CN102003645A

CN102003645A - Light emitting diode (LED) integrated module

Info

Publication number: CN102003645A
Application number: CN2010102977060A
Authority: CN
Inventors: 戴培钧
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-09-30
Filing date: 2010-09-30
Publication date: 2011-04-06

Abstract

The invention provides a light emitting diode (LED) integrated module which comprises a substrate and LED bare chips arranged on the substrate, wherein the number of the LED bare chips is greater than or equal to 15, the LED bare chips are electrically connected in a serial mode or a parallel mode or a serial-parallel mode, the power of each LED bare chip is less than or equal to 0.25W, and the total current of the LED bare chips is less than or equal to 100mA. In the invention, because the power of each LED bare chip is controlled below 0.25W and the total current is controlled, according to the principle that the smaller the current value is, the lower the heating quantity is, under the condition that the total power of the LED integrated module is not reduced, the heating quantity is greatly lowered. Thus, when the LED integrated module of the invention is applied to an LED lamp, compared with the traditional LED integrated module, the required heat dissipation component is smaller, and the volume of the manufactured LED lamp is smaller.

Description

The LED integration module

Technical field

The present invention relates to a kind of light source, relate in particular to a kind of LED (light emitting diode) integration module.

Background technology

Along with the continuous development of LED technology, the LED lamp has had widely and has used.Wherein power type LED lamp has progressed into lighting field.

In the power-type LED illuminating product of prior art, the most representative is single LEDs chip packaging of 1W power, and the groundwork electric current of this packaging is 350MA, and operating voltage is about 3V.Power is single LEDs chip packaging of 2W, the corresponding 700mA that is increased to of groundwork electric current, and operating voltage still is about 3V.Its groundwork electric current of more powerful single LEDs chip packaging can corresponding increase.

In the illumination of reality was used, the current value of LED packaging was big more, and the heat of generation is many more, and is correspondingly also just big more for the radiating element that provides effective heat radiation to use.Therefore, its volume of high-powered LED lamp in the market is all bigger, has limited the lifting of LED lamp power.

Summary of the invention

The object of the present invention is to provide a kind of LED integration module, with its caloric value under the constant power less than traditional LED lamp, so that can produce the littler LED lamp of volume.

According to above-mentioned purpose, LED integration module provided by the invention comprises: substrate and the LED bare chip that is arranged on the substrate, the quantity of described LED bare chip is more than or equal to 15, adopt serial or parallel connection or series-parallel mode to be electrically connected between the described LED bare chip, the power of every described LED bare chip is smaller or equal to 0.25W, and the total current of described LED bare chip is smaller or equal to 100mA.

In above-mentioned LED integration module, the quantity of described LED bare chip is less than 80.

In above-mentioned LED integration module, the quantity of described LED bare chip is 50.

In above-mentioned LED integration module, the power of described LED bare chip is more than or equal to 0.05W.

In above-mentioned LED integration module, the power of described LED bare chip is 0.1W.

In above-mentioned LED integration module, the total current of described LED bare chip is more than or equal to 10mA.

In above-mentioned LED integration module, on described LED bare chip, be packaged with photic zone.

As mentioned above, power with single LEDs bare chip is controlled at below the 0.25W in the present invention, and controlled total current, according to the low more principle of the more little caloric value of current value, under the situation that does not reduce LED integration module general power, caloric value is reduced significantly, therefore, when LED integration module of the present invention is applied to the LED lamp, compare with traditional LED integration module, required thermal component is littler, and the LED lamp body of producing is long-pending smaller and more exquisite.

Description of drawings

Fig. 1 is the front view and the vertical view of LED integration module of the present invention;

Fig. 2 is a kind of electrical connection between the LED bare chip in the LED integration module among Fig. 1;

Fig. 3 is the another kind of electrical connection between the LED bare chip in the LED integration module among Fig. 1.

The specific embodiment

See also Fig. 1, LED integration module of the present invention includes substrate 2 and the LED bare chip 1 that is arranged on the substrate 2.Substrate 2 can adopt traditional structure and material, for example the aluminum base PCB plate.The LED bare chip is orderly or unordered shape arrangement and is installed on the substrate 2.Encapsulation photic zone 5 on LED bare chip 1.

In the present invention, be installed at least 15 of the quantity of the LED bare chip 1 on the substrate 2, the power of every LEDs chip 1 is not more than 0.25W.As for the upper limit of LED bare chip 1 quantity, the power of the LED integration module that those skilled in the art can be as required and deciding, preferably, upper limit quantity preferably is controlled in 80.In the present embodiment, the quantity of LED bare chip 1 is chosen as 50.The power lower limit of every LEDs bare chip 1 can also be as required or situation about can purchase and deciding, and preferably, the power of led chip 1 is not less than 0.05W.In the present embodiment, the power selection of LED bare chip 1 is 0.1W.

See also Fig. 2 and Fig. 3, Fig. 2 and Fig. 3 have shown the electrical connection between the LED bare chip 1 among Fig. 1.As shown in Figure 2, can adopt the mode of series connection between a plurality of LED bare chips 1, also can adopt mode in parallel, perhaps adopt the mode of connection in series-parallel (the series connection back is in parallel) as shown in Figure 3.Generally speaking, the connected mode of LED bare chip 1 can be selected in serial or parallel connection, as long as satisfy a condition, the total current at the circuit two ends (positive pole and negative pole) 3,4 after promptly the LED bare chip connects is not more than 100mA.As for the lower limit of total current, the power of the LED integration module that those skilled in the art can be as required and deciding, preferably, lower limit is set to 10mA.

In the present embodiment, used 50 power to be 0.1W, operating current LED bare chip 1, adopted the connected mode of serial shown in Figure 2 as 35mA.The general power of the LED integration module that obtains is 50*0.1=5W, owing to be connected in series, therefore, its total current still is 35mA, and operating voltage is about 150V.Its operating current of LED integration module of this 5W only is 35mA, compares with the LED packaging of traditional single 5W, caloric value is little tens times.

Claims

1. a LED integration module comprises: substrate and the LED bare chip that is arranged on the substrate, it is characterized in that, the quantity of described LED bare chip is more than or equal to 15, adopt serial or parallel connection or series-parallel mode to be electrically connected between the described LED bare chip, the power of every described LED bare chip is smaller or equal to 0.25W, and the total current of described LED bare chip is smaller or equal to 100mA.

2. LED integration module as claimed in claim 1 is characterized in that, the quantity of described LED bare chip is less than 80.

3. LED integration module as claimed in claim 1 or 2 is characterized in that, the quantity of described LED bare chip is 50.

4. LED integration module as claimed in claim 1 is characterized in that the power of described LED bare chip is more than or equal to 0.05W.

5. as claim 1 or 5 described LED integration modules, it is characterized in that the power of described LED bare chip is 0.1W.

6. LED integration module as claimed in claim 1 is characterized in that the total current of described LED bare chip is more than or equal to 10mA.

7. as claim 1,2,4 or 6 described LED integration modules, it is characterized in that, on described LED bare chip, be packaged with photic zone.