CN102023365A - 相机模块、使相机模具聚焦的方法以及装置 - Google Patents

相机模块、使相机模具聚焦的方法以及装置 Download PDF

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CN102023365A
CN102023365A CN201010003400XA CN201010003400A CN102023365A CN 102023365 A CN102023365 A CN 102023365A CN 201010003400X A CN201010003400X A CN 201010003400XA CN 201010003400 A CN201010003400 A CN 201010003400A CN 102023365 A CN102023365 A CN 102023365A
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李相彦
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Samsung Electro Mechanics Co Ltd
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    • GPHYSICS
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    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32Means for focusing
    • G03B13/34Power focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32Means for focusing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
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    • G02B7/025Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • GPHYSICS
    • G02OPTICS
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    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
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    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10Power-operated focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
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    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
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Abstract

本发明提供一种相机模块、使相机模具聚焦的方法以及装置,该相机模块包括:透镜筒,容纳透镜;壳体,与透镜筒一体地形成;基底单元,具有通过粘结剂结合到壳体的顶表面,并包括上升和下降单元穿过的通过部分,当壳体粘结到基底单元时,上升和下降单元使壳体竖直地运动,以执行聚焦。

Description

相机模块、使相机模具聚焦的方法以及装置
本申请要求于2009年9月14日在韩国知识产权局提交的第10-2009-0086587号韩国专利申请的优先权,该申请的内容通过引用被结合于此。
技术领域
本发明涉及一种相机模块,更具体地讲,涉及一种相机模块、一种使该相机模块聚集的方法以及一种使该相机模块聚焦的装置,该相机模块安装在个人移动终端等上以执行成像功能。
背景技术
随着近来移动终端(例如,便携式电话以及个人数字助理(PDA))的发展,现在,移动终端不仅提供电话呼叫功能,而且被用作用于音乐、电影以及游戏等的多集合装置(multi-convergence divice)。这些多集合装置中最具代表性的是相机模块。
此外,由于移动终端尺寸和厚度减小,所以也使安装在终端中的相机模块的尺寸和厚度减小。
在高像素相机模块的情况下,当用于容纳透镜的透镜筒被装配到壳体中时,壳体的高度被调节,并会被减小。因此,需要执行聚焦。
在装配透镜筒和壳体的过程中,透镜筒通过螺钉结合到壳体,以使得相机模块聚焦。因此,当通过螺钉将透镜筒结合到壳体时,相机模块聚焦的位置可被操作者调节和改变。
然而,在这种相机模块中,当透镜筒被旋转以执行聚焦时,杂质会从接触部分落入到透镜筒和壳体之间的空间中,从而损害屏幕。此外,当透镜筒和壳体被装配时,需要调节旋转扭矩。因此,当前,需要解决这样的问题的技术。
发明内容
本发明一方面提供一种可使得装配过程简化的相机模块、一种使相机模具聚焦的方法以及一种使相机模块聚焦的装置。
根据本发明的一方面,提供一种相机模块,该相机模块包括:透镜筒,容纳透镜;壳体,与透镜筒一体地形成;基底单元,具有通过粘结剂结合到壳体的顶表面,并包括上升和下降单元穿过的通过部分,当壳体粘结到基底单元时,上升和下降单元使壳体竖直地运动,以执行聚焦。
每个通过部分可以是形成于在壳体和基底单元之间的结合部分处的孔。
通过部分可形成在基底单元的各个角中,从而是敞开的。
透镜筒和壳体可以是一体注模的产品。
可壳体包括逃逸部分,该逃逸部分形成在壳体的粘结到基底单元的外侧表面上,并且该逃逸部分按照楔形形成,以提供逃逸空间,使得粘结剂逃逸到逃逸空间中。
根据本发明的另一方面,提供一种使相机模块聚焦的方法,该方法包括:
将壳体设置在基底单元上,使得壳体布置在与基底单元粘结的粘结位置,与透镜筒一体地形成的壳体包括透镜;将粘结剂施加在基底单元的粘结位置,并暂时粘结壳体;通过使用穿过形成在基底单元中的通过部分的上升和下降单元使壳体的位置竖直运动以使相机模块聚焦。
在透镜设置在模具中之后,可执行注模以形成壳体,使得透镜容纳在壳体中。
通过部分可以是形成于在壳体和基底单元之间的粘结部分处的孔,以穿过基底单元。
通过部分可通过切割基底单元的各个角形成。
根据本发明的另一方面,提供一种用于使相机模块聚焦的装置,该装置包括:上升和下降单元,形成为穿过形成在基底单元中的通过部分;驱动单元,使上升和下降单元运动,以使与透镜筒一体的壳体竖直运动,从而使相机模块聚焦。
驱动单元可包括形成在上升和下降单元的端部的电机单元。
附图说明
通过下面结合附图进行的详细描述,本发明的上述和其它方面、特点和其它优点将会被更清楚地理解,其中:
图1是根据本发明的实施例的相机模块的透视图;
图2是解释图1的相机模块的基底单元的截面图;
