CN102006199B - Time division multiplexing (TDM) switching module testing device, method and system - Google Patents
Time division multiplexing (TDM) switching module testing device, method and system Download PDFInfo
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Abstract
The invention discloses a time division multiplexing (TDM) switching module testing method which comprises the following steps: (A1) constructing a configuration acquiring command of a TDM switching module; (B1) sending the configuration acquiring command to the tested TDM switching module, and receiving the configuration information returned by the tested TDM switching module; and (C1) testing the tested TDM switching module according to the configured test command and the acquired configuration information. When the scale of the switching network is changed, the invention can realize self-adaption and has no need of additionally providing an interface module and a business processing module for testing, thus the testing environment does not need to be changed greatly, and the labor and material resources for constructing the testing environment are saved.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of testing apparatus and the method for large capacity I DM in the communications field (Time DivisionMultiplex, time division multiplexing) switching network.
Background technology
The TDM switching technology is the key technology of traditional fixed line and second generation mobile communication equipment.At present 3G (3G (Third Generation) Moblie) equipment that rises gradually need keep the compatibility of apparatus with 2G (second generation mobile communication), so also there is the TDM switching technology in the 3G equipment.TDM function of exchange in the equipment is to be finished by the exchange chip of special use, and the exchange capacity of single exchange chip is less, is generally 16K or 32K, can't finish jumbo exchange.
Large capacity I DM exchange generally is to be finished by the power board of special use.The TDM power board also is the TDM Switching Module, mainly is made up of CPU (Central Processing Unit CPU), switching matrix and some other essential resource.Switching matrix is made up of several time gas exchange chips, divides three grades: input stage (first order), intergrade (second level) and output stage (third level), and the number of chips of each grade is identical, and the chip between the adjacent two-stage links to each other in twos.Any one input can correspond to any one output, is the time gas exchange net of clog-free, a full exchange.According to the difference of chip used exchange capacity, the difference of number of chips, the overall exchange capacity of this switching matrix will change.The TDM power board be time slot in the communication system (time slot: a time-multiplexed timeslice) Jiao Huan center, only finish function of exchange, do not manage business.Service Processing Module in the system (also claiming service processing board) needs to be connected to switching center by TDM exchange interface module (also claiming the Fabric Interface plate).The corresponding a plurality of interface modules of Switching Module, exchange capacity is more big, and then required interface module, Service Processing Module are just more many.Under laboratory environment, need carry out idle time slot test to switching network.Existing method of testing is to finish test to the TDM Switching Module by Service Processing Module and interface module.When the switching network scale enlarges, exchange capacity strengthens, and in order to test this switching network, needs extra a lot of Service Processing Modules, interface module and other resource that is used for test that increase, obtain but also can not guarantee that each time slot can both be tested (input time slot, output time solt).In addition, if exchange capacity changes, according to existing method of testing, then need to build again test environment, become big such as: exchange capacity, then need to prepare more Service Processing Module, interface module and other resource accordingly, increase material and human cost, waste time and energy, the test effect also might not be obvious.This shows that a kind of simple, time saving and energy saving method of testing is badly in need of in this area.
Application number is to disclose a kind of switching network method of testing and test initiation module in CN200810084801.5, the Chinese patent application of denomination of invention for " switching network method of testing and system and test initiation module ", mainly comprises a test initiation module and at least one switching network.Its main feature is: in three grades of switching networks, when the intergrade crosspoint receives test packet successively from the test initiation module, test packet is sent to the output stage crosspoint that self links to each other respectively, and when respectively when the input stage crosspoint that self connected receives test packet, send to handle to the test initiation module.Clearly, switching network test macro and method that this patent application is announced only are applicable to the packet switching network, are not suitable for the TDM Switching Module.Though the logical construction of these two switching networks can be identical, concrete realization is different: at first, and the exchange chip difference of the two employing; Secondly, the content of the two exchange is also different.In addition, need the test packet of complex structure in the method that this patent is announced, operability is relatively poor.
