CN102013616B - Molding process and equipment for manufacturing electronic components by using plastic-coated metal assembly - Google Patents
Molding process and equipment for manufacturing electronic components by using plastic-coated metal assembly Download PDFInfo
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- CN102013616B CN102013616B CN2009103065810A CN200910306581A CN102013616B CN 102013616 B CN102013616 B CN 102013616B CN 2009103065810 A CN2009103065810 A CN 2009103065810A CN 200910306581 A CN200910306581 A CN 200910306581A CN 102013616 B CN102013616 B CN 102013616B
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Abstract
The invention provides molding process and equipment for manufacturing electronic components by using a plastic-coated metal assembly and relates to the molding process and equipment of the electronic components. The molding process comprises a material belt forming process and an electroplating process and also comprises a resection process, a plastic-coating process and the other resection process which are combined to one step. The resection process, the plastic-coating process and the other resection process are completed on a vertical injection molding machine and is realized by a combined die, the three processes of side-connecting material resection, plastic-coated molding and center line connecting material resection of a material belt can be continuously completed on one vertical injection molding machine through the combined die installed on the vertical injection molding machine, and the required electronic components of the plastic-coated metal assembly is obtained through the resecting plastic-coating resection process. The equipment comprises a material belt molding machine, a die and electroplating equipment as well as a vertical injection molding machine and a combined die. The molding process and equipment have the advantages of simplified process, automation and integration level improvement, equipment reduction, operator reduction, efficiency improvement, cost reduction, stable and reliable quality and energy saving.
Description
Technical field
The present invention relates to moulding process and the equipment of electronic devices and components.Especially refer to that a kind of plastic metal assembly is to make moulding process and the equipment of electronic devices and components.
Background technology
The electronic devices and components such as manual rotation encoder, switch, the metal assemblies such as the terminal of its metal (or citing approvingly pin) and contact chip are general plastic in body, can make metal assembly and the body strong bonded such as terminal and contact chip, improve electric stability and the useful life of product.
In prior art, plastic metal assembly comprises that with the moulding process of making electronic devices and components material strip is shaped, electroplates processing, excises in material strip and interfere remaining coupling part in plastic binder, plastic moulding and excision material strip.
Above-mentioned material strip is shaped, and refers to become metal assembly one by one to arrange the metal tape coupled together the metal tape punching, and it had both comprised metal assembly one by one, also comprises the binder that metal assembly is one by one coupled together.Ordinary circumstance, binder comprises limit binder and center line binder, so-called limit binder refers to that along the length direction of material strip, inciting somebody to action the adjacent end portion of metal assembly one by one couples together, so-called center line binder refers to along the length direction of material strip, the centre position of adjacent metal assembly one by one be coupled together, metal assembly is one by one arranged connect into average totally be convenient to carry the material strip of being convenient to plastic moulding.
Above-mentioned plating processing refers to the material strip of moulding is carried out to electroplating processes.In above-mentioned excision material strip, interfere plastic binder to refer to excise the limit binder, because the limit binder forms interferences (obstacle) impact to next step plastic, must excise before plastic moulding.Plastic moulding refers to having excised the plastic moulding of metal assembly in the material strip of interfering plastic binder.Remaining coupling part in above-mentioned excision material strip, finger is after plastic moulding, the center line binder of material strip also couples together plastic good metal assembly one by one, must excision these center line binder (remaining coupling part), just can obtain electronic devices and components finished product one by one.
It must be noted that, in prior art, in the excision material strip, interfering in plastic binder, plastic moulding and excision material strip this three-procedure of remaining coupling part to take the whole piece material strip carries out as unit, first on a punch press, interfere plastic binder in excision whole piece material strip, again this material strip is placed on vertical injection molding machine and carries out plastic moulding, be placed in the remaining coupling part of excision on another punch press afterwards, then this material strip.Visible, in can not on the same material strip, implementing in succession to excise material strip to each metal assembly, interfere this three-procedure of remaining coupling part in plastic binder, plastic moulding and excision material strip.
In sum, the moulding process operation of the plastic metal assembly of prior art is many, through the material strip of electroplating processing, need to forward to again on vertical injection molding machine from after a punch press processing, forward to again afterwards on another punch press, operation is discontinuous, the equipment needed is many, and time and effort consuming is taken a lot of work, and working (machining) efficiency is low, processing cost is high, consumes energy high; Simultaneously, in processing, operation is difficult to control, and causes the deformation of products processed, difficult quality guarantee; In addition, because operation is discontinuous, potential safety hazard is also many.
