CN203563258U - Connecting structure of double-element substrate - Google Patents
Connecting structure of double-element substrate Download PDFInfo
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- CN203563258U CN203563258U CN201320649681.5U CN201320649681U CN203563258U CN 203563258 U CN203563258 U CN 203563258U CN 201320649681 U CN201320649681 U CN 201320649681U CN 203563258 U CN203563258 U CN 203563258U
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- connection pad
- device substrate
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- element substrate
- connected structure
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Abstract
The utility model provides a connecting structure of a double-element substrate. The connecting structure comprises a first element substrate, a second element substrate and a conductive adhesive layer. The first element substrate comprises a plurality of first connecting pads which form at least two different separation pitches. The second element substrate is disposed on one side of the first element substrate and comprises a plurality of second connecting pads corresponding to the first connecting pads. The conductive adhesive layer is arranged between the first connecting pads of the first element substrate and the second connecting pads of the second element substrate. The first connecting pads are electrically connected with the second connecting pads through the conductive adhesive layer.
Description
Technical field
The utility model relates to a kind of connected structure, and particularly relevant for a kind of connected structure of two element substrate.
Background technology
In existing technology, electric connection method between flexible circuit board and display floater, contact panel or printed circuit board (PCB) mostly is and first between the connection pad of flexible circuit board and the connection pad of display floater, contact panel or printed circuit board (PCB), configures anisotropic conductive (Anisotropic Conductive Film is called for short ACF).Then, the connection pad of pressing flexible circuit board, anisotropic conductive, with the connection pad of display floater, contact panel or printed circuit board (PCB), flexible circuit board and display floater, contact panel or printed circuit board (PCB) with the conductive particle by anisotropic conductive, be electrically connected each connection pad of flexible circuit board and connection pad corresponding on display floater, contact panel or printed circuit board (PCB), so that can electrically conduct to each other.
Yet, when flexible circuit board press excursion, because being all equidistantly (Pitch), arranges connection pad, so connection pad of an anisotropic conductive cover part, and flexible circuit board only can be electrically conducted with the connection pad that part covers under anisotropic conductive, this is because the sense of current of flexible circuit board is mainly the direction of vertical face.Therefore, the connection pad not contacting with anisotropic conductive, will cause signal and the normal situation difference to some extent that contacts at this place, and produce impedance inequality, and then affect voltage and the electric current of whole connected structure.In addition, because connection pad is all equidistant arrangement, if therefore will increase conducting area, need to increase the size (as width) of flexible circuit board, and then increase cost of manufacture.
Utility model content
The utility model provides a kind of connected structure of two element substrate, and it has preferably on-state rate.
The connected structure of two element substrate of the present utility model, it comprises the first device substrate, the second device substrate and conductive adhesive layer.The first device substrate has a plurality of the first connection pads, and wherein the first connection pad at least has two kinds of different spacing.The second device substrate is configured in a side of the first device substrate and has the second connection pad that a plurality of corresponding the first connection pads arrange.Conductive adhesive layer is configured between the first connection pad of the first device substrate and the second connection pad of the second device substrate, and wherein the first connection pad is electrically connected by conductive adhesive layer and the second connection pad.
In an embodiment of the present utility model, the first above-mentioned connection pad at least comprises at least one the first connection gasket, at least one the second connection gasket and a plurality of the 3rd connection gasket.The contact area of the first connection gasket is three times of contact area of each the 3rd connection gasket, and the contact area of the second connection gasket is the twice of the contact area of each the 3rd connection gasket.
In an embodiment of the present utility model, the first above-mentioned connection pad is of similar shape with the second corresponding connection pad.
In an embodiment of the present utility model, above-mentioned conductive adhesive layer comprises elargol layer or anisotropic conductive adhesive layer (Anisotropic Conductive Film is called for short ACF).
In an embodiment of the present utility model, the first above-mentioned device substrate is the substrate of display floater or contact panel, and the second device substrate is flexible circuit board.
In an embodiment of the present utility model, the material of the first above-mentioned connection pad is the stacking of transparent conductive material, metal material or transparent conductive material and metal material, and the material of the second connection pad is single metal or composition metal.
In an embodiment of the present utility model, one of them is flexible circuit board for the first above-mentioned device substrate and the second device substrate, and wherein another is printed circuit board (PCB).
In an embodiment of the present utility model, the connected structure of above-mentioned two element substrate, also comprises: at least one contraposition ruler, is configured on the first device substrate or the second device substrate.
In an embodiment of the present utility model, above-mentioned contraposition ruler comprises a plurality of contraposition scales, and at least corresponding plural contraposition scale of the width of each the first connection pad.
