CN102006031A - Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof - Google Patents
Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof Download PDFInfo
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- CN102006031A CN102006031A CN201010540214XA CN201010540214A CN102006031A CN 102006031 A CN102006031 A CN 102006031A CN 201010540214X A CN201010540214X A CN 201010540214XA CN 201010540214 A CN201010540214 A CN 201010540214A CN 102006031 A CN102006031 A CN 102006031A
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Abstract
The invention discloses a plastic packaged surface-mount quartz crystal oscillator, which consists of a metal lead sheet, a resonator, a programmable oscillator integrated circuit and a plastic package material. The metal lead sheet supports the resonator; a plastic package part coats the metal lead sheet, the resonator and the programmable oscillator integrated circuit and packages the resonator; one side of the metal lead sheet supports the programmable oscillator integrated circuit and is electrically connected with the programmable oscillator integrated circuit; the other side of the metal lead sheet is used for fixing the resonator; and the metal lead sheet makes the resonator electrically connected with the programmable oscillator integrated circuit. The oscillator and a manufacturing method thereof make the product structure and technical process simple and clear, and are applied to low-cost manufacture; and the oscillator has the characteristics of durability, effectiveness, low cost and the like, and is easy to implement and convenient to manufacture.
Description
Technical field
The present invention relates to quartz oscillator and manufacture method thereof, specifically, the invention relates to the quartz crystal oscillator pasted on surface and the manufacture method thereof of Plastic Package.The present invention uses the quartz-crystal resonator of programmable oscillator integrated circuit silicon chip (IC silicon chip) and cost optimization production.
Background technology
Quartz oscillator is because the accuracy and the stability of its frequency are indispensable parts in hyundai electronics industry such as communication, computer, amusement equipment and other our related field.Up to the present, quartz oscillator is normally added corresponding oscillating circuit by the piezoelectric quartz crystal resonator, with one can be formed with the encapsulant of sealing someway, direct voltage can act on by the lead-in wire of sealed package on the quartz oscillator and to produce vibration.
Generally, quartz crystal oscillator pasted on surface is added corresponding oscillating circuit and base of ceramic and metal enclosing cover by a piezoelectric quartz crystal resonator and is formed.In order to reach hermetic operational environment, the pressure welding encapsulation of this class base of ceramic and metal enclosing cover needs special equipment, and this kind equipment is mainly controlled by Japanese manufacturer, and special equipment requirements has also increased the production cost of this type of oscillator.
Base of ceramic is stacked integrated application metal the overdoes ceramic structure of technology such as deposition, metal mixed and ceramet involution, this type of ceramic component needs high-tech to produce, production cost is than higher relatively, and all compare in short supply in supply side all the time, strictly, this class pedestal has increased the risk of material supply in the world by the monopolization control of three tame Japanese firms at present.Usually the precision of the output frequency of oscillator is decided by the precision of used resonator, and the precision of this class resonator needs to carry out once before capping or how this accurate frequency adjustment.The accurate adjustment of this quefrency can increase the production cost of this type of resonator undoubtedly.Comprehensive, as to use the base of ceramic of Japan's monopolization to produce oscillator wherein comes from base of ceramic itself and supplementary equipment therefore cost and technology cost more than 50 percent cost.
In the case, can provide simple structure, low-cost production, effectively durable quartz crystal oscillator pasted on surface has its tangible advantage and advantage.
Summary of the invention
At above-mentioned problem, the present invention proposes a kind of quartz crystal oscillator pasted on surface and manufacture method thereof, this oscillator and manufacture method thereof have been broken away from expensive pedestal and the special installation that uses Japan's control, make that product structure of the present invention and technological process are simple and clear, be applicable to low-cost the manufacturing, have durability, validity, easy to implement, with low cost, be convenient to make and and usually oscillator have same or surmount characteristics such as index.
Another object of the present invention provides a kind of quartz crystal oscillator pasted on surface and manufacture method thereof of Plastic Package, and this oscillator also has the highly low little characteristics of volume.