Summary of the invention
The main technical problem to be solved in the present invention is, a kind of TDM Switching Module testing apparatus, method and system are provided, and scale that can the self adaptation switching network changes.
For solving the problems of the technologies described above, the invention provides a kind of TDM Switching Module method of testing, comprising:
Order is obtained in the configuration of A1, structure TDM Switching Module;
B1, send described configuration to tested TDM Switching Module and obtain order, and receive the configuration information that is returned by tested TDM Switching Module;
C1, according to the test command that disposes and the configuration information that gets access to tested TDM Switching Module is tested.
Wherein, the described configuration information that is returned by tested TDM Switching Module comprises exchange capacity and the idle time slot of the number of exchange chip in the tested TDM Switching Module, single exchange chip; After step B1 and before the step C1, also comprise according to described configuration information and calculate the exchange capacity of described tested TDM Switching Module, determine the step of the time slot upper limit of tested TDM Switching Module according to described exchange capacity; According to the test command that disposes and the time slot upper limit tested TDM Switching Module is tested among the described step C1.
The present invention also provides a kind of TDM Switching Module testing apparatus simultaneously, comprising:
The interface processing module is used for being connected with the corresponding interface of TDM Switching Module;
The control processing module is connected with the interface processing module, and described control processing module comprises:
The Operation and Maintenance submodule, order is obtained in the configuration that is used for structure TDM Switching Module;
The configuration reading submodule is used for that order is obtained in described configuration and sends to tested TDM Switching Module, and receives the configuration information that is returned by tested TDM Switching Module;
Detection sub-module is used for according to the test command that disposes and the configuration information that gets access to tested TDM Switching Module being tested.
The present invention also provides a kind of TDM Switching Module test macro simultaneously, comprises at least one TDM Switching Module and above-mentioned TDM Switching Module testing apparatus, and described TDM Switching Module testing apparatus links to each other with described TDM Switching Module.
Testing apparatus according to the present invention is when the scale of switching network changes, can accomplish self adaptation, do not need to increase interface module and Service Processing Module for test, thereby do not need test environment is done big change yet, saved the human and material resources of building test environment.
Testing apparatus according to the present invention is by carrying out information interaction with the TDM Switching Module, obtain the configuration information of TDM Switching Module, calculate the exchange capacity of TDM Switching Module, different exchange capacities, its timeslot number difference is according to the exchange capacity of this tested TDM Switching Module, can determine and this tested TDM Switching Module time slot corresponding upper limit, when idle time slot poll is detected, by the restriction of the time slot upper limit, can guarantee that all idle time slots are to all being detected.
Description of drawings
Fig. 1 is the application scenarios schematic diagram of TDM Switching Module;
Fig. 2 is 64K TDM switching network logical construction schematic diagram;
Fig. 3 is the hardware structure diagram of a kind of embodiment of testing apparatus of the present invention;
Fig. 4 is the function logic frame chart of a kind of embodiment of testing apparatus of the present invention;
Fig. 5 is the process chart of a kind of embodiment of testing apparatus of the present invention;
Fig. 6 is the connection diagram according to testing apparatus of the present invention and TDM Switching Module.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail below by embodiment.
TDM Switching Module checkout gear according to the present invention carries out communication by interface and the TDM Switching Module of TDM Switching Module, at first obtain the configuration information of TDM Switching Module, checkout gear can be tested tested TDM Switching Module according to the configuration information that gets access to, thereby realize the condition of checkout gear self adaptation TDM Switching Module.