In an embodiment of the present utility model, the material of above-mentioned contraposition ruler is the stacking of transparent conductive material, metal material or transparent conductive material and metal material.
Based on above-mentioned, because the first connection pad of the first device substrate of the present utility model at least has two kinds of different spacing, therefore when the second device substrate pressing is offset on the first device substrate, the second connection pad on the second device substrate still can contact the first connection pad of the first device substrate effectively, to maintain the on-state rate of the connected structure of two element substrate.In addition,, compared to the existing connection pad with uniform distances size, the design of the first connection pad of the present utility model can effectively increase contact area.Therefore, the utility model does not need additionally to increase into the second wider device substrate of original selection, can increase the conducting area of the connected structure of two element substrate.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, Bing coordinates accompanying drawing to be described in detail below.
Accompanying drawing explanation
Figure 1A is the schematic diagram of connected structure of a kind of two element substrate of an embodiment of the present utility model;
Figure 1B is the schematic diagram of the first device substrate of Figure 1A;
Fig. 1 C is the schematic diagram of the second device substrate of Figure 1A;
Fig. 2 is the schematic diagram of connected structure of a kind of two element substrate of another embodiment of the present utility model;
Fig. 3 is the schematic diagram of connected structure of a kind of two element substrate of embodiment tri-of the present utility model.
Description of reference numerals:
10a, 10b, 10c: the connected structure of two element substrate;
100a, 100b: the first device substrate;
110a, 110b: the first connection pad;
112a, 112b: the first connection gasket;
114a, 114b: the second connection gasket;
116a, 116b: the 3rd connection gasket;
200a: the second device substrate;
210a: the second connection pad;
212a: the 4th connection gasket;
214a: the 5th connection gasket;
216a: the 6th connection gasket;
300: conductive adhesive layer;
400: contraposition ruler;
401,402,403,404,405,406,407,408,409,410: contraposition scale;
P1, P2, P3: spacing.
Embodiment
Figure 1A is the schematic diagram of connected structure of a kind of two element substrate of an embodiment of the present utility model.Figure 1B is the schematic diagram of the first device substrate of Figure 1A.Fig. 1 C is the schematic diagram of the second device substrate of Figure 1A.Please also refer to Figure 1A, Figure 1B and Fig. 1 C, in the present embodiment, the connected structure 10a of two element substrate comprises the first device substrate 100a, the second device substrate 200a and conductive adhesive layer 300.
The first device substrate 100a has a plurality of the first connection pad 110a, and particularly, the first connection pad 110a at least has two kinds of different spacing (Figure 1A from three different spacing P1, P2, P3 are schematically shown in Figure 1B).The second device substrate 200a is configured in a side of the first device substrate 100a and has the second connection pad 210a that a plurality of corresponding the first connection pad 110a arrange.Conductive adhesive layer 300 is configured between the first connection pad 110a of the first device substrate 100a and the second connection pad 210a of the second device substrate 200a, and wherein the first connection pad 110a is electrically connected by conductive adhesive layer 300 and the second connection pad 210a.
Specifically, the first device substrate 100a is for example display floater or the substrate of contact panel (being for example hard substrate), and the material of these first connection pads 110a comprises the stacking of transparent conductive material, metal material or transparent conductive material and metal material.The first connection pad 110a at least comprise at least one first connection gasket 112a(Figure 1B schematically illustrate one), schematically illustrate two at least one second connection gasket 114a(Figure 1B) and a plurality of the 3rd connection gasket 116a(Figure 1B in schematically illustrate five).It should be noted that, the present embodiment is in order to increase the contact area of connection pad, therefore the connection pad with identical function is integrated into a connection pad with larger bonding area, as the first connection gasket 112a and the second connection gasket 114a.Herein, the contact area of the first connection gasket 112a is three times of contact area of each the 3rd connection gasket 116a, and the contact area of the second connection gasket 114a is the twice of the contact area of each the 3rd connection gasket 116a.
As shown in Figure 1A and Figure 1B, spacing P1 described herein, P2, P3 are by the distance between the center line of the first extremely adjacent connection pad 110a of the center line of each the first connection pad 110a.More particularly, spacing P1 is greater than spacing P2, and spacing P2 is greater than spacing P3.Herein, the first connection pad 110a has different spacing P1, P2, P3, arranges, but do not limited but be uniformly-spaced, and spacing distance wherein also can have the design of different interval distance.