图3是根据本发明的实施例的相机模块的基底单元的透视图;
图4至图6是解释根据本发明的另一实施例的使相机模块聚焦的方法的截面图;
图7是解释根据本发明的另一实施例的相机模块的基底单元的透视图。
具体实施方式
现在,将参照附图详细描述本发明的示例性实施例。但是,本发明可按照许多不同的形式实现,并且不应被解释为限于在此阐述的实施例。相反,提供这些实施例使得该公开将是彻底的和完整的,并将充分将本发明的范围传达给本领域技术人员。在附图中,为了清楚起见,层和区域的厚度被夸大了。在附图中,相同的标号指示相同的元件,因此,将省略对它们的描述。
图1是根据本发明的实施例的相机模块的透视图。图2是解释图1的相机模块的基底单元的截面图。
参照图1和图2,相机模块100可包括透镜筒110、壳体120和基底单元130。
透镜筒110是与壳体120一体的注模产品。多个透镜容纳在透镜筒110中,以使其沿着光轴布置。因此,与透镜筒110一体的壳体120可通过将注模材料注射到模具(在该模具中,透镜被布置在设计的位置)中而被制造。
在这种情况下,虽然未示出,但是布置在透镜筒110中的透镜可包括至少一个空间,使得相邻透镜可彼此隔开预定距离。虽然至少一个透镜设置在透镜筒110中,但是设置在透镜筒110中的透镜的数量不受限制。
如上所述,壳体120通过一个注模工艺与透镜筒110一体地形成。实质上不限定透镜筒110和壳体120之间的边界。
壳体120可包括粘结到其内部的红外线(IR)过滤器112,IR过滤器112能够从通过透镜的光中过滤红外线。壳体120的底表面可通过粘结剂134粘结到基底单元130的顶表面。
逃逸部分122可形成在粘结到基底单元130的壳体120的粘结表面的外侧。逃逸部分122可按照楔形形成,以提供逃逸空间,使得粘结剂134进入逃逸空间中。当基底单元130和壳体120被压迫并彼此粘结时,压迫力使得粘结剂134流入到壳体120的逃逸部分122。因此,能够防止粘结剂134运动到基底单元130的外部。
在本发明的该实施例中,逃逸部分122防止粘结剂134运动到形成在基底单元130的每个侧表面上的侧电极单元136,从而侧电极单元136不被粘结剂134污染。
IR过滤器112布置在透镜筒110和图像传感器140之间,并可通过粘结剂粘结到形成在壳体120内的支撑表面。
能够从传播的光中过滤红外线的IR过滤器可用作IR过滤器112。然而,不限于此,IR过滤器112可用能够从透过透镜的光中过滤不必要的光的任何过滤器代替。
图像传感器140布置在透镜筒110之下,并可将由透镜筒110形成的图像转换成电信号。为了转换,图像传感器140可包括像素阵列和光电转换单元。
像素阵列响应于透过透镜的光储存电荷,用作光接收元件的光电转换单元将储存在像素阵列中的电荷转换成可用的电信号。例如,电荷耦合器件(CCD)图像传感器或者互补金属氧化物半导体(CMOS)图像传感器可用作图像传感器140。
图像传感器140可通过引线键合方法(wire-bonding method)安装在基底单元130的顶表面上。基底单元130和图像传感器140之间的电连接不限于引线键合方法。
图3是解释根据本发明的实施例的相机模块的基底单元的透视图。
参照图3,基底单元130粘结到壳体120的底表面,使得安装在基底单元130的顶表面上的图像传感器140布置在壳体120的内部空间内。
基底单元130可包括形成在其表面上的焊盘单元,焊盘单元布置在图像传感器140周围。因此,可按照图像传感器140可电连接到焊盘单元的方式执行引线键合。
此外,基底单元130可包括形成在其四个角中的每个角处的通过部分132,上升和下降单元10穿过该通过部分132。上升和下降单元10使壳体120竖直地运动,以使相机模块聚焦。
通过部分132形成于在壳体120和基底单元130之间的粘结部分处,并可以是穿过基底单元130的孔。然而,通过部分132不限于此。根据设计者的意图,通过部分132的形状可以按照多种方式被设计。
图4至图6是解释根据本发明的另一实施例的使相机模块聚焦的方法的截面图。
参照图4,使相机模块聚焦的方法可包括将与透镜筒110一体的壳体120设置在基底单元130上,使得壳体120布置在与基底单元130粘结的粘结位置。
此时,粘结剂134被施加在基底单元130的顶表面上,以对应于与壳体120粘结的粘结位置。在涂覆粘结剂134的位置形成基底单元130的通过部分132。
上升和下降单元10布置在基底单元130之下,并插入到形成在基底单元130中的通过部分132中。
参照图5,所述方法可包括在将粘结剂134施加在基底单元130的粘结位置之后,暂时粘结壳体120。
上升和下降单元10穿过通过部分132以调节壳体120的高度。在粘结剂134硬化时,可以调节壳体120的高度。
参照图6,当壳体120的高度被调节时,执行相机模块的聚焦。使用上升和下降单元10调节相机模块的位置。在位置被调节之后,粘结剂140硬化,使得壳体120固定到位。
根据本发明的另一实施例的用于使相机模块聚焦的装置可包括上升和下降单元10和驱动单元。
上升和下降单元10可形成为穿过形成在基底单元130中的通过部分132。上升和下降单元10的形状不受限制,只要上升和下降单元10的直径小于通过部分132的直径即可。例如,上升和下降单元10可按照条形形成。
用于使上升和下降单元10竖直地运动的驱动单元可包括电机单元20。上升和下降单元10可通过从电机单元20提供的驱动力微动。驱动单元不限于电机单元20。
通常,透镜筒和壳体分别形成并通过螺钉彼此结合,以形成相机模块。在这种情况下,当通过旋转透镜筒执行聚焦时,杂质可从接触部分落入到透镜筒和壳体之间的空间中,从而损害屏幕。当透镜筒和壳体装配在一起时,难以调节旋转扭矩。
然而,在根据本发明的实施例的相机模块、用于使相机模块聚焦的方法以及用于使相机模块聚焦的装置中,由于透镜筒110和壳体120一体地形成,所以可省略上述装配过程。因此,能够防止出现杂质,并省去调节旋转扭矩的麻烦。
此外,由于通过用于使相机模块聚焦的装置执行相机模块的聚焦被简单地执行,所以本发明的实施例可被容易地应用于必须执行聚焦的高像素相机模块。
图7是解释根据本发明的另一实施例的相机模块的基底单元的透视图。壳体120、图像传感器140以及上升和下降单元10基本上与上述实施例的相同。因此,将省略对其它的特别描述。
参照图7,基底单元230粘结到壳体120的底表面,使得安装在基底单元230的顶表面上的图像传感器140设置在壳体120的内部空间中。
基底单元230可包括在其表面上的围绕图像传感器140布置的焊盘单元。图像传感器140可通过引线键合电连接到焊盘单元。
基底单元230可包括形成在其四个角的每个角处的通过部分。该通过部分可以是形成在基底单元230的每个角处的敞开部分232。
用于使壳体120竖直地运动的上升和下降单元10通过敞开部分232竖直地运动,以使相机模块聚焦。与根据本发明的上述实施例的基底单元130的通过部分132相比,基底单元230的敞开部分232可更容易地形成。
虽然已经结合示例性实施例显示和描述了本发明,但本领域技术人员应该清楚,在不脱离由权利要求限定的本发明的精神和范围的情况下,可进行修改和更改。

