CN102016394A - LED fluorescent lamp - Google Patents
LED fluorescent lamp Download PDFInfo
- Publication number
- CN102016394A CN102016394A CN2010800014381A CN201080001438A CN102016394A CN 102016394 A CN102016394 A CN 102016394A CN 2010800014381 A CN2010800014381 A CN 2010800014381A CN 201080001438 A CN201080001438 A CN 201080001438A CN 102016394 A CN102016394 A CN 102016394A
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- CN
- China
- Prior art keywords
- heat
- light source
- fluorescent lamp
- conducting substrate
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention provides a LED fluorescent lamp, comprising a lamp head, a glass bulb and a control circuit, at least two LED light sources, at least two light source panels for fixing the LED light sources, a heat conduction device and a rear cover. The heat conduction device comprises at least two heat conduction base plates capable of inclining towards its vertical center line direction and at least two light source panels are respectively permanently connected with at least two heat conduction base plates in the heat conduction way and the bottom of the heat conduction base plate extends downwards to form a housing cavity. The rear cover comprises a shell and a hollow column for housing the control circuit and the shell is in closed joint with the heat conduction device by an annular interface, thus the heat conduction device is scarfed with the rear cover in the heat conduction way and a plurality of heat radiation slices are arranged on the outer side surface of the rear cover. The light source panel, the heat conduction device, the shell of the rear cover and the heat radiation slices form a good heat conduction and heat radiation path. The LED fluorescent lamp has good heat conduction and heat radiation and effectively solves the over-heat problem of the LED light source.
Description
Technical field
The present invention relates to field of illuminating lamps.More particularly, the present invention relates to a kind of LED fluorescent lamp as lighting, the luminous efficiency height of this LED fluorescent lamp, heat radiation is good.
Background of invention
LED is as a kind of solid luminescence light source with great development potentiality, since being born the sixties in 20th century, advantage is subjected to people more and more pays close attention to so that its life-span length, sound construction, low-power consumption and appearance and size is flexible etc., replaced traditional high-pressure halogen lamp gradually and has been applied in various lighting fields.But this caloric value when work of LED lamp is bigger, has produced bigger light decay thus, has also shortened the service life of LED lamp simultaneously, so limited the range of application of LED lamp at lighting field to a certain extent.
Because the brightness and the underpower of single led light source can not be used as illumination and use, so existing illuminating LED lamp has generally all been assembled a plurality of led light sources, constitute the led array structure, cause desired brightness and power to reach.The number of the led light source of assembling is many more, and the brightness of made LED lamp and power also will be high more.Though the led array structure can reach lighting requirement, also produced heat thus and concentrated, local temperature is too high, influences the problems such as stability of circuit control system.Because special heat conduction and heat abstractor are not set, therefore, the heat that is produced by a plurality of led light sources can not dissipate effectively, makes that the temperature of shell of lamp can be than higher, and the people has hot danger at a touch; Moreover the temperature height also makes the lamp ratio be easier to damage.
At present, proposed the heat dissipation problem that many technical schemes solve relevant LED light fixture, the radiating effect that these technical schemes have is relatively poor, although the radiating effect that has is better, but cost is too high, complex structure.For example the Chinese invention patent application number 200910011246.8, name is called the patent application of " heat-radiation LED illuminating lamp of loop heat-tube heat radiator ", a kind of LED illuminating lamp that adopts the loop heat-tube heat radiator heat radiation is disclosed, utilize that loop heat-tube heat radiator structure and heat-pipe radiator thermal resistance are little, the high principle of the coefficient of heat conduction, solve the LED heat dissipation problem, but the cost height of this radiating mode, complex structure.
Therefore, be necessary existing LED light fixture as the illumination purpose is improved, improve its thermal conductivity, thereby can solve the heat dissipation problem of LED light fixture well, improve luminous efficiency, cut down the consumption of energy, reduce light decay, increase luminous flux.
Summary of the invention
The objective of the invention is to overcome above-mentioned shortcoming of the prior art, a kind of LED fluorescent lamp of novelty is provided, this LED fluorescent lamp has thermal conductive resin and thermal diffusivity, has prolonged the service life of LED lamp, has reduced energy consumption and has reduced light decay.