As shown in Figure 1A and Fig. 1 C, the first connection pad 110a is of similar shape with the second corresponding connection pad 210a.That is, the second connection pad 210a is at least comprised of the 4th connection gasket 212a, the 5th connection gasket 214a and the 6th connection gasket 216a of corresponding the first connection gasket 112a, the second connection gasket 114a and the 3rd connection gasket 116a.In the present embodiment, the second device substrate 200a is for example flexible circuit board, and the material of the second connection pad 210a comprises single metal or composition metal.When the mode by pressing is pressure bonded to the second device substrate 200a on the first device substrate 100a, conductive adhesive layer 300 is for example elargol layer or anisotropic conductive adhesive layer, can corresponding the 4th connection gasket 212a, the 5th connection gasket 214a, the 6th connection gasket 216a that is electrically connected the first connection gasket 112a, the second connection gasket 114a, the 3rd connection gasket 116a and the second connection pad 210a of the first connection pad 110a.
Because the first connection pad 110a of the first device substrate 100a of the present embodiment has different spacing P1, P2, P3, therefore when the second device substrate 200a pressing is offset on the first device substrate 100a, the second connection pad 210a on the second device substrate 200a still can contact the first connection pad 110a of the first device substrate 100a effectively, can maintain the on-state rate of the connected structure 10a of two element substrate, and improve the reliability of product.In addition,, compared to the existing connection pad with uniform distances size, the design of the first connection pad 110a of the present embodiment can effectively increase contact area.Therefore, the present embodiment does not need additionally to increase into the second wider device substrate of original selection, can increase the conducting area of the connected structure 10a of two element substrate.
Fig. 2 is the schematic diagram of connected structure of a kind of two element substrate of another embodiment of the present utility model.The present embodiment is continued to use element numbers and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate element, and has omitted the explanation of constructed content.Explanation about clipped can be with reference to previous embodiment, and it is no longer repeated for the present embodiment.
Please refer to Fig. 2, the main difference of connected structure 10a of the connected structure 10b of the two element substrate of the present embodiment and the two element substrate of previous embodiment is to be: the first device substrate 100b of the present embodiment is embodied as printed circuit board (PCB), and the first connection gasket 112b of the first connection pad 110b is, the material of the second connection gasket 114b, the 3rd connection gasket 116b is single metal or or composition metal.
It is worth mentioning that, in the present embodiment, the first device substrate 100b is printed circuit board (PCB), and the second device substrate 200a is flexible circuit board.But the present embodiment does not limit the form of the first device substrate 100b and the second device substrate 200a.In other unshowned embodiment, can be also that the first device substrate is flexible circuit board, the second device substrate is printed circuit board (PCB), still belongs to the adoptable technical scheme of the utility model, does not depart from the scope of utility model institute wish protection.
Fig. 3 is the schematic diagram of connected structure of a kind of two element substrate of embodiment tri-of the present utility model.The present embodiment is continued to use element numbers and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate element, and has omitted the explanation of constructed content.Explanation about clipped can be with reference to previous embodiment, and it is no longer repeated for the present embodiment.
Please refer to Fig. 3, the main difference of connected structure 10a of the connected structure 10c of the two element substrate of the present embodiment and the two element substrate of previous embodiment is to be: the connected structure 10c of two element substrate also comprises at least one contraposition ruler 400, and wherein contraposition ruler 400 is configured on the first device substrate 100a.Certainly, in other unshowned embodiment, contraposition ruler is also configurable on the second device substrate, at this, is not limited.
Specifically, please refer to Fig. 3, the contraposition ruler 400 of the present embodiment comprises a plurality of contraposition scales 401,402,403,404,405,406,407,408,409,410, and at least corresponding plural contraposition scale of the width of each the first connection pad 110a, as contraposition scale 408,409.Herein, the material of contraposition ruler 400 is for example the stacking of transparent conductive material, metal material or transparent conductive material and metal material.When the second device substrate 200a pressing was offset to the first device substrate 100a when upper, can judge that accurately the first connection pad 110a(is as the second connection gasket 114a, the 3rd connection gasket 116a via contraposition ruler 400) and the second connection pad 210a(as the 5th connection gasket 214a, the 6th connection gasket 216a) between side-play amount.Then, can adjust via contraposition scale about 401～410 position of the second connection pad 210a, can promote the pressing contraposition precision between the second device substrate 200a and the first device substrate 100a, and can utilize contraposition scale 401～410 simultaneously, whether each connection gasket (as the second connection gasket 114a, the 3rd connection gasket 116a) the pressing overlapping region that has checked pressing is enough, be for example reach 1/2 connection gasket width more than, using as the function of confirming non-defective unit; In addition, can also on the first device substrate 100a, configure a plurality of contraposition rulers 400, can more improve contraposition precision like this.