Based on this, the present invention is achieved in that a kind of quartz crystal oscillator pasted on surface of Plastic Package, and described oscillator is made up of metal lead wire sheet, resonator, programmable oscillator integrated circuit (being called for short the IC silicon chip) and plastic encapsulant; Described metal lead wire sheet supports resonator, Plastic Package part clad metal lead wire, resonator, programmable oscillator integrated circuit, wherein the metal lead wire sheet simultaneously supports the IC silicon chip and is electrically connected with the IC silicon chip, metal lead wire sheet one side in addition then is used for fixing resonator, and the metal lead wire sheet can be electrically connected resonator and IC silicon chip.
Described metal lead wire sheet, it has a plurality of pins, and has at least a part of pin to be exposed to outside the Plastic Package part, and Plastic Package partly is covered in the above and below of metal lead wire sheet and passes from the gap of pin.
The present invention at first uses a kind of metal lead wire sheet, and this kind metal lead wire sheet can be any metal, is generally but is not limited to copper alloy.The quantity of the exit of this metal lead wire sheet and size can determine according to the specification of product, is generally but is not limited to six.Wherein four exits can be used for the outside line plate on circuit carry out function and be connected, all the other two can be used for other function, such as the programing work that carries out the IC silicon chip.Oscillator structure of the present invention is simple, and the one side of metal lead wire sheet is used to install IC silicon chip and binding IC silicon chip, and one side is used to that then resonator is installed and makes resonator and IC silicon chip by the metal wire of metal lead wire sheet and binding be arranged being connected of function aspects in addition.The pin of metal lead wire sheet can be designed to the two-dimensional matrix of simple one dimension matrix or complexity so that can comprise the pin of a plurality of metal lead wire sheets.
The present invention is bonded in the IC silicon chip on the middle body of metal lead wire sheet with the bottom of binding at the IC silicon chip.This IC silicon chip is bonded in binding conductive adhesion thing normally on the metal lead wire sheet, solidifies the back so that the ground end of circuit is connected on the particular end of the bottom of IC silicon chip by the metal lead wire sheet and the outside line plate.
Use binding technology with metal wire IC silicon chip and metal lead wire sheet to be linked together in function aspects then, the correspondence of IC silicon chip exit and each exit of metal lead wire sheet is connected and can determines according to the specification of IC silicon chip and the specification of Plastic Package quartz crystal oscillator pasted on surface.This moment, the IC silicon chip linked together on function by exit on the metal lead wire sheet and outside line plate circuit.The metal wire of binding usefulness is aluminum steel or gold thread normally, but also can be the metal wire that other is suitable for.
The present invention is bonded in a surface sticked quartz crystal resonator with a kind of binding the other one side of metal lead wire sheet.This binding is generally the conductive adhesion thing, solidifies back conductive adhesion thing and the region of interest of two pads of resonator bottom and metal lead wire sheet is linked together securely and being connected of electric aspect arranged.At this moment, resonator has had being connected of function aspects by the metal lead wire sheet with the metal binding line with the IC silicon chip.
Because the IC silicon chip is programmable, can programme to the IC silicon chip according to specification at last, satisfies customer requirement.At the IC silicon chip is under the programmable situation, also has an advantage, is exactly that used resonator can be without this working procedure processing of frequency trim, and the left frequency departure that comes can remedy by the programming of IC silicon chip.Like this, when making used resonator, also cost can be saved aspect equipment, material and time.
The present invention also has a characteristic, and used exactly resonator can be produced by the technology behind the cost optimization, and slave unit aspect, material aspect, process time, cost all can be saved in a large number in aspect and qualification rate aspect like this.Used resonator need not frequency is adjusted to the frequency that needs accurately, has so just avoided using expensive frequency trim equipment, has also avoided owing to the requirement of resonator precise frequency the disqualification rate that produces owing to a small amount of drift of frequency in each operation.And those results that increase cost are inevitable in common resonator production.