The objective of the invention is to be achieved through the following technical solutions, a kind of LED fluorescent lamp be provided, comprise can being inserted on the bulb socket and the lamp holder that is connected with power supply, glass envelope and control circuit that described LED fluorescent lamp also comprises:
At least two led light sources, described led light source is connected with described control circuit;
At least two light source panels, described at least two led light sources are separately fixed on described two light source panels at least;
Heat-transfer device, described heat-transfer device comprises at least two heat-conducting substrates that are obliquely installed to its vertical center line direction, but described at least two light source panels are fixed in respectively on described two heat-conducting substrates with heat-conducting mode at least, the bottom of described heat-conducting substrate extends to form a receiving compartment downwards, and the bottom margin of described receiving compartment is provided with ring interface;
Bonnet, described bonnet comprises housing and is used to hold the hollow cylinder of described control circuit, described housing engages with described glass envelope, the upper inside wall of described housing is provided with a ring interface, closely engage with the ring interface of described heat-transfer device by this interface, but make described heat-transfer device and described bonnet together with the heat-conducting mode interlocking, fixedly connected with described housing in the bottom of described hollow cylinder, described hollow cylinder is in described control circuit is received in the receiving compartment of described heat-transfer device.
In one embodiment of the present invention, described LED fluorescent lamp comprises:
Three led light sources;
Three light source panels, described three led light sources are separately fixed on described three light source panels;
Heat-transfer device, described heat-transfer device comprises three radially equidistant intervals ground heat-conducting substrates of being provided with and tilting to its vertical center line direction, described each heat-conducting substrate comprises following heat-conducting substrate and the last heat-conducting substrate that upwards slopes inwardly and extend to form along the described top of heat-conducting substrate down, the described heat-conducting substrate of going up forms a triangular shape structure on the top of heat-transfer device, and the end face of described triangular shape structure has the circular hole that passes through for the lead that connects described led light source and described control circuit.Described heat-transfer device also comprises three last demarcation strips that are arranged on the following demarcation strip between the described down heat-conducting substrate and upwards slope inwardly and extend to form along the top of described each time demarcation strip, and described heat-conducting substrate down and described following demarcation strip nestle up connecting ring around disc of formation; The wherein said light source panel that is connected with led light source is separately fixed at described going up on the heat-conducting substrate.
Preferably, in above preferred embodiment, described each time heat-conducting substrate is provided with a spring eye, is used for an end of buckle spring, and the other end of spring is fixed on the described light source panel, makes described light source panel be fixed in more securely on the described heat-conducting substrate down.
According to the present invention, can put the glue mode or adopt any mechanical system that described led light source is fixed on the described light source panel, and described light source panel and described heat-conducting substrate can be fixed together by securing member, some glue or sticking heat radiation oil.Preferably, scribble the heat radiation oil reservoir between described light source panel and the described heat-conducting substrate.
The outer surface of bonnet housing of the present invention can be provided with many and spaced fin parallel with its central vertical axis, to reach better radiating effect.
The bottom of the hollow cylinder of bonnet can be fixedly connected on the housing by for example clamping, mode such as be spirally connected, and this is apparent to those skilled in the art.
Strengthen radiating effect, but described light source panel, heat-conducting plate, radiator and reflector are preferably selected the material of heat conduction for use, as aluminium, aluminium alloy or pottery.
In the LED light fixture, main heater element is a led light source, and the heat of its generation distributes can influence the stability of control circuit, thereby influences the illumination effect of led light source conversely again.LED fluorescent lamp of the present invention closely contacts led chip light source panel with heat-transfer device, heat-transfer device also forms tight the connection with the bonnet that is provided with fin, thereby good heat conduction and heat radiation approach have been formed, the heat that led light source is given out distributes quickly and efficiently by the heat radiation approach of light source panel-heat-transfer device-bonnet-fin, has reduced led light source so that lamp body temperature inside.Therefore the temperature of control circuit can be not too high, strengthened the stability of control circuit.The pathway of heat conduction of the present invention and heat radiation can reach good heat-radiation effect, guarantees that LED is not overheated, has prolonged the life-span of LED fluorescent lamp, has solved the problem of great power LED fluorescent lamp heating thus.
In addition, the design that only need change heat-conducting substrate in the heat-transfer device just can increase the quantity of led light source and light source panel, so the present invention can make the great power LED fluorescent lamp of seriation.
Be described further below with reference to the technique effect of accompanying drawing, to understand purpose of the present invention, feature and effect fully design of the present invention, concrete structure and generation.
Description of drawings
Figure 1 shows that the front view of the LED fluorescent lamp of one embodiment of the invention.
Figure 2 shows that along the cutaway view of A-A direction shown in Figure 1.