Please refer to Fig. 1, Fig. 1 is the application scenarios schematic diagram of TDM Switching Module.In the practical application, the TDM Switching Module generally is to be designed to special-purpose TDM network board, and its critical piece is CPU and TDM switching matrix.As shown in fig. 1, the TDM Switching Module externally directly provides interface (external interface among the figure), can be undertaken alternately by this interface and Switching Module according to checkout gear of the present invention.Usually, this Interface design becomes FE mouth (being the Fast Ethernet mouth).Service processing board can not be undertaken must being connected to the interface module shown in the figure alternately by the external interface among the figure and Switching Module.For high-speed optical signal is connected, interface module is finished the conversion of photosignal between interface module and Service Processing Module.Also can be connected with interface module as Service Processing Module according to checkout gear of the present invention, realization is mutual with Switching Module.The TDM Switching Module is only finished the time gas exchange function, can not realize professional processing.Exchange capacity can be designed to 64K, 128K, 256K or bigger according to the difference of application scenarios.The corresponding a plurality of interface modules of TDM Switching Module.Exchange capacity is more big, and then required interface module, Service Processing Module are just more many.
Fig. 2 is 64K TDM switching matrix building-block of logic, is made up of 12 16K time gas exchange chips altogether, is divided into 3 grades: input switching stage, middle switching stage and output switching stage, each switching stage has 4 exchange chips.The exchange chip of input stage is numbered: 16K exchange chip _ 1,16K exchange chip _ 2,16K exchange chip _ 3,16K exchange chip _ 4; The exchange chip of intergrade is numbered: 16K exchange chip _ 5,16K exchange chip _ 6,16K exchange chip _ 7,16K exchange chip _ 8; The exchange chip of output stage is numbered: 16K exchange chip _ 9,16K exchange chip _ 10,16K exchange chip _ 11,16K exchange chip _ 12.The exchange capacity of each sheet exchange chip is 16K, and 32 32M HW (HW:Highway HW High Way) are arranged.Single chip input side HW is numbered: in0, in1, in2 ... in31, outlet side HW is numbered: out0, out1, out2 ... out31.Every 32M HW has 512 time slots.Entire switching network input switching stage is totally 128 32M HW, is numbered: in0, in1, in2 ... in127.Each exchange chip of input stage all links to each other with each chip of intergrade, and 32 output HW of each exchange chip of input stage are divided into 4 groups, and per 8 32M HW are multiplexed into one group.The 1st chip 16K exchange chip _ 1st with input stage is example, and this chip input side has 32 32M HW, is numbered: in0, in1, in2 ... in31.Outlet side also has 32 32M HW, but per 8 32M HW are multiplexed into one group (being divided into into 4 groups), first chip (16K exchange chip _ 5) of first group of multiplexing HW and intergrade links to each other, second group links to each other with second chip (16K exchange chip _ 6) of intergrade, the 3rd group links to each other with the 3rd chip (16K exchange chip _ 7) of intergrade, and the 4th group links to each other with the 4th chip (16K exchange chip _ 8) of intergrade.Each chip of other of input stage is to adopt the chip of this mode and intergrade to be connected.Each chip of intergrade also is to adopt the chip of this mode and output stage to be connected, and only the input of each chip of intergrade becomes 4 groups of HW lines (every group is by 8 multiplexing forming of 32M HW).Each chip of output stage be input as 4 groups of HW (each group HW be 8 multiplexing forming of 32M HW), be output as 32 32M HW.The entire switching network output stage has the output HW of 128 32M, is numbered: out 0, out 1, out 2 ... out 127.As can be seen, any one input can find any one output corresponding with it, so this switching network is clog-free, full exchange.
Above described be the switching matrix of 64K capacity, have at least dual mode to upgrade to it: exchange chip is replaced with more jumbo, such as using the 32K exchange chip to replace the 16K exchange chip; Increase the core number of switching network, have 12 time gas exchange chips in the above-mentioned 64K switching network, each level has 4, if the core number of each grade is increased to 8, the capacity of entire switching network has also just increased one times so.