Summary of the invention
The deficiency that the equipment that the operation of moulding process that the present invention is intended to overcome the plastic metal assembly of prior art is many, operation is discontinuous, need is many, time and effort consuming is taken a lot of work, working (machining) efficiency is low, processing cost is high, the power consumption is high, operation is difficult to control, cause the deformation of products processed, difficult quality guarantee in processing, release moulding process and the equipment of a kind of plastic metal assembly of novelty with the making electronic devices and components.
For this reason, the plastic metal assembly of the present invention is as follows with the technical scheme of the moulding process of making electronic devices and components and equipment.
The plastic metal assembly of the present invention, to make the moulding process of electronic devices and components, comprising:
Material strip shaping flow process, be about to the metal tape punching and become material strip that metal assembly is one by one arranged, that coupled together by limit binder and center line binder; Described limit binder is the metal edge strip coupled together along the adjacent end portion of material strip length direction general described metal assembly one by one, and described center line binder is the bonding jumper coupled together along the adjacent center position of material strip length direction general described metal assembly one by one;
Electroplate work flow, the described material strip soon be shaped carries out electroplating processes;
Also comprise, be combined into the plastic excision flow process of excision of a step, the plastic excision flow process of described excision completes on a vertical injection molding machine, by assembling die, realize, by the described material strip after electroplating by the assembling die of installing on a described vertical injection molding machine, the three-procedure that makes to excise the excision limit binder of interfering plastic described limit binder, plastic moulding and excision center line binder completes continuously on a described vertical injection molding machine, through the plastic excision flow process of described excision, obtain the electronic devices and components of needed plastic metal assembly.
Described assembling die comprises excision limit binder mould, the plastic mould of the described limit binder that the excision interference is plastic and excises the excision center line binder mould of described center line binder, described excision limit binder mould, described plastic mould and described excision center line binder mould removably are installed on described assembling die successively, that is: the upper module of described excision limit binder mould, the upper module of the upper module of described plastic mould and described excision center line binder mould removably is installed on the upper module of described assembling die successively, the lower module of described excision limit binder mould, the lower module of the lower module of described plastic mould and described excision center line binder mould removably is installed on the lower module of described assembling die successively, described assembling die removably is installed on a described vertical injection molding machine, and the walking program of the operation power of described assembling die, working procedure and control and described material strip and control are provided by a described vertical injection molding machine.
The plastic metal assembly of the present invention, to make the equipment of electronic devices and components, comprising: material strip forming machine and mould, electroplating device; Also comprise a vertical injection molding machine and assembling die, described assembling die removably is installed on a described vertical injection molding machine.
The plastic metal assembly of the present invention is to make moulding process and the equipment of electronic devices and components, compared with the existing technology, its successful: one, technological process become letter, use equipment reduces, interfere the excision limit binder flow process of plastic limit binder, plastic moulding flow process and excision center line binder flow process to merge into the plastic excision flow process of described excision of the present invention the excision of prior art, flow process of the plastic excision flow process of described excision has substituted three flow processs of prior art, and the equipment of use also is reduced to a vertical injection molding machine.They are two years old, automation and the integrated horizontal of technique improve greatly, the excision of prior art is interfered the excision limit binder flow process of plastic limit binder, plastic moulding flow process and excision center line binder flow process to take respectively material strip one by one to carry out as unit, and one of them flow process of whole piece material strip is over just can transfer on another equipment and completes next step flow process; And the present invention excises the excision limit binder flow process of interfering plastic limit binder, plastic moulding flow process and excision center line binder flow process in succession on the same material strip, in prior art (two are filled bed, a vertical injection molding machine) minute three work that flow process completes on three machines that linked up on a vertical injection molding machine, technique of the present invention if material strip enter a described vertical injection molding machine, out be exactly the electronic devices and components of needed plastic metal assembly.Its three, operating efficiency improves, the corresponding minimizing of operating personnel, can reduce by two operating personnel, processing cost reduces.Its four, because automation and the integrated horizontal of technique improves greatly, the electric property of the product of producing improves, the distortion in processing etc. is avoided.Its five, energy-conservation, on a vertical injection molding machine, complete simultaneously the start of three operations, energy-conservation is natural.
The accompanying drawing explanation
Fig. 1 is the material strip schematic diagram.