Figure 3 shows that the three-dimensional exploded view of LED fluorescent lamp shown in Figure 1.
Figure 4 shows that the top perspective schematic diagram of heat-transfer device in the LED fluorescent lamp shown in Figure 1.
Figure 5 shows that the elevated bottom perspective schematic diagram of heat-transfer device shown in Figure 4.
Figure 6 shows that the front view of heat-transfer device shown in Figure 4.
Figure 7 shows that the vertical view of heat-transfer device shown in Figure 4.
The specific embodiment
Referring to figs. 1 through Fig. 3, there is shown the LED fluorescent lamp 10 as one embodiment of the present invention, described fluorescent lamp 10 comprises glass envelope 100, three led light sources 400, three light source panels 300, heat-transfer device 500, control circuit 600, bonnet 700 and lamp holders 800.
Led light source can be made of one or more LED.In the present embodiment, three led light sources 400 respectively are made up of 3 chip LEDs, are separately fixed on three light source panels 300.Led light source 400 and light source panel 300 can put glue or any known mechanical system is fixed together.
To shown in Figure 7, the top of heat-transfer device is triangular shape substantially as Fig. 4, and the bottom is cylindric.In the present embodiment, heat-transfer device 500 comprises three radially equidistant intervals ground heat-conducting substrates of being provided with and tilting to its vertical center line direction.Making heat-conducting substrate become tilted configuration with the central vertical axis of fluorescent lamp, is can to come out by direct irradiation for the light that allows led chip send.Each piece heat-conducting substrate comprises heat-conducting substrate 510 and last heat-conducting substrate 530 down, should go up heat-conducting substrate 530 and upwards slope inwardly along the top of heat-conducting substrate 510 down and extend and form, the light source panel 300 that wherein is connected with led light source 400 is fixed on the heat-conducting substrate 530.Going up heat-conducting substrate 530 for three abuts against together in triangular shape structure of the top of heat-transfer device formation.This triangular shape structure has a flat end face 560, has a circular hole 561 in the center of end face 560, and led light source 400 can form with lead by this circular hole 561 with control circuit 600 and be electrically connected.
Between light source panel 300 and heat-conducting substrate, can be coated with one deck heat radiation oil, thereby play better conductive force.Certainly, light source panel 300 is fixed on adopts any any other mode known in the art on the heat-conducting substrate, preferably can make the two form good heat conduction and radiating effect, for example, can utilize the stronger heat radiation oil of viscosity directly light source panel 300 to be bonded on the heat-conducting plate.Present embodiment also adopts spring leaf 200 to strengthen fixing between light source panel and the last heat-conducting substrate 530.For this reason, respectively be provided with a spring eye 511 on the heat-conducting substrate 510 down, an end of spring leaf 200 is buckled in this spring eye inboard, and the other end of spring leaf is pushed down light source panel 300.Because the stressed effect of spring, the reaction force of spring can be pushed down light source panel 300 securely, thereby light source panel 300 more closely is fixed on the heat-conducting substrate 530.
Heat-transfer device 500 also comprises three last demarcation strips 540 that are arranged on down the following demarcation strip 520 between the heat-conducting substrate 510 and upwards slope inwardly and extend to form along the top of described each time demarcation strip 520.Described heat-conducting substrate 510 down and described demarcation strip 520 down nestle up connecting ring around forming a disc, as Fig. 4 and shown in Figure 7.The purpose that upper and lower demarcation strip 540,520 is configured to tilt is for the light that allows led light source 400 send along all directions can exhale fully effectively, makes that dispersing of light is unlikely is obstructed.
Extend to form a receiving compartment 550 by following heat-conducting substrate 510 and following demarcation strip 520 downwards around the cone bottom that forms, on the bottom margin of receiving compartment 550, be provided with ring interface.In the present embodiment, this ring interface is that the bottom margin of receiving compartment 550 bends inwards and forms step 551.
Outer surface at housing 720 is provided with many and spaced fin 721 parallel with its central vertical axis, and being provided with of these fin 721 can distribute the heat that heat-transfer device 500 passes over well, reaches better radiating effect.
But the housing 720 of light source panel 300, heat-transfer device 500, bonnet is preferably selected the material of heat conduction for use, for example aluminium, aluminium alloy or pottery etc.
Because being fixed with the light source panel of led light source is close on the heat-conducting substrate of heat-transfer device, heat-transfer device forms heat conduction with bonnet again and is connected, and the hull outside surface of bonnet is provided with many fin, takes this to form the heat conduction and the heat radiation approach of a good light source panel-heat-transfer device-bonnet-fin.The heat that led light source sends distributes apace by this heat radiation approach, has reduced the temperature of led light source, thereby has solved the heat dissipation problem of LED light fixture effectively.
According to the present invention, the quantity of led light source can be for more than 2, as 3 or 4, in addition more a plurality of, as long as correspondingly adjust the quantity of heat-conducting substrate in the heat-transfer device 500.Because solved the heat dissipation problem of led light source, thereby can make more high-power, the LED light fixture of low energy consumption and littler light decay more.
Therefore, the invention provides a kind of LED fluorescent lamp, not only solved the heat dissipation problem of LED effectively, but also improved luminous flux and the luminous efficiency of LED widely.
Though described preferred embodiment of the present invention in conjunction with the accompanying drawings, the present invention should not be restricted to and above description and identical structure of accompanying drawing and operation.Concerning those skilled in the art; under the situation that does not exceed design of the present invention and scope, also can make many improvement and variation, but these improvement and variation all should belong to the scope of protection of present invention to the foregoing description by logical analysis, reasoning, or a limited experiment.
Claims (11)
1. a LED fluorescent lamp comprises can being inserted on the bulb socket and the lamp holder that is connected with power supply, glass envelope and control circuit, and it is characterized in that, described LED fluorescent lamp also comprises:
At least two led light sources, described led light source is connected with described control circuit;
At least two light source panels, described at least two led light sources are separately fixed on described two light source panels at least;
Heat-transfer device, described heat-transfer device comprises at least two heat-conducting substrates that are obliquely installed to its vertical center line direction, but described at least two light source panels are fixed in respectively on described two heat-conducting substrates with heat-conducting mode at least, the bottom of described heat-conducting substrate extends to form a receiving compartment downwards, and the bottom margin of described receiving compartment is provided with ring interface;
Bonnet, described bonnet comprises housing and is used to hold the hollow cylinder of described control circuit, described housing engages with described glass envelope, the upper inside wall of described housing is provided with a ring interface, closely engage with the ring interface of described heat-transfer device by this interface, but make described heat-transfer device and described bonnet together with the heat-conducting mode interlocking, fixedly connected with described housing in the bottom of described hollow cylinder, described hollow cylinder is in described control circuit is received in the receiving compartment of described heat-transfer device.
2. LED fluorescent lamp as claimed in claim 1 is characterized in that, described LED fluorescent lamp comprises:
Three led light sources;
Three light source panels, described three led light sources are separately fixed on described three light source panels;
Heat-transfer device, described heat-transfer device comprises three equidistant intervals ground settings and the heat-conducting substrate that tilts to its vertical center line direction, described each heat-conducting substrate comprises following heat-conducting substrate and the last heat-conducting substrate that upwards slopes inwardly and extend to form along the described top of heat-conducting substrate down, and the described heat-conducting substrate of going up forms a triangular shape structure at the top of heat-transfer device; Described heat-transfer device also comprises three last demarcation strips that are arranged on the following demarcation strip between the described down heat-conducting substrate and upwards slope inwardly and extend to form along the top of described each time demarcation strip, and described heat-conducting substrate down and described following demarcation strip nestle up connecting ring around disc of formation;
The wherein said light source panel that is connected with led light source is separately fixed at described going up on the heat-conducting substrate.
3. LED fluorescent lamp as claimed in claim 2, it is characterized in that described each time heat-conducting substrate is provided with spring eye, be used for an end of buckle spring, and the other end of spring is fixed on the described light source panel, makes described light source panel be fixed in described going up on the heat-conducting substrate securely.
4. LED fluorescent lamp as claimed in claim 2 is characterized in that, the end face of described triangular shape structure has the circular hole that passes through for the lead that connects described led light source and described control circuit.
5. as each described LED fluorescent lamp in the claim 1 to 4, it is characterized in that described led light source is fixed on the described light source panel with a glue mode or mechanical system.
6. as each described LED fluorescent lamp in the claim 1 to 4, it is characterized in that, in the following ways described light source panel and described heat-conducting substrate are fixed together: securing member, some glue or sticking heat radiation oil.
7. as each described LED fluorescent lamp in the claim 1 to 4, it is characterized in that, scribble the heat radiation oil reservoir between described light source panel and the described heat-conducting substrate.