Claims (11)

1.一种相机模块,包括:
透镜筒,容纳透镜;
壳体,与透镜筒一体地形成;
基底单元,具有通过粘结剂结合到壳体的顶表面,并包括上升和下降单元穿过的通过部分,当壳体粘结到基底单元时,上升和下降单元使壳体竖直地运动,以执行聚焦。
2.如权利要求1所述的相机模块,其中,每个通过部分是形成于在壳体和基底单元之间的结合部分处的孔。
3.如权利要求1所述的相机模块,其中,通过部分形成在基底单元的各个角中,从而是敞开的。
4.如权利要求1所述的相机模块,其中,透镜筒和壳体是一体注模的产品。
5.如权利要求1所述的相机模块,其中,壳体包括逃逸部分,该逃逸部分形成在壳体的粘结到基底单元的外侧表面上,并且该逃逸部分按照楔形形成,以提供逃逸空间,使得粘结剂逃逸到逃逸空间中。
6.一种使相机模块聚焦的方法,该方法包括:
将壳体设置在基底单元上,使得壳体布置在与基底单元粘结的粘结位置,与透镜筒一体地形成的壳体包括透镜;
将粘结剂施加在基底单元的粘结位置,并暂时粘结壳体;
通过使用穿过形成在基底单元中的通过部分的上升和下降单元使壳体的位置竖直运动以使相机模块聚焦。
7.如权利要求6所述的方法,其中,在透镜设置在模具中之后,执行注模以形成壳体,使得透镜容纳在壳体中。
8.如权利要求6所述的方法,其中,通过部分是形成于在壳体和基底单元之间的粘结部分处的孔,以穿过基底单元。
9.如权利要求6所述的方法,其中,通过部分通过切割基底单元的各个角形成。
10.一种用于使相机模块聚焦的装置,该装置包括:
上升和下降单元,形成为穿过形成在基底单元中的通过部分;
驱动单元,使上升和下降单元运动,以使与透镜筒一体的壳体竖直运动,从而使相机模块聚焦。
11.如权利要求10所述的装置,其中,驱动单元包括形成在上升和下降单元的端部的电机单元。
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