CN101986022A - LED (light emitting diode) light bar heat dissipation structure - Google Patents

LED (light emitting diode) light bar heat dissipation structure Download PDF

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Publication number
CN101986022A
CN101986022A CN2010105604423A CN201010560442A CN101986022A CN 101986022 A CN101986022 A CN 101986022A CN 2010105604423 A CN2010105604423 A CN 2010105604423A CN 201010560442 A CN201010560442 A CN 201010560442A CN 101986022 A CN101986022 A CN 101986022A
Authority
CN
China
Prior art keywords
board substrate
copper foil
heat dissipation
led lamp
lamp bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105604423A
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Chinese (zh)
Inventor
潘福春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAILONG ELECTRONIC (KUNSHAN) CO Ltd
Original Assignee
TAILONG ELECTRONIC (KUNSHAN) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAILONG ELECTRONIC (KUNSHAN) CO Ltd filed Critical TAILONG ELECTRONIC (KUNSHAN) CO Ltd
Priority to CN2010105604423A priority Critical patent/CN101986022A/en
Publication of CN101986022A publication Critical patent/CN101986022A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an LED light bar heat dissipation structure, comprising a circuit board substrate, a conductive copper foil, a joint hole and a heat dissipation copper foil, wherein the conductive copper foil is adhered to the surface of the circuit board substrate; the joint hole passes through the conductive copper foil and the circuit board substrate from the reverse side of the circuit board substrate to be below the LED light on the front side; and the heat dissipation copper foil is adhered to the reverse side of the circuit board substrate and contacts with the part below the LED light on the front side via the joint hole. The reverse side of the circuit board substrate of the LED light bar heat dissipation structure of the invention is adhered to one heat dissipation copper foil which contacts with the part below the LED light on the front side via the joint hole, thus the design causes heat generated on the LED light on the light bar to be conducted to the heat dissipation copper foil via the joint hole; because the heat dissipation copper foil has higher heat dissipation efficiency compared with the circuit board substrate, the heat dissipation area of the LED light bar is enlarged, and the heat dissipation efficiency of the LED light bar is improved.

Description

LED lamp bar radiator structure
Technical field
The present invention relates to a kind of LED lamp bar radiator structure, particularly relate to a kind of LED lamp bar radiator structure that can enlarge LED lamp bar area of dissipation and improve LED lamp bar radiating efficiency.
Background technology
The pcb board of LED lamp strip adoption softness is a substrate, and employing LED is an illuminator, and is can be arbitrarily crooked, also can arbitrarily be fixed on the rough surface, and in addition, LED lamp bar also has: advantages such as humble, the efficient electricity-saving of generating heat, overlength service life, low voltage operating.Just because of above-mentioned advantage, LED lamp bar has been widely used in industries such as furniture, automobile, advertisement, illumination, steamer now.LED lamp bar circuit in the past mostly is enclosed construction, adopt the front side heat radiation promptly only to dispel the heat by LED lamp ambient air on the lamp bar, such design make all heats concentrate on the LED lamp around, though the heating of LED lamp is humble, but, can have influence on the service life of LED equally through the rising that after a while its temperature of use still can be to a certain degree.In sum, problem demanding prompt solution is, even under the humble situation of LED lamp bar heating, temperature by LED lamp on the long use lamp bar still has rising to a certain degree, therefore need a kind of more rational LED lamp bar radiator structure of design, reduce the LED operating temperature, increase LED service life.
Summary of the invention
Technical problem to be solved by this invention is, a kind of LED lamp bar radiator structure is provided, and it further reduces the LED operating temperature by enlarging LED lamp bar area of dissipation and improving LED lamp bar radiating efficiency mode, increase LED service life.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of LED lamp bar radiator structure, and this radiator structure comprises: the wiring board substrate; Copper-foil conducting electricity, it is attached to described wiring board substrate surface, in addition, also comprises: connecting hole, it passes described copper-foil conducting electricity and the described wiring board substrate below to positive LED lamp from described wiring board substrate reverse side; The heat radiation Copper Foil, the below that it adheres to described wiring board substrate reverse side and touches positive LED lamp by described connecting hole.
The heat radiation Copper Foil of described LED lamp bar radiator structure is that same integral body adheres to described wiring board substrate reverse side.
The heat radiation Copper Foil of described LED lamp bar radiator structure is made up of discrete radiating block, and each radiating block covers a described connecting hole at least.
Advantage of the present invention is, LED lamp bar radiator structure involved in the present invention, its reverse side at the circuit base board has adhered to a heat radiation Copper Foil, this heat radiation Copper Foil touches the below of LED lamp by described connecting hole, such design makes the heat that the LED lamp produces on the lamp bar conduct to described heat radiation Copper Foil by connecting hole, because described heat radiation Copper Foil has higher radiating efficiency than described wiring board substrate, therefore not only enlarge the area of dissipation of LED lamp bar, and improve the radiating efficiency of LED lamp bar.
Description of drawings
Fig. 1 is the overall structure schematic diagram of traditional LED lamp bar;
Structural representation when Fig. 2 does not install the heat radiation Copper Foil additional for LED lamp bar radiator structure of the present invention;
Structural representation when Fig. 3 installs the heat radiation Copper Foil additional for LED lamp bar radiator structure of the present invention.
 
