will better understand the technical solution of the present invention, the following detailed description of the present invention is provided in conjunction with the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention in any way.
Referring to fig. 1 to 5, in one embodiment, a three-dimensional assembled ceramic circuit board is provided, wherein a process edge 4 is disposed on a side edge of a ceramic circuit board main body 1; the technical edge 4 comprises a ceramic substrate 41 in the middle and a copper layer 42 on the ceramic substrate; a circuit copper 3 is connected between the copper layer 42 and a terminal on the ceramic circuit board main body 1; the bottom of the circuit copper 3 is free of a ceramic substrate 41; the process edge 4, the ceramic circuit board main body 1 and the surrounded area of the circuit copper 3 form a ceramic separation plate 2; and a snapping groove 7 for detaching the ceramic separating plate 6 is arranged at the joint of the ceramic separating plate 2 and the ceramic circuit board main body 1 and/or the technical edge 4.
As shown in fig. 5, a fabrication hole is provided in the middle of the ceramic circuit board main body 1, so that the ceramic circuit board main body 1 forms a zigzag structure; the technical edge 4 is located in the technical hole, and likewise, the ceramic separating plate 2 is also located in the technical hole.
The top and lower layers of the ceramic substrate 41 of the technical edge 4 have a copper edge layer 42.
The ceramic circuit board main body 1 is used for mounting electronic components and is generally rectangular, and the ceramic circuit board main body 1 has at least three layers of structures, including a ceramic substrate in the middle and a copper layer positioned on the upper layer of the ceramic substrate, wherein the copper layer forms circuit board conducting circuit connection; the ceramic separation plate 2 is made of a ceramic substrate material; the circuit copper 3 can be distributed on the upper layer surface or the lower layer surface of the ceramic circuit board main body 1; the ceramic substrate at the bottom of the wiring copper 3 is cut off.
When the three-dimensional assembled ceramic circuit board is used, the ceramic separation plate 2 is firstly pulled off and separated from the ceramic circuit board main body 1 by hands, and due to the pulling groove 7, the ceramic separation plate can be separated by the force of hands, and after the ceramic separation plate is separated, the connection part of the circuit copper 3 and the process edge 4 is also cut off and separated; after the separation operation is finished, the circuit copper 3 can be bent upwards or downwards as required to form a lead, so that the lead can be conveniently stacked and connected with other ceramic circuit boards or directly connected with terminals of other electrical appliances.
In order to prevent the circuit copper from being bent and deformed due to collision and scraping before the three-dimensional assembled ceramic circuit board is not used, the circuit copper 3 is fixed by reserving the ceramic separating plate and the process edge 4 and is only detached when the three-dimensional assembled ceramic circuit board is used.
Optimization is carried out on the basis of the above embodiment, and the depth of the breaking groove 7 is 1/3 of the thickness of the ceramic substrate. The depth of the breaking groove 7 is used for controlling the separation difficulty of the ceramic separation plate, the deeper the breaking groove is, the easier the breaking groove is, but in order to avoid the disconnection of the ceramic separation plate under the non-considered condition, the depth of the breaking groove 7 cannot be too deep, and generally 1/3 which is the thickness of the ceramic substrate is preferred; the processing of the snapping groove 7 is realized through a carving machine.
As shown in fig. 2, the above embodiment is optimized, and the process edges 4 are connected to each other to form a frame to enclose the ceramic circuit board body 1. In order to prevent the technical edges 4 from falling off under the non-artificial condition, the technical edges 4 are kept connected with each other, and the structural stability of the product can be improved.
As shown in fig. 2 and 5, the optimization is performed on the basis of the above-described embodiments, and the terminals on the ceramic circuit board body 1 are distributed at the edge positions of the board body. The wiring terminals are all distributed at the edge of the board body, so that the design of circuit copper is facilitated, the circuit copper is connected with the technical edge 4, and the distribution of other components on the ceramic circuit board main body 1 is not influenced.
As shown in fig. 2, in the above embodiment, it is optimized that corners 6 are provided at both sides of the connection between the copper wiring 3 and the terminal portion of the ceramic circuit board 1. The wiring end position also is the copper layer on ceramic circuit board 1, and the copper layer is connected with circuit copper 3, and the both sides of junction are not the right angle, but fillet structure, form corner 6 for circuit copper 3 is bending the back, and the portion of bending has corner 6 to realize the enhancement connection, prevents that circuit copper 3 from splitting.
As shown in fig. 2, based on the above embodiment, it is optimized that the two sides of the connection between the circuit copper 3 and the copper edge layer 42 are provided with the breaking grooves 5. The breaking groove 5 is triangular, so that the joint of the circuit copper 3 and the process edge 4 becomes weak, and the circuit copper 3 can be separated from the process edge 4 by hands.