In sum, because the first connection pad of the first device substrate of the present utility model at least has two kinds of different spacing, therefore when the second device substrate pressing is offset on the first device substrate, the second connection pad on the second device substrate still can contact the first connection pad of the first device substrate effectively, to maintain the on-state rate of the connected structure of two element substrate, and improve the reliability of product.Moreover compared to the existing connection pad with uniform distances size, the design of the first connection pad of the present utility model can effectively increase contact area.Therefore, the utility model does not need additionally to increase into the second wider device substrate of original selection, can increase the conducting area of the connected structure of two element substrate.In addition, the utility model also can improve the pressing contraposition precision between the first device substrate and the second device substrate by contraposition ruler is set.
Finally it should be noted that: each embodiment, only in order to the technical solution of the utility model to be described, is not intended to limit above; Although the utility model is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a connected structure for two element substrate, is characterized in that, comprising:
The first device substrate, has a plurality of the first connection pads, and wherein said the first connection pad at least has two kinds of different spacing;
The second device substrate, is configured in a side of this first device substrate and has the second connection pad that described the first connection pad of a plurality of correspondences arranges; And
Conductive adhesive layer, is configured between described first connection pad of this first device substrate and described second connection pad of this second device substrate, and wherein said the first connection pad is electrically connected by this conductive adhesive layer and described the second connection pad.
2. the connected structure of two element substrate according to claim 1, it is characterized in that, described the first connection pad at least comprises at least one the first connection gasket, at least one the second connection gasket and a plurality of the 3rd connection gasket, the contact area of this first connection gasket is three times of contact area of respectively the 3rd connection gasket, and the contact area of this second connection gasket is the twice of the contact area of the 3rd connection gasket respectively.
3. the connected structure of two element substrate according to claim 1, is characterized in that, described the first connection pad is of similar shape with corresponding described the second connection pad.
4. the connected structure of two element substrate according to claim 1, is characterized in that, this conductive adhesive layer is elargol layer or anisotropic conductive adhesive layer.
5. the connected structure of two element substrate according to claim 1, is characterized in that, this first device substrate is the substrate of display floater or contact panel, and this second device substrate is flexible circuit board.
6. the connected structure of two element substrate according to claim 5, it is characterized in that, the material of described the first connection pad is the stacking of transparent conductive material, metal material or transparent conductive material and metal material, and the material of described the second connection pad is single metal or composition metal.
7. the connected structure of two element substrate according to claim 1, is characterized in that, one of them is flexible circuit board for this first device substrate and this second device substrate, and wherein another is printed circuit board (PCB).
8. the connected structure of two element substrate according to claim 1, is characterized in that, also comprises:
At least one contraposition ruler, is configured on this first device substrate or this second device substrate.
9. the connected structure of two element substrate according to claim 8, is characterized in that, this contraposition ruler comprises a plurality of contraposition scales, and at least corresponding plural described contraposition scale of width of this first connection pad respectively.
10. the connected structure of two element substrate according to claim 8, is characterized in that, the material of this contraposition ruler is the stacking of transparent conductive material, metal material or transparent conductive material and metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320649681.5U CN203563258U (en) | 2013-10-21 | 2013-10-21 | Connecting structure of double-element substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320649681.5U CN203563258U (en) | 2013-10-21 | 2013-10-21 | Connecting structure of double-element substrate |
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| CN203563258U true CN203563258U (en) | 2014-04-23 |
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| CN201320649681.5U Expired - Fee Related CN203563258U (en) | 2013-10-21 | 2013-10-21 | Connecting structure of double-element substrate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571103A (en) * | 2016-10-27 | 2017-04-19 | 昆山国显光电有限公司 | Bonding structure and application thereof |
| CN111048232A (en) * | 2019-12-16 | 2020-04-21 | 业成科技（成都）有限公司 | Welding type anisotropic conductive film joint structure |
-
2013
- 2013-10-21 CN CN201320649681.5U patent/CN203563258U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571103A (en) * | 2016-10-27 | 2017-04-19 | 昆山国显光电有限公司 | Bonding structure and application thereof |
| CN111048232A (en) * | 2019-12-16 | 2020-04-21 | 业成科技（成都）有限公司 | Welding type anisotropic conductive film joint structure |
| CN111048232B (en) * | 2019-12-16 | 2021-07-27 | 业成科技（成都）有限公司 | Welding type anisotropic conductive film joint structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 Termination date: 20201021 |