Fig. 2 is the walking schematic diagram of material strip of the present invention in assembling die.
Fig. 3 is the schematic diagram that upper module in assembling die of the present invention and lower module close up.
Fig. 4 is that in assembling die of the present invention, the upper module turn-over makes its working face upward, the schematic diagram after decomposition and assembling.
Fig. 5 be the lower module in assembling die of the present invention decompose and assembling after schematic diagram.
Fig. 6 is excision limit binder mould decomposing schematic representation (wherein, excision limit binder upper mould piece turn-over, make its working face upward).
Fig. 7 is plastic mould decomposing schematic representation (wherein, excision limit binder upper mould piece turn-over, makes its working face upward).
Fig. 8 is excision center line binder mould decomposing schematic representation (wherein, excision limit binder upper mould piece turn-over, make its working face upward).
In figure: 1, material strip; 11, metal assembly; 12, limit binder; 13, center line binder; 2, assembling die; 21, assembling die upper module; 211, excision limit binder upper mould piece installation pit; 212, plastic packaging mold upper module installation pit; 213, excision center line binder upper mould piece installation pit; 214, lead; 22, assembling die lower module; 221, excision limit binder lower mould piece installation pit; 222, plastic packaging mold lower module installation pit; 223, excision center line binder lower mould piece installation pit; 224, pilot hole; 3, excision limit binder mould; 31, the upper module of excision limit binder mould; 32, the lower module of excision limit binder mould; 4, plastic packaging mold; 41, plastic packaging mold upper module; 42, plastic packaging mold lower module; 5, excision center line binder mould; 51, the upper module of excision center line binder mould; 52, the lower module of excision center line binder mould.
Embodiment
Below, introduce by reference to the accompanying drawings the specific embodiment of the present invention.
The plastic metal assembly of the present invention, to make the moulding process of electronic devices and components, comprising:
Material strip shaping flow process, be about to the metal tape punching and become the material strip 1 that metal assembly 11 one by one is that arrange, coupled together by limit binder 12 and center line binder 13; Described limit binder 12 is the metal edge strip coupled together along the adjacent end portion of material strip 1 length direction general described metal assembly 11 one by one, and described center line binder 13 is the bonding jumper coupled together along the adjacent center position of material strip 1 length direction general described metal assembly 11 one by one;
Electroplate work flow, the described material strip 1 soon be shaped carries out electroplating processes;
Also comprise, be combined into the plastic excision flow process of excision of a step, the plastic excision flow process of described excision completes on a vertical injection molding machine, by assembling die 2, realize, by the described material strip 1 after electroplating by the described assembling die 2 of installing on a described vertical injection molding machine, the three-procedure that makes to excise the excision limit binder of interfering plastic described limit binder 12, plastic moulding and excision center line binder 13 completes continuously on a described vertical injection molding machine, through the plastic excision flow process of described excision, obtain the electronic devices and components of needed plastic metal assembly 11.
Described assembling die 2 comprises excision limit binder mould 3, the plastic mould 4 of the described limit binder 12 that the excision interference is plastic and excises the excision center line binder mould 5 of described center line binder 13; Described excision limit binder mould 3, described plastic mould 4 and described excision center line binder mould 5 removably are installed on described assembling die 3 successively, that is: excision limit binder upper mould piece 31, plastic mould upper module 41 and excision center line binder upper mould piece 51 removably are installed on assembling die upper module 21 successively, and excision limit binder lower mould piece 32, plastic mould lower module 42 and excision center line binder lower mould piece 52 removably are installed on assembling die lower module 22 successively; Described assembling die 2 removably is installed on a described vertical injection molding machine, and the walking program of the operation power of described assembling die 2, working procedure and control and described material strip 1 and control are provided by a described vertical injection molding machine.
The plastic metal assembly of the present invention, to make the equipment of electronic devices and components, comprising: material strip forming machine and mould, electroplating device; Also comprise a vertical injection molding machine and assembling die, described assembling die removably is installed on a described vertical injection molding machine.
