CN101987429B - 化学机械研磨方法和装置 - Google Patents
化学机械研磨方法和装置 Download PDFInfo
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- CN101987429B CN101987429B CN200910056137A CN200910056137A CN101987429B CN 101987429 B CN101987429 B CN 101987429B CN 200910056137 A CN200910056137 A CN 200910056137A CN 200910056137 A CN200910056137 A CN 200910056137A CN 101987429 B CN101987429 B CN 101987429B
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- grinding
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- silicon chip
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200910056137A CN101987429B (zh) | 2009-08-07 | 2009-08-07 | 化学机械研磨方法和装置 |
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CN200910056137A CN101987429B (zh) | 2009-08-07 | 2009-08-07 | 化学机械研磨方法和装置 |
Publications (2)
Publication Number | Publication Date |
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CN101987429A CN101987429A (zh) | 2011-03-23 |
CN101987429B true CN101987429B (zh) | 2012-09-26 |
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CN200910056137A Expired - Fee Related CN101987429B (zh) | 2009-08-07 | 2009-08-07 | 化学机械研磨方法和装置 |
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CN (1) | CN101987429B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1195595A (zh) * | 1997-02-21 | 1998-10-14 | 艾伯特·胡 | 使用皮带式抛光垫抛光平面的设备和方法 |
EP0919330A1 (en) * | 1994-10-11 | 1999-06-02 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
US6315857B1 (en) * | 1998-07-10 | 2001-11-13 | Mosel Vitelic, Inc. | Polishing pad shaping and patterning |
CN1577758A (zh) * | 2003-06-26 | 2005-02-09 | 松下电器产业株式会社 | 研磨垫、研磨装置及晶片的研磨方法 |
CN1646263A (zh) * | 2001-11-02 | 2005-07-27 | Asm纳托尔公司 | 具有可前移的清扫器的电化学机械加工 |
US7086936B1 (en) * | 2003-12-22 | 2006-08-08 | Lam Research Corporation | Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module |
-
2009
- 2009-08-07 CN CN200910056137A patent/CN101987429B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0919330A1 (en) * | 1994-10-11 | 1999-06-02 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
CN1195595A (zh) * | 1997-02-21 | 1998-10-14 | 艾伯特·胡 | 使用皮带式抛光垫抛光平面的设备和方法 |
US6315857B1 (en) * | 1998-07-10 | 2001-11-13 | Mosel Vitelic, Inc. | Polishing pad shaping and patterning |
CN1646263A (zh) * | 2001-11-02 | 2005-07-27 | Asm纳托尔公司 | 具有可前移的清扫器的电化学机械加工 |
CN1577758A (zh) * | 2003-06-26 | 2005-02-09 | 松下电器产业株式会社 | 研磨垫、研磨装置及晶片的研磨方法 |
US7086936B1 (en) * | 2003-12-22 | 2006-08-08 | Lam Research Corporation | Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module |
Also Published As
Publication number | Publication date |
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CN101987429A (zh) | 2011-03-23 |
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C06 | Publication | ||
PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121116 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121116 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20200807 |
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CF01 | Termination of patent right due to non-payment of annual fee |