In order to produce common oscillator, the frequency of employed resonator need accurately be adjusted to the frequency range of regulation.As producing the oscillator of 1,000 kinds of different frequencies, the resonator that just needs to produce 1,000 kinds of different frequencies comes supporting with it.But hit at this,, only need to produce a kind of a kind of resonator of frequency range for the oscillator of producing 1,000 kinds of different frequencies.This characteristics provide convenience for the large-scale production resonator, and the parameter of also having saved design cost and production equipment constantly changes and the production cost that brings.Because the programmable I C silicon chip that uses among the present invention can be adjusted to required frequency automatically with the output frequency of the Plastic Package oscillator among the present invention, thereby the Plastic Package quartz oscillator among the present invention can satisfy the requirement of client to different oscillator frequencies.
The present invention is packaged as a whole whole metal lead wire sheet, IC silicon chip, binding line resonator with semiconductor packaging with appropriate plastic material, become the quartz crystal oscillator pasted on surface of Plastic Package.
Description of drawings
Fig. 1 is the structural representation that the present invention implemented.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram that the present invention implemented.
Fig. 3 is the structure assembly drawing of the present invention's enforcement except that the Plastic Package part.
Embodiment
Below, in conjunction with the accompanying drawings shown in, concrete enforcement of the present invention is elaborated, but this explanation is not the qualification to all execution modes of the present invention.
Fig. 1 is a schematic diagram of the present invention, shown end view of the present invention among the figure, as seen from the figure, Plastic Package has partly constituted body of the present invention, the Plastic Package part is divided into plastics top 1 again and plastic lower portion divides 10, the pin 52 of the metal lead wire sheet 5 that shows among the figure is drawn in body, and extends to the bottom of body, so that externally be electrically connected.
The actual size of product of the present invention can change according to actual needs.For example, the high size of a kind of length and width commonly used can be 7mm x 5mm x 1.5 mm, 5mm x 3.2mm x 1.4 mm and 3.2mm x 2.5mm x 1.4 mm.The both sides of the body among Fig. 1 are extended with 3 pins respectively, have 6 pins, but in fact the quantity of pin can be determined according to the demand of reality and the specification of used programmable oscillator integrated circuit (IC silicon chip).
Fig. 2 is a package assembly decomposing schematic representation of the present invention, and Fig. 2 has shown the composition situation of each parts of the present invention.Plastics top 1 among the figure and plastic lower portion divide 10 to show the plastic material that is used for the enclose oscillator assembly and forms the product body.The plastic resin of preferably injection mo(u)lding class of this plastics, but the material of other injection mo(u)lding class is also available.
8 of resonators have been connected on the metal lead wire sheet 5 by conductive adhesion thing 6 and non-conductive binding 7, and this two classes binding can solidify simultaneously according to the specification requirement that binding manufacturer provides; Wherein conductive adhesion thing 6 is coated in two contact jaws of resonator, and 7 of non-conductive bindings are coated in the resonator middle part.
In other embodiments, resonator 8 can be full ceramic resonator, and the pedestal of this full ceramic resonator and enclosing cover are that ceramic material is made entirely.
Fig. 3 is the assembling schematic diagram of structure shown in Figure 2 except the Plastic Package part, has shown the semi-finished product of the present invention before Plastic Package.Shown in the figure, metal lead wire sheet 5 is to form by the sheet metal etching, is fixed with IC silicon chip 3 above the metal lead wire sheet 5, and is electrically connected with IC silicon chip 3 by binding line 2; The below of metal lead wire sheet 5 is fixed with resonator 8, and resonator 8 also is electrically connected with metal lead wire sheet 5.Resonator 8 and oscillator IC silicon chip 3 have been connected to metal lead wire sheet 5.The binding line 2 that is presented between oscillator IC silicon chip 3 and the metal lead wire sheet 5 has been finished all pins of IC silicon chip 3 and being connected of metal lead wire sheet 5 electric works energy aspect.
Therefore, the concrete manufacture method of the above-mentioned execution mode of realization the present invention is:
1, makes the metal lead wire sheet: utilize punching press or corrosion or the used metal lead wire sheet 5 of other method manufacturing the present invention.
2, dress resonator: with reference to the structure of figure 2, resonator 8 is packed in the frock, two contact terminals 9 of resonator will make progress, to be used to aim at metal lead wire sheet 5.
