CN102012399B - Device for improving response stability of surface acoustic wave gas sensor - Google Patents
Device for improving response stability of surface acoustic wave gas sensor Download PDFInfo
- Publication number
- CN102012399B CN102012399B CN2010102932750A CN201010293275A CN102012399B CN 102012399 B CN102012399 B CN 102012399B CN 2010102932750 A CN2010102932750 A CN 2010102932750A CN 201010293275 A CN201010293275 A CN 201010293275A CN 102012399 B CN102012399 B CN 102012399B
- Authority
- CN
- China
- Prior art keywords
- electrode
- gas sensors
- wave gas
- surface wave
- sonic surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a device for improving the response stability of a surface acoustic wave gas sensor, wherein a metal cover is placed on a base plate of the surface acoustic wave gas sensor to form an gas chamber, the width of the metal cover is smaller than that of the base plate, and the hollow part of the metal cover is wider than an electrode, and the electrode and a sensitive film are ensured to be arranged in the hollow part of the metal gas chamber, therefore, the base plate can play the role of isolation when external gas is pumped in, and only can the sensitive film on the base plate adsorb gas, and adhesive on the back of the base plate can not contact with gas, thereby preventing the adhesive absorbing gas from generating stress owing to the swelling effect, and further solving the unstable response of the surface acoustic wave gas sensor caused by the stress. In addition, the metal gas chamber further has an electromagnetic shielding function, which can avoid the mutual interference among a plurality of the surface acoustic wave gas sensors. The scheme of the invention realizes the minimization of the gas chamber, and is beneficial to the shortening of the response time of the sensor.
Description
Technical field
The present invention relates to the sonic surface wave gas sensors technical field, relate in particular to a kind of device that improves the sonic surface wave gas sensors response stability.
Background technology
The response of existing sonic surface wave gas sensors in the atmosphere to be measured of constant density is normally unsettled; This is because when fixing sonic surface wave gas sensors, adopted bonding agent (the SAW sensor is directly sticked on the circuit board, or peg graft after the SAW sensor being pasted on the pedestal such as TO-39 again or be welded on the circuit board).Because bonding agent is organism such as epoxy, silicon rubber, meeting adsorbed gas, the swelling effect that absorption causes can produce very big stress on the substrate of sensor.As everyone knows, the SAW gas sensor is the same with the SAW sensor of other types, and counter stress also is very sensitive, thereby makes the response of SAW gas sensor can't be stabilized in a constant level.
Summary of the invention
Problem to be solved by this invention is: how a kind of device that improves the sonic surface wave gas sensors response stability is provided, and this device has overcome existing SAW gas sensor because the unstable problem of the response that bonding agent adsorbed gas is caused.
Technical matters proposed by the invention is to solve like this: a kind of device that improves the sonic surface wave gas sensors response stability is provided; Comprise a circuit board and directly stick on the one or more sonic surface wave gas sensors on the circuit board; Said sonic surface wave gas sensors comprises substrate, electrode and sensitive thin film, it is characterized in that:
Hollow metal cover and an Airtight gasket of also comprising a strip; Thereby the Airtight gasket of said metal cap through the centre is held in and forms an airtight metal air chamber on the substrate, and metal air chamber has that an air intake opening communicates with ambient atmosphere and an exhausr port communicates with micro air pump; The width of said metal cap is than the narrow width of substrate; And the width of metal cap hollow space is bigger than the width of electrode; Make electrode and sensitive thin film be positioned at the hollow space of metal air chamber, and the pad of electrode is not covered and be exposed to outer so that carry out wire bonds by metal cap.
Device according to raising sonic surface wave gas sensors response stability provided by the present invention; It is characterized in that; The electrode of said sonic surface wave gas sensors has various structure; Sensor electrode for delay line type is made up of a pair of interdigital electrode, comprises a pair of or an interdigital electrode and a pair of reflecting grating for the resonator-type sensor electrode, comprises a pair of interdigital electrode, a pair of reflecting grating and one for the sensor electrode of surface transverse wave type and converges grid.
Device according to raising sonic surface wave gas sensors response stability provided by the present invention; It is characterized in that said sonic surface wave gas sensors comprises and is produced on the sonic surface wave gas sensors on the single crystal piezoelectric substrate or is produced on the piezoelectric membrane type sonic surface wave gas sensors on the non-single crystal piezoelectric substrate.
Outstanding feature of the present invention is the air chamber that has adopted an elongated strip shaped; The width of this air chamber substrate more used than sonic surface wave gas sensors is also narrow; Therefore can not whole sonic surface wave gas sensors be put into air chamber, and only can the sensitive thin film that be positioned at the substrate center position be put into air chamber.When in air chamber, pumping into ambient atmosphere like this; Substrate has played buffer action; Make the sensitive thin film above the substrate be exposed under the ambient atmosphere; And the bonding agent below the substrate does not reach gas, thereby has avoided because the unstable problem of the sonic surface wave gas sensors that stress caused response of the air-breathing generation of bonding agent.