Fig. 3 is the hardware structure diagram of a kind of embodiment of testing apparatus of the present invention, and in one embodiment, this testing apparatus can comprise: control processing module, interface processing module and display module.The control processing module links to each other with interface processing module, display module respectively.Testing apparatus can also comprise the memory unit that links to each other with the control processing module, and memory unit can be memory devices such as hard disk, flash disk.Display module is used for controlling the processing module testing result and shows by the mode of scheming or show.The interface processing module is used for being connected with the corresponding interface of TDM Switching Module.In the present embodiment, the interface processing module provides 3 kinds of interfaces: optical interface, FE (Fast Ethernet, i.e. Fast Ethernet) interface and USB (Universal Serial BUS, i.e. USB) interface.Wherein optical interface is to be realized jointly by optical signal processing chip and photosignal conversion chip, one end of optical signal processing chip is used for connecting the optical interface of tested TDM Switching Module, the other end is connected with the photosignal conversion chip, and the other end of photosignal conversion chip is connected with the control processing module again; The FE mouth is by PHY (PhysicalLayer, be ethernet physical layer) chip and MAC (Media Access Control, being media access controller) chip realizes jointly, one end of PHY chip is used for connecting the FE mouth of tested TDM Switching Module, the other end is connected with the MAC chip, and the other end of MAC chip is connected to the control processing module; USB interface is to drive chip by USB to realize that the one end is used for connecting the USB interface of TDM Switching Module, and the other end connects the control processing module.In other embodiments, the interface that device externally provides can comprise one or both in the above-mentioned interface, perhaps can also adopt other forms of interface.
Fig. 4 is the function logic frame chart of a kind of embodiment of testing apparatus of the present invention, and the control processing module comprises Operation and Maintenance submodule 402, configuration reading submodule 403, detection sub-module 405.Wherein, the man-machine interface of Operation and Maintenance submodule 402 by the close friend realizes the operation and maintenance to this testing apparatus, it is an Operation and Maintenance platform, comprise following function: the chart demonstration of the setting of parameter, the structure of order, data etc., order is obtained in the configuration that is particularly useful for constructing the TDM Switching Module.Configuration reading submodule 403 is used for that order is obtained in described configuration and sends to tested TDM Switching Module, and receives the configuration information that is returned by tested TDM Switching Module.Detection sub-module 405 is used for according to the test command that disposes and the configuration information that gets access to tested TDM Switching Module being tested.Described control processing module can further include data processing sub 404, described data processing sub 404 is used for storing the data of operating process into memory unit, test result is handled, and result is outputed to display module by described Operation and Maintenance submodule 402 show.
The described configuration information that is returned by tested TDM Switching Module comprises exchange capacity and the idle time slot of the number of exchange chip in the tested TDM Switching Module, single exchange chip, described configuration reading submodule also is used for calculating according to described configuration information the exchange capacity of described tested TDM Switching Module, determine the time slot upper limit of tested TDM Switching Module according to described exchange capacity, and these data are preserved by the data processing sub.Detection sub-module 405 is tested tested TDM Switching Module according to the test command that disposes and the time slot upper limit.The unit that detection sub-module 405 comprises the unit that single exchange chip is tested and is used for entire switching network is tested.The described unit that single exchange chip is tested is used for sending the chip detection order to the TDM Switching Module, receive the detecting information that tested TDM Switching Module returns, described detecting information comprises numbering, input time slot and the output time solt of tested exchange chip, and tested exchange chip is carried out idle time slot conduction detection.The described unit that entire switching network is tested comprises detecting unit and detecting unit at random according to the order of sequence.Described detecting unit at random is used for sending sense command at random to tested TDM Switching Module, it is right to make the idle time slot of the idle time slot of the input stage that described Switching Module selects at random and output stage form time slot to be measured, it is right to receive each time slot to be measured that described Switching Module returns, and to each time slot to be measured to carrying out conduction detection; Described detecting unit according to the order of sequence is used for sending sense command according to the order of sequence to the TDM Switching Module, making described Switching Module is benchmark with each idle time slot of input stage successively, to form time slot to be measured right with each idle time slot of output stage respectively, it is right to receive the time slot to be measured that described Switching Module returns, and to time slot to be measured to carrying out conduction detection.
In another embodiment, described control processing module also comprises for the timer 406 of setting the scheduled time, described configuration reading submodule 403 is obtained the scheduled time of described timer 406, if do not receive the configuration information that is returned by tested TDM Switching Module in the given time, then repeat to send described configuration to tested TDM Switching Module and obtain order.The timer of a 20ms for example is set.If configuration reading submodule 403 is received the response message that the TDM Switching Module returns, then obtain the configuration information success.If configuration reading submodule 403 is not also received the response message that the TDM Switching Module returns behind the timer expiry, then repeat to send configuration again and obtain order 4 times.If obtain for 5 times unsuccessfully, then report by operating maintenance module 402 and obtain the unusual of failure.The Operation and Maintenance personnel need check whether connection is normal.
Certainly, the control processing module also comprises driven element module 401, driven element module 401 is used for realizing the driving of this device bottom hardware, comprises the driving of PHY chip, MAC chip, USB chip, optical signal processing chip, photosignal conversion chip, hard disk, display module etc.
The method that above-mentioned detection device detects the TDM Switching Module may further comprise the steps as shown in Figure 5:
Step S501: order is obtained in the configuration by man-machine interface (Operation and Maintenance submodule) structure TDM switching network;
Step S502: the configuration reading submodule is obtained order to the configuration among the tested TDM Switching Module forwarding step S501, receives the configuration information that is returned by tested TDM Switching Module.A timer can be set, when the configuration reading submodule does not receive configuration information in setting-up time, can repeat to send configuration to tested TDM Switching Module and obtain order.Configuration information comprises exchange capacity and the idle time slot of the number of exchange chip in the tested TDM Switching Module, single exchange chip, can calculate the exchange capacity of described tested TDM Switching Module according to described configuration information, determine the time slot upper limit of tested TDM Switching Module according to described exchange capacity.These data are preserved by the data processing sub.Perhaps the described configuration information that is directly sent according to the configuration reading submodule by the data processing sub calculates the exchange capacity of described tested TDM Switching Module, determines the time slot upper limit and the preservation of tested TDM Switching Module according to described exchange capacity.
Step S503: detection module is tested tested switching network according to the configuration information that the test command that disposes and step S502 get access to, and specifically according to the test command that disposes by the Operation and Maintenance submodule and the time slot upper limit determined tested TDM Switching Module is tested.Detection module comprises test to single exchange chip to the test of TDM Switching Module, and/or to the test of entire switching network.
When single exchange chip being carried out idle time slot conduction detection, the detected object (can be certain chip in the switching network, a part of chip or whole chip) of switching network is set by the Operation and Maintenance submodule, send the chip detection order to the TDM Switching Module, the detecting information that reception is returned from Switching Module, the detecting information that receives comprises: the numbering of exchange chip, input time slot, output time solt carries out idle time slot conduction detection to tested exchange chip then.
The method of entire switching network being carried out idle time slot conduction detection has two kinds: with machine testing and detection according to the order of sequence.Be exactly to send switching network sense command at random by the detection sub-module of testing apparatus to the TDM Switching Module with machine testing, Switching Module is selected the idle time slot of input stage and the idle time slot of output stage after receiving this order at random, the detection sub-module of testing apparatus is carried out conduction detection to this time slot to (input time slot, output time solt) then.Detect according to the order of sequence is exactly that the detection sub-module of testing apparatus sends switching network sense command according to the order of sequence to the TDM Switching Module, it is benchmark that switching network receives back the 1st the idle time slot with input stage of this order, to form time slot to be measured right with each idle time slot of output stage respectively, then the detection sub-module of testing apparatus to each time slot to be measured of receiving to carrying out conduction detection.Successively the remaining idle time slot of input stage is repeated aforesaid operations then.
Step S504: after the detection testing result is transferred to the data processing sub and handle, comprise statistics and analysis, and result is shown by the form of display module with chart.In one embodiment, after obtaining testing result, testing apparatus filters testing result, only keeps to detect the chip that do not pass through number, input time slot, output time solt, and these data are stored by the data processing sub and show, analyze and safeguard for the staff.Like this can be as far as possible few preservation data, solve memory space, reduce data processing amount.
Fig. 6 is the schematic diagram that TDM switching network testing apparatus is connected with the TDM Switching Module.Critical piece in the TDM Switching Module is CPU and TDM switching matrix, also has other auxiliary resources simultaneously, such as: clock, HW cable, FE interface etc.This testing apparatus can directly be connected with the TDM Switching Module by the FE mouth; Also can be connected on the interface module by optical interface, thereby realization and TDM Switching Module is mutual.If the TDM Switching Module provides external USB mouth, this device also can be connected with it by USB.This device can get access to relevant configuration information on the TDM Switching Module by above-mentioned interface, such as: number of exchange chip etc. in the exchange capacity of single exchange chip, the switching network.
In sum, the present invention has the following advantages:
When 1, the scale of switching network changed, this testing apparatus can be accomplished self adaptation, did not need to increase interface module and Service Processing Module for test, thereby did not also need test environment is done big change, had saved the human and material resources of building test environment.
2, provide man machine operation interface, simple to operate.
3, provide multiple external interface, can link to each other with tested TDM Switching Module neatly.
4, the function that test result is had statistical analysis, and with the chart demonstration, cheer and bright.
Above content be in conjunction with concrete execution mode to further describing that the present invention does, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. TDM Switching Module method of testing is characterized in that comprising:
Order is obtained in the configuration of A1, structure time division multiplexing tdm Switching Module;
B1, send described configuration to tested TDM Switching Module and obtain order, and receive the configuration information that is returned by tested TDM Switching Module;
C1, according to the test command that disposes and the configuration information that gets access to tested TDM Switching Module is tested, comprised the single exchange chip of tested switching network is tested or entire switching network is tested;
The described step that entire switching network is tested comprises with machine testing or detects according to the order of sequence;
Describedly comprise with machine testing: send sense command at random to tested TDM Switching Module, it is right to make the idle time slot of the idle time slot of the input stage that described Switching Module selects at random and output stage form time slot to be measured; It is right to receive each time slot to be measured that described Switching Module returns, and to each time slot to be measured to carrying out conduction detection;
The described detection according to the order of sequence comprises: send sense command according to the order of sequence to tested TDM Switching Module, making described Switching Module is benchmark with each idle time slot of input stage successively, and to form time slot to be measured right with each idle time slot of output stage respectively; It is right to receive the time slot to be measured that described Switching Module returns, and to time slot to be measured to carrying out conduction detection;
The described step that the single exchange chip of tested switching network is tested comprises:
Send the chip detection order to tested TDM Switching Module; Receive the detecting information that tested TDM Switching Module returns, described detecting information comprises numbering, input time slot and the output time solt of tested exchange chip; Tested exchange chip is carried out idle time slot conduction detection.
2. the method for claim 1 is characterized in that, the described configuration information that is returned by tested TDM Switching Module comprises exchange capacity and the idle time slot of the number of exchange chip in the tested TDM Switching Module, single exchange chip; After step B1 and before the step C1, also comprise according to described configuration information and calculate the exchange capacity of described tested TDM Switching Module, determine the step of the time slot upper limit of tested TDM Switching Module according to described exchange capacity; According to the test command that disposes and the time slot upper limit tested TDM Switching Module is tested among the described step C1.
3. method as claimed in claim 1 or 2 is characterized in that, described step B1 also comprises: if do not receive the configuration information that is returned by tested TDM Switching Module in the given time, then repeat to send described configuration to tested TDM Switching Module and obtain order.