The circuit copper 3 is optimized on the basis of the embodiment, and the thickness of the circuit copper 3 is 0.3-0.5 mm.
The preparation method applied to the three-dimensional assembled ceramic circuit board comprises the following steps:
firstly, graphic design: designing a process edge 4 on the side edge of the original circuit pattern or in the process hole; a circuit copper 3 is connected between the process edge 4 and a wiring terminal on the circuit diagram to form a design pattern; wherein the process edge 4 is in the same layer as the line copper 3.
Secondly, processing the ceramic circuit board according to the design pattern to form an etched ceramic circuit board;
thirdly, engraving: removing the ceramic substrate at the bottom of the circuit copper 3 by using a carving machine;
fourthly, marking out: scribing and cutting are carried out along the joint of the ceramic separation plate 2 and the ceramic circuit board main body 1, so that a breaking groove 7 is formed at the joint of the ceramic separation plate 2 and the ceramic circuit board main body 1.
As a further operation of the above preparation method:
fifthly, forming: on the basis of the fourth step, the ceramic separation plate 2 is removed, the process edge 4 is removed, the circuit copper 3 and the copper edge layer 42 are separated, the circuit copper 3 extending out of the ceramic circuit board main body 1 is reserved, and then the circuit copper 3 is bent towards the upper part or the lower part of the ceramic circuit board main body 1 to form the connecting terminal.
After the forming step is finished, when the circuit board is installed, a plurality of ceramic circuit board main bodies 1 can be stacked up and down and then connected with one another through the wiring terminals to form a multi-layer three-dimensional ceramic circuit board; as shown in fig. 5, the ceramic circuit board main body may be designed into a zigzag structure with a fabrication hole in the middle; the multilayer ceramic circuit board main bodies are connected with each other through the terminal; the middle of the circuit board in the shape of the Chinese character 'hui' can be used for mounting electric appliances or other parts, so that the circuit board is sleeved on the electric appliances or the parts.
In the invention, when the ceramic circuit board is processed according to the design pattern, the specific process steps are as follows:
1. selecting a ceramic plate: alumina, aluminum nitride, zirconia, etc., with a thickness of 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, and a size of 100 x 100mm, 160 x 190, etc.
2. Laser drilling: a technical edge tool hole and a product inner functional hole;
3. vacuum sputtering: plating a layer of titanium on the ceramic plate, wherein the thickness of the titanium is 1um, and plating a layer of copper, and the thickness of the copper is 3-5 um.
4. Electroplating and thickening the whole plate: continuously plating copper to ensure that the thickness of the plated copper reaches 10 um;
5. outer layer pattern: pasting a dry film, exposing and developing; transferring the design pattern to a ceramic plate; the pattern is designed as a positive piece, and the exposed copper after development carries out electroplating copper thickening on the pattern electroplating process. The thickness of the dry film is more than 40 um;
6. pattern electroplating: thickening the circuit copper to the design requirement, specifically 0.3 mm-0.5 mm; plating a layer of tin on the copper;
7. removing the film: removing the dry film;
8. etching copper: adopting an alkaline etching process;
9. etching titanium, removing tin, soldering resistance and chemical gold deposition: normal production;
10. engraving: engraving by using a fine engraving machine, removing the ceramic substrate at the bottom of the circuit copper 3, and reserving the circuit copper;
11. laser scribing: scribing and cutting are carried out along the joint of the ceramic separation plate 2 and the ceramic circuit board main body 1, and the depth is 1/3 the thickness of the ceramic substrate, so that the ceramic substrate is used for separating.
12. The copper bar and the ceramic circuit board main body need to be additionally provided with a corner design, and the copper bar is bent to play a reinforcing role.
13. The suspended copper strip can be fixed on the technical edge, so that the protective effect is achieved, and the device is not easy to damage when being pasted. And is also the condition of mechanized mass mounting production.
14. After the ceramic circuit board is pasted with components, the technical edge and other protective ceramic crushed aggregates are removed, and the copper bar is butted with other components.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. It should be noted that there are no specific structures shown in the drawings, and it will be apparent to those skilled in the art that various changes, modifications, or alterations can be made therein without departing from the principles of the invention; such modifications, variations, or combinations, or other uses of the inventive concept and techniques as applied to other uses without modification, are intended to be included within the scope of the present invention.