In addition, the volume of air chamber of the present invention has almost reached and has minimized, and has significantly reduced the concentration balance time of ambient atmos in air chamber, helps shortening sensor's response time and desorption time.
Moreover air chamber adopts metal to make, and also has the function of electromagnetic screen, can prevent the electromagnetic interference (EMI) between a plurality of sonic surface wave gas sensors.
Need to prove,, need the customization SAW device for realizing the present invention.Existing sonic surface wave gas sensors adopts commercial SAW filter more, plates sensitive membrane after the TO-39 encapsulation is uncapped and forms.Obviously, this band packaged device no longer is applicable to this patent, and needs the customization device.When the electrode layout design, need widen pad and distance between electrodes, so that lay metal cap.
Description of drawings
Fig. 1 is a strip metal cap of the present invention;
Fig. 2 is the scheme of installation of metal cap;
Wherein, 1 is metal cap, and 2 is Airtight gasket, and 3 is air intake opening, and 4 is exhausr port, and 5 is groove, and 6 is sensitive thin film, and 7 is substrate, and 8 is reflecting grating, and 9 is interdigital electrode, and 10 is pad, and 11 is circuit board, and 12 is bonding agent
Embodiment
Below in conjunction with attaching Fig. 1 and 2 and embodiment further describes the present invention:
This improves the device of sonic surface wave gas sensors response stability; Hollow metal cover and an Airtight gasket of comprising a strip; Thereby the Airtight gasket of said metal cap through the centre is held in and forms an airtight metal air chamber on the substrate, and metal air chamber has that an air intake opening communicates with ambient atmosphere and an exhausr port communicates with micro air pump; The width of said metal cap is than the narrow width of substrate; And the width of metal cap hollow space is bigger than the width of electrode; Make electrode and sensitive thin film be positioned at the hollow space of metal air chamber, and the pad of electrode is not covered and be exposed to outer so that carry out wire bonds by metal cap.
Below be a concrete preparation method of the present invention:
At first the used SAW device of sonic surface wave gas sensors is processed in customization; Substrate 7 adopts ST quartzy, and length W is 12mm, and width L2 is 10mm; Electrode (comprising interdigital electrode 9 and reflecting grating 8) adopts both-end mode of resonance structure; The width L1 of electrode is 1mm, specially adds large bonding pad 10 and distance between electrodes, makes that pad is 3.5mm apart from center lines of electrodes.The spraying sensitive polymer film 6 at the electrode centers position.
Then, according to the size of this special SAW gas sensor, process strip metal cap 1 as shown in Figure 1.The width L of metal cap is 5mm; Length overall is 40mm, is provided with two concave stations of laying the SAW sensor, two concave station interval 4mm; And on whole length direction, laid a rectangle groove 5; Groove is positioned at the center of metal cap, is of a size of 3 * 3mm, and opening respectively is connected to a stainless-steel tube as air intake opening 3 and exhausr port 4 in the front and back of groove.
Be the installation of metal cap at last.According to the size of metal cap, two SAW gas sensors are fixed on the circuit board 11 with epoxy resin (bonding agent 12), behind rubber ring (Airtight gasket 2) on the position pad shown in the dotted line of substrate upper edge, metal cap is pressed on the rubber ring.The screw hole (not shown) is arranged in the metal cap, be fixed on the circuit board with screw.
Claims (3)
1. device that improves the sonic surface wave gas sensors response stability; Comprise a circuit board and directly stick on the one or more sonic surface wave gas sensors on the circuit board; Said sonic surface wave gas sensors comprises substrate, electrode and sensitive thin film, it is characterized in that:
Hollow metal cover and an Airtight gasket of also comprising a strip; Thereby the Airtight gasket of said metal cap through the centre is held in and forms an airtight metal air chamber on the substrate, and metal air chamber has that an air intake opening communicates with ambient atmosphere and an exhausr port communicates with micro air pump; The width of said metal cap is than the narrow width of substrate; And the width of metal cap hollow space is bigger than the width of electrode; Make electrode and sensitive thin film be positioned at the hollow space of metal air chamber, and the pad of electrode is not covered and be exposed to outer so that carry out wire bonds by metal cap.
2. a kind of device that improves the sonic surface wave gas sensors response stability according to claim 1; It is characterized in that; The electrode of said sonic surface wave gas sensors has various structure; Sensor electrode for delay line type is made up of a pair of interdigital electrode, comprises a pair of or an interdigital electrode and a pair of reflecting grating for the resonator-type sensor electrode, comprises a pair of interdigital electrode, a pair of reflecting grating and one for the sensor electrode of surface transverse wave type and converges grid.
