CN101997088A - OLED (organic light emitting diode) device packaging structure - Google Patents
OLED (organic light emitting diode) device packaging structure Download PDFInfo
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- CN101997088A CN101997088A CN 201010501508 CN201010501508A CN101997088A CN 101997088 A CN101997088 A CN 101997088A CN 201010501508 CN201010501508 CN 201010501508 CN 201010501508 A CN201010501508 A CN 201010501508A CN 101997088 A CN101997088 A CN 101997088A
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- cover plate
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- oled device
- resin layer
- oled
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Abstract
The invention discloses an OLED (organic light emitting diode) device packaging structure by which the sealing effect of an OLED device can be improved. The OLED device packaging structure comprises a substrate and a packaging cover plate, wherein the packaging cover plate is arranged on the substrate; a UV resin layer is arranged on the inner surface of the packaging cover plate; the substrate is bound with the packaging cover plate through the UV resin layer; a sealing plate is arranged on the inner surface of the UV resin layer; and a cavity for containing the OLED device is formed between the substrate and the sealing plate. The packaging structure of the invention is produced and manufactured by the following steps: firstly, applying the UV resin layer on the inner surface of the packaging cover plate by screen printing and the like; then placing the sealing plate on the inner surface of the UV resin layer; adhering the substrate and the packaging cover plate by the UV resin layer; and finally, irradiating by UV rays to solidify the UV resin layer, thereby completing the packaging of the OLED device. According to the packaging structure, the sealing effect can be greatly improved, thereby ensuring the service life and product performance of the OLED device.
Description
Technical field
The present invention relates to a kind of encapsulating structure, be specifically related to a kind of OLED device encapsulation structure that is used to encapsulate the OLED device.
Background technology
At present, encapsulation technology has material impact to the life-span and the properties of product of OLED (Organic Light-emitting Diode, Organic Light Emitting Diode) display device.As shown in Figure 1, in existing OLED packaging technology, one is by absorbing moisture and oxygen to guarantee packaging effect at glass packaging cover plate A inner surface attaching drier B, but, still there is certain deficiency in its packaging effect, attaches drier etc. in addition as need, influences the production cost of OLED display device, simultaneously because drier has problems such as outgas after long-time the use, the life-span and the performance of OLED product there is certain influence.
Summary of the invention
Technical problem to be solved by this invention provides a kind of OLED device encapsulation structure that improves sealing effectiveness.
The technical solution adopted for the present invention to solve the technical problems is: the OLED device encapsulation structure, comprise substrate and be arranged on encapsulation cover plate on the substrate, be provided with the UV resin bed at the encapsulation cover plate inner surface, described substrate is by UV resin bed and encapsulation cover plate bonding, be provided with sealing plate at UV resin bed inner surface, between substrate and sealing plate, form the cavity volume that holds the OLED device.
Further be that described substrate, encapsulation cover plate and sealing plate all adopt glass plate to make.
The invention has the beneficial effects as follows: encapsulating structure of the present invention applies one deck UV resin bed in modes such as encapsulation cover plate inner surface employing silk screen printings earlier when manufacturing; Place sealing plate at UV resin bed inner surface then; Substrate and encapsulation cover plate are adhered to by the UV resin bed; By the UV irradiate light, make the sclerosis of UV resin bed at last, thereby finish encapsulation the OLED device.This encapsulating structure can improve sealing effectiveness greatly, thereby can guarantee the life-span and the properties of product of OLED device.
Description of drawings
Fig. 1 is an encapsulating structure of the prior art;
Fig. 2 is an encapsulating structure of the present invention.
Be labeled as among the figure: substrate 1, encapsulation cover plate 2, OLED device 3, UV resin bed 4, sealing plate 5.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
As shown in Figure 2, OLED device encapsulation structure of the present invention, comprise substrate 1 and be arranged on encapsulation cover plate 2 on the substrate 1, be provided with UV resin bed 4 at encapsulation cover plate 2 inner surfaces, described substrate 1 is by UV resin bed 4 and encapsulation cover plate 2 bondings, be provided with sealing plate 5 at UV resin bed 4 inner surfaces, between substrate 1 and sealing plate 5, form the cavity volume that holds OLED device 3.When manufacturing, apply one deck UV resin bed 4 in modes such as encapsulation cover plate 4 inner surfaces employing silk screen printings earlier; Place sealing plate 5 at UV resin bed 4 inner surfaces then; Substrate 1 and encapsulation cover plate 2 are adhered to by UV resin bed 4; By the UV irradiate light, make 4 sclerosis of UV resin bed at last, thereby finish encapsulation OLED device 3.This encapsulating structure can improve sealing effectiveness greatly, thereby can guarantee the life-span and the properties of product of OLED device 3.
In the above-described embodiment, substrate 1 can adopt corrosion resistant plates such as plastic plate is made, encapsulation cover plate 2 can adopt the indium steel with sealing plate 5 to make, as optimal way, described substrate 1, encapsulation cover plate 2 preferably adopt glass plate to make with sealing plate 5, and the thickness of sealing plate 5 is preferably disposed between 20 μ m to the 50 μ m.
Claims (2)
1.OLED device encapsulation structure, comprise substrate (1) and be arranged on encapsulation cover plate (2) on the substrate (1), it is characterized in that: be provided with UV resin bed (4) at encapsulation cover plate (2) inner surface, described substrate (1) is by UV resin bed (4) and encapsulation cover plate (2) bonding, be provided with sealing plate (5) at UV resin bed (4) inner surface, between substrate (1) and sealing plate (5), form and hold the cavity volume of OLED device (3).
2. OLED device encapsulation structure as claimed in claim 1 is characterized in that: described substrate (1), encapsulation cover plate (2) all adopt glass plate to make with sealing plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010501508 CN101997088A (en) | 2010-10-10 | 2010-10-10 | OLED (organic light emitting diode) device packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010501508 CN101997088A (en) | 2010-10-10 | 2010-10-10 | OLED (organic light emitting diode) device packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101997088A true CN101997088A (en) | 2011-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010501508 Pending CN101997088A (en) | 2010-10-10 | 2010-10-10 | OLED (organic light emitting diode) device packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN101997088A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013000363A1 (en) * | 2011-06-30 | 2013-01-03 | 重庆爱特光电有限公司 | Transmissive oled gun sight |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170849A1 (en) * | 2006-01-25 | 2007-07-26 | Park Jin-Woo | Organic light emitting display device and method of fabricating the same |
| CN201820801U (en) * | 2010-10-10 | 2011-05-04 | 四川虹视显示技术有限公司 | Encapsulating structure for OLED (Organic Light Emitting Diode) device |
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2010
- 2010-10-10 CN CN 201010501508 patent/CN101997088A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170849A1 (en) * | 2006-01-25 | 2007-07-26 | Park Jin-Woo | Organic light emitting display device and method of fabricating the same |
| CN201820801U (en) * | 2010-10-10 | 2011-05-04 | 四川虹视显示技术有限公司 | Encapsulating structure for OLED (Organic Light Emitting Diode) device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013000363A1 (en) * | 2011-06-30 | 2013-01-03 | 重庆爱特光电有限公司 | Transmissive oled gun sight |
| US8832988B2 (en) | 2011-06-30 | 2014-09-16 | Chongqing Aite Optical And Electronics Co., Ltd. | Transmission-type OLED riflescope |
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Application publication date: 20110330 |