3, coating binding: an amount of conductive adhesion thing 6 of distribution on two contact terminals 9 of resonator; At an amount of non-conductive binding 7 of resonator middle part distribution.
4, dress metal lead wire sheet: metal lead wire sheet 5 is placed on the resonator 8 exactly, and confirms that the binding 6,7 on metal lead wire sheet 5 resonator 8 has good contact.
5, solidify: curing conductive binding 6 and non-conductive binding 7 in baking oven, guarantee that temperature of oven and time are correct so that resonator 8 and metal lead wire sheet 5 combine.
6, coating electrically conductive binding: after the metal lead wire sheet 5 after the above-mentioned curing cooled down, put an amount of conductive adhesion thing 4 of place distribution of IC silicon chip in the middle part 51 of metal lead wire sheet 5.
7, dress IC silicon chip: the central part that conductive adhesion thing 4 is arranged 51 that IC silicon chip 3 is mounted on appointment on the metal lead wire sheet 5.
8, solidify: curing conductive binding 4 in baking oven, guarantee that temperature of oven and time are correct so that IC silicon chip 3 and metal lead wire sheet 5 combine.
9, binding IC silicon chip: the whole frock that step 7 obtains is put into line binding machine application binding (conductor wire pressure welding) technology, so that the respective pins of the contact disc of IC silicon chip 3 and metal lead wire sheet is linked together by metal binding line 2.
10, be coated with protection glue: inject an amount of protection glue at the position of IC silicon chip and metal binding line 2 so that protection IC silicon chip 3 and the good metal binding line 2 of binding.Protection glue adopts non-conductive adhesive usually.
11, solidify: guarantee that in baking oven temperature and time is correct so that solidify protection glue.
12, injection moulding encapsulation: carry out Plastic Package by injection molding machine, with IC silicon chip 3, metal lead wire sheet 5 resonator, 8 plastic covering parts 1 and 10, so that all becoming one, metal lead wire sheet 5, IC silicon chip 3, metal binding line 2 and resonator 8 form the oscillator of a Plastic Package, wherein the pin 52 of metal lead wire sheet 5 is exposed to outside the parts of plastics, so that be electrically connected.
If metal lead wire sheet 5 is scribed according to mode shown in Figure 3 or etching is made, also need to separate, so that the finished product moulding with the oscillator of suitable method with unnecessary metal lead wire sheet and Plastic Package.
After the oscillator of the Plastic Package of made of the present invention is finished, also need the IC silicon chip is programmed and tested.
By this method, can produce the Plastic Package quartz crystal oscillator pasted on surface.To between the 200Mhz, size is fit to present standard size to oscillator frequency scope of the present invention at 1Mhz, such as: 7mm x 5mm, 5mm x 3.2mm and 3.2mm x 2.5mm.
The above only is to specific descriptions of the invention process, all modes of not representing the present invention and being implemented.Equivalent variations and the modification done on the basis of the object of the invention and technical scheme are all in the protection range of invention.
Claims (10)
1. the quartz crystal oscillator pasted on surface of a Plastic Package is characterized in that described oscillator partly is made up of metal lead wire sheet, resonator, programmable oscillator integrated circuit and Plastic Package; Described metal lead wire sheet supports resonator, Plastic Package part clad metal lead wire, resonator, programmable oscillator integrated circuit, wherein the metal lead wire sheet simultaneously supports the programmable oscillator integrated circuit and is electrically connected with the programmable oscillator integrated circuit, metal lead wire sheet one side in addition then is used for fixing resonator, and the metal lead wire sheet can be electrically connected resonator and programmable oscillator integrated circuit.
2. the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 1, it is characterized in that described metal lead wire sheet, it has a plurality of pins, and have at least a part of pin to be exposed to outside the Plastic Package part, Plastic Package partly is covered in the above and below of metal lead wire sheet and passes from the gap of pin.
3. the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 1, the pin that it is characterized in that the metal lead wire sheet is one dimension matrix or two-dimensional matrix, so that can comprise the pin of a plurality of metal lead wire sheets.