3. a kind of device that improves the sonic surface wave gas sensors response stability according to claim 1; It is characterized in that said sonic surface wave gas sensors comprises and is produced on the sonic surface wave gas sensors on the single crystal piezoelectric substrate or is produced on the piezoelectric membrane type sonic surface wave gas sensors on the non-single crystal piezoelectric substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102932750A CN102012399B (en) | 2010-09-27 | 2010-09-27 | Device for improving response stability of surface acoustic wave gas sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102932750A CN102012399B (en) | 2010-09-27 | 2010-09-27 | Device for improving response stability of surface acoustic wave gas sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102012399A CN102012399A (en) | 2011-04-13 |
CN102012399B true CN102012399B (en) | 2012-08-08 |
Family
ID=43842639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102932750A Active CN102012399B (en) | 2010-09-27 | 2010-09-27 | Device for improving response stability of surface acoustic wave gas sensor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102012399B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102496768B (en) * | 2011-12-26 | 2014-12-31 | 中国电子科技集团公司第二十六研究所 | Micro-strip delay line based on defected ground structure |
CN102662033A (en) * | 2012-05-21 | 2012-09-12 | 电子科技大学 | Structure of test cavity |
CN103336053B (en) * | 2013-06-18 | 2015-11-04 | 电子科技大学 | A kind of surface acoustic wave gas sensors array of private reference |
CN103512950B (en) * | 2013-10-25 | 2015-12-30 | 中国电子科技集团公司第三十八研究所 | A kind of surface acoustic wave formaldehyde gas sensor utilizing water to absorb formaldehyde |
EP3186627B1 (en) * | 2014-08-27 | 2020-05-27 | 3M Innovative Properties Company | Magneto-mechanical resonator sensor with absorption material |
CN104330470B (en) * | 2014-09-30 | 2018-04-10 | 成都柏森松传感技术有限公司 | Detection means based on SAW sensor |
CN114778698B (en) * | 2022-06-17 | 2022-10-14 | 电子科技大学 | Material elastic modulus measuring method based on composite piezoelectric film bulk acoustic resonance |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101493437A (en) * | 2009-01-21 | 2009-07-29 | 电子科技大学 | Surface acoustic wave gas sensors array with electromagnetic shielding function |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6085576A (en) * | 1998-03-20 | 2000-07-11 | Cyrano Sciences, Inc. | Handheld sensing apparatus |
DE19837515B4 (en) * | 1998-08-19 | 2008-04-17 | Robert Bosch Gmbh | Electrochemical sensor |
-
2010
- 2010-09-27 CN CN2010102932750A patent/CN102012399B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101493437A (en) * | 2009-01-21 | 2009-07-29 | 电子科技大学 | Surface acoustic wave gas sensors array with electromagnetic shielding function |
Also Published As
Publication number | Publication date |
---|---|
CN102012399A (en) | 2011-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102012399B (en) | Device for improving response stability of surface acoustic wave gas sensor | |
CN206542568U (en) | Loudspeaker enclosure | |
CN208572318U (en) | Loudspeaker enclosure | |
CN2812465Y (en) | Microphone package structure for micro-electromechanical system | |
CN205176445U (en) | Liquid crystal display device | |
CN208285529U (en) | Sounding device and electronic equipment | |
WO2019047749A1 (en) | Electroacoustic device, manufacturing method therefor, and mobile terminal | |
WO2020024678A1 (en) | Loudspeaker module | |
WO2022257739A1 (en) | Sound production device and electronic apparatus | |
CN205647459U (en) | Surface acoustic wave filter chips's packaging structure | |
EP2355341A3 (en) | Piezoelectric vibrator and oscillator using the same | |
TW200641493A (en) | Mounting structure and mounting method of a semiconductor device, and liquid crystal display device | |
CN209283511U (en) | A kind of MEMS microphone that signal-to-noise ratio is high | |
CN201403200Y (en) | Silicon capacitance microphone | |
CN104244154A (en) | Open Cavity Substrate in a MEMS Microphone Assembly and Method of Manufacturing the Same | |
CN209748756U (en) | Microphone structure of electronic equipment and electronic equipment | |
CN107543864A (en) | Spacecraft leaks positioning acoustic matrix sensor | |
CN207250473U (en) | A kind of absorption type wafer carrier | |
CN202886665U (en) | Chip and optical fiber array packaging structure | |
KR100590043B1 (en) | A plasma display panel | |
CN205219994U (en) | FPC holding device | |
CN208657076U (en) | A kind of water-proof loudspeaker | |
CN201699672U (en) | Tuning fork quartz crystal resonator | |
CN205810912U (en) | A kind of battery absorbing elements and mobile terminal | |
CN208275714U (en) | A kind of ultrasonic sensor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |