CN102016394B - Led fluorescent lamp - Google Patents

Abstract

The invention provides an LED fluorescent lamp which comprises a lamp holder, a glass bulb, a control circuit, at least two LED light sources, at least two light source panels for fixing the LED light sources, a heat conducting device and a rear cover. The heat conducting device comprises at least two heat conducting substrates which are obliquely arranged towards the direction vertical to the center line of the heat conducting device, the at least two light source panels are respectively and fixedly connected to the at least two heat conducting substrates in a heat conducting mode, and the bottom ends of the heat conducting substrates extend downwards to form a receiving cavity. The rear cover comprises a shell and a hollow cylinder for accommodating the control circuit, the shell is tightly jointed with the heat conducting device through an annular interface, so that the heat conducting device and the rear cover are embedded together in a heat conducting manner, and the outer side surface of the rear cover is also provided with a plurality of radiating fins. A good heat conduction and heat dissipation path is formed by the light source panel, the heat conduction device, the shell of the rear cover and the heat dissipation fins. The LED fluorescent lamp has good heat conductivity and heat dissipation, and effectively solves the problem of overheating of an LED light source.

Description

LED fluorescent lamp

technical field

The invention relates to the field of lighting fixtures. More specifically, the present invention relates to an LED fluorescent lamp used as a lighting fixture, the LED fluorescent lamp has high luminous efficiency and good heat dissipation.

Background of the invention

As a solid light source with great development potential, LED has attracted more and more attention due to its advantages of long life, firm structure, low power consumption and flexible shape and size since its birth in the 1960s, and has gradually replaced Traditional high-voltage halogen lamps are used in various lighting fields. However, the LED lamp itself generates a relatively large amount of heat when it is working, resulting in a large light attenuation and shortening the service life of the LED lamp, thus limiting the application range of the LED lamp in the lighting field to a certain extent.

Because the brightness and power of a single LED light source are insufficient, it cannot be used as lighting. Therefore, the existing LED lights for lighting are generally assembled with multiple LED light sources to form an LED array structure to achieve the required brightness and power. The more the number of LED light sources assembled, the higher the brightness and power of the LED lamp made. Although the LED array structure can meet the lighting requirements, it also produces problems such as heat concentration, excessive local temperature, and affecting the stability of the circuit control system. Since there is no special heat conduction and heat dissipation device, the heat generated by multiple LED light sources cannot be effectively dissipated, so that the temperature of the shell of the lamp will be relatively high, and there will be a danger of scalding when people touch it; moreover, the temperature High also makes the lamp easier to damage.

At present, many technical solutions have been proposed to solve the heat dissipation problem of LED lamps, but some of these technical solutions have poor heat dissipation effects, and some have high heat dissipation effects, but the cost is too high and the structure is complicated. For example, China's invention patent application number 200910011246.8, the patent application titled "Loop-type heat pipe radiator heat dissipation LED lighting lamp", discloses a LED lighting lamp that uses a loop-type heat pipe radiator to dissipate heat. The principle of small thermal resistance and high thermal conductivity of the heat sink can solve the problem of LED heat dissipation, but this heat dissipation method has high cost and complex structure.

Therefore, it is necessary to improve the existing LED lamps used for lighting purposes to improve their thermal conductivity, so as to solve the heat dissipation problem of LED lamps, improve luminous efficiency, reduce energy consumption, reduce light decay, and increase luminous flux.

Contents of the invention

The object of the present invention is to overcome the above-mentioned shortcomings in the prior art, and provide a novel LED fluorescent lamp, which has good thermal conductivity and heat dissipation, prolongs the service life of the LED lamp, reduces energy consumption and light decay .

The purpose of the present invention is achieved through the following technical solutions. An LED fluorescent lamp is provided, including a lamp cap that can be inserted into the lamp base and connected to a power supply, a glass bulb and a control circuit. The LED fluorescent lamp also includes:

At least two LED light sources, the LED light sources are connected to the control circuit;

At least two light source panels, the at least two LED light sources are respectively fixed on the at least two light source panels;

A heat conduction device, the heat conduction device includes at least two heat conduction substrates inclined to the vertical centerline direction, the at least two light source panels are respectively fixed on the at least two heat conduction substrates in a heat conduction manner, the heat conduction The bottom end of the substrate extends downward to form a receiving cavity, and an annular interface is provided on the bottom edge of the receiving cavity;

The rear cover, the rear cover includes a housing and a hollow cylinder for accommodating the control circuit, the housing is engaged with the glass bulb, and the upper part of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conduction device is closely engaged, so that the heat conduction device and the rear cover are embedded together in a heat conduction manner, the bottom of the hollow cylinder is fixedly connected with the housing, and the hollow cylinder Received together with the control circuit in the receiving cavity of the heat conducting device.