4. the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 1, it is characterized in that by binding the programmable oscillator integrated circuit being bonded on the middle body of metal lead wire sheet, and described binding is the conductive adhesion thing in the bottom of programmable oscillator integrated circuit.
5. the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 1, it is characterized in that metal wire links together programmable oscillator integrated circuit and metal lead wire sheet in function aspects, programmable oscillator integrated circuit exit is connected by metal wire is corresponding with each exit of metal lead wire sheet.
6. the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 1, it is characterized in that adopting binding that resonator is bonded in the bottom of metal lead wire sheet, and the region of interest of two pads of resonator bottom and metal lead wire sheet is linked together securely and being connected of electric aspect arranged by the conductive adhesion thing.
7. the manufacture method of the quartz crystal oscillator pasted on surface of a Plastic Package is characterized in that this method comprises the steps:
1), dress resonator: resonator is packed in the production line, and two contact terminals of resonator upwards;
2), fixed resonator: the metal lead wire sheet is placed on the resonator exactly, and metal lead wire sheet resonator is fixed together;
3), fixing programmable oscillator integrated circuit: the programmable oscillator integrated circuit is mounted on the metal lead wire sheet, and is connected with the metal lead wire sheet;
4), injection moulding encapsulation: carry out Plastic Package by injection molding machine, with programmable oscillator integrated circuit, metal lead wire sheet resonator plastic covering packed part, the oscillator of an integrally formed Plastic Package.
8. the manufacture method of the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 7 is characterized in that described step 2) in, an amount of conductive adhesion thing of distribution on two contact terminals of resonator; At an amount of non-conductive binding of resonator middle part distribution, resonator and metal lead wire sheet are fixed together by conductive adhesion thing and non-conductive binding; In the described step 3),, the programmable oscillator integrated circuit is mounted on the metal lead wire sheet at an amount of conductive adhesion thing of the middle part of metal lead wire sheet distribution.
9. the manufacture method of the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 7, it is characterized in that in step 3), the metal lead wire sheet that is fixed with resonator and programmable oscillator integrated circuit is put into line binding machine, adopt metal wire to carry out pressure welding, the contact disc of programmable oscillator integrated circuit and the respective pins of metal lead wire sheet are linked together by metal wire.
10. the manufacture method of the quartz crystal oscillator pasted on surface of Plastic Package as claimed in claim 9; it is characterized in that injecting protection glue the metal wire that protection programmable oscillator integrated circuit and binding are good at the position of programmable oscillator integrated circuit and metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010540214XA CN102006031A (en) | 2010-11-11 | 2010-11-11 | Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010540214XA CN102006031A (en) | 2010-11-11 | 2010-11-11 | Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102006031A true CN102006031A (en) | 2011-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010540214XA Pending CN102006031A (en) | 2010-11-11 | 2010-11-11 | Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761152A (en) * | 2004-10-12 | 2006-04-19 | 威廉·比华 | Quartz crystal oscillator pasted on surface, and preparation method |
| CN101336512A (en) * | 2005-12-01 | 2008-12-31 | Zipic公司 | Method for producing crystal oscillator |
| CN101394058A (en) * | 2008-09-05 | 2009-03-25 | 深圳市长科连通电子有限公司 | Encapsulation method for connector |
| CN101719759A (en) * | 2009-12-04 | 2010-06-02 | 武汉盛华微系统技术股份有限公司 | Method for adhering components and parts to packaging surface |
-
2010
- 2010-11-11 CN CN201010540214XA patent/CN102006031A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761152A (en) * | 2004-10-12 | 2006-04-19 | 威廉·比华 | Quartz crystal oscillator pasted on surface, and preparation method |
| CN101336512A (en) * | 2005-12-01 | 2008-12-31 | Zipic公司 | Method for producing crystal oscillator |
| CN101394058A (en) * | 2008-09-05 | 2009-03-25 | 深圳市长科连通电子有限公司 | Encapsulation method for connector |
| CN101719759A (en) * | 2009-12-04 | 2010-06-02 | 武汉盛华微系统技术股份有限公司 | Method for adhering components and parts to packaging surface |
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Application publication date: 20110406 |