The specific embodiment
For further disclosing technical scheme of the present invention, be described with reference to the accompanying drawings embodiments of the present invention now.
Fig. 1 is the overall structure schematic diagram of traditional LED lamp bar, structural representation when Fig. 2 does not install the heat radiation Copper Foil additional for LED lamp bar radiator structure of the present invention, structural representation when Fig. 3 installs the heat radiation Copper Foil additional for LED lamp bar radiator structure of the present invention wherein, comprising: wiring board substrate 21; Copper-foil conducting electricity 22, it is attached to described wiring board substrate 21 surfaces, in addition, also comprises: connecting hole 23, it passes described copper-foil conducting electricity 22 and described wiring board substrate 21 below to the LED lamp in front from described wiring board substrate 21 reverse side; Heat radiation Copper Foil 24, the below that it adheres to described wiring board substrate 21 reverse side and touches positive LED lamp by described connecting hole 23.The heat radiation Copper Foil 24 of above-mentioned LED lamp bar radiator structure can be same integral body and adheres to described wiring board substrate 21 reverse side, like this on the described heat radiation Copper Foil 24 of the heat that the LED bar produces on the lamp bar by the most same integral body of described connecting hole 23 conduction, dispel the heat by this integral heat sink Copper Foil 24, can significantly increase the area of dissipation of LED lamp bar.
In addition, preferred embodiment described heat radiation Copper Foil 24 is made up of discrete radiating block as one of the present invention, and each radiating block covers a described connecting hole 23 at least.Above-mentioned design makes the LED lamp produces on the lamp bar heat conduct on each discrete radiating block by the described connecting hole 23 of its below, dispel the heat by each discrete radiating block, make each discrete radiating block of described heat radiation Copper Foil 24 to make up flexibly like this.
More than, the basic ideas and basic principles of the present invention have been set forth by description of listed embodiment.But the present invention never is limited to above-mentioned listed embodiment, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on technical scheme of the present invention of change all should belong to protection scope of the present invention.

Claims (3)

1. LED lamp bar radiator structure, this radiator structure comprises: wiring board substrate (21); Copper-foil conducting electricity (22), it is attached to described wiring board substrate (21) surface, it is characterized in that, also comprise: connecting hole (23), it passes described copper-foil conducting electricity (22) and described wiring board substrate (21) below to positive LED lamp from described wiring board substrate (21) reverse side; Heat radiation Copper Foil (24), the below that it adheres to described wiring board substrate (21) reverse side and touches positive LED lamp by described connecting hole (23).
2. LED lamp bar radiator structure according to claim 1 is characterized in that described heat radiation Copper Foil (24) adheres to described wiring board substrate (21) reverse side for same integral body.
3. according to claim 1 or 2 described LED lamp bar radiator structures, it is characterized in that described heat radiation Copper Foil (24) is made up of discrete radiating block, each radiating block covers a described connecting hole (23) at least.
CN2010105604423A 2010-11-26 2010-11-26 LED (light emitting diode) light bar heat dissipation structure Pending CN101986022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105604423A CN101986022A (en) 2010-11-26 2010-11-26 LED (light emitting diode) light bar heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105604423A CN101986022A (en) 2010-11-26 2010-11-26 LED (light emitting diode) light bar heat dissipation structure

Publications (1)

Publication Number Publication Date
CN101986022A true CN101986022A (en) 2011-03-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105604423A Pending CN101986022A (en) 2010-11-26 2010-11-26 LED (light emitting diode) light bar heat dissipation structure

Country Status (1)

Country Link
CN (1) CN101986022A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104235661A (en) * 2013-06-19 2014-12-24 瑞轩科技股份有限公司 Light bar and direct backlight module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2835786Y (en) * 2005-09-27 2006-11-08 光磊科技股份有限公司 Heat radiation type LED light source module and lamp thereof
CN201852067U (en) * 2010-11-26 2011-06-01 台龙电子(昆山)有限公司 Heat dissipation structure of LED (light emitting diode) lamp bars

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2835786Y (en) * 2005-09-27 2006-11-08 光磊科技股份有限公司 Heat radiation type LED light source module and lamp thereof
CN201852067U (en) * 2010-11-26 2011-06-01 台龙电子(昆山)有限公司 Heat dissipation structure of LED (light emitting diode) lamp bars

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104235661A (en) * 2013-06-19 2014-12-24 瑞轩科技股份有限公司 Light bar and direct backlight module
CN104235661B (en) * 2013-06-19 2018-05-29 瑞轩科技股份有限公司 Lamp bar and direct type backlight module

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Application publication date: 20110316