Described assembling die 2 comprises excision limit binder mould 3, the plastic mould 4 of the described limit binder 12 that the excision interference is plastic and excises the excision center line binder mould 5 of described center line binder 13; Described excision limit binder mould 3, described plastic mould 4 and described excision center line binder mould 5 removably are installed on described assembling die 3 successively, that is: excision limit binder upper mould piece 31, plastic mould upper module 41 and excision center line binder upper mould piece 51 removably are installed on described assembling die upper module 21 successively, and excision limit binder lower mould piece 32, plastic mould lower module 42 and excision center line binder lower mould piece 52 removably are installed on assembling die lower module 22 successively;
The walking program of the operation power of described assembling die 2, working procedure and control and described material strip 1 and control are provided by a described vertical injection molding machine.
On described assembling die upper module 21, have excision limit binder upper mould piece installation pit 211, plastic packaging mold upper module installation pit 212 and excision center line binder upper mould piece installation pit 213, excision limit binder upper mould piece 31, plastic packaging mold upper module 41, excision center line binder upper mould piece 51 removably are installed on respectively excision limit binder upper mould piece installation pit 211, plastic packaging mold upper module installation pit 212, excision center line binder upper mould piece installation pit 213; On described assembling die lower module 22, have excision limit binder lower mould piece installation pit 221, plastic packaging mold lower module installation pit 222 and excision center line binder lower mould piece installation pit 223, excision limit binder lower mould piece 32, plastic packaging mold lower module 42, excision center line binder lower mould piece 42 removably are installed on respectively excision limit binder lower mould piece installation pit 221, plastic packaging mold lower module installation pit 222, excision center line binder lower mould piece installation pit 223.
Described assembling die upper module 21 is shaped with lead 214, corresponding with quantity and the position of lead 214, at described assembling die lower module 22, be shaped with pilot hole 224, lead 214 is arranged in pilot hole 224, and the start up and down of described assembling die upper module 21 is played to guiding and control action.
Material strip 1 through material strip moulding flow process, plating work flow, after sending into a described vertical injection molding machine, under the control of the control device of described vertical injection molding machine, material strip 1 moves forward a step, assembling die 2 starts once, the excision limit binder mould 3 in assembling die 2, plastic packaging mold 4,5 starts simultaneously of excision center line binder mould; Material strip 1 moves forward a step again, and start is once again for assembling die 2.Material strip 1 often moves forward a step, processes with regard to the electronic devices and components that a plastic metal assembly is arranged
Claims (1)
1. plastic metal assembly, to make the moulding process of electronic devices and components, comprising:
Material strip shaping flow process, be about to the metal tape punching and become material strip (1) that metal assembly (11) is one by one arranged, that coupled together by limit binder (12) and center line binder (13); Described limit binder (12) is the metal edge strip coupled together along the adjacent end portion of material strip (1) length direction general described metal assembly (11) one by one, and described center line binder (13) is the bonding jumper coupled together along the adjacent center position of material strip (1) length direction general described metal assembly (11) one by one;
Electroplate work flow, the described material strip (1) soon be shaped carries out electroplating processes;
It is characterized in that: also comprise, be combined into the plastic excision flow process of excision of a step, the plastic excision flow process of described excision completes on a vertical injection molding machine, by assembling die (2), realize, by the described material strip (1) after electroplating by the described assembling die (2) of installing on a described vertical injection molding machine, make to excise the excision limit binder of interfering plastic described limit binder (12), the three-procedure of plastic moulding and excision center line binder completes continuously on a described vertical injection molding machine, through the plastic excision flow process of described excision, obtain the electronic devices and components of needed plastic metal assembly (11).
2. plastic metal assembly according to claim 1, to make the moulding process of electronic devices and components, is characterized in that: described assembling die (2) comprises excision limit binder mould (3), the plastic mould (4) of the described limit binder (12) that the excision interference is plastic and excises the excision center line binder mould (5) of described center line binder (13); Described excision limit binder mould (3), described plastic mould (4) and described excision center line binder mould (5) are installed on described assembling die (3) successively, that is: excision limit binder upper mould piece (31), plastic mould upper module (41) and excision center line binder upper mould piece (51) are installed on assembling die upper module (21) successively, and excision limit binder lower mould piece (32), plastic mould lower module (42) and excision center line binder lower mould piece (52) are installed on assembling die lower module (22) successively; The walking program of operation power, working procedure and the control of described assembling die (2) and described material strip (1) and control are provided by a described vertical injection molding machine.