Claims (9)
1. A three-dimensional assembled ceramic circuit board comprises a ceramic circuit board main body (1), and is characterized in that a technical edge (4) is arranged on the side edge of the ceramic circuit board main body (1); the process edge (4) comprises a ceramic substrate (41) in the middle and a copper layer (42) on the ceramic substrate; a circuit copper (3) is connected between the copper layer (42) and a terminal on the ceramic circuit board main body (1); the bottom of the circuit copper (3) is free of a ceramic substrate (41); the process edge (4), the ceramic circuit board main body (1) and the surrounded area of the circuit copper (3) form a ceramic separation plate (2); and a breaking groove (7) for removing the ceramic separation plate (6) is arranged at the joint of the ceramic separation plate (2) and the ceramic circuit board main body (1) and/or the process edge (4).
2. The three-dimensional assembled ceramic circuit board according to claim 1, wherein the depth of the breaking groove (7) is 1/3 times the thickness of the ceramic substrate (41).
3. The three-dimensional assembled ceramic circuit board according to claim 1, wherein the technical edges (4) are connected to each other to form a frame body to enclose the ceramic circuit board body (1).
4. Three-dimensional assembled ceramic circuit board according to claim 1, wherein the terminals on the ceramic circuit board body (1) are distributed at the edge of the board body.
5. The three-dimensional assembled ceramic circuit board according to claim 1, wherein corners (6) are provided on both sides of the connection between the circuit copper (3) and the terminal portion of the ceramic circuit board (1).
6. The three-dimensional assembled ceramic circuit board according to claim 1, wherein the two sides of the joint of the circuit copper (3) and the copper layer (42) are provided with breaking grooves (5).
7. The three-dimensional assembled ceramic circuit board according to claim 1, wherein the thickness of the circuit copper (3) is 0.3-0.5 mm.
8. The method for preparing the three-dimensional assembled ceramic circuit board applied to any one of claims 1 to 7, is characterized by comprising the following steps:
firstly, graphic design: designing a process edge (4) on the side edge of the original circuit pattern; a circuit copper (3) is connected between the process edge (4) and a wiring terminal on the circuit diagram to form a design pattern;
secondly, processing the ceramic circuit board according to the design pattern to form an etched ceramic circuit board;
thirdly, engraving: removing the ceramic substrate (41) at the bottom of the circuit copper (3) by adopting an engraving machine;
fourthly, marking out: scribing and cutting are carried out along the joint of the ceramic separation plate (2), the ceramic circuit board main body (1) and the process edge (4), so that a breaking groove (7) is formed at the joint of the ceramic separation plate (2), the ceramic circuit board main body (1) and the process edge (4).
9. The method for preparing a three-dimensional assembled ceramic circuit board according to claim 8, further comprising the steps of:
fifthly, forming: and on the basis of the fourth step, removing the process edge (4), separating the circuit copper (3) from the copper layer (42), removing the ceramic separating plate (2), retaining the circuit copper (3) extending out of the ceramic circuit board main body (1), and bending the circuit copper (3) towards the upper part or the lower part of the ceramic circuit board main body (1) to form the connecting terminal.
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| CN110752197A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Lead frame, packaged integrated circuit board, power supply chip and packaging method of circuit board |
| CN210928151U (en) * | 2019-08-15 | 2020-07-03 | 鹤山市中富兴业电路有限公司 | PCB with lead wire design is torn to hand |
-
2021
- 2021-12-13 CN CN202111521522.2A patent/CN114423142B/en active Active
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| US5119272A (en) * | 1986-07-21 | 1992-06-02 | Mitsumi Electric Co., Ltd. | Circuit board and method of producing circuit board |
| JP2002076532A (en) * | 2000-08-28 | 2002-03-15 | Kyocera Corp | Ceramic circuit board |
| JP2003068966A (en) * | 2001-08-29 | 2003-03-07 | Kyocera Corp | Ceramic circuit board |
| CN1494365A (en) * | 2003-09-17 | 2004-05-05 | 建汉科技股份有限公司 | V type slot circuit board |
| CN102026472A (en) * | 2009-09-11 | 2011-04-20 | 希姆通信息技术（上海）有限公司 | Surface installation module |
| CN105934069A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Circuit board jointed board |
| CN206575671U (en) * | 2017-01-20 | 2017-10-20 | 奥斯比电子（深圳）有限公司 | Point plate blast resistance construction of FPC plates |
| CN106973497A (en) * | 2017-04-07 | 2017-07-21 | 深圳怡化电脑股份有限公司 | Printed circuit board and cash handling device |
| CN210928151U (en) * | 2019-08-15 | 2020-07-03 | 鹤山市中富兴业电路有限公司 | PCB with lead wire design is torn to hand |
| CN110752197A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Lead frame, packaged integrated circuit board, power supply chip and packaging method of circuit board |
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| CN114423142B (en) | 2023-12-12 |
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