4. TDM Switching Module testing apparatus is characterized in that comprising:
The interface processing module is used for being connected with the corresponding interface of time division multiplexing tdm Switching Module;
The control processing module is connected with the interface processing module, and described control processing module comprises:
The Operation and Maintenance submodule, order is obtained in the configuration that is used for structure TDM Switching Module;
The configuration reading submodule is used for that order is obtained in described configuration and sends to tested TDM Switching Module, and receives the configuration information that is returned by tested TDM Switching Module;
Detection sub-module is used for according to the test command that disposes and the configuration information that gets access to tested TDM Switching Module being tested, the unit that comprises for the unit that single exchange chip is tested and be used for entire switching network is tested:
The described unit that entire switching network is tested comprises detecting unit and detecting unit at random according to the order of sequence; Described detecting unit at random is used for sending sense command at random to tested TDM Switching Module, it is right to make the idle time slot of the idle time slot of the input stage that described Switching Module selects at random and output stage form time slot to be measured, it is right to receive each time slot to be measured that described Switching Module returns, and to each time slot to be measured to carrying out conduction detection; Described detecting unit according to the order of sequence is used for sending sense command according to the order of sequence to the TDM Switching Module, making described Switching Module is benchmark with each idle time slot of input stage successively, to form time slot to be measured right with each idle time slot of output stage respectively, it is right to receive the time slot to be measured that described Switching Module returns, and to time slot to be measured to carrying out conduction detection;
The described unit that single exchange chip is tested is used for sending the chip detection order to the TDM Switching Module, receive the detecting information that tested TDM Switching Module returns, described detecting information comprises numbering, input time slot and the output time solt of tested exchange chip, and tested exchange chip is carried out idle time slot conduction detection.
5. TDM Switching Module testing apparatus as claimed in claim 4 is characterized in that, the described configuration information that is returned by tested TDM Switching Module comprises exchange capacity and the idle time slot of the number of exchange chip in the tested TDM Switching Module, single exchange chip; Described configuration reading submodule also is used for calculating according to described configuration information the exchange capacity of described tested TDM Switching Module, determines the time slot upper limit of tested TDM Switching Module according to described exchange capacity; Described detection sub-module is used for according to the test command that disposes and the time slot upper limit tested TDM Switching Module being tested.
6. TDM Switching Module testing apparatus as claimed in claim 5, it is characterized in that, described control processing module also comprises for the timer of setting the scheduled time, described configuration reading submodule is obtained the scheduled time of described timer, if do not receive the configuration information that is returned by tested TDM Switching Module in the given time, then repeat to send described configuration to tested TDM Switching Module and obtain order.
7. as each described TDM Switching Module testing apparatus of claim 4 to 6, it is characterized in that described interface processing module comprises at least a in following three kinds of interfaces:
Optical interface comprises optical signal processing chip and the photosignal conversion chip of series connection, and the other end of described optical signal processing chip is used for connecting the optical interface of tested TDM Switching Module, and the other end of described photosignal conversion chip is used for connecting the control processing module;
Fastethernet interface, comprise ethernet physical layer PHY chip and media access controller chip, one end of described PHY chip is used for connecting the Fast Ethernet mouth of tested TDM Switching Module, the other end is connected with the media access controller chip, and the other end of media access controller chip connects the control processing module again;
USB interface comprises that USB drives chip, and described USB drives the USB interface that chip one end is connected the TDM Switching Module, and the control processing module of the other end and testing apparatus inside is connected.
8. TDM Switching Module test macro, comprise at least one TDM Switching Module, it is characterized in that: comprise that also described TDM Switching Module testing apparatus links to each other with described TDM Switching Module as each described TDM Switching Module testing apparatus in the claim 4 to 7.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1790957A (en) * | 2004-12-14 | 2006-06-21 | 华为技术有限公司 | Apparatus testing method |
| CN1855783A (en) * | 2005-04-21 | 2006-11-01 | 华为技术有限公司 | Mass TDMA complex switching chip data processing method |
| CN101299685A (en) * | 2008-03-18 | 2008-11-05 | 华为技术有限公司 | Method and system for testing switching network as well as test initiation module |
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