3. plastic metal assembly, to make the equipment of electronic devices and components, comprising: material strip forming machine and mould, electroplating device; Also comprise a vertical injection molding machine and assembling die (2), described assembling die (2) is installed on a described vertical injection molding machine; It is characterized in that: described assembling die (2) comprises excision limit binder mould (3), the plastic mould (4) of the described limit binder (12) that the excision interference is plastic and excises the excision center line binder mould (5) of described center line binder (13); Described excision limit binder mould (3), described plastic mould (4) and described excision center line binder mould (5) are installed on described assembling die (3) successively, that is: excision limit binder upper mould piece (31), plastic mould upper module (41) and excision center line binder upper mould piece (51) are installed on assembling die upper module (21) successively, and excision limit binder lower mould piece (32), plastic mould lower module (42) and excision center line binder lower mould piece (52) are installed on assembling die lower module (22) successively.
4. plastic metal assembly according to claim 3 is to make the equipment of electronic devices and components, it is characterized in that: on described assembling die upper module (21), have excision limit binder upper mould piece installation pit (211), plastic packaging mold upper module installation pit (212) and excision center line binder upper mould piece installation pit (213), excision limit binder upper mould piece (31), plastic packaging mold upper module (41), excision center line binder upper mould piece (51) is installed on respectively excision limit binder upper mould piece installation pit (211), plastic packaging mold upper module installation pit (212), excision center line binder upper mould piece installation pit (213), on described assembling die lower module (22), have excision limit binder lower mould piece installation pit (221), plastic packaging mold lower module installation pit (222) and excision center line binder lower mould piece installation pit (223), excision limit binder lower mould piece (32), plastic packaging mold lower module (42), excision center line binder lower mould piece (42) are installed on respectively excision limit binder lower mould piece installation pit (221), plastic packaging mold lower module installation pit (222), excision center line binder lower mould piece installation pit (223).
5. plastic metal assembly according to claim 3 is to make the equipment of electronic devices and components, it is characterized in that: described assembling die upper module (21) is shaped with lead (214), corresponding with quantity and the position of lead (214), at described assembling die lower module (22), be shaped with pilot hole (224), lead (214) is arranged in pilot hole (224), and the start up and down of described assembling die upper module (21) is played to guiding and control action.
6. plastic metal assembly according to claim 3 is to make the equipment of electronic devices and components, and it is characterized in that: described excision limit binder mould (3), described plastic mould (4) and described excision center line binder mould (5) removably are installed on described assembling die (3) successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103065810A CN102013616B (en) | 2009-09-04 | 2009-09-04 | Molding process and equipment for manufacturing electronic components by using plastic-coated metal assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103065810A CN102013616B (en) | 2009-09-04 | 2009-09-04 | Molding process and equipment for manufacturing electronic components by using plastic-coated metal assembly |
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| Publication Number | Publication Date |
|---|---|
| CN102013616A CN102013616A (en) | 2011-04-13 |
| CN102013616B true CN102013616B (en) | 2013-11-27 |
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| CN2009103065810A Expired - Fee Related CN102013616B (en) | 2009-09-04 | 2009-09-04 | Molding process and equipment for manufacturing electronic components by using plastic-coated metal assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107413975B (en) * | 2016-05-12 | 2018-09-04 | 宁波恒进自动化技术有限公司 | A kind of self-action charge bar blanking equipment with electroplating processes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6575723B2 (en) * | 2000-04-07 | 2003-06-10 | Charles Ondrejka | Mold base system |
| US6782940B2 (en) * | 2000-06-07 | 2004-08-31 | Romain L. Billiet | Method for rapid reproduction of molds and mold components |
| US6896505B2 (en) * | 2002-06-27 | 2005-05-24 | Modular Molding International, Inc. | System for removably mounting modules in an injection molding press |
| CN1324724C (en) * | 2004-05-12 | 2007-07-04 | 成都宏明双新精密模具零件有限责任公司 | Manufacturing method of plastic-encapsulated precision parts and manufacturing die |
| US20080248151A1 (en) * | 2007-04-05 | 2008-10-09 | Chih-Yu Chen | Cavity insert positioning mechanism of an injection mold |
| CN101450519B (en) * | 2007-12-07 | 2013-06-19 | 合兴集团有限公司 | Production method of metal insert plastic product in vehicle sensor |
| CN101468510B (en) * | 2007-12-26 | 2012-10-10 | 上海徕木电子股份有限公司 | Small terminal and material belt integral built-in injection mold |
| CN201140502Y (en) * | 2007-12-26 | 2008-10-29 | 合兴集团有限公司 | Composite mold for producing metal insert plastic products in vehicle sensor |
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