In a preferred embodiment of the present invention, the LED fluorescent lamp includes:

Three LED light sources;

Three light source panels, the three LED light sources are respectively fixed on the three light source panels;

A heat conduction device, the heat conduction device includes three heat conduction substrates arranged at equal intervals in the radial direction and inclined to the direction of the vertical centerline, each of the heat conduction substrates includes a lower heat conduction substrate and an upward and inward direction along the top of the lower heat conduction substrate The upper heat conduction substrate formed by oblique extension, the upper heat conduction substrate forms a triangular structure on the upper part of the heat conduction device, and the top surface of the triangular structure has a circle for the wire connecting the LED light source and the control circuit to pass through. hole. The heat conduction device also includes three lower partition plates arranged between the lower heat conduction substrates and an upper partition plate formed by extending upwardly and inwardly along the top ends of the respective lower partition plates. The lower heat conduction substrates Closely connected with the lower partition plate to form a circular surface; wherein the light source panels fixedly connected with LED light sources are respectively fixed on the upper heat-conducting substrate.

Preferably, in the preferred embodiment above, each of the lower heat-conducting substrates is provided with a spring hole for snapping one end of the spring, and the other end of the spring is fixed on the light source panel, so that the light source panel is more firmly fixed on the lower heat conduction substrate.

According to the present invention, the LED light source can be fixed on the light source panel by dispensing glue or any mechanical method, and the light source panel and the heat-conducting substrate can be fixed through fasteners, glue dispensing or viscous heat dissipation oil. fixed together. Preferably, a heat dissipation oil layer is coated between the light source panel and the heat conduction substrate.

The outer surface of the rear cover shell of the present invention may be provided with a plurality of cooling fins parallel to its central vertical axis and arranged at intervals to achieve a better heat dissipation effect.

It is obvious to those skilled in the art that the bottom of the hollow cylinder of the rear cover can be fixedly connected to the housing by, for example, clamping or screwing.

To enhance the heat dissipation effect, the light source panel, heat conduction plate, heat sink and reflector are preferably made of heat-conducting materials, such as aluminum, aluminum alloy or ceramics.

In LED lamps, the main heating element is the LED light source, and the heat generated by it will affect the stability of the control circuit, which in turn will affect the luminous effect of the LED light source. In the LED fluorescent lamp of the present invention, the LED chip light source panel is in close contact with the heat conduction device, and the heat conduction device is also closely connected with the back cover provided with heat sinks, thus forming a good heat conduction and heat dissipation path, and the heat emitted by the LED light source Through the heat dissipation path of the light source panel-heat conduction device-back cover-heat sink, it can be dissipated quickly and efficiently, reducing the temperature of the LED light source and the inside of the lamp body. Therefore, the temperature of the control circuit will not be too high, and the stability of the control circuit is enhanced. The conduction path of heat conduction and heat dissipation of the present invention can achieve a good heat dissipation effect, ensure that the LED does not overheat, prolong the life of the LED fluorescent lamp, thereby solving the problem of heating of the high-power LED fluorescent lamp.

In addition, the number of LED light sources and light source panels can be increased only by changing the design of the heat conduction substrate in the heat conduction device, so the present invention can be made into serialized high-power LED fluorescent lamps.

The idea, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, features and effects of the present invention.

Description of drawings

Fig. 1 is a front view of an LED fluorescent lamp according to an embodiment of the present invention.

Fig. 2 is a sectional view along the A-A direction shown in Fig. 1 .

FIG. 3 is a three-dimensional exploded view of the LED fluorescent lamp shown in FIG. 1 .

FIG. 4 is a schematic top perspective view of the heat conduction device in the LED fluorescent lamp shown in FIG. 1 .

FIG. 5 is a schematic bottom perspective view of the heat conduction device shown in FIG. 4 .

FIG. 6 is a front view of the heat conduction device shown in FIG. 4 .

FIG. 7 is a top view of the heat conduction device shown in FIG. 4 .

Detailed ways

Referring to Fig. 1 to Fig. 3, the LED fluorescent lamp 10 as a preferred embodiment of the present invention is shown in the figure, and described fluorescent lamp 10 comprises glass bubble 100, three LED light sources 400, three light source panels 300, heat conduction device 500, control Circuit 600 , back cover 700 and lamp holder 800 .

The glass bubble 100 can be a transparent glass bubble, or a glass bubble sprayed with silica gel, a twisted glass bubble, a frosted glass bubble, etc. can be selected as required. The lamp holder 800 can be designed as lamp holders of various sizes as required, such as E11, E12, E14, E17, E26, E27 and so on. The control circuit 600 is not the main point of the present invention, and will not be described in detail here.

The LED light source can consist of one or more LEDs. In this embodiment, each of the three LED light sources 400 is composed of three chip LEDs, which are respectively fixed on three light source panels 300 . The LED light source 400 and the light source panel 300 can be fixed together by dispensing glue or any known mechanical means.

As shown in FIGS. 4 to 7 , the upper part of the heat conduction device is generally triangular in shape, and the lower part is cylindrical in shape. In this embodiment, the heat conduction device 500 includes three heat conduction substrates arranged at equal intervals in the radial direction and inclined toward the vertical centerline thereof. The heat-conducting substrate and the central vertical axis of the fluorescent lamp are arranged obliquely so that the light emitted by the LED chip can be directly irradiated. Each heat-conducting substrate includes a lower heat-conducting substrate 510 and an upper heat-conducting substrate 530. The upper heat-conducting substrate 530 extends upward and inwardly along the top of the lower heat-conducting substrate 510, wherein the light source panel 300 with the LED light source 400 fixed on it on the substrate 530 . The three upper heat-conducting substrates 530 are close together to form a triangular structure on the upper part of the heat-conducting device. The triangular structure has a flat top surface 560, and a circular hole 561 is opened at the center of the top surface 560, through which the LED light source 400 and the control circuit 600 can be electrically connected with wires.

A layer of heat dissipation oil can be coated between the light source panel 300 and the heat conduction substrate, so as to have a better heat conduction effect. Of course, any other method known in the art can be used to fix the light source panel 300 on the heat-conducting substrate. The panel 300 is bonded to the heat conducting plate. In this embodiment, the spring piece 200 is also used to strengthen the fixation between the light source panel and the upper heat-conducting substrate 530 . To this end, a spring hole 511 is provided on each of the lower heat-conducting substrates 510 , one end of the spring piece 200 is buckled inside the spring hole, and the other end of the spring piece is pressed against the light source panel 300 . Due to the force of the spring, the reaction force of the spring will firmly press the light source panel 300 , so that the light source panel 300 is more tightly fixed on the upper heat conducting substrate 530 .

The heat conduction device 500 further includes three lower partition plates 520 disposed between the lower heat conduction substrates 510 , and an upper partition plate 540 extending upward and inwardly along the top ends of the respective lower partition plates 520 . The lower heat conduction substrate 510 and the lower partition plate 520 are closely connected to form a circular surface, as shown in FIG. 4 and FIG. 7 . The purpose of disposing the upper and lower partition plates 540, 520 at an inclination is to allow the light emitted by the LED light source 400 in all directions to fully and effectively diverge, so that the divergence of the light will not be hindered.

The bottom end of the conical body formed by the lower heat conduction substrate 510 and the lower partition plate 520 extends downward to form a receiving cavity 550 , and an annular interface is provided on the bottom edge of the receiving cavity 550 . In this embodiment, the annular interface forms a step 551 by bending the bottom edge of the receiving cavity 550 inward.

The rear cover 700 is ring-shaped and includes a housing 720 and a hollow cylinder 710. The bottom of the hollow cylinder 710 is fixed with the housing 720, and the fixing can be in any manner known in the art. The upper end of the housing 720 and the glass bulb 100 can be joined together by any means known in the art, such as clamping or screwing. The upper side of the inner wall of the casing protrudes outward to form a step, which is closely connected with the step 551 of the heat conduction device 500, so that the heat conduction device 500 and the rear cover 700 are embedded together in a heat conduction manner, forming good heat conduction and heat dissipation aisle. The size of the hollow cylinder 710 matches the size of the receiving cavity 550 of the heat conducting device 500 , and after containing the control circuit 600 , they are received together in the receiving cavity 550 of the heat conducting device.

The outer surface of the housing 720 is provided with a plurality of heat sinks 721 parallel to its central vertical axis and arranged at intervals. The arrangement of these heat sinks 721 can dissipate the heat transferred from the heat conduction device 500 well to achieve better heat dissipation. Effect.

The light source panel 300, the heat conduction device 500, and the housing 720 of the rear cover are preferably made of heat conduction materials, such as aluminum, aluminum alloy or ceramics.