8. as each described LED fluorescent lamp in the claim 1 to 4, it is characterized in that the outer surface of described housing is provided with many and spaced fin parallel with its central vertical axis.
9. as each described LED fluorescent lamp in the claim 1 to 4, it is characterized in that, but the housing of described light source panel, heat-transfer device and described bonnet is selected the material of heat conduction for use.
10. LED fluorescent lamp as claimed in claim 9 is characterized in that, but the material of described heat conduction is aluminium, aluminium alloy or pottery.
11., it is characterized in that described glass envelope is selected from glass envelope, twisted string glass envelope and the ground glass bubble of silicone spray as each described LED fluorescent lamp in the claim 1 to 4.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2010/070550 WO2011094949A1 (en) | 2010-02-05 | 2010-02-05 | Led fluorescent lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102016394A true CN102016394A (en) | 2011-04-13 |
| CN102016394B CN102016394B (en) | 2013-04-10 |
Family
ID=43844566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800014381A Expired - Fee Related CN102016394B (en) | 2010-02-05 | 2010-02-05 | Led fluorescent lamp |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2357402A3 (en) |
| CN (1) | CN102016394B (en) |
| HK (1) | HK1156681A1 (en) |
| TW (1) | TW201135148A (en) |
| WO (1) | WO2011094949A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818234A (en) * | 2011-06-07 | 2012-12-12 | 蔡子丰 | Radiating structure of luminescent lamp body, corresponding lighting device and manufacture method thereof |
| CN103133896A (en) * | 2011-11-29 | 2013-06-05 | 泰金宝电通股份有限公司 | Lamp bulb |
| CN105319821A (en) * | 2014-07-16 | 2016-02-10 | 日立乐金光科技株式会社 | Optical module and projection image display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201500687A (en) | 2013-06-24 | 2015-01-01 | Beautiful Light Technology Corp | Light emitting diode bulb |
| CN203517389U (en) * | 2013-09-23 | 2014-04-02 | 马士科技有限公司 | LED bulb |
| CN104832833A (en) * | 2015-04-27 | 2015-08-12 | 东莞勤上光电股份有限公司 | Ultraviolet sterilization and illumination integrated lamp |
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2010
- 2010-02-05 WO PCT/CN2010/070550 patent/WO2011094949A1/en active Application Filing
- 2010-02-05 CN CN2010800014381A patent/CN102016394B/en not_active Expired - Fee Related
- 2010-12-17 EP EP10252162.2A patent/EP2357402A3/en not_active Withdrawn
-
2011
- 2011-01-19 TW TW100101921A patent/TW201135148A/en unknown
- 2011-10-13 HK HK11110868.5A patent/HK1156681A1/en not_active IP Right Cessation
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| CN2763686Y (en) * | 2005-01-11 | 2006-03-08 | 深圳市中电照明有限公司 | LED lamp cup |
| CN201106805Y (en) * | 2007-11-02 | 2008-08-27 | 深圳市邦贝尔电子有限公司 | No-dizzy LED lighting lamp |
| CN201246614Y (en) * | 2008-07-16 | 2009-05-27 | 沈李豪 | LED bulb |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818234A (en) * | 2011-06-07 | 2012-12-12 | 蔡子丰 | Radiating structure of luminescent lamp body, corresponding lighting device and manufacture method thereof |
| WO2012167732A1 (en) * | 2011-06-07 | 2012-12-13 | 莱姆尼斯照明（亚洲）有限公司 | Heat dissipation structure for lamp body, corresponding lighting device and manufacturing method therefor |
| CN102818234B (en) * | 2011-06-07 | 2016-12-07 | 蔡子丰 | Heat dissipation structure for luminous lamp body, corresponding illuminator and manufacture method thereof |
| CN103133896A (en) * | 2011-11-29 | 2013-06-05 | 泰金宝电通股份有限公司 | Lamp bulb |
| CN105319821A (en) * | 2014-07-16 | 2016-02-10 | 日立乐金光科技株式会社 | Optical module and projection image display device |
| CN105319821B (en) * | 2014-07-16 | 2017-05-24 | 日立乐金光科技株式会社 | Optical module and projection image display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011094949A1 (en) | 2011-08-11 |
| TW201135148A (en) | 2011-10-16 |
| HK1156681A1 (en) | 2012-06-15 |
| EP2357402A2 (en) | 2011-08-17 |
| EP2357402A3 (en) | 2013-04-10 |
| CN102016394B (en) | 2013-04-10 |
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