Since the light source panel fixed with the LED light source is closely attached to the heat conduction substrate of the heat conduction device, the heat conduction device forms a heat conduction connection with the back cover, and the outer surface of the shell of the back cover is provided with a plurality of heat sinks, thereby forming a good light source Panel - heat conduction device - back cover - heat conduction and heat dissipation path of heat sink. The heat emitted by the LED light source is quickly dissipated through the heat dissipation path, reducing the temperature of the LED light source, thereby effectively solving the heat dissipation problem of the LED lamp.

According to the present invention, the number of LED light sources can be more than 2, such as 3 or 4, or even more, as long as the number of heat-conducting substrates in the heat-conducting device 500 is adjusted accordingly. Because the heat dissipation problem of the LED light source is solved, it can be made into an LED lamp with higher power, lower energy consumption and smaller light decay.

Therefore, the present invention provides an LED fluorescent lamp, which not only effectively solves the heat dissipation problem of the LED, but also greatly improves the luminous flux and luminous efficiency of the LED.

Although preferred specific embodiments of the present invention have been described with reference to the accompanying drawings, the present invention should not be limited to the same structure and operation as those described above and accompanying drawings. For those skilled in the art, many improvements and changes can also be made to the above-mentioned embodiments through logical analysis, reasoning or limited experiments without exceeding the concept and scope of the present invention, but these improvements and changes should all belong to the present invention. The scope of protection claimed by the invention.

Claims (10)

1. An LED fluorescent lamp, comprising a lamp cap that can be inserted into the lamp base and connected to a power supply, a glass bulb and a control circuit, characterized in that, the LED fluorescent lamp also includes: Three LED light sources, the LED light sources are connected to the control circuit; Three light source panels, the three LED light sources are respectively fixed on the three light source panels; A heat conduction device, the heat conduction device includes three heat conduction substrates inclined to the vertical centerline direction, the three light source panels are respectively fixed on the three heat conduction substrates in a heat conduction manner, and each heat conduction substrate includes The lower heat conduction substrate and the upper heat conduction substrate formed by extending upward and inward along the top of the lower heat conduction substrate, the upper heat conduction substrate forms a triangular structure on the top of the heat conduction device; the heat conduction device also includes three pieces arranged on the The lower partition plate between the lower heat conduction substrates and the upper partition plate formed by extending upward and inward along the top ends of the respective lower partition plates, the lower heat conduction substrate and the lower partition plate are closely connected A circular surface is formed around it, and the bottom end of the cone formed by the lower heat conduction substrate and the lower partition plate extends downwards to form a receiving cavity, and an annular interface is provided on the bottom edge of the receiving cavity; and The rear cover, the rear cover includes a housing and a hollow cylinder for accommodating the control circuit, the housing is engaged with the glass bulb, and the upper part of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conduction device is closely engaged, so that the heat conduction device and the rear cover are embedded together in a heat conduction manner, the bottom of the hollow cylinder is fixedly connected with the housing, and the hollow cylinder Received together with the control circuit in the receiving cavity of the heat conducting device. 2. The LED fluorescent lamp according to claim 1, wherein each of the lower heat-conducting substrates is provided with a spring hole for snapping one end of the spring, and the other end of the spring is fixed on the light source panel, so that The light source panel is firmly fixed on the upper heat conducting substrate. 3 . The LED fluorescent lamp according to claim 1 , wherein a round hole is opened on the top surface of the triangular structure for the wire connecting the LED light source and the control circuit to pass through. 4 . 4. The LED fluorescent lamp according to any one of claims 1 to 3, wherein the LED light source is fixed on the light source panel by glue dispensing or mechanically. 5. The LED fluorescent lamp according to any one of claims 1 to 3, characterized in that, the light source panel and the heat conducting substrate are fixed together by the following methods: fasteners, glue dispensing or viscous heat dissipation Oil. 6. The LED fluorescent lamp according to any one of claims 1 to 3, characterized in that a heat dissipation oil layer is coated between the light source panel and the heat conduction substrate. 7. The LED fluorescent lamp according to any one of claims 1 to 3, characterized in that, the outer surface of the casing is provided with a plurality of cooling fins parallel to its central vertical axis and arranged at intervals. 8. The LED fluorescent lamp according to any one of claims 1 to 3, wherein the light source panel, the heat conduction device and the housing of the rear cover are made of materials that can conduct heat. 9. The LED fluorescent lamp according to claim 8, wherein the heat-conducting material is aluminum, aluminum alloy or ceramics. 10. The LED fluorescent lamp according to any one of claims 1 to 3, wherein the glass bulb is selected from glass bulbs sprayed with silica gel, twisted glass bulbs or frosted